# Motor Driver/Controller, Three Phase AC, 13.5V to 18.5V, 600V/10A/6 Outputs, DIP-24

![Product image](https://novapart.co/image/farnell:2762331/)

**URL**: https://novapart.co/products/IGCM10F60GAXKMA1/motor-driver-controller-three-phase-ac-135v-to
**SKU**: IGCM10F60GAXKMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || Intelligent Power Modules
**Price**: €6.2800
**Stock**: 200+
**Lead Time**: 176 days (indicative)

## Description

Motor Type:Three Phase AC; No. of Outputs:6Outputs; Output Current:10A; Output Voltage:600V; Driver Case Style:DIP; No. of Pins:24Pins; Supply Voltage Min:13.5V; Supply Voltage Max:18.5V

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| Ipm Series | CIPOS Mini |
| Product Range | CIPOS Mini |
| Ipm Case Style | DIP |
| Ipm Power Device | IGBT |
| Isolation Voltage | 2kV |
| Current Rating (Ic / Id) | 10A |
| Voltage Rating (Vces / Vdss) | 600V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2762331/)

**IGCM10F60GA Datasheet** 

## **CIPOS™ Mini** 

## **IGCM10F60GA** 

## **Description** 

The CIPOS™ module family offers the chance for integrating various power and control components to increase reliability and optimize PCB size and system cost. It is designed to control 3-phase motors in variable speed drives. The package concept is specially adapted to power applications, which need good thermal conduction and electrical isolation, but also less EMI and overload protection. To deliver excellent electrical performance, Infineon’s leading-edge RC-Drives IGBTs are combined with an optimized SOI gate driver. 

## **Features** 

Package 

- Fully isolated dual in-line molded module 

- Lead-free terminal plating; RoHS compliant 

Inverter 

- Reverse Conducting Drives IGBTs 

- Rugged SOI gate driver technology with stability against transient and negative voltage 

- Allowable negative VS potential up to -11 V for signal transmission at VBS = 15 V 

- Integrated bootstrap functionality 

- Overcurrent shutdown 

- Built-in NTC thermistor for temperature monitor 

- Undervoltage lockout at all channels 

- Low-side emitter pins accessible for phase current monitoring (open emitter) 

- Cross-conduction prevention 

- All of 6 switches turn off during protection 

## **Potential applications** 

- Home appliances, low power motor drives 

Please read the Important Notice and Warnings at the end of this document page 1 of 22 

Datasheet 

V 3.1 2023-06-23 

**www.infineon.com** 

**CIPOS™ Mini IGCM10F60GA Product validation** 

**==> picture [104 x 46] intentionally omitted <==**

## **Product validation** 

Qualified for industrial applications according to the relevant tests of JEDEC47/20/22. 

## **Table 1 Product Information** 

|**Base Part Number**|**Package Type**|**Standard Pack**|**Standard Pack**|**Remarks**|
|---|---|---|---|---|
|||**Form**|**MOQ**||
|IGCM10F60GA|DIP 36x21|14pcs/Tube|280pcs||



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**CIPOS™ Mini IGCM10F60GA Table of contents** 

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## **Table of contents** 

|**Table of contents**|**Table of contents**|
|---|---|
|**Description .................................................................................................................................... 1**||
|**Features ........................................................................................................................................ 1**||
|**Potential applications ..................................................................................................................... 1**||
|**Product validation .......................................................................................................................... 2**||
|**Table**|**of contents ............................................................................................................................ 3**|
|**1**|**Internal Electrical Schematic ................................................................................................... 4**|
|**2**|**Pin Description ...................................................................................................................... 5**|
|2.1|Pin Assignment ........................................................................................................................................ 5|
|2.2|Pin Description ........................................................................................................................................ 6|
|**3**|**Absolute Maximum Ratings ..................................................................................................... 8**|
|3.1|Module Section ........................................................................................................................................ 8|
|3.2|Inverter Section ....................................................................................................................................... 8|
|3.3|Control Section ........................................................................................................................................ 8|
|**4**|**Thermal Characteristics .......................................................................................................... 9**|
|**5**|**Recommended Operation Conditions ...................................................................................... 10**|
|**6**|**Static Parameters ................................................................................................................. 11**|
|6.1|Inverter Section ..................................................................................................................................... 11|
|6.2|Control Section ...................................................................................................................................... 11|
|**7**|**Dynamic Parameters ............................................................................................................. 12**|
|7.1|Inverter Section ..................................................................................................................................... 12|
|7.2|Control Section ...................................................................................................................................... 12|
|**8**|**Thermistor ........................................................................................................................... 13**|
|**9**|**Mechanical Characteristics and Ratings ................................................................................... 14**|
|**10**|**Qualification Information....................................................................................................... 15**|
|**11**|**Diagrams and Tables ............................................................................................................. 16**|
|11.1|TCMeasurement Point ........................................................................................................................... 16|
|11.2|Backside Curvature Measurment Point ................................................................................................ 16|
|11.3|Switching Time Definition ..................................................................................................................... 17|
|**12**|**Application Guide .................................................................................................................. 18**|
|12.1|Typical Application Schematic ............................................................................................................. 18|
|12.2|Performance Chart ................................................................................................................................ 19|
|**13**|**Package Outline .................................................................................................................... 20**|
|**Revision history............................................................................................................................. 21**||



