# Intelligent Power Module (IPM), IGBT, 600 V, 35 A, 2 kV, DIP, CIPOS

![Product image](https://novapart.co/image/farnell:4707489/)

**URL**: https://novapart.co/products/IM06B50GC1XKMA1/intelligent-power-module-ipm-igbt-600-v-35-a-2-kv
**SKU**: IM06B50GC1XKMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || Intelligent Power Modules
**Price**: €14.1800
**Stock**: 200+
**Lead Time**: 204 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| Ipm Series | CIPOS |
| Product Range | CIPOS Mini Series |
| Ipm Case Style | DIP |
| Ipm Power Device | IGBT |
| Isolation Voltage | 2kV |
| Current Rating (Ic / Id) | 35A |
| Voltage Rating (Vces / Vdss) | 600V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4707489/)

## **IM06B50GC1 datasheet** 

## **CIPOS™ Mini IPM** 

## **IM06B50GC1, 600 V 50 A** 

## **Description** 

The CIPOS™ Mini IPM, IM06B50GC1 offers the chance for integrating various power and control components to increase reliability and optimize PCB size and system cost. It is designed to control 3-phase motors in variable speed drives. The package concept is specially adapted to power applications, which need good thermal conduction and electrical isolation, but also less EMI and overload protection. To deliver excellent electrical performance, Infineon’s leading-edge TRENCHSTOP™ IGBTs and anti-parallel diodes are combined with an optimized SOI gate driver. 

## **Features** 

Package 

- Fully isolated dual in-line molded module 

- Lead-free terminal plating; RoHS compliant 

Inverter 

- 650 V TRENCHSTOP™ IGBT7 T7 

- 600 V Rugged SOI gate driver technology with stability against transient and negative voltage 

- Allowable negative VS potential up to -11 V for signal transmission at VBS = 15 V 

- Integrated bootstrap functionality 

- Overcurrent shutdown 

- Built-in NTC thermistor for temperature monitor 

- Undervoltage lockout at all channels 

- Low-side emitter pins accessible for phase current monitoring (open emitter) 

- Cross-conduction prevention 

- All of 6 switches turn off during protection 

## **Potential applications** 

- Air-conditioners 

- Heat-pump application 

- Home appliances 

- Motor drives 

Please read the Important Notice and Warnings at the end of this document page 1 of 22 

Datasheet 

V 1.20 2026-02-02 

**www.infineon.com** 

**CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A Product validation** 

**==> picture [103 x 46] intentionally omitted <==**

## **Product validation** 

Qualified for industrial applications according to the relevant tests of JEDEC47/20/22. 

## **Table 1 Product Information** 

|**Base Part Number**|**Package Type**|**Standard Pack**|**Standard Pack**|**Remarks**|
|---|---|---|---|---|
|||**Form**|**MOQ**||
|IM06B50GC1|DIP 36x21D|14pcs/Tube|280pcs||



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**CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A Table of contents** 

**==> picture [103 x 46] intentionally omitted <==**

## **Table of contents** 

|**Table of contents**|**Table of contents**|
|---|---|
|**Description .................................................................................................................................... 1**||
|**Features ........................................................................................................................................ 1**||
|**Potential applications ..................................................................................................................... 1**||
|**Product validation .......................................................................................................................... 2**||
|**Table**|**of contents ............................................................................................................................ 3**|
|**1**|**Internal electrical schematic ................................................................................................... 4**|
|**2**|**Pin description ....................................................................................................................... 5**|
|2.1|Pin assignment ........................................................................................................................................ 5|
|2.2|Pin description ........................................................................................................................................ 6|
|**3**|**Absolute maximum ratings ..................................................................................................... 8**|
|3.1|Module section ........................................................................................................................................ 8|
|3.2|Inverter section ....................................................................................................................................... 8|
|3.3|Control section ........................................................................................................................................ 8|
|**4**|**Thermal characteristics .......................................................................................................... 9**|
|**5**|**Recommended operation conditions ....................................................................................... 10**|
|**6**|**Static parameters ................................................................................................................. 11**|
|6.1|Inverter section ..................................................................................................................................... 11|
|6.2|Control section ...................................................................................................................................... 11|
|**7**|**Dynamic parameters ............................................................................................................. 12**|
|7.1|Inverter section ..................................................................................................................................... 12|
|7.2|Control section ...................................................................................................................................... 12|
|**8**|**Thermistor ........................................................................................................................... 13**|
|**9**|**Mechanical characteristics and ratings .................................................................................... 14**|
|**10**|**Qualification information ....................................................................................................... 15**|
|**11**|**Diagrams and tables .............................................................................................................. 16**|
|11.1|TCMeasurement point (top view) ......................................................................................................... 16|
|11.2|Backside curvature measurment point ................................................................................................ 16|
|11.3|Switching test circuit ............................................................................................................................. 17|
|11.4|Switching time definition ...................................................................................................................... 17|
|**12**|**Application guide .................................................................................................................. 18**|
|12.1|Typical application schematic .............................................................................................................. 18|
|12.2|Performance chart ................................................................................................................................ 19|
|**13**|**Package outline .................................................................................................................... 20**|
|**Revision history............................................................................................................................. 21**||



