# Power MOSFET, N Channel, 900 V, 5.7 A, 1 ohm, TO-220, Through Hole

![Product image](https://novapart.co/image/farnell:1664003/)

**URL**: https://novapart.co/products/IPA90R1K0C3XKSA1/power-mosfet-n-channel-900-v-57-a-1-ohm-to-220
**SKU**: IPA90R1K0C3XKSA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5790
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Power Dissipation | 32W |
| Transistor Mounting | Through Hole |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 32W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 1ohm |
| Transistor Case Style | TO-220 |
| Drain Source Voltage Vds | 900V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 5.7A |
| Drain Source On State Resistance | 1ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1664003/)

**IPA90R1K0C3** 

## **CoolMOS[™] Power Transistor** 

## **Features** 

- Lowest figure-of-merit RON x Qg 

- Extreme dv/dt rated 

## **Product Summary** 

|**Product Summary**|||
|---|---|---|
||||
|_V_DS@_T_J=25°C|900|V|
||||
|_R_DS(on),max@_T_J= 25°C|1.0|Ω|
||||
|_Q_g,typ|34|nC|



- High peak current capability 

- Qualified according to JEDEC[1)  ] for target applications 

- Pb-free lead plating; RoHS compliant 

- Ultra low gate charge 

## PG-TO220 FP 

## **CoolMOS™ 900V is designed for:** 

- Quasi Resonant Flyback / Forward topologies 

- PC Silverbox and consumer applications 

- Industrial SMPS 

|**Type**||**Package**|||**Marking**|
|---|---|---|---|---|---|
|||||||
|IPA90R1K0C3||PG-TO220 FP|PG-TO220 FP||9R1K0C|



**Maximum ratings,** at _T_ J=25 °C, unless otherwise specified 

|**Parameter**<br>**Symbol**<br>~~i~~|**Symbol **<br>~~i~~|**Conditions**<br>~~i~~<br>~~-_+~~|**Unit**<br>**Value**<br>~~i~~<br>~~+~~|**Unit**|
|---|---|---|---|---|
|Continuous drain current2)<br>_I_<br>~~|~~|_I_D<br>~~|~~|_T_C=25 °C<br>~~|~~<br>~~-_+~~|A<br>5.7<br>3.6<br>12<br>~~|~~<br>~~+~~<br>~~i~~<br>~~ee~~|A|
|||_T_C=100 °C<br>~~|~~<br>~~-_+~~<br>~~i~~|||
|Pulsed drain current3)<br>_I_<br>~~ee~~|_I_D,pulse<br>~~ee~~|_T_C=25 °C<br>~~-_ +~~<br>~~ee~~|||
|Avalanche energy, single pulse<br>_E_<br>~~a~~|_E_AS<br>~~a~~|_I_D=1.1 A,_V_DD=50 V<br>~~a~~|97<br>mJ<br>0.37<br>~~a~~<br>~~ee~~|mJ|
|Avalanche energy, repetitive_t_AR<br>3),4)<br>_E_<br>~~ee~~|_E_AR<br>~~ee~~|_I_D=1.1 A,_V_DD=50 V<br>~~ee~~|||
|Avalanche current, repetitive_t_AR<br>3),4)<br>_I_<br>~~a~~|_I_AR<br>~~a~~|~~a~~|A<br>1.1<br>~~a~~|A|
|MOSFET d_v_/d_t_ruggedness<br>d<br>~~ee~~|d_v_/d_t_<br>~~ee~~|_V_DS=0...400 V<br>~~ee~~|V/ns<br>50<br>~~ee~~|V/ns|
|Gate source voltage<br>_V_<br>~~ee~~|_V_GS<br>~~ee~~|static<br>~~ee~~|V<br>±30<br>±20<br>~~ee~~<br>~~a~~|V<br>~~a~~|
|||AC (f>1 Hz)<br>~~ee~~<br>~~a~~|||
|Power dissipation<br>_P_<br>~~a~~|_P_tot<br>~~a~~|_T_C=25 °C<br>~~a~~|W<br>32<br>~~a~~|W|
|Operating and storage temperature<br>_T_<br>~~ee~~|_T_J,_T_stg<br>~~ee~~|~~ee~~|°C<br>-55 ... 150<br>~~ee~~|°C|
|Mounting torque<br>~~i~~|~~i~~|M2.5 screws<br>~~i~~|50<br>Ncm<br>~~i~~|Ncm|