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**CIPOS™ Mini IGCM10F60GA** 

**Internal Electrical Schematic** 

**1** 

## **Internal Electrical Schematic** 

**Figure 1 Internal electrical schematic** 

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**CIPOS™ Mini IGCM10F60GA** 

**Pin Description** 

## **2 Pin Description** 

## **2.1 Pin Assignment** 

**==> picture [61 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
Bottom view<br>**----- End of picture text -----**<br>


**Figure 2 Pin configuration** 

|**Table 2**|**Pin assignment**||
|---|---|---|
|**Pin number**|**Pin name**|**Pin description**|
|1|VS(U)|U-phase high-side floatingIC supplyoffset voltage|
|2|VB(U)|U-phase high-side floatingIC supplyvoltage|
|3|VS(V)|V-phase high-side floatingIC supplyoffset voltage|
|4|VB(V)|V-phase high-side floatingIC supplyvoltage|
|5|VS(W)|W-phase high-side floatingIC supplyoffset voltage|
|6|VB(W)|W-phase high-side floatingIC supplyvoltage|
|7|HIN(U)|U-phase high-sidegate driver input|
|8|HIN(V)|V-phase high-sidegate driver input|
|9|HIN(W)|W-phase high-sidegate driver input|
|10|LIN(U)|U-phase low-sidegate driver input|
|11|LIN(V)|V-phase low-sidegate driver input|
|12|LIN(W)|W-phase low-sidegate driver input|
|13|VDD|Low-side control supply|
|14|VFO|Fault output/temperature monitor|
|15|ITRIP|Overcurrent shutdown input|
|16|VSS|Low-side control negative supply|
|17|NW|W-phase low-side emitter|
|18|NV|V-phase low-side emitter|



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## **CIPOS™ Mini IGCM10F60GA Pin Description** 

**==> picture [104 x 46] intentionally omitted <==**

|19|NU|U-phase low-side emitter|
|---|---|---|
|20|W|Motor W-phase output|
|21|V|Motor V-phase output|
|22|U|Motor U-phase output|
|23|P|Positive bus input voltage|
|24|NC|No connection|



## **2.2 Pin Description** 

## **HIN(U, V, W) and LIN(U, V, W) (Low-side and highside control pins, Pin 7 - 12)** 

These pins are positive logic and they are responsible for the control of the integrated IGBTs. The Schmitt-trigger input thresholds of them are such to guarantee LSTTL and CMOS compatibility down to 3.3 V controller outputs. A pull-down resistor of about 5 k Ω is internally provided to prebias inputs during supply start-up, and a zener clamp is provided to protect the pins. Input Schmitt-trigger and noise filter provide noise rejection to short input pulses. 

The noise filter suppresses control pulses shoter than the filter time _t_ FIL,IN. The Figure 4 describes how the filter works. An input pulse-width shorter than 1 µs is not recommended. 

