# Power MOSFET, N Channel, 120 V, 100 A, 4000 µohm, TO-263 (D2PAK), Surface Mount

![Product image](https://novapart.co/image/farnell:3227629/)

**URL**: https://novapart.co/products/IPB100N12S305ATMA1/power-mosfet-n-channel-120-v-100-a-4000-ohm-to-263
**SKU**: IPB100N12S305ATMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €2.5500
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (21-Jan-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | OptiMOS-T |
| Qualification | AEC-Q101 |
| Power Dissipation | 300W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-263 (D2PAK) |
| Drain Source Voltage Vds | 120V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 100A |
| Drain Source On State Resistance | 4000µohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3227629/)

**IPB100N12S3-05 IPI100N12S3-05, IPP100N12S3-05** 

## **OptiMOS[®] -T Power-Transistor** 

|**Product Summary**|||
|---|---|---|
||||
|_V_DS|120|V|
||||
|_R_DS(on),max(SMD version)|4.8|mW|
||||
|_I_D|100|A|



## **Features** 

- OptiMOS™ - power MOSFET for automotive applications 

- N-channel - Enhancement mode 

- Automotive AEC Q101 qualified 

**==> picture [236 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
PG-TO263-3-2  PG-TO262-3-1  PG-TO220-3-1<br>**----- End of picture text -----**<br>


- MSL1 up to 260°C peak reflow 

- 175°C operating temperature 

- Green product (RoHS compliant) 

• 100% Avalanche tested 

|~~—-~~|~~—- +~~|~~+~~|
|---|---|---|
|Type<br>~~—-~~|Package<br>~~—- +~~|Marking<br>~~+~~|
|~~—-~~|~~—- +~~|~~+~~|
|IPB100N12S3-05<br>~~—-~~|PG-TO263-3-2<br>~~—- +~~|3PN1205<br>~~+~~|
|~~—-~~|~~—- +~~|~~+~~|
|IPI100N12S3-05<br>~~—-~~|PG-TO262-3-1<br>~~—- +~~|3PN1205<br>~~+~~|
|~~—-~~|~~—- +~~|~~+~~|
|IPP100N12S3-05<br>~~—-~~|PG-TO220-3-1<br>~~—- +~~|3PN1205<br>~~+~~|



## **Maximum ratings,** at _T_ j=25 °C, unless otherwise specified 

|**Maximum ratings,**at_T_j=25 °C, unless otherwise specified=25 °C, unless otherwise specified|j=25 °C, unless otherwise specified=25 °C, unless otherwise specified|j=25 °C, unless otherwise specified=25 °C, unless otherwise specified|||
|---|---|---|---|---|
|**Parameter**|**Symbol**|**Conditions**|**Unit**<br>**Value**|**Unit**|
|Continuous drain current1)|_I_D|_T_C=25 °C,_V_GS=10 V|100<br>A<br>100<br>400|A|
|||_T_C=100 °C,<br>_V_GS=10 V2)|||
|Pulsed drain current2)|_I_D,pulse|_T_C=25 °C|||
|Avalanche energy, single pulse2)|_E_AS|_I_D=50A|1445<br>mJ|mJ|
|Avalanche current, single pulse|_I AS_|_-_|100<br>A|A|
|Gate source voltage|_V_GS|-|±20<br>V|V|
|Power dissipation|_P_tot|_T_C=25 °C|300<br>W|W|
|Operating and storage temperature|_T_j,_T_stg|-|-55 ... +175<br>°C|°C|



Rev. 1.0 

page 1 

2016-06-20 

|||||**IPB100N12S3-05**|**IPB100N12S3-05**|**IPB100N12S3-05**|
|---|---|---|---|---|---|---|
|||||**IPI100N12S3-05, IPP100N12S3-05**|||
|**Parameter**<br>**Thermal characteristics2)**<br>~~ee ~~||**Symbol**<br>**Conditions**<br> ~~ee ~~|||**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br> ~~ee~~||
||Thermal resistance, junction - case|_R_thJC|-||-|-<br>0.5<br>K/W|
||Thermal resistance, junction -<br>ambient, leaded|_R_thJA|-||-|-<br>62|
||SMD version, device on PCB|_R_thJA|minimal footprint||-|-<br>62|
||||6 cm|6 cm2cooling area3)|-|-<br>40|



