# Power MOSFET, N Channel, 800 V, 17 A, 0.25 ohm, TO-263 (D2PAK), Surface Mount

![Product image](https://novapart.co/image/farnell:3703543RL/)

**URL**: https://novapart.co/products/IPB80R290C3AATMA2/power-mosfet-n-channel-800-v-17-a-025-ohm-to-263
**SKU**: IPB80R290C3AATMA2
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €2.0300
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | CoolMOS |
| Qualification | AEC-Q101 |
| Power Dissipation | 227W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-263 (D2PAK) |
| Drain Source Voltage Vds | 800V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 17A |
| Drain Source On State Resistance | 0.25ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3703543RL/)

**IPB80R290C3A** 

## **CoolMOS[®] Power Transistor** 

|**Product Summary**|||
|---|---|---|
||||
|_V_DS|800|V|
||||
|_R_DS(on)max|0.29|Ω|
||||
|_Q_g,typ|91|nC|



## **Features** 

- New revolutionary high voltage technology 

- Ultra low gate charge and ultra low effective capacitances 

**==> picture [67 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
PG-TO263-3-2<br>**----- End of picture text -----**<br>


- Extreme dv/dt rated 

- High peak current capability 

- Automotive AEC Q101 qualified 

- Green package (RoHS compliant) 

## **CoolMOS C3A designed for:** 

- DC/DC converters for Automotive Applications 

||||
|---|---|---|
|**Type**|**Package**|**Marking**|
||||
|IPB80R290C3A|PG-TO263-3-2|8R290C3A|



**Maximum ratings,** at _T_ j=25 °C, unless otherwise specified 

|**Parameter**<br>**Symbol**<br>~~rr~~|**Symbol **<br>~~rr~~|**Conditions**<br>~~rr~~|**Unit**<br>**Value**<br>~~rr~~|**Unit**|
|---|---|---|---|---|
|Continuous drain current<br>_I_<br>/|_I_D<br>/|_T_C=25 °C<br>~~[_-—-——~~|A<br>17<br>11<br>51<br>~~[_-—-——~~<br>~~a~~<br>~~re~~|A|
|||_T_C=100 °C<br> ~~[_-—-——~~<br>~~a~~|||
|Pulsed drain current1)<br>_I_<br>~~re~~|_I_D,pulse<br>~~re~~|_T_C=25 °C<br>~~re~~|||
|Avalanche energy, single pulse<br>_E_<br>~~rr~~|_E_AS<br>~~rr~~|_I_D=3.4 A,_V_DD=50 V<br>~~rr~~|670<br>mJ<br>0.5<br>~~rr~~<br>~~re~~|mJ|
|Avalanche energy, repetitive_t_AR<br>1),2)<br>_E_<br>~~re~~|_E_AR<br>~~re~~|_I_D=17 A,_V_DD=50 V<br>~~re~~|||
|Avalanche current, repetitive_t_AR<br>1),2)<br>_I_<br>~~rr~~|_I_AR<br>~~rr~~|~~rr~~|A<br>17<br>~~rr~~|A|
|MOSFET d_v_/d_t_ruggedness<br>d<br>~~re~~|d_v_/d_t_<br>~~re~~|_V_DS=0…640 V<br>~~re~~|V/ns<br>50<br>~~re~~|V/ns|
|Gate source voltage<br>_V_<br>~~rr~~|_V_GS<br>~~rr~~|static<br>~~rr~~|V<br>±20<br>~~rr~~|V|
|Power dissipation<br>_P_<br>~~re~~|_P_tot<br>~~re~~|_T_C=25 °C<br>~~re~~|W<br>227<br>~~re~~|W|
|Operating temperature<br>_T_<br>~~rr~~|_T_j<br>~~rr~~|~~rr~~|°C<br>-40 ... 150<br>-40 ... 150<br>~~rr~~<br>~~rr~~|°C|
|Storage temperature<br>_T_<br>~~rr~~|_T_stg<br>~~rr~~|~~rr~~|||