**==> picture [239 x 88] intentionally omitted <==**

**----- Start of picture text -----**<br>
CIPOS™<br>VDD<br>Schmitt-Trigger<br>HINx INPUT NOISE<br>LINx FILTER<br> 5 k <br>SWITCH LEVEL<br>VSS VIH; VIL<br>Figure 3 Input pin structure<br>**----- End of picture text -----**<br>


**==> picture [198 x 64] intentionally omitted <==**

**----- Start of picture text -----**<br>
a) t FIL,IN b) t FIL,IN<br>HIN HIN<br>LIN LIN<br>high<br>HO HO<br>LO low LO<br>**----- End of picture text -----**<br>


**Figure 4 Input filter timing diagram** 

The integrated gate driver additionally provides a shoot-through prevention capability that avoids the simultaneous on-states of the same leg. When both inputs of the same leg are activated, only formerly activated one is remained activated so that the leg is kept steadily in a safe state. 

A minimum deadtime insertion of typically 380 ns is also provided by driver, in order to reduce crossconduction of the IGBTs. 

## **VFO (Fault-output and NTC, Pin 14)** 

The VFO pin indicates a module failure in case of undervoltage at pin VDD or in case of triggered overcurrent detection at ITRIP. An external pull-up resistor is required. 

**==> picture [192 x 60] intentionally omitted <==**

**----- Start of picture text -----**<br>
VDD CIPOS™<br>RON,FLT From ITRIP - Latch<br>VFO<br>   1<br>VSS From UV detection<br>Thermistor<br>**----- End of picture text -----**<br>


**Figure 5 Internal circuit at pin VFO** 

The pin 14 provides direct access to the NTC which is referenced to VSS. An external pull-up resistor connected to +5 V ensures that the resulting voltage can be directly connected to the microcontroller. 

## **ITRIP (Overcurrent detection function, Pin 15)** 

The CIPOS™ product family provides an overcurrent detection function by connecting the ITRIP input with the IGBT current feedback. The ITRIP comparator threshold (typ. 0.47 V) is referenced to VSS. An input noise filter (tITRIP = typ. 530 ns) prevents the driver to detect false overcurrent events. Overcurrent detection generates a shutdown of all outputs of the gate driver. 

The fault-clear time is set to minimum 40 µs. 

## **VDD, VSS (Low-side control supply and reference, Pin 13, 16)** 

VDD is the control supply and it provides power both to input logic and to output stage. Input logic is referenced to VSS ground. 

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## **CIPOS™ Mini IGCM10F60GA** 

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## **Pin Description** 

The undervoltage circuit enables the device to operate at power on when a supply voltage of at least a typical voltage of VDDUV+ = 12.1 V is present. The gate driver shuts down all the outputs, when the VDD supply voltage is below VDDUV- = 10.4 V. This prevents the IGBTs from critically low gate voltage levels during on-state and therefore from excessive power dissipation. 

## **VB(U, V, W) and VS(U, V, W) (High-side supplies, Pin 1 - 6)** 

VB to VS is the high-side supply voltage. The highside circuit can float with respect to VSS following the high-side IGBT emitter voltage. 

Due to the low power consumption, the floating driver stage is supplied by integrated bootstrap circuit. 

The undervoltage detection operates with a rising supply threshold of typical VBSUV+ = 12.1 V and a falling threshold of VBSUV- = 10.4 V. 

This ensures very stable designs even under harsh conditions. 

## **NW, NV, NU (Low-side emitter, Pin 17 - 19)** 

The low-side emitters are available for current measurement of each phase leg. It is recommended to keep the connection to pin VSS as short as possible to avoid unnecessary inductive voltage drops. 

## **W, V, U (High-side emitter and low-side collector, Pin 20 - 22)** 

These pins are connected to motor U, V, W input pins 

## **P (Positive bus input voltage, Pin 23)** 

The high-side IGBTs are connected to the bus voltage. It is noted that the bus voltage does not exceed 450 V. 

VS(U, V, W) provide a high robustness against negative voltage in respect of VSS of -50 V transiently. 

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**CIPOS™ Mini IGCM10F60GA Absolute Maximum Ratings** 

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## **3 Absolute Maximum Ratings** 