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**CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A Internal electrical schematic** 

**==> picture [103 x 46] intentionally omitted <==**

## **1 Internal electrical schematic** 

**==> picture [364 x 411] intentionally omitted <==**

**----- Start of picture text -----**<br>
 NC (24)<br>P (23)<br>(1) VS(U)<br>(2) VB(U) VB1 HO1<br>RBS1 VS1 U (22)<br>(3) VS(V)<br>(4) VB(V) VB2 HO2<br>RBS2 VS2 V (21)<br>(5) VS(W)<br>HO3<br>(6) VB(W) VB3<br>RBS3 VS3 W (20)<br>(7) HIN(U) HIN1 LO1<br>(8) HIN(V) HIN2<br>NU (19)<br>(9) HIN(W) HIN3<br>(10) LIN(U) LIN1<br>(11) LIN(V) LIN2 LO2<br>(12) LIN(W) LIN3<br>NV (18)<br>(13) VDD VDD<br>(14) VFO VFO<br>LO3<br>(15) ITRIP ITRIP<br>(16) VSS VSS NW (17)<br>Thermistor<br>**----- End of picture text -----**<br>


**Figure 1 Internal electrical schematic** 

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**CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A** 

## **Pin description** 

## **2 Pin description** 

## **2.1 Pin assignment** 

**==> picture [332 x 313] intentionally omitted <==**

**----- Start of picture text -----**<br>
Bottom view<br>(24) NC<br>(1) VS(U) i a ww Sad<br>(2) VB(U) (@)<br>(23) P<br>(3) VS(V)<br>(4) VB(V)<br>(22) U<br>(5) VS(W)<br>(6) VB(W)<br>(21) V<br>(7) HIN(U)<br>(8) HIN(V) (20) W<br>(9) HIN(W)<br>(10) LIN(U)<br>(11) LIN(V) (19) NU<br>(12) LIN(W)<br>(13) VDD<br>(14) VFO (18) NV<br>(15) ITRIP<br>(16) VSS<br>(17) NW<br>**----- End of picture text -----**<br>


**Figure 2 Pin assignment** 

|**Pin number**<br>~~PF~~|**Pin name**<br>~~PF~~|**Pin description**|
|---|---|---|
|1<br>~~PF~~|VS(U)<br>~~PFPY~~|U-phase high-side floatingIC supplyoffset voltage|
|2|VB(U)<br>~~PY~~|U-phase high-side floatingIC supplyvoltage|
|3<br>~~PF~~|VS(V)<br>~~PY~~<br>~~PF~~|V-phase high-side floatingIC supplyoffset voltage|
|4<br>~~PF~~|VB(V)<br>~~PF~~|V-phase high-side floatingIC supplyvoltage|
|5<br>~~PF~~<br>~~P~~|VS(W)<br>~~PFPY~~<br>~~P~~|W-phase high-side floatingIC supplyoffset voltage|
|6<br>~~P~~|VB(W)<br>~~P~~|W-phase high-side floatingIC supplyvoltage|
|7<br>~~P~~<br>~~P~~|HIN(U)<br>~~PPY~~<br>~~P~~|U-phase high-sidegate driver input|
|8<br>~~P~~<br>~~PF~~|HIN(V)<br>~~P~~<br>~~PF~~|V-phase high-sidegate driver input|
|9<br>~~P~~<br>~~PFPP~~|HIN(W)<br>~~P~~<br>~~PFPP~~|W-phase high-sidegate driver input|
|10<br>~~PFPP~~|LIN(U)<br>~~PFPP~~|U-phase low-sidegate driver input|
|11<br>~~PP~~|LIN(V)<br>~~PP~~|V-phase low-sidegate driver input|
|12<br>~~PP~~|LIN(W)<br>~~PPPY~~|W-phase low-sidegate driver input|
|13<br>~~|~~|VDD<br>~~PY~~<br>~~|~~|Low-side control supply|
|14<br>~~|~~|VFO<br>~~|~~|Fault output/temperature monitor|