Rev. 2.0 

page 1 

2009-03-24 

**IPB80R290C3A** 

**Maximum ratings,** at _T_ j=25 °C, unless otherwise specified 

||**Parameter**|**Symbol **|**Conditions**||**Value**||**Unit**|
|---|---|---|---|---|---|---|---|
||Continuous diode forward current|_I_S|||17||A|
||||_T_C=25 °C|||||
||Diode pulse current1)|_I_S,pulse|||51|||
||Reverse diode d_v_/d_t_ 3)|d_v_/d_t_|||4||V/ns|
|**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Thermal characteristics**<br>**Values**<br>~~ee~~<br>~~ee ee~~||||||||
||Thermal resistance, junction - case|_R_thJC||-|-|0.55|K/W|
||||SMD version, device|||||
|||_R_thJA|on PCB, minimal|-|-|62||
||Thermal resistance, junction -||footprint|||||
||ambient||SMD version, device|||||
||||on PCB, 6 cm2 cooling|cooling<br>-|35|-||
||||area4)|||||
||Soldering temperature, reflow<br>soldering|_T_sold|MSL1; 10s|-|-|260|°C|
||**Electrical characteristics,**at_T_j=25 °C, unless otherwise specified|=25 °C, unless otherwise specified|=25 °C, unless otherwise specified|||||
||**Static characteristics**|||||||
||Drain-source breakdown voltage|_V_(BR)DSS|_V_GS=0 V,_I_D=250 µA|800|-|-|V|
||Gate threshold voltage|_V_GS(th)|_V_DS=_V_GS,_I_D=1.0 mA|2.1|3|3.9||
||Zero gate voltage drain current|_I_DSS|_V_DS=800 V,_V_GS=0 V,<br>_T_j=25 °C|-|-|25|µA|
||Gate-source leakage current|_I_GSS|_V_GS=20 V,_V_DS=0 V|-|-|100|nA|
||Drain-source on-state resistance|_R_DS(on)|_V_GS=10 V,_I_D=11 A,<br>_T_j=25 °C|-|0.25|0.29|Ω|
||||_V_GS=10 V,_I_D=11 A,<br>_T_j=150 °C|-|0.67|-||
||Gate resistance|_R_G|_f_=1 MHz, open drain|-|0.85|-|Ω|



Rev. 2.0 

page 2 

2009-03-24 

**IPB80R290C3A** 

|**IPB80R290C3A**|**IPB80R290C3A**|**IPB80R290C3A**|**IPB80R290C3A**|**IPB80R290C3A**|**IPB80R290C3A**|**IPB80R290C3A**|**IPB80R290C3A**|
|---|---|---|---|---|---|---|---|
|**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~Lr~~||||||||
||**Dynamic characteristics**|||||||
||Input capacitance<br>Output capacitance<br>Effective output capacitance, energy<br>related5)<br>Effective output capacitance, time<br>related6)||_C_iss<br>-<br>2300<br>-<br>_C_oss<br>-<br>94<br>-<br>_C_o(er)<br>-<br>72<br>-<br>_C_o(tr)<br>-<br>210<br>-<br>_V_GS=0 V,_V_DS=100 V,<br>_f_=1 MHz<br>_V_GS=0 V,_V_DS=0 V<br>to 480 V<br>~~SSeee~~<br>~~een~~<br>~~|~~ ft||||pF|
||Turn-on delay time<br>Rise time<br>Turn-off delay time<br>Fall time|_t_d(on)<br>-<br>25<br>-<br>_t_r<br>-<br>15<br>-<br>_t_d(off)<br>-<br>72<br>-<br>_t_f<br>-<br>12<br>-<br>_V_DD=400 V,<br>_V_GS=0/10 V,_I_D=17 A,<br>_R_G=4.7Ω,<br>_T_j = 125°C<br>~~So~~<br>~~Ff]~~<br>~~=~~=~~==~~|||||ns|
||Gate Charge Characteristics|||||||
||Gate to source charge||_Q_gs||-|12<br>-|nC|
||Gate to drain charge||_Q_gd|_V_DD=640 V,_I_D=17 A,|-|45<br>-||
||Gate charge total||_Q_g|_V_GS=0 to 10 V|-|88<br>117||
||Gate plateau voltage||_V_plateau||-|5.5<br>-|V|
||**Reverse Diode**|||||||
||Diode forward voltage||_V_SD|_V_GS=0 V,_I_F=_I_S,<br>_T_j=25 °C|-|1<br>1.2|V|
||Reverse recovery time||_t_rr||-|550<br>-|ns|
||Reverse recovery charge||_Q_rr|_V_R=400 V,_I_F=_I_S,<br>d_i_F/d_t_=100 A/µs|-|15<br>-|µC|
||Peak reverse recovery current||_I_rrm||-|51<br>-|A|