(VDD = 15 V and TJ = 25°C, if not stated otherwise) 

|**3.1**<br>**Module Section**|||||
|---|---|---|---|---|
|**Description**|**Symbol**|**Condition**|**Value**|**Unit**|
|Storage temperature range|TSTG||-40 ~ 125|°C|
|Operatingcase temperature|TC|Refer to Figure 7|-40 ~ 125|°C|
|Operating junction temperature|TJ||-40 ~ 150|°C|
|Isolation test voltage|VISO|1 min,RMS,f = 60 Hz|2000|V|



|**3.2**<br>**Inverter Section**|||||
|---|---|---|---|---|
|**Description**|**Symbol**|**Condition**|**Value**|**Unit**|
|Max. blockingvoltage|VCES||600|V|
|DC link supplyvoltage of P-N|VPN|Applied between P-N|450|V|
|DC link supplyvoltage(surge)of P-N|VPN(surge)|Applied between P-N|500|V|
|Output current1|IC|TC= 25°C, TJ< 150°C|±10|A|
|||TC= 100°C, TJ< 150°C|±6||
|Maximum peak collector current|IC(peak)|TC= 25°C, TJ< 150°C<br>less than 1 ms|±20|A|
|Power dissipationper IGBT|Ptot||26.1|W|
|Short circuit withstand time|tSC|VDC≤ 400 V,TJ= 150°C|5|µs|



|**3.3**<br>**Control Section**|||||
|---|---|---|---|---|
|**Description**|**Symbol**|**Condition**|**Value**|**Unit**|
|High-side offset voltage|VS||600|V|
|Repetitive peak reverse voltage of<br>bootstrapdiode|VRRM||600|V|
|Module supplyvoltage|VDD||-1 ~ 20|V|
|High-side floating supply voltage<br>(VBreference to VS)|VBS||-1 ~ 20|V|
|Input voltage(LIN,HIN,ITRIP)|VIN||-1 ~ 10|V|



1 Pulse width and period are limited by junction temperature Datasheet 8 of 22 

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**CIPOS™ Mini IGCM10F60GA** 

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## **Thermal Characteristics** 

|**4**<br>**Thermal Characteristics**|**4**<br>**Thermal Characteristics**|**4**<br>**Thermal Characteristics**|||||
|---|---|---|---|---|---|---|
|**Description**|**Symbol**|**Condition**|**Value**|||**Unit**|
||||**Min.**|**Typ.**|**Max.**||
|Single IGBT thermal resistance,<br>junction to case|RthJC|See Figure 7 for TC<br>measurementpoint|-|-|4.79|K/W|



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**CIPOS™ Mini IGCM10F60GA** 

**Recommended Operation Conditions** 

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## **5 Recommended Operation Conditions** 

All voltages are absolute voltages referenced to VSS -potential unless otherwise specified. 

|**Description**|**Symbol**|**Value**|**Value**|**Value**|**Unit**|
|---|---|---|---|---|---|
|||**Min.**|**Typ. **|**Max.**||
|DC link supplyvoltage of P-N|VPN|0|-|400|V|
|Low-side supplyvoltage|VDD|14.0|16.0|18.5|V|
|High-side floatingsupplyvoltage(VBvs. VS)|VBS|13.5|-|18.5|V|
|Logic input voltages LIN, HIN, ITRIP|VIN<br>VITRIP|0|-|5|V|
|Inverter PWM carrier frequency|fPWM|-|-|20|kHz|
|External deadtime between HIN and LIN|DT|1.0|-|-|µs|
|Voltage between VSS– N(includingsurge)|VCOMP|-5|-|5|V|
|Minimum input pulse width|PWIN(ON)<br>PWIN(OFF)|1|-|-|µs|
|Control supply variation|ΔVBS<br>ΔVDD|-1<br>-1|-<br>-|1<br>1|V/µs|



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**CIPOS™ Mini IGCM10F60GA** 

**Static Parameters** 

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## **6 Static Parameters** 

(VDD = VBS = 15 V and TJ = 25°C, if not stated otherwise) 

## **6.1 Inverter Section** 

|**Description**|**Symbol**|**Condition**||**Value**||**Unit**|
|---|---|---|---|---|---|---|
||||**Min.**|**Typ. **|**Max.**||
|Collector-emitter voltage|VCE(Sat)|IC= 6 A, TJ= 25°C<br>IC= 6 A,TJ= 150°C|-<br>-|1.6<br>1.8|2.0<br>-|V|
|Collector-emitter leakage current|ICES|VCE= 600 V|-|-|1|mA|
|Diode forward voltage|VF|IF= 6 A, TJ= 25°C<br>IF= 6 A,TJ= 150°C|-<br>-|1.75<br>1.8|2.2<br>-|V|