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## **CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A Pin description** 

**==> picture [103 x 46] intentionally omitted <==**

|**Pin number**|**Pin name**|**Pin description**|
|---|---|---|
|15|ITRIP|Overcurrent shutdown input|
|16|VSS|Low-side control negative supply|
|17|NW|W-phase low-side emitter|
|18|NV|V-phase low-side emitter|
|19|NU|U-phase low-side emitter|
|20|W|Motor W-phase output|
|21|V|Motor V-phase output|
|22|U|Motor U-phase output|
|23|P|Positive bus input voltage|
|24|NC|No connection|



## **2.2 Pin description** 

## **HIN (U, V, W) and LIN (U, V, W) (Low-side and highside control pins, Pin 7 - 12)** 

These pins are positive logic, and they are responsible for the control of the integrated IGBTs. The schmitt-trigger input thresholds of them are such to guarantee LSTTL and CMOS compatibility down to 3.3 V controller outputs. A pull-down resistor of about 5 kΩ is internally provided to prebias inputs during supply start-up, and a zener clamp is provided to protect the pins. Negative pulses down to an absolute minimum of -5.5 V are allowed that offers an outstanding robustness. Input schmitt-trigger and noise filter provide noise rejection to short input pulses. 

The noise filter suppresses control pulses shorter than the filter time _t_ FIL, IN. The Figure 4 describes how the filter works. An input pulse-width shorter than 1 µs is not recommended. 

**==> picture [239 x 88] intentionally omitted <==**

**----- Start of picture text -----**<br>
CIPOS [TM]<br>VDD<br>Schmitt-Trigger<br>HINx INPUT NOISE<br>LINx FILTER<br> 5 k <br>SWITCH LEVEL<br>VSS VIH; VIL<br>Figure 3 Input pin structure<br>**----- End of picture text -----**<br>


**==> picture [239 x 89] intentionally omitted <==**

**----- Start of picture text -----**<br>
a) t FIL,IN b) t FIL,IN<br>HIN HIN<br>LIN LIN<br>high<br>HO HO<br>LO low LO<br>Figure 4 Input filter timing diagram<br>**----- End of picture text -----**<br>


The integrated gate driver additionally provides a shoot-through prevention capability that avoids the simultaneous on-states of the same leg. When both inputs of the same leg are activated, only formerly activated one remained activated so that the leg is kept steadily in a safe state. 

A minimum deadtime insertion of typically 360 ns is also provided by driver, to reduce cross-conduction of the IGBTs. 

## **VFO (Fault-output and NTC, Pin 14)** 

The VFO pin indicates a module failure in case of undervoltage at pin VDD or in case of triggered overcurrent detection at ITRIP. An external pull-up resistor is required. 

**==> picture [189 x 61] intentionally omitted <==**

**----- Start of picture text -----**<br>
VDD CIPOS [TM]<br>RON, FLT From ITRIP - Latch<br>VFO<br>   1<br>VSS From UV detection<br>Thermistor<br>**----- End of picture text -----**<br>


**Figure 5 Internal circuit at pin VFO** 

The sleep function is activated after each trigger of ITRIP or undervoltage lockout. A new edge input signal is mandatory to activate gate drives after falut-clear time. 

## **ITRIP (Overcurrent detection function, Pin 15)** 

This product family provides an overcurrent detection function by connecting the ITRIP input with the IGBT current feedback. The ITRIP comparator threshold (typ. 0.525 V) is referenced to VSS. An 

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## **CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A Pin description** 

input noise filter (tITRIP = typ. 530 ns) prevents the driver to detect false overcurrent events. Overcurrent detection generates a shutdown of outputs of the gate driver. Fast track shutdown function allows low-side outputs to be turned off faster than high side outputs about 200 ns. The fault-clear time is set to minimum 100 µs. 