Rev. 1.0 

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2008-07-29 

**IPA90R1K0C3** 

**Maximum ratings,** at _T_ J=25 °C, unless otherwise specified 

|**Parameter**|**Symbol **|**Conditions**|**Value**|**Unit**|
|---|---|---|---|---|
|Continuous diode forward current2)|_I_S|_T_C=25 °C|3.3|A|
|Diode pulse current3)|_I_S,pulse||13||
|Reverse diode d_v_/d_t_5)|d_v_/d_t_||4|V/ns|



**Parameter Symbol Conditions Values Unit min. typ. max.** ~~es ee ee~~ 

## **Thermal characteristics** 

|**Parameter**<br>**Thermal characteristics**<br>~~es ee ee~~|**Symbol **<br>~~es ee ee~~|**Conditions**<br>~~es ee ee ~~|**min.**<br> ~~ee~~|**typ.**<br>**Values**<br>~~ee~~|**max.**<br>~~ee~~|**Unit**<br>~~ee~~|
|---|---|---|---|---|---|---|
|Thermal resistance, junction - case|_R_thJC||-|-|3.9|K/W|
|Thermal resistance, junction -<br>ambient|_R_thJA|leaded|-|-|62||
|Soldering temperature,<br>wavesoldering only allowed at leads|_T_sold|1.6 mm (0.063 in.)<br>from case for 10 s|-|-|260|°C|



**Electrical characteristics,** at _T_ J=25 °C, unless otherwise specified 

## **Static characteristics** 

|**Static characteristics**|||||||
|---|---|---|---|---|---|---|
|Drain-source breakdown voltage|_V_(BR)DSS|_V_GS=0 V,_I_D=250 µA|900|-|-|V|
|Gate threshold voltage|_V_GS(th)|_V_DS=_V_GS,_I_D=0.37 mA|2.5|3|3.5||
|Zero gate voltage drain current|_I_DSS|_V_DS=900 V,_V_GS=0 V,<br>_T_j=25 °C|-|-|1|µA|
|||_V_DS=900 V,_V_GS=0 V,<br>_T_j=150 °C|-|10|-||
|Gate-source leakage current|_I_GSS|_V_GS=20 V,_V_DS=0 V|-|-|100|nA|
|Drain-source on-state resistance|_R_DS(on)|_V_GS=10 V,_I_D=3.3 A,<br>_T_j=25 °C|-|0.78|1|Ω|
|||_V_GS=10 V,_I_D=3.3 A,<br>_T_j=150 °C|-|2.1|-||
|Gate resistance|_R_G|_f_=1 MHz, open drain|-|1.3|-|Ω|



Rev. 1.0 

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2008-07-29 

**IPA90R1K0C3** 

|~~ee~~|**Parameter**<br>~~ee~~|**Symbol **<br>~~ee~~|<br>~~ee~~|**Conditions**<br>**min.**<br>~~ee~~|**typ.**<br>**Values**<br>~~ee~~|**max.**<br>~~ee~~|**Unit**<br>~~ee~~|
|---|---|---|---|---|---|---|---|
|~~ee~~|~~ee~~|~~ee~~|~~ee~~|~~ee~~|~~ee~~|~~ee~~|~~ee~~|
||**Dynamic characteristics**|||||||
||Input capacitance<br>Output capacitance|_C_iss<br>-<br>850<br>-<br>_C_oss<br>-<br>42<br>-<br>_V_GS=0 V,_V_DS=100 V,<br>_f_=1 MHz<br>~~ee~~|||||pF|
||Effective output capacitance, energy<br>related6)<br>Effective output capacitance, time<br>related7)|_C_o(er)<br>-<br>28<br>-<br>_C_o(tr)<br>-<br>100<br>-<br>_V_GS=0 V,_V_DS=0 V<br>to 500 V<br>~~aa~~<br>~~Z~~<br>~~eT~~||||||
||Turn-on delay time<br>Rise time<br>Turn-off delay time<br>Fall time<br>Gate Charge Characteristics|_t_d(on)<br>-<br>70<br>-<br>_t_r<br>-<br>20<br>-<br>_t_d(off)<br>-<br>400<br>-<br>_t_f<br>-<br>35<br>-<br>_V_DD=400 V,<br>_V_GS=10 V,_I_D=3.3 A,<br>_R_G=62.4Ω<br>~~EEE~~<br>~~||~~<br>~~|~~<br>~~|~~|||||ns|
||Gate to source charge|_Q_gs||-|4|-|nC|
||Gate to drain charge|_Q_gd||-<br>_V_DD=400 V,_I_D=3.3 A,|15|-||
||Gate charge total|_Q_g||-<br>_V_GS=0 to 10 V|34|tbd||
||Gate plateau voltage|_V_plateau||-|4.5|-|V|
||**Reverse Diode**|||||||
||Diode forward voltage|_V_SD||_V_GS=0 V,_I_F=3.3 A,<br>_T_j=25 °C<br>-|0.8|1.2|V|
||Reverse recovery time|_t_rr||-|340|-|ns|
||Reverse recovery charge|_Q_rr||-<br>_V_R=400 V,_I_F=_I_S,<br>d_i_F/d_t_=100 A/µs|4.1|-|µC|
||Peak reverse recovery current|_I_rrm||-|21|-|A|