**Electrical characteristics,** at _T_ j=25 °C, unless otherwise specified 

|**Static characteristics**|||||||
|---|---|---|---|---|---|---|
|Drain-source breakdown voltage|_V_(BR)DSS|_V_GS=0 V,_I_D= 1 mA|120|-|-|V|
|Gate threshold voltage|_V_GS(th)|_V_DS=_V_GS,_I_D=240µA|2.0|3.0|4.0||
|Zero gate voltage drain current|_I_DSS|_V_DS=120 V,_V_GS=0 V,<br>_T_j=25 °C|-|0.01|1|µA|
|||_V_DS=120 V,_V_GS=0 V,<br>_T_j=125 °C2)|-|1|100||
|Gate-source leakage current|_I_GSS|_V_GS=20V,_V_DS=0V|-|-|100|nA|
|Drain-source on-state resistance|_R_DS(on)|_V_GS=10V,_I_D=100A|-|4.3|5.1|mW|
|||_V_GS=10V,_I_D=100A,<br>SMD version|-|4.0|4.8||



Rev. 1.0 

page 2 

2016-06-20 

||||**IPB100N12S3-05**|**IPB100N12S3-05**|**IPB100N12S3-05**|**IPB100N12S3-05**|**IPB100N12S3-05**|
|---|---|---|---|---|---|---|---|
||||**IPI100N12S3-05, IPP100N12S3-05**|||||
|**Parameter**<br>~~ee ~~||**Symbol**<br>**Conditions**<br> ~~ee~~||**min.**|**typ.**<br>**Values**|**max.**|**Unit**|
||**Dynamic characteristics2)**|||||||
||Input capacitance|_C_iss||-|8900|11570|pF|
||Output capacitance|_C_oss|_V_GS=0V,_V_DS=25V,<br>_f_=1MHz|-|2520|3276||
||Reverse transfer capacitance|Crss||-|220|330||
||Turn-on delay time|_t_d(on)||-|34|-|ns|
||Rise time|_t_r|_V_DD=20V,_V_GS=10V,|-|17|-||
||Turn-off delay time|_t_d(off)|_I_D=80A,_R_G=3.5W|-|60|-||
||Fall time|_t_f||-|20|-||
||**Gate Charge Characteristics2)**|||||||
||Gate to source charge|_Q_gs||-|46|61|nC|
||Gate to drain charge|_Q_gd|_V_DD=96V,_I_D=100A,|-|34|51||
||Gate charge total|_Q_g|_V_GS=0 to 10V|-|139|185||
||Gate plateau voltage|_V_plateau||-|5.5|-|V|
||**Reverse Diode**|||||||
||Diode continous forward current2)|_I_S||-|-|100|A|
||||_T_C=25°C|||||
||Diode pulse current2)|_I_S,pulse||-|-|400||
||Diode forward voltage|_V_SD|_V_GS=0V,_I_F=100A,<br>_T_j=25°C|0.6|1|1.2|V|
||Reverse recovery time2)|_t_rr|_V_R=60V,_I_F=50A,<br>d_i_F/d_t_=100A/µs|-|108|-|ns|
||Reverse recovery charge2)|_Q_rr||-|380|-|nC|



- 1) Current is limited by bondwire; with an _R_ thJC = 0.5K/W the chip is able to carry 165A at 25°C. For detailed information see Application Note ANPS071E 

2) Defined by design. Not subject to production test. 

3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 

Rev. 1.0 

page 3 

2016-06-20 

**IPB100N12S3-05 IPI100N12S3-05, IPP100N12S3-05** 

## **1 Power dissipation** 

_P_ tot = f( _T_ C); _V_ GS = 10 V 

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**----- Start of picture text -----**<br>
300<br>250<br>200<br>150<br>100<br>50<br>0<br>0 50 100 150 200<br>T C [°C]<br> [W]<br>tot<br>P<br>**----- End of picture text -----**<br>