## **VDD, VSS (Low-side control supply and reference, Pin 13, 16)** 

VDD is the control supply, and it provides power both to input logic and to output stage. Input logic is referenced to VSS ground. 

The undervoltage circuit enables the device to operate at power on when a supply voltage of at least a typical voltage of VDDUV+ = 12.4 V is present. The gate driver shuts down all the outputs, when the VDD supply voltage is below VDDUV- = 11.5 V. This prevents the IGBTs from critically low gate voltage levels during on-state and therefore from excessive power dissipation. 

## **VB (U, V, W) and VS (U, V, W) (High-side supplies, Pin 1 - 6)** 

VB to VS is the high-side supply voltage. The highside circuit can float with respect to VSS following the high-side IGBT emitter voltage. 

**==> picture [103 x 46] intentionally omitted <==**

Due to the low power consumption, the floating driver stage is supplied by integrated bootstrap circuit. 

The undervoltage detection operates with a rising supply threshold of typical VBSUV+ = 11.5 V and a falling threshold of VBSUV- = 10.7 V. 

VS (U, V, W) provide a high robustness against negative voltage in respect of VSS of -50 V transiently. This ensures very stable designs even under harsh conditions. 

## **NW, NV, NU (Low-side emitter, Pin 17 - 19)** 

The low-side emitters are available for current measurement of each phase leg. It is recommended to keep the connection to pin VSS as short as possible to avoid unnecessary inductive voltage drops. 

## **W, V, U (High-side emitter and low-side collector, Pin 20 - 22)** 

These pins are connected to motor U, V, W input pins 

## **P (Positive bus input voltage, Pin 23)** 

The high-side IGBTs are connected to the bus voltage. It is noted that the bus voltage does not exceed 450 V. 

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**CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A Absolute maximum ratings** 

**==> picture [103 x 46] intentionally omitted <==**

## **3 Absolute maximum ratings** 

(VDD = 15 V and TJ = 25°C, if not stated otherwise) 

## **3.1 Module section** 

|**3.1**<br>**Module section**|||||
|---|---|---|---|---|
|**Description**|**Symbol**|**Condition**|**Value**|**Unit**|
|Storage temperature range|TSTG||-40 ~ 125|°C|
|Operatingcase temperature|TC|Refer to Figure 7|-40 ~ 125|°C|
|Operating junction temperature|TJ||-40 ~ 150|°C|
|Maximumjunction temperature1|TJ, switch, max||175|°C|
|Isolation test voltage|VISO|1 min,RMS,f = 60 Hz|2000|V|



## **3.2 Inverter section** 

|**Description**|**Symbol**|**Condition**|**Value**|**Unit**|
|---|---|---|---|---|
|Max. blockingvoltage|VCES||600|V|
|DC link supplyvoltage of P-N|VPN|Applied between P-N|450|V|
|DC link supplyvoltage(surge)of P-N|VPN (surge)|Applied between P-N|500|V|
|Each IGBT collector current2|IC|TC= 25°C, TJ< 150°C|35|A|
|Each IGBTcollector peak current1|ICP|TC= 25°C, TJ< 150°C<br>less than 1 ms|100|A|
|Output current|IO|TC= 25°C,TJ< 150°C|50|A|
|Power dissipationper IGBT|Ptot||216|W|
|Short circuit withstand time|tSC|VDC≤ 360V,TJ= 150°C|3|µs|



## **3.3 Control section** 

|**Description**|**Symbol**|**Condition**|**Value**|**Unit**|
|---|---|---|---|---|
|High side offset voltage|VS||600|V|
|Repetitive peak reverse voltage of<br>bootstrapdiode|VRRM||600|V|
|Module supplyvoltage|VDD||-1 ~ 20|V|
|High-side floating supply voltage<br>(VBreference to VS)|VBS||-1 ~ 20|V|
|Input voltage(LIN,HIN,ITRIP)|VIN||-1 ~ VDD+0.3|V|



> 1The maximum junction temperature rating of built in power chips is 175°C under condition: max. 10 sec, every 10 min, max. 1 hrs cumulative over lifetime. 

