# Power MOSFET, N Channel, 900 V, 15 A, 0.28 ohm, TO-263 (D2PAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2726050RL/)

**URL**: https://novapart.co/products/IPB90R340C3ATMA1/power-mosfet-n-channel-900-v-15-a-028-ohm-to-263
**SKU**: IPB90R340C3ATMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.5100
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Channel Type | N Channel |
| Power Dissipation | 208W |
| Drain Source On State Resistance | 0.28ohm |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2726050RL/)

**IPB90R340C3** 

## **CoolMOS[™] Power Transistor** 

## **Product Summary** 

## **Features** 

- Lowest figure-of-merit RON x Qg 

- Extreme dv/dt rated 

|_V_DS@_T_J=25°C|900|V|
|---|---|---|
|_R_DS(on),max@_T_J=25°C|0.34|W|
|_Q_g,typ|94|nC|



- High peak current capability 

- Qualified according to JEDEC[1)] for industrial applications 

- Pb-free lead plating; RoHS compliant 

## PG-TO263 

- Ultra low gate charge 

## **CoolMOS™900V is designed for:** 

- Quasi Resonant Flyback / Forward topologies 

- SMPS 

- PC Silverbox 

- Lighting 

- Solar 

|**Type**|**Package**|**Marking**|
|---|---|---|
|**IPB90R340C3**|**PG-TO263**|**9R340C**|



**Maximum ratings,** at _T_ J=25 °C, unless otherwise specified 

|**Maximum ratings,**at_T_J=25 °C, unless otherwise specified=25 °C, unless otherwise specified|J=25 °C, unless otherwise specified=25 °C, unless otherwise specified|J=25 °C, unless otherwise specified=25 °C, unless otherwise specified|||
|---|---|---|---|---|
|**Parameter**|**Symbol **<br>~~i~~<br>~~{—_}—___~~|**Conditions**<br>~~i~~<br>~~{—_}—___~~|**Value**<br>~~i~~<br>~~{—_}—___~~|**Unit**|
|Continuous drain current|_I_D<br>~~|~~<br>~~{—_}—___~~|_T_C=25 °C<br>~~|~~<br>~~{—_}—___~~|15<br>~~|~~<br>~~{—_}—___~~|A|
|||_T_C=100 °C<br>~~|~~<br>~~{—_}—___~~<br>~~i~~|9.5<br>~~|~~<br>~~{—_}—___~~<br>~~i~~||
|Pulsed drain current 2)|_I_D,pulse<br>~~{—_}—___~~<br>~~Pe~~|_T_C=25 °C<br>~~{—_}—___~~<br>~~Pe~~|34<br>~~{—_}—___~~<br>~~Pe~~||
|Avalanche energy, single pulse|_E_AS<br>~~Pe~~|_I_D=3.1 A,_V_DD=50 V<br>~~Pe~~|678<br>~~Pe~~|mJ|
|Avalanche energy, repetitive_t_AR<br>2),3)|_E_AR<br>~~Pe~~|_I_D=3.1 A,_V_DD=50 V<br>~~Pe~~|1<br>~~Pe~~||
|Avalanche current, repetitive_t_AR<br>2),3)|_I_AR<br>~~Pe~~|~~Pe~~|3.1<br>~~Pe~~|A|
|MOSFET d_v_/d_t_ ruggedness|d_v_/d_t_<br>~~i~~|_V_DS=0...400 V<br>~~i~~|50<br>~~i~~|V/ns|
|Gate source voltage|_V_GS<br>~~|~~|static<br>~~|~~<br>~~+~~|±20<br>~~|~~<br>~~+~~|V<br>~~+~~<br>~~i~~|
|||AC (f>1 Hz)<br>~~|~~<br>~~i~~|±30<br>~~|~~<br>~~i~~||
|Power dissipation|_P_tot<br>~~i~~|_T_C=25 °C<br>~~i~~|208<br>~~i~~|W|
|Operating and storage temperature|_T_J,_T_stg<br>~~a~~|~~a~~|-55 ... 150<br>~~a~~|°C|



**Rev. 2.0** 

**page 1** 

**2012-04-16** 

**IPB90R340C3** 

**Maximum ratings,** at _T_ J=25 °C, unless otherwise specified 

|**Parameter**|**Symbol**|**Conditions**|**Value**|**Unit**|
|---|---|---|---|---|
|Continuous diode forward current|_I_S|_T_C=25 °C|9.2|A|
|Diode pulse current 2)|_I_S,pulse||34||
|Reverse diode d_v_/d_t_ 4)|d_v_/d_t_||4|V/ns|