> 1) Pulse width _t_ p limited by _T_ j,max 

> 2) Repetitive avalanche causes additional power losses that can be calculated as _P_ AV= _E_ AR* _f._ 

> 3) _I_ SD≤ _I_ D, d _i_ /d _t_ ≤200A/µs, _V_ DClink = 400V, _V_ peak< _V_ (BR)DSS, _T_ j< _T_ jmax, identical low side and high side switch 

> 4) Device on 40mm*40mm*1.5 epoxy PCB FR4 with 6cm2 (one layer, 70µm 

> 5) _C_ o(er) is a fixed capacitance that gives the same stored energy as _C_ oss while _V_ DS is rising from 0 to 80% _V_ DSS. 

- 6) _C_ o(tr) is a fixed capacitance that gives the same charging time as _C_ oss while _V_ DS is rising from 0 to 80% _V_ DSS. 

Rev. 2.0 

page 3 

2009-03-24 

**IPB80R290C3A** 

## **2 Safe operating area** 

## **1 Power dissipation** 

_P_ tot=f( _T_ C) 

_I_ D=f( _V_ DS); _T_ C=25 °C; _D_ =0 parameter: _t_ p 

**==> picture [466 x 657] intentionally omitted <==**

**----- Start of picture text -----**<br>
240 10 [2]<br>limited by on-state<br>resistance<br>200 1 µs<br>10 µs<br>160 10 [1] 100 µs<br>1 ms<br>120<br>10 ms<br>DC<br>80 10 [0]<br>40<br>0 10 [-1]<br>0 25 50 75 100 125 150 1 10 100 1000<br>T  C [°C] V  DS [V]<br>3 Max. transient thermal impedance 4 Typ. output characteristics<br>thJC=f(=f( t  P)) I  D=f( V  DS);  T  j=25 °C<br>parameter:  D=t  p// T parameter:  V  GS<br>10 [0] 60<br>20 V<br>50<br>10 V<br>0.5<br>40<br>0.2<br>10 [-1] 30<br>0.1 6.5 V<br>0.05<br>0.02 20 6 V<br>0.01<br>5.5 V<br>10<br>single pulse<br>5 V<br>10 [-2] 0<br>10 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1] 0 5 10 15 20 25<br>t  p [s] V  DS [V]<br>page 4 2009-03-24<br>f\ b<br> [W]  [A]<br>P  tot I  D<br> [K/W]  [A]<br>I  D<br> thJC<br>Z<br>**----- End of picture text -----**<br>


## **3 Max. transient thermal impedance** 

ZthJC=f(=f( _t_ P)) 

## parameter: _D=t_ p// _T_ 

Rev. 2.0 page 4 2009-03-24 

**IPB80R290C3A** 

## **5 Typ. output characteristics** 

_I_ D=f( _V_ DS); _T_ j=150 °C parameter: _V_ GS 

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**----- Start of picture text -----**<br>
35<br>20 V<br>30 eo)<br>10 V<br>25 6 V<br>20 Ofa 4<br>5.5 V<br>15<br>—_ [fT]<br>5 V<br>10<br>fm<br>4.5 V<br>5<br>0<br>0 A 5 10 15 20 25<br>V  DS [V]<br> [A]<br>I  D<br>**----- End of picture text -----**<br>


## **7 Drain-source on-state resistance** 

_R_ DS(on)=f( _T_ j); _I_ D=11 A; _V_ GS=10 V 

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**----- Start of picture text -----**<br>
0.8<br>0.6<br>0.4<br>typ<br>0.2<br>0<br>-60 -20 20 60 100 140 180<br>T  j [°C]<br>]<br>[ Ω<br> DS(on)<br>R<br>**----- End of picture text -----**<br>