> 2 Pulse width and period are limited by junction temperature. Datasheet 8 of 22 

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**CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A Thermal characteristics** 

**==> picture [103 x 46] intentionally omitted <==**

## **4 Thermal characteristics** 

|**Description**|**Symbol**|**Condition**||**Value**||**Unit**|
|---|---|---|---|---|---|---|
||||**Min.**|**Typ. **|**Max.**||
|Single IGBT thermal resistance,<br>junction to case|RthJC|See Figure 7 for TC<br>measurementpoint|-|-|0.6|K/W|
|Single diode thermal resistance,<br>junction-case|RthJC, D||-|-|1.0|K/W|



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**CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A** 

**==> picture [103 x 46] intentionally omitted <==**

## **Recommended operation conditions** 

## **5 Recommended operation conditions** 

All voltages are absolute voltages referenced to VSS -potential unless otherwise specified. 

|**Description**|**Symbol**||**Value**||**Unit**|
|---|---|---|---|---|---|
|||**Min.**|**Typ. **|**Max.**||
|DC link supplyvoltage of P-N|VPN|0|300|400|V|
|Low-side supplyvoltage|VDD|13.0|15.0|17.5|V|
|High-side floatingsupplyvoltage(VBvs. VS)|VBS|13.0|-|17.5|V|
|Logic input voltages LIN, HIN, ITRIP|VIN<br>VITRIP|0|-|5.0|V|
|Inverter PWM carrier frequency|fPWM|-|-|20|kHz|
|External deadtime between HINand LIN|DT|2.0|-|-|µs|
|Voltage between VSS– N(includingsurge)|VCOMP|-5.0|-|5.0|V|
|Minimum input pulse width|PWIN(ON)<br>PWIN(OFF)|1.0|-|-|µs|
|Control supply variation|ΔVBS,<br>ΔVDD|-1.0<br>-1.0|-<br>-|1.0<br>1.0|V/µs|



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**CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A** 

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## **Static parameters** 

## **6 Static parameters** 

(VDD = VBS = 15 V and TJ = 25°C, if not stated otherwise) 

## **6.1 Inverter section** 

|**6.1**<br>**Inverter section**|||||||
|---|---|---|---|---|---|---|
|**Description**|**Symbol**|**Condition**||**Value**||**Unit**|
||||**Min.**|**Typ. **|**Max.**||
|Collector-emitter voltage|VCE(Sat)|IC= 50 A, TJ= 25°C<br>IC= 50 A,TJ= 150°C|-<br>-|1.80<br>2.15|2.20<br>-|V|
|Collector-emitter leakage current|ICES|VCE= 600 V|-|-|1|mA|
|Diode forward voltage|VF|IF= 50 A, TJ= 25°C<br>IF= 50 A,TJ= 150°C|-<br>-|2.30<br>2.25|-<br>-|V|



## **6.2 Control section** 

|**6.2**<br>**Control section**|||||||
|---|---|---|---|---|---|---|
|**Description**|**Symbol**|**Condition**||**Value**||**Unit**|
||||**Min.**|**Typ. **|**Max.**||
|Logic "1" input voltage(LIN,HIN)|VIH||1.7|2.0|2.3|V|
|Logic "0" input voltage(LIN,HIN)|VIL||0.7|0.9|1.1|V|
|ITRIP positivegoingthreshold|VIT, TH+||475|525|570|mV|
|ITRIPinput hysteresis|VIT, HYS||45|70|-|mV|
|VDDand VBSsupply undervoltage<br>positive going threshold|VDDUV+||11.5|12.4|13.1|V|
||VBSUV+||10.6|11.5|12.2||
|VDDand VBSsupply undervoltage<br>negative going threshold|VDDUV-||10.6|11.5|12.3|V|
||VBSUV-||9.7|10.7|11.7||
|VDDand VBSsupply undervoltage<br>lockout hysteresis|VDDUVH<br>VBSUVH||0.5|0.9|-|V|
|Quiescent VBxsupply current<br>(VBxonly)|IQBS|HIN= 0 V|-|-|300|µA|
|Quiescent VDDsupply current<br>(VDDonly)|IQDD|LIN= 0 V, HINX= 5 V|-|-|1.1|mA|
|Input bias current for LIN,HIN|IIN+|VIN= 5 V|-|1.1|1.7|mA|
|Input bias current for ITRIP|IITRIP+|VITRIP= 5 V|-|68|185|µA|
|Input bias current for VFO|IFO|VFO= 5 V,VITRIP= 0 V|-|60|-|µA|
|VFOoutput voltage|VFO|IFO= 10 mA,VITRIP= 1 V|-|0.35|-|V|
|Bootstrapdiode forward voltage|VF_BSD|IF= 0.3 mA|-|1.0|-|V|
|Bootstrap diode resistance|RBSD|Between VF1= 4 V and VF2= 5<br>V|-|37|-|Ω|