Reverse diode d _v_ /d _t_[4)] 

|**Parameter**<br>**Thermal characteristics**<br>~~— |~~|**Symbol**<br>~~|~~|**Conditions**<br>~~|~~|**min.**|**typ.**<br>**Values**|**max.**|**Unit**|
|---|---|---|---|---|---|---|
|Thermal resistance, junction - case|_R_thJC||-|-|0.6|K/W|
|Thermal resistance, junction -<br>ambient|_R_thJA|SMD version, device<br>on PCB: at minimum<br>footprint|-|-|62||
||_R_thJA|SMD version, device<br>on PCB: at 6 cm²<br>**cooling** **area** 5)|-|35|-||
|Soldering temperature, only reflow<br>soldering allowed; part not qualified<br>for direct wave soldering but bottom<br>side PCB wave soldering is allowed|_T_sold|**cooling**<br>reflow MSL1|-|-|260|°C|



**Electrical characteristics,** at _T_ J=25 °C, unless otherwise specified 

## **Static characteristics** 

|Drain-source breakdown voltage|_V_(BR)DSS|_V_GS=0 V,_I_D=250 µA|900|-|-|V|
|---|---|---|---|---|---|---|
|Gate threshold voltage|_V_GS(th)|_V_DS=_V_GS,_I_D=1 mA|2.5|3|3.5||
|Zero gate voltage drain current|_I_DSS|_V_DS=900 V,_V_GS=0 V,<br>_T_j=25 °C|-|-|2|µA|
|||_V_DS=900 V,_V_GS=0 V,<br>_T_j=150 °C|-|20|-||
|Gate-source leakage current|_I_GSS|_V_GS=20 V,_V_DS=0 V|-|-|100|nA|
|Drain-source on-state resistance|_R_DS(on)|_V_GS=10 V,_I_D=9.2 A,<br>_T_j=25 °C|-|0.28|0.34|W|
|||_V_GS=10 V,_I_D=9.2 A,<br>_T_j=150 °C|-|0.76|-||
|Gate resistance|_R_G|_f_=1 MHz, open drain|-|1.3|-|W|



**Rev. 2.0** 

**page 2** 

**2012-04-16** 

|**IPB90R340C3**<br>**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>Cinfineon~~es~~<br>~~ee~~|**IPB90R340C3**<br>**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>Cinfineon~~es~~<br>~~ee~~|**IPB90R340C3**<br>**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>Cinfineon~~es~~<br>~~ee~~|**IPB90R340C3**<br>**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>Cinfineon~~es~~<br>~~ee~~|**IPB90R340C3**<br>**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>Cinfineon~~es~~<br>~~ee~~|**IPB90R340C3**<br>**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>Cinfineon~~es~~<br>~~ee~~|**IPB90R340C3**<br>**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>Cinfineon~~es~~<br>~~ee~~|
|---|---|---|---|---|---|---|
|**Dynamic characteristics**|||||||
|Input capacitance<br>Output capacitance<br>Effective output capacitance, energy<br>related 6)<br>Effective output capacitance, time<br>related 7)|_C_iss<br>-<br>2400<br>-<br>_C_oss<br>-<br>120<br>-<br>_C_o(er)<br>-<br>71<br>-<br>_C_o(tr)<br>-<br>280<br>-<br>_V_GS=0 V,_V_DS=100 V,<br>_f_=1 MHz<br>_V_GS=0 V,_V_DS=0 V<br>to 500 V<br>~~===~~<br>~~SRR~~|||||pF|
|Turn-on delay time<br>Rise time<br>Turn-off delay time<br>Fall time|_t_d(on)<br>-<br>70<br>-<br>_t_r<br>-<br>20<br>-<br>_t_d(off)<br>-<br>400<br>-<br>_t_f<br>-<br>25<br>-<br>_V_DD=400 V,<br>_V_GS=10 V,_I_D=9.2A,<br>_R_G=23.1W<br>~~aEEE~~|||||ns|
|Gate Charge Characteristics|||||||
|Gate to source charge|_Q_gs||-|11|-|nC|
|Gate to drain charge|_Q_gd|_V_DD=400 V,_I_D=9.2 A,|-|41|-||
|Gate charge total|_Q_g|_V_GS=0 to 10 V|-|94|-||
|Gate plateau voltage|_V_plateau||-|4.6|-|V|
|**Reverse Diode**|||||||
|Diode forward voltage|_V_SD|_V_GS=0 V,_I_F=9.2 A,<br>_T_j=25 °C|-|0.8|1.2|V|
|Reverse recovery time|_t_rr||-|510|-|ns|
|Reverse recovery charge|_Q_rr|_V_R=400 V,_I_F=_I_S,<br>d_i_F/d_t_=100 A/µs|-|11|-|µC|
|Peak reverse recovery current|_I_rrm||-|41|-|A|