- 1) J-STD20 and JESD22 

- 2) Limited only by maximum temperature 

- 3) Pulse width _t_ p limited by _T_ J,max 

- 4) Repetitive avalanche causes additional power losses that can be calculated as _P_ AV= _E_ AR* _f._ 

- 5) ISD≤ID, di/dt≤ 200 A/µs, VDClink=400V, Vpeak<V(BR)DSS, TJ<TJ,max, identical low side and high side switch 

- 6) _C_ o(er) is a fixed capacitance that gives the same stored energy as _C_ oss while _V_ DS is rising from 0 to 50% _V_ DSS. 

- 7) _C_ o(tr) is a fixed capacitance that gives the same charging time as _C_ oss while _V_ DS is rising from 0 to 50% _V_ DSS. 

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2008-07-29 

**IPA90R1K0C3** 

## **2 Safe operating area** 

## **1 Power dissipation** 

_P_ tot=f( _T_ C) 

_I_ D=f( _V_ DS); _T_ C=25 °C; _D_ =0 parameter: _t_ p 

**==> picture [436 x 575] intentionally omitted <==**

**----- Start of picture text -----**<br>
40 10 [2]<br>limited by on-state<br>resistance<br>30<br>10 [1] 1 µs<br>10 µs<br>100 µs<br>20 1 ms<br>10 ms<br>10 [0]<br>10<br>DC<br>0 10 [-1]<br>0 25 50 75 100 125 150 1 10 100 1000<br>T  C [°C] V  DS [V]<br>3 Max. transient thermal impedance 4 Typ. output characteristics<br>thJC=f(tP)=f(tP)P)) I  D=f( V  DS);  T  J=25 °C<br>parameter:  D=t  p// T parameter:  V  GS<br>10 [1] 20<br>20 V<br>10 V<br>0.5 8 V<br>15<br>10 [0]<br>0.2 6 V<br>0.1 5.5 V<br>10<br>0.05<br>0.02<br>10 [-1] 0.01 5 V<br>single pulse<br>5<br>4.5 V<br>4 V<br>10 [-2] 0<br>10 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1] 10 [0] 10 [1] 0 5 10 15 20 25<br>t  p [s] V  DS [V]<br> [W]  [A]<br>P  tot I  D<br> [K/W]  [A]<br>I  D<br> thJC<br>Z<br>**----- End of picture text -----**<br>


**3 Max. transient thermal impedance** 

ZthJC=f(tP)=f(tP)P)) 

parameter: _D=t_ p// _T_ 

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2008-07-29 

page 4 

**IPA90R1K0C3** 

**5 Typ. output characteristics** 

_I_ D=f( _V_ DS); _T_ J=150 °C 

parameter: _V_ GS 

## **6 Typ. drain-source on-state resistance** 

_R_ DS(on)=f( _I_ D); _T_ J=150 °C parameter: _V_ GS 

**==> picture [432 x 249] intentionally omitted <==**

**----- Start of picture text -----**<br>
8 10<br>20 V<br>10 V<br>8 V<br>6 V<br>5.5 V<br>8<br>5 V<br>6<br>4.5 V 10 V<br>6<br>4<br>4 5 V<br>4 V 4.8 V<br>4.5 V<br>2 4 V<br>2<br>0 0<br>0 5 10 15 20 25 0 2 4 6 8 10 12<br>V  DS [V] I  D [A]<br>]<br>Ω<br> [A]  [<br>I  D<br> DS(on)<br>R<br>**----- End of picture text -----**<br>