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**==> picture [103 x 46] intentionally omitted <==**

## **Dynamic parameters** 

## **7 Dynamic parameters** 

(VDD = 15 V and TJ = 25°C, if not stated otherwise) 

## **7.1 Inverter section** 

|**7.1**<br>**Inverter section**|||||||
|---|---|---|---|---|---|---|
|**Description**|**Symbol**|**Condition**||**Value**||**Unit**|
||||**Min.**|**Typ. **|**Max.**||
|Turn-onpropagation delaytime|ton|VLIN, HIN= 5 V,<br>IC= 50 A,<br>VDC= 300 V|-|860|-|ns|
|Turn-on rise time|tr||-|85|-|ns|
|Turn-on switchingtime|tc(on)||-|285|-|ns|
|Reverse recoverytime|trr||-|235|-|ns|
|Turn-offpropagation delaytime|toff|VLIN, HIN= 0 V,<br>IC= 50 A,<br>VDC= 300 V|-|1155|-|ns|
|Turn-off fall time|tf||-|35|-|ns|
|Turn-off switchingtime|tc(off)||-|110|-|ns|
|Short circuitpropagation delaytime|tSCP|From VIT, TH+to 10% ISC|-|1430|-|ns|
|IGBT turn-on energy (includes<br>reverse recovery of diode)|Eon|VDC= 300 V, IC= 50 A<br>TJ= 25°C<br>TJ= 150°C|-<br>-|2460<br>3460|-<br>-|µJ|
|IGBT turn-off energy|Eoff|VDC= 300 V, IC= 50 A<br>TJ= 25°C<br>TJ= 150°C|-<br>-|1080<br>1525|-<br>-|µJ|
|Diode recovery energy|Erec|VDC= 300 V, IC= 50 A<br>TJ= 25°C<br>TJ= 150°C|-<br>-|145<br>410|-<br>-|µJ|



## **7.2 Control section** 

|**7.2**<br>**Control section**|||||||
|---|---|---|---|---|---|---|
|**Description**|**Symbol**|**Condition**||**Value**||**Unit**|
||||**Min.**|**Typ. **|**Max.**||
|Input filter time ITRIP|tITRIP|VITRIP= 1 V|-|530|-|ns|
|Input filter time at LIN, HINfor turn on<br>and off|tFIL, IN|VLIN, HIN= 0 V or 5 V|-|290|-|ns|
|Fault clear time after ITRIP-fault|tFLTCLR||100|280|-|µs|
|ITRIPto fault propagation delay|tFLT|VLIN, HIN = 0 or VLIN, HIN = 5 V,<br>VITRIP = 1 V|-|680|1000|ns|
|Internal deadtime|DTIC||-|360|-|ns|
|Matching propagation delay time (on<br>and off)all channels|MT|External dead time > 500<br>ns|-|20|-|ns|



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**CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A Thermistor** 

**==> picture [103 x 46] intentionally omitted <==**

## **8 Thermistor** 

|**8**|**Thermistor**|||||||||
|---|---|---|---|---|---|---|---|---|---|
||||||||**Value**|||
||**Description**|**Symbol**|||**Condition**|**Min.**|**Typ. **|**Max.**|**Unit**|
|Resistance|||RNTC||TNTC= 25°C|-|85|-|kΩ|
|B-constant of NTC||||||||||
|(Negative temperature coefficient)||B (25/100)||||-|4092|-|K|
|thermistor||||||||||



