ILCX18-JI5F8-32.000MHZ

4 Pad Ceramic Crystal, 2.5mm x 2.0mm                                                                ILCX18 Series 

**Product Features: Applications:** SMD Package PCMCIA Cards Small package Foot Print Storage Supplied in Tape and Reel PC’s Compatible with Leadfree Processing GSM Cell Phone Fundamental Mode up to 60MHz Wireless Lan USB GSM Cell Phone 

## **Electrical Specifications** 

|**Frequency**|12MHz to 60MHz|
|---|---|
|**Equivalent Series Resistance**<br>12MHz – 19.999999MHz<br>20MHz – 29.999999MHz<br>30MHz – 39.999999MHz<br>40MHz–60MHz|100 Ohms Maximum<br>80 Ohms Maximum<br>60 Ohms Maximum<br>40 Ohms Maximum|
|**Shunt Capacitance (C0)**|3.5pF Maximum|
|**Frequency Tolerance (at 25°C)**|±50ppm, ±30ppm, ±25ppm, ±20ppm, ±15ppm, or ±10ppm|
|**Frequency Stability (over Temperature)**|±50ppm, ±30ppm, ±25ppm, ±20ppm, ±15ppm, or ±10ppm|
|**Mode of Operation**|Fundamental|
|**Crystal Cut**|AT Cut|
|**Load Capacitance**|8pF to 32pF or Specify|
|**Drive Level**|100µW Maximum|
|**Aging**|3ppm/Year Maximum|
|**Operating Temperature Range**|See Part Number Guide|
|**Storage Temperature Range**|-40°C to +125°C|



## **Mechanical and Solder Pad Dimensions** 

## **Part Number Guide** 

|**Sample Part Number: ILCX18 – FB1F18 – 20.000 MHz**|**Sample Part Number: ILCX18 – FB1F18 – 20.000 MHz**|**Sample Part Number: ILCX18 – FB1F18 – 20.000 MHz**|**Sample Part Number: ILCX18 – FB1F18 – 20.000 MHz**|**Sample Part Number: ILCX18 – FB1F18 – 20.000 MHz**|**Sample Part Number: ILCX18 – FB1F18 – 20.000 MHz**|**Sample Part Number: ILCX18 – FB1F18 – 20.000 MHz**|
|---|---|---|---|---|---|---|
|**Package**|**Frequency**<br>**Tolerance**|**Frequency**<br>**Stability**|**Operating**<br>**Temperature Range**|**Mode of**<br>**Operations**|**Load Capacitance**|**Frequency**|
|ILCX18 -|B = ±50ppm<br>~~es~~|B = ±50ppm<br>~~es~~|0 = 0°C to +50°C<br>~~es~~|F = Fundamental|8pF to 32pF or<br>Specify|- 20.000 MHz|
||F = ±30ppm<br>~~es~~<br>~~Rs~~|F = ±30ppm<br>~~es~~<br>~~Rs~~|1 = 0°C to +70°C<br>~~es~~<br>~~Rs~~||||
||G = ±25ppm<br>~~Rs~~<br>~~Rs~~|G = ±25ppm<br>~~Rs~~<br>~~Rs~~|2 = -10°C to +60°C<br>~~Rs~~<br>~~Rs~~||||
||H = ±20ppm<br>~~Rs~~<br>~~Rs~~|H = ±20ppm<br>~~Rs~~<br>~~Rs~~|3 = -20°C to +70°C<br>~~Rs~~<br>~~Rs~~||||
||I = ±15ppm<br>~~Rs~~|I = ±15ppm**<br>~~Rs~~|5 = -40°C to +85°C*<br>~~Rs~~||||
||J = ±10ppm|J = ±10ppm**|8 = -30°C to +85°C*||||
||||9 = -10°C to +50°C||||
||||D = -10°C to +105°C*||||
||||E = -40°C to +105°C*||||



** Not available at all frequencies.    * Not available for all frequency stability options. 

ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ● Rev:  09/26/18_H www.ilsiamerica.com ~~a~~ Specifications subject to change without notice 

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## 4 Pad Ceramic Crystal, 2.5mm x 2.0mm                                                                ILCX18 Series 

## **Pb Free Solder Reflow Profile:** 

**==> picture [221 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
Units are backward compatible with +240°C reflow processes<br>**----- End of picture text -----**<br>


|Ts max to TL(Ramp-up Rate)|3ºC / second max|
|---|---|
|Preheat<br>Temperature min (Ts min)<br>Temperature typ (Ts typ)<br>Temperature max (Ts max)<br>Time (Ts)|150ºC<br>175ºC<br>200ºC<br>60 to180 seconds|
|Ramp-up Tate (TLto Tp|3ºC / second max|
|Time Maintained Above<br>Temperature (TL)<br>Time (TL)|217ºC<br>60 to 150 seconds|
|L)<br>Peak Temperature (Tp)|260ºC max for 10<br>seconds|
|Time within 5ºC to Peak<br>Temperature (Tp)|20 to 40 seconds|
|Ramp-down Rate|6ºC / second max|
|Tune 25ºC to Peak Temperature|8 minutes max|



## **Package Information:** 

MSL = 1 

Termination = e4 (Au over Ni over W base metallization) 

## **Tape and Reel Information:** 

|PITCH|4.00|
|---|---|
|TAPE WIDTH|8.00|
|REEL DIA|180|
|QTY PER REEL|3,000|



## **Environmental Specifications:** 

|Thermal Shock|MIL-STD-883,Method 1011,Condition A|
|---|---|
|Moisture Resistance|MIL-STD-883,Method 1004|
|Mechanical Shock|MIL-STD-883,Method 2002,Condition B|
|Mechanical Vibration|MIL-STD-883,Method 2007,Condition A|
|Resistance to SolderingHeat|J-STD-020C,Table 5-2 Pb-free devices(except 2 cycles max)|
|Hazardous Substance|Pb-Free / RoHS / Green Compliant|
|Solderability|JESD22-B102-D Method 2(PreconditioningE)|
|Terminal Strength|MIL-STD-883,Method 2004,Test Condition D|
|Gross Leak|MIL-STD-883,Method 1014,Condition C|
|Fine Leak|MIL-STD-883,Method 1014,Condition A2,R1=2x10-8 atm cc/s|
|Solvent Resistance|MIL-STD-202, Method 215|



**Marking:** 

Line 1:  I-Date Code (Date Code = YWW) Line 2:  Frequency 

Rev:  09/26/18_H 

ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ● www.ilsiamerica.com ~~ee~~ Specifications subject to change without notice 

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