## **6 Typ. drain-source on-state resistance** 

_R_ DS(on)=f( _I_ D); _T_ j=150 °C parameter: _V_ GS 

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**----- Start of picture text -----**<br>
1.4<br>1.3<br>1.2<br>1.1 ieee et fp<br>1 |yt fp<br>0.9<br>tii 4 V 4.5 V 5 V .<br>6.5 V<br>6 V<br>0.8<br>10 V<br>20 V<br>0.7<br>ee 0 5 10 15 20<br>I  D [A]<br>]<br>Ω<br> [<br> DS(on)<br>R<br>**----- End of picture text -----**<br>


## **8 Typ. transfer characteristics** 

_I_ D=f( _V_ GS); | _V_ DS|>2| _I_ D| _R_ DS(on)max parameter: _T_ j 

**==> picture [222 x 265] intentionally omitted <==**

**----- Start of picture text -----**<br>
60<br>50 tae 25 °C<br>40<br>30<br>[-<br>20 l 150 °C<br>10<br>0<br>0 2 4 6 8 10<br>V  GS [V]<br> [A]<br>I  D<br>**----- End of picture text -----**<br>


Rev. 2.0 

2009-03-24 

page 5 

**IPB80R290C3A** 

## **10 Forward characteristics of reverse diode** 

## **9 Typ. gate charge** 

_V_ GS=f( _Q_ gate); _I_ D=17 A pulsed parameter: _V_ DD 

_I_ F=f( _V_ SD) parameter: _T_ j 

**==> picture [464 x 611] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 10 [2]<br>8 yy<br>160 V<br>25 °C<br>640 V<br>10 [1]<br>6 150  ° C<br>4<br>10 [0]<br>2<br>|<br>0 10 [-1]<br>0 20 40 60 80 100 0 0.5 1 1.5 2<br>Q  gate [nC] V  SD [V]<br>11 Avalanche energy 12 Drain-source breakdown voltage<br> AS=f(=f( T  j); );  I  D=3.4 A; =3.4 A;  V  DD=50 V=50 V V  BR(DSS)=f( T  j);  I  D=0.25 mA<br>700 960<br>600 a 920<br>500 A=} 880<br>400 \O 840<br>300 A 800<br>200 oN 760<br>100 on 720<br>0 NN 680<br>25 50 75 100 125 150 -60 -20 20 60 100 140 180<br>T  j [°C] T  j [°C]<br> [V]  [A]<br>V  GS I  F<br> [V]<br> [mJ]<br> AS<br>E  BR(DSS)<br>V<br>**----- End of picture text -----**<br>


## **11 Avalanche energy** 

_E_ AS=f(=f( _T_ j); ); _I_ D=3.4 A; =3.4 A; _V_ DD=50 V=50 V 

Rev. 2.0 

page 6 

2009-03-24 

**IPB80R290C3A** 

**13 Typ. capacitances** 

## **14 Typ. Coss stored energy** 

_C_ =f( _V_ DS); _V_ GS=0 V; _f_ =1 MHz 

_E_ oss _=_ f _(V_ DS _)_ 

**==> picture [464 x 267] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 [4] 18<br>Ciss 16<br>14 E<br>10 [3] EES T T L E LLLIL<br>12<br>Sannea<br>10 SannEy4n<br>Coss<br>10 [2]<br>8<br>6<br>| PC EEL YE<br>10 [1]<br>Bee 4 Saep4nen<br>Crss<br>2<br>10 [0] a gees 0 aapZTESUd4nenendane<br>0 100 200 300 400 500 0 100 200 300 400 500 600 700 800<br>V  DS [V] V  DS [V]<br> [µJ]<br>  [pF]<br>C  oss<br>E<br>**----- End of picture text -----**<br>


Rev. 2.0 

2009-03-24 

page 7 

**IPB80R290C3A** 

## **Definition of diode switching characteristics** 

Rev. 2.0 

page 8 

2009-03-24 

**IPB80R290C3A** 

**PG-TO263-3-2: Outlines** 

Rev. 2.0 

page 9 

2009-03-24 

**IPB80R290C3A** 

## **Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved.** 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including ‑ without limitation warranties of non infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). 

## **Warnings** 

Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

Rev. 2.0 

page 10 

2009-03-24 



## Links

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- [Supplier page](https://es.farnell.com/infineon/ipb80r290c3aatma2/mosfet-n-ch-800v-17a-to-263/dp/3703543RL)
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