**==> picture [511 x 210] intentionally omitted <==**

**----- Start of picture text -----**<br>
3500<br>35  Min. Temp. [°C]  RMin. [kΩ]  RTyp. [kΩ]  RMax. [kΩ]<br> Min.<br>3000 30  Typ. Typ. 50  29.151  30.157  31.178<br>25  M  Max.ax.<br>60  20.018  20.669  21.329<br>2500 20<br>15 70  13.994  14.424  14.858<br>2000<br>10<br>80  9.946  10.234  10.523<br>5<br>1500<br>0 90  7.177  7.373  7.569<br>50 60 70 80 90 100 110 120 130<br>1000 Thermistor temperature [°C] 100  5.253  5.388  5.523<br>500 110  3.884  3.99  4.096<br>120  2.908  2.991  3.075<br>0<br>-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 125  2.527  2.601  2.676<br>Thermistor temperature [°C]<br>Thermistor resistance [kΩ]<br>Thermistor resistance [kΩ]<br>**----- End of picture text -----**<br>


**Figure 6 Thermistor resistance – temperature curve and table (For more information, please refer to the application note)** 

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**CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A** 

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## **Mechanical characteristics and ratings** 

## **9 Mechanical characteristics and ratings** 

|**Description**|**Condition**||**Value**||**Unit**|
|---|---|---|---|---|---|
|||**Min.**|**Typ. **|**Max.**||
|Mountingtorque|M3 screw and washer|0.59|-|0.78|Nm|
|Backside curvature|Refer to Figure 8|0|-|150|µm|
|Weight||-|6.60|-|g|



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## **CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A Qualification information** 

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## **10 Qualification information** 

|**UL certification**|File number: E314539||
|---|---|---|
|**Moisture sensitivity level**|-||
|**RoHS compliant**|Yes(Lead-free terminalplating)||
|**ESD**|HBM(human bodymodel)class|2|
||CDM(charged device model)class|C2a|



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**CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A Diagrams and tables** 

## **11 Diagrams and tables** 

## **11.1 TC Measurement point (top view)** 

**Figure 7 TC measurement point[1]** 

## **11.2 Backside curvature measurment point** 

**Figure 8 Backside curvature measurement position** 

1Any measurement except for the specified point in Figure 7 is not relevant for the temperature verification and brings wrong or different information. 

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**CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A Diagrams and tables** 

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## **11.3 Switching test circuit** 

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**----- Start of picture text -----**<br>
Oneleg diagram<br>P A<br>VBS 22uF VB IC<br>HS switching<br>HO<br>input signal 0.1uF<br>HIN<br>VS VS Inductor A: LS switching VDC<br>VDD VDD U, V, W<br>220uF B: HS switching<br>0.1uF<br>LIN LO<br>LS switching<br>input signal VSS<br>0.1uF ITRIP NU, NV, NW<br>Rshunt<br>1.8kΩ<br>**----- End of picture text -----**<br>


**Figure 9 Switching test circuit** 

## **11.4 Switching time definition** 

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**----- Start of picture text -----**<br>
HINx<br>LINx<br>2.1 V<br>0.9 V<br>trr<br>toff ton<br>IDx 10% Irrx Irr<br>90% IDx 90% IDx<br>tr<br>tf<br>VDSx 10%  VDSx 10% ICx 10% IDx 10% VDSx<br>tc(off) tc(on)<br>Turn-off Turn-on<br>**----- End of picture text -----**<br>


**Figure 10 Switching time definition** 

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**CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A Application guide** 

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## **12 Application guide** 

## **12.1 Typical application schematic** 

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**----- Start of picture text -----**<br>
NC (24)<br>P (23)<br>(1) V S(U)<br>(2) V B(U) VB1 HO1<br>RBS1 VS1 U (22)<br>#4 (3) V S(V)<br>(4) V B(V) VB2 HO2<br>RBS2 VS2 V (21) 3-ph  AC<br>Motor<br>(5) V S(W)<br>(6) V B(W) VB3 HO3<br>RBS3 VS3 W (20)<br>#1 #5<br>(7) H IN(U) HIN1<br>(8) H IN(V) HIN2 LO1<br>(9) H IN(W) HIN3 NU (19)<br>(10) LIN(U) LIN1<br>ControllerMicro ((1112)) L LININ((VW)) LIN2LIN3 LO2 #6 #7<br>NV (18)<br>VDD line ((1413)) V VFODD VDDVFO GND linePower<br>(15) ITRIP ITRIP LO3<br>5 or 3.3V line (16) VSS VSS NW (17)<br>Thermistor<br>#3<br>Temperature monitor #2 U-phase current sensingV-phase current sensing<br>W-phase current sensing<br><Signal for protection><br><Signal for protection><br>GND line Control<br>**----- End of picture text -----**<br>


**Figure 11 Typical application circuit** 

- #1 Input circuit 

   - RC filter circuit can be used to reduce input signal noise (e.g. 100 Ω, 1 nF). 