- 1) J-STD20 and JESD22 

- 2) Pulse width _t_ p limited by _T_ J,max 

- 3) Repetitive avalanche causes additional power losses that can be calculated as _P_ AV= _E_ AR* _f._ 

- 4) ISD≤ID, di/dt≤200A/µs, VDClink=400V, Vpeak<V(BR)DSS, TJ<TJ,max, identical low side and high side switch 

- 5) Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6 cm² (one layer, 70µm thick) copper area for drain connection. PCB is vertical without blown air. 

- 6) Co(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 50% VDSS. 

- 7) _C_ o(tr) is a fixed capacitance that gives the same charging time as _C_ oss while _V_ DS is rising from 0 to 50% _V_ DSS. 

**Rev. 2.0** 

**page 3** 

**2012-04-16** 

**IPB90R340C3** 

## **1 Power dissipation** 

_P_ tot=f( _T_ C) 

## **2 Safe operating area** 

_I_ D=f( _V_ DS); _T_ C=25 °C; _D_ =0 

parameter: _t_ p 

**==> picture [468 x 610] intentionally omitted <==**

**----- Start of picture text -----**<br>
250 10 [2]<br>limited by on-state<br>resistance<br>1 µs<br>200<br>10 µs<br>10 [1] 100 µs<br>150<br>1 ms<br>10 ms<br>100<br>10 [0] DC<br>50<br>0<br>10 [-1]<br>0 25 50 75 100 125 150 1 10 100 1000<br>T C [°C] V DS [V]<br>3 Max. transient thermal impedance 4 Typ. output characteristics<br>thJC=f(tP)=f(tP)P)) I  D=f( V  DS);  T  J=25 °C<br>parameter:  D=t  p// T parameter:  V  GS<br>10 [0] 50<br>10 V<br>8 V<br>40<br>,<br>0.5<br>6 V<br>30<br>0.2 5.5 V<br>10 [-1]<br>0.1<br>20<br>5 V<br>0.05<br>0.02<br>0.01 10 4.5 V<br>single pulse<br>4 V<br>10 [-2] 0<br>0 5 10 15 20 25<br>10 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1]<br>t p [s] V DS [V]<br> [W]<br> [A]<br>P tot I D<br> [K/W]  [A]<br>I D<br>thJC<br>Z<br>**----- End of picture text -----**<br>


## **3 Max. transient thermal impedance** 

ZthJC=f(tP)=f(tP)P)) 

parameter: _D=t_ p// _T_ 

**Rev. 2.0** 

**page 4** 

**2012-04-16** 

**IPB90R340C3** 

## **5 Typ. output characteristics** 

_I_ D=f( _V_ DS); _T_ J=150 °C 

parameter: _V_ GS 

## **6 Typ. drain-source on-state resistance** 

_R_ DS(on)=f( _I_ D); _T_ J=150 °C parameter: _V_ GS 

**==> picture [464 x 608] intentionally omitted <==**

**----- Start of picture text -----**<br>
25 5<br>20 V<br>10 V<br>20 TTT ) 8 V 4 Py<br>6 V<br>5 V<br>O A LTE]<br>15 3<br>4.5 V<br>10 V<br>10 2<br>f a L L<br>5 V<br>4 V<br>4.8 V<br>5 - ~- 1 4 V 4.5 V<br>Hs FE<br>Jo) ee e<br>0 0<br>0 5 10 15 20 25 0 5 10 15 20 25 30<br>V DS [V] I D [A]<br>7 Drain-source on-state resistance 8 Typ. transfer characteristics<br> DS(on)=f(=f( T  j););  I  D=9.2 A;=9.2 A;  V  GS=10 V=10 V I  D=f( V  GS);  V  DS=20V<br>parameter:  T  J<br>1 50<br>25 °C<br>0.8 40<br>y P PE<br>0.6 30<br>98 % yy) typ | p<br>150 °C<br>0.4 we) 20 f ee<br>0.2 10<br>anAo f i o<br>0 0<br>-60 -20 20 60 100 140 180 0 2 4 6 8 10<br>T J [°C] V GS [V]<br>]<br>W<br> [A]  [<br>I D DS(on)<br>R<br>]<br>W<br> [  [A]<br>DS(on) I D<br>R<br>**----- End of picture text -----**<br>