## **3 Safe operating area** 

_I_ D = f( _V_ DS); _T_ C = 25 °C; _D_ = 0; SMD parameter: _t_ p 

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**----- Start of picture text -----**<br>
1000<br>1 µs<br>10 µs<br>100 µs<br>100<br>1 ms<br>10<br>1<br>0.1 1 10 100 1000<br>V DS [V]<br> [A]<br>I D<br>**----- End of picture text -----**<br>


## **2 Drain current** 

_I_ D = f( _T_ C); _V_ GS = 10 V; SMD 

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**----- Start of picture text -----**<br>
100<br>80<br>60<br>40<br>20<br>0<br>0 50 100 150 200<br>T C [°C]<br> [A]<br>I D<br>**----- End of picture text -----**<br>


**4 Max. transient thermal impedance** _Z_ thJC = f( _t_ p) 

parameter: _D_ = _t_ p/ _T_ 

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**----- Start of picture text -----**<br>
10 [1 ]<br>10 [0 ]<br>0.5<br>H ERE<br>10 [-1 ]<br>0.1<br>0.05<br>0.01<br>10 [-2 ]<br>single pulse<br>10 [-3 ]<br>10 [-6 ] 10 [-5 ] 10 [-4 ] 10 [-3 ] 10 [-2 ] 10 [-1 ] 10 [0 ]<br>t p [s]<br> [K/W]<br>thJC<br>Z<br>**----- End of picture text -----**<br>


Rev. 1.0 

page 4 

2016-06-20 

**IPB100N12S3-05 IPI100N12S3-05, IPP100N12S3-05** 

## **5 Typ. output characteristics** 

_I_ D = f( _V_ DS); _T_ j = 25 °C; SMD 

parameter: _V_ GS 

## **6 Typ. drain-source on-state resistance** 

_R_ DS(on) = f( _I_ D); _T_ j = 25 °C; SMD parameter: _V_ GS 

**==> picture [465 x 603] intentionally omitted <==**

**----- Start of picture text -----**<br>
400 9<br>10 V  7 V  6.5 V<br>360<br>S S 8 Too<br>320 y]<br>5.5 V<br>280<br>6 V  7<br>240<br>200 fo 6 A E<br>160 5.5 V  6 V<br>pa f e<br>5<br>120 6.5 V<br>5 V  7 V<br>80<br>p—— 4 4 e e 10 V<br>40<br>0 |pees 3 Seti aaaza rae<br>0 1 2 3 4 5 0 20 40 60 80 100 120 140 160 180<br>V DS [V]  I D [A]<br>7 Typ. transfer characteristics 8 Typ. drain-source on-state resistance<br>= f( V  GS); );  V  DS = 6V= 6V R  DS(on) = f( T  j);  I  D = 100 A;  V  GS = 10 V; SMD<br>parameter:  T  j<br>350 8.5<br>300<br>250 f/ 7.5<br>6.5<br>200<br>5.5<br>}f<br>150<br>4.5<br>100<br>175 °C<br>50 3.5<br>25 °C<br>-55 °C<br>0 yy,<br>2.5<br>3 4 5 6 7<br>-60 -20 20 60 100 140 180<br>V GS [V]  °C]<br> [A]   [mΩ]<br>I D<br>DS(on)<br>R<br>]<br>W<br> [A]  [m<br>I D<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


## **7 Typ. transfer characteristics** 

_I_ D = f( _V_ GS); ); _V_ DS = 6V= 6V 

parameter: _T_ j 

**==> picture [225 x 268] intentionally omitted <==**

**----- Start of picture text -----**<br>
8.5<br>7.5<br>6.5<br>5.5<br>4.5<br>3.5<br>2.5<br>-60 -20 20 60 100 140 180<br>T j [°C]<br>]<br>W<br>[m<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


Rev. 1.0 

2016-06-20 

page 5 

**IPB100N12S3-05 IPI100N12S3-05, IPP100N12S3-05** 

## **9 Typ. gate threshold voltage** 

_V_ GS(th) = f( _T_ j); _V_ GS = _V_ DS 

## **10 Typ. capacitances** 

_C_ = f( _V_ DS); _V_ GS = 0 V; _f_ = 1 MHz 

parameter: _I_ D 

**==> picture [226 x 267] intentionally omitted <==**

**----- Start of picture text -----**<br>
4<br>3.5<br>3<br>am 1200 µA<br>240 µA<br>2.5<br>\<br>2<br>1.5 \<br>-60 -20 20 60 100 140 180<br>T j [°C]<br> [V]<br>GS(th)<br>V<br>**----- End of picture text -----**<br>