   - The filter capacitors should be placed close to the IPM (to VSS pin especially). 

- #2 ITRIP circuit 

   - To prevent protection function errors, RC filter (1.5~ 2.0 µs, e.g. 68 Ω, 22 nF) circuit is recommended. 

   - The filter capacitor should be placed close to ITRIP and VSS pins. 

- #3 VFO circuit 

   - VFO pin is an open-drain output. This signal line should be pulled up to the bias voltage of the 5 V/3.3 V with a proper resistor. 

   - It is recommended that RC filter circuit is placed close to the controller. 

- #4 VB-VS circuit 

   - Capacitors for high-side floating supply voltage should be placed close to VB and VS pins. 

- #5 Snubber capacitor 

   - The wiring among the IPM, snubber capacitor and shunt resistors should be short as possible. 

- #6 Shunt resistor 

   - SMD-type resistors are strongly recommended to minimize stray inductance. 

- #7 Ground pattern 

   - Power ground and signal ground should be connected at a single point. It is recommended to connect them at the end of shunt resistor. 

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**CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A Application guide** 

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## **12.2 Performance chart** 

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**----- Start of picture text -----**<br>
IM06B50GC1<br>40<br>38<br>36<br>34<br>32<br>30<br>28<br>26 F SW =5kHz<br>24 F SW =15kHz<br>22<br>20<br>18<br>16<br>14<br>12<br>10<br>8<br>6 VDC=300V, VDD=VBS=15V, SVPWM<br>4 TJ ≤150℃ ,  TC ≤125 o C, M.I.=0.8, P.F.=0.8<br>2<br>0<br>0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150<br>Case Temperature, TC [℃]<br>]<br>rms<br> [A<br>O<br>Maximum Output Current, I<br>**----- End of picture text -----**<br>


**Figure 12 Maximum operating current SOA[1]** 

1This maximum operating current SOA is just one of example based on typical characteristics for this product. It can be changed by each user’s actual operating conditions. 

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## **CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A Package outline** 

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**----- Start of picture text -----**<br>
13 Package outline<br>**----- End of picture text -----**<br>


**Figure 13 IM06B50GC1** 

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## **CIPOS™ Mini IPM IM06B50GC1, 600 V 50 A Revision history** 

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## **Revision history** 

|**Document version**|**Date of release**|**Description of changes**|
|---|---|---|
|1.00|2024-12-10|Initial release.|
|1.10|2025-02-28|Updated UL number and Figure 13(package outline).|
|1.20|2026-02-02|Clarified the output current rating by explicitly adding the junction<br>temperature condition (TJ< 150°C).|



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## **Trademarks** 

All referenced product or service names and trademarks are the property of their respective owners. 

## **IMPORTANT NOTICE** 

**Edition 2026-02-02** The information given in this document shall in no event be regarded as a guarantee of conditions or **Published by** characteristics (“Beschaffenheitsgarantie”). **Infineon Technologies AG** With respect to any examples, hints or any typical **81726 Munich, Germany** values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all **© 2026 Infineon Technologies AG.** warranties and liabilities of any kind, including without limitation warranties of non-infringement **All Rights Reserved.** of intellectual property rights of any third party. **Do you have a question about this** In addition, any information given in this document **document?** is subject to customer’s compliance with its obligations stated in this document and any **Email: erratum@infineon.com** applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in **Document reference** customer’s applications. **Datasheet IM06B50GC1** 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

Please note that this product is not qualified according to the AEC Q100 or AEC Q101 documents of the Automotive Electronics Council. 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



## Links

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- [Supplier page](https://es.farnell.com/infineon/im06b50gc1xkma1/ipm-module-igbt-2kv-35a-dip/dp/4707489)
---

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