## **7 Drain-source on-state resistance** 

_R_ DS(on)=f(=f( _T_ j);); _I_ D=9.2 A;=9.2 A; _V_ GS=10 V=10 V 

**Rev. 2.0** 

**2012-04-16** 

**page 5** 

**IPB90R340C3** 

## **9 Typ. gate charge** 

## **10 Forward characteristics of reverse diode** _I_ F=f( _V_ SD) 

_V_ GS=f( _Q_ gate); _I_ D=9.2 A pulsed parameter: _V_ DD 

**==> picture [466 x 635] intentionally omitted <==**

**----- Start of picture text -----**<br>
parameter:  V  DD parameter:  T  J<br>10 10 [2]<br>8 25 °C, 98%<br>150 °C, 98%<br>10 [1]<br>/\/ ig<br>6<br>150 °C<br>400 V 720 V<br>25 °C<br>4<br>10 [0]<br>2<br>ue! ilIf<br>0 10 [-1]<br>0 20 40 60 80 100 0 0.5 1 1.5 2<br>Q gate [nC] V SD [V]<br>11 Avalanche energy 12 Drain-source breakdown voltage<br> AS=f(=f( T  J););  I  D=3.1A;=3.1A;  V  DD=50 V=50 V V  BR(DSS)=f( T  J);  I  D=0.25 mA<br>700 1050<br>600<br>1000<br>ASE<br>500<br>950<br>\ =<br>400<br>300<br>ASKe EEEEE= 900<br>200<br>850<br>NE<br>100<br>oe<br>0 800<br>25 50 75 100 125 150 -60 -20 20 60 100 140 180<br>T J [°C] T J [°C]<br> [V]<br> [A]<br>V GS I F<br> [V]<br> [mJ]<br>AS<br>E BR(DSS)<br>V<br>**----- End of picture text -----**<br>


## **11 Avalanche energy** 

_E_ AS=f(=f( _T_ J);); _I_ D=3.1A;=3.1A; _V_ DD=50 V=50 V 

**Rev. 2.0** 

**page 6** 

**2012-04-16** 

**IPB90R340C3** 

**14 Typ. Coss stored energy** _E_ oss _=_ f _(V_ DS _)_ 

**13 Typ. capacitances** 

**==> picture [469 x 309] intentionally omitted <==**

**----- Start of picture text -----**<br>
C  =f( V  DS);  V  GS=0 V;  f  =1 MHz E  oss =  f (V  DS )<br>10 [4] 12<br>Ciss<br>10<br>10 [3]<br>8<br>a oo<br>10 [2] Coss 6<br>Ko EE<br>4<br>\ oe OK<br>10 [1]<br>Crss 2<br>tem] Of<br>10 [0] 0<br>0 100 200 300 400 500 600 0 100 200 300 400 500 600<br>V DS [V] V DS [V]<br> [µJ]<br> [pF]<br>C oss<br>E<br>**----- End of picture text -----**<br>


**Rev. 2.0** 

**2012-04-16** 

**page 7** 

**IPB90R340C3** 

## **Definition of diode switching characteristics** 

**Rev. 2.0** 

**page 8** 

**2012-04-16** 

**IPB90R340C3** 

**PG-TO263 Outlines** 

**Rev. 2.0** 

**page 9** 

**2012-04-16** 

**IPB90R340C3** 

## **Published by** 

**Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved.** 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of 

conditions or characteristics. With respect to any examples or hints given herein, any typical 

values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can **reasonably be expected to cause the failure of that life** - **support device or system or to affect** the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

**Rev. 2.0** 

**page 10** 

**2012-04-16** 



## Links

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- [Supplier page](https://es.farnell.com/en-ES/infineon/ipb90r340c3atma1/mosfet-n-ch-900v-15a-to-263-3/dp/2726050RL)
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