## **7 Drain-source on-state resistance** 

_R_ DS(on)=f( _T_ J); _I_ D=3.3 A; _V_ GS=10 V 

## **8 Typ. transfer characteristics** 

_I_ D=f( _V_ GS); _V_ DS≥20V 

parameter: _T_ J 

**==> picture [431 x 251] intentionally omitted <==**

**----- Start of picture text -----**<br>
3 20<br>2.5<br>25 °C<br>15<br>2<br>1.5 10<br>98 %<br>150 °C<br>1<br>typ<br>5<br>0.5<br>0 0<br>-60 -20 20 60 100 140 180 0 2 4 6 8 10<br>T  j [°C] V  GS [V]<br>]<br>[ Ω  [A]<br>I  D<br> DS(on)<br>R<br>**----- End of picture text -----**<br>


Rev. 1.0 

2008-07-29 

page 5 

**IPA90R1K0C3** 

**9 Typ. gate charge** 

_V_ GS=f( _Q_ gate); _I_ D=3.3 A pulsed parameter: _V_ DD 

## **10 Forward characteristics of reverse diode** 

_I_ F=f( _V_ SD) parameter: _T_ J 

**==> picture [430 x 253] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 10 [2]<br>8 25 °C, 98%<br>150 °C, 98%<br>10 [1]<br>6 400 V 720 V<br>25 °C<br>150 °C<br>4<br>10 [0]<br>2<br>0 10 [-1]<br>0 10 20 30 40 0 0.5 1 1.5 2<br>Q  gate [nC] V  SD [V]<br> [V]<br> [A]<br>V  GS I  F<br>**----- End of picture text -----**<br>


## **11 Avalanche energy** 

_E_ AS=f( _T_ j); _I_ D=1.1 A; _V_ DD=50 V 

## **12 Drain-source breakdown voltage** 

_V_ BR(DSS)=f( _T_ j); _I_ D=0.25 mA 

**==> picture [434 x 250] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 1050<br>80 1000<br>60 950<br>40 900<br>20 850<br>0 800<br>25 50 75 100 125 150 -60 -20 20 60 100 140 180<br>T  J [°C] T  J [°C]<br> [V]<br> [mJ]<br> AS<br>E  BR(DSS)<br>V<br>**----- End of picture text -----**<br>


Rev. 1.0 

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2008-07-29 

**IPA90R1K0C3** 

**13 Typ. capacitances** 

_C_ =f( _V_ DS); _V_ GS=0 V; _f_ =1 MHz 

## **14 Typ. Coss stored energy** 

_E_ oss _=_ f _(V_ DS _)_ 

**==> picture [434 x 249] intentionally omitted <==**

**----- Start of picture text -----**<br>
10000 5<br>| Ciss 4 TLL<br>1000<br>3<br>100<br>Coss 2<br>Re<br>10<br>1<br>\—— Crss Bzanil<br>1 faa 0<br>0 100 200 300 400 500 600 0 100 200 300 400 500 600<br>V  DS [V] V  DS [V]<br> [µJ]<br>  [pF]<br>C  oss<br>E<br>**----- End of picture text -----**<br>


Rev. 1.0 

2008-07-29 

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**IPA90R1K0C3** 

## **Definition of diode switching characteristics** 

Rev. 1.0 

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**IPA90R1K0C3** 

## **PG-TO220 FP Outline/Fully isolated package (2500VAC; 1 minute)** 

Dimensions in mm/inches 

Rev. 1.0 

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2008-07-29 

**IPA90R1K0C3** 

## **Published by** 

**Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved.** 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

Rev. 1.0 

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2008-07-29 



## Links

- [View this product on Novapart](https://novapart.co/products/IPA90R1K0C3XKSA1/power-mosfet-n-channel-900-v-57-a-1-ohm-to-220)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/en-ES/infineon/ipa90r1k0c3xksa1/mosfet-n-to-220/dp/1664003)
---

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