## **11 Typical forward diode characteristics** 

## IF = f(VSD) 

parameter: _T_ j 

**==> picture [225 x 267] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 [3 ]<br>10 [2 ]<br>175 °C  25 °C<br>10 [1 ]<br>10 [0 ]<br>0 0.2 0.4 0.6 0.8 1 1.2 1.4<br>V SD [V]<br> [A]<br>I F<br>**----- End of picture text -----**<br>


**==> picture [224 x 190] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 [4 ] Ciss<br>Coss<br>10 [3 ]<br>Crss<br>10 [2 ]<br>0 5 10 15 20 25 30<br>V DS [V]<br> [pF]<br>C<br>**----- End of picture text -----**<br>


## **12 Typ. avalanche characteristics** 

_I_ A S= f( _t_ AV) 

parameter: Tj(start) 

**==> picture [228 x 269] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>100<br>25 °C<br>100 °C<br>150 °C<br>10<br>1<br>0.1 1 10 100 1000<br>t AV [µs]<br> [A]<br>I AV<br>**----- End of picture text -----**<br>


Rev. 1.0 

page 6 

2016-06-20 

**IPB100N12S3-05 IPI100N12S3-05, IPP100N12S3-05** 

## **13 Typical avalanche energy** 

_E_ AS = f( _T_ j) 

## **14 Typ. drain-source breakdown voltage** 

_V_ BR(DSS) = f( _T_ j); _I_ D = 1 mA 

parameter: _I_ D 

**==> picture [226 x 610] intentionally omitted <==**

**----- Start of picture text -----**<br>
3500<br>3000<br>25 A<br>2500<br>2000<br>1500<br>50 A<br>1000<br>100 A<br>500<br>0<br>25 75 125 175<br>T j [°C]<br>15 Typ. gate charge<br> GS = f(= f( Q  gate); );  I  D = 100 A pulsed= 100 A pulsed<br>parameter:  V  DD<br>10<br>9<br>24 V<br>8 96 V<br>7<br>6<br>VA<br>5<br>4<br>| Yi<br>3<br>2<br>1<br>/<br>0<br>0 20 40 60 80 100 120 140<br>Q gate [nC]<br> [mJ]<br>AS<br>E<br> [V]<br>GS<br>V<br>**----- End of picture text -----**<br>


## **15 Typ. gate charge** 

_V_ GS = f(= f( _Q_ gate); ); _I_ D = 100 A pulsed= 100 A pulsed parameter: _V_ DD 

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**----- Start of picture text -----**<br>
135<br>130<br>125<br>120<br>115<br>110<br>-55 -15 25 65 105 145<br>T j [°C]<br> [V]<br>BR(DSS)<br>V<br>**----- End of picture text -----**<br>


## **16 Gate charge waveforms** 

**==> picture [207 x 227] intentionally omitted <==**

**----- Start of picture text -----**<br>
V  GS<br>Q g<br>V  gs(th)<br>Q  g(th) Q  sw Q gate<br>Q  gs Q  gd<br>**----- End of picture text -----**<br>


Rev. 1.0 

2016-06-20 

page 7 

**IPB100N12S3-05 IPI100N12S3-05, IPP100N12S3-05** 

## **Published by Infineon Technologies AG 81726 Munich, Germany** 

## **© Infineon Technologies AG 2016 All Rights Reserved.** 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including `‑` without limitation warranties of non infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( **www.infineon.com** ). 

## **Warnings** 

Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

Rev. 1.0 

page 8 

2016-06-20 

**IPB100N12S3-05 IPI100N12S3-05, IPP100N12S3-05** 

|Revision History|Revision History||||
|---|---|---|---|---|
|**Version**||Date||Changes|
|Revision 1.0|Revision 1.0||20.06.2016|Final Data Sheet|



Rev. 1.0 

page 9 

2016-06-20 



## Links

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- [Supplier page](https://es.farnell.com/infineon/ipb100n12s305atma1/mosfet-n-ch-120v-175deg-c-300w/dp/3227629)
---

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