## **6.2 Control Section** 

|**6.2**<br>**Control Section**|||||||
|---|---|---|---|---|---|---|
|**Description**|**Symbol**|**Condition**|**Value**|||**Unit**|
||||**Min.**|**Typ. **|**Max.**||
|Logic "1" input voltage(LIN,HIN)|VIH||-|2.1|2.5|V|
|Logic "0" input voltage(LIN,HIN)|VIL||0.7|0.9|-|V|
|ITRIPpositivegoingthreshold|VIT,TH+||400|470|540|mV|
|ITRIP input hysteresis|VIT,HYS||40|70|-|mV|
|VDDand VBSsupply undervoltage<br>positive going threshold|VDDUV+||10.8|12.1|13.0|V|
||VBSUV+||10.8|12.1|13.0||
|VDDand VBSsupply undervoltage<br>negative going threshold|VDDUV-||9.5|10.4|11.2|V|
||VBSUV-||9.5|10.4|11.2||
|VDDand VBSsupply undervoltage<br>lockout hysteresis|VDDUVH<br>VBSUVH||1.0|1.7|-|V|
|Quiescent VBxsupply current<br>(VBxonly)|IQBS|HIN= 0 V|-|300|500|µA|
|Quiescent VDDsupply current<br>(VDDonly)|IQDD|LIN= 0 V, HINX= 5 V|-|370|900|µA|
|Input bias current for LIN, HIN|IIN+|VIN= 5 V|-|1.0|1.5|mA|
||IIN-|VIN= 0 V|-|2.0|-|µA|
|Input bias current for ITRIP|IITRIP+|VITRIP= 5 V|-|65|150|µA|
|Input bias current for VFO|IFO|VFO= 5 V,VITRIP= 0 V|-|60|-|µA|
|VFOoutput voltage|VFO|IFO= 10 mA,VITRIP= 1 V|-|0.5|-|V|
|Bootstrapdiode forward voltage|VF_BSD|IF= 20 mA|-|2.6|-|V|
|Bootstrap diode resistance of U-<br>phase1|RBS(U)|VS(V)or VS(W)= 300 V, TJ= 25°C<br>VS(V)and VS(W)= 0 V, TJ= 25°C<br>VS(V)or VS(W)= 300 V, TJ= 125°C<br>VS(V)and VS(W)= 0 V,TJ= 125°C|-|35<br>40<br>50<br>65|-||



1 RBS(V) and RBS(W) have same values to RBS(U) 

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**CIPOS™ Mini IGCM10F60GA** 

**Dynamic Parameters** 

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## **7 Dynamic Parameters** 

(VDD = 15 V and TJ = 25°C, if not stated otherwise) 

## **7.1 Inverter Section** 

|**7.1**<br>**Inverter Section**|||||||
|---|---|---|---|---|---|---|
|**Description**|**Symbol**|**Condition**||**Value**||**Unit**|
||||**Min.**|**Typ. **|**Max.**||
|Turn-onpropagation delaytime|ton|VLIN, HIN= 5 V,<br>IC= 6 A,<br>VDC= 300 V|-|670|-|ns|
|Turn-on rise time|tr||-|20|-|ns|
|Turn-on switchingtime|tc(on)||-|80|-|ns|
|Reverse recoverytime|trr||-|110|-|ns|
|Turn-offpropagation delaytime|toff|VLIN, HIN= 0 V,<br>IC= 6 A,<br>VDC= 300 V|-|820|-|ns|
|Turn-off fall time|tf||-|170|-|ns|
|Turn-off switchingtime|tc(off)||-|180|-|ns|
|Short circuitpropagation delaytime|tSCP|From VIT,TH+to 10% ISC|-|1250|-|ns|
|IGBT turn-on energy (includes<br>reverse recovery of diode)|Eon|VDC= 300 V, IC= 6 A<br>TJ= 25°C<br>TJ= 150°C|-<br>-|110<br>155|-<br>-|µJ|
|IGBT turn-off energy|Eoff|VDC= 300 V, IC= 6 A<br>TJ= 25°C<br>TJ= 150°C|-<br>-|155<br>220|-<br>-|µJ|
|Diode recovery energy|Erec|VDC= 300 V, IC= 6 A<br>TJ= 25°C<br>TJ= 150°C|-<br>-|45<br>75|-<br>-|µJ|



|**7.2**<br>**Control Section**|**7.2**<br>**Control Section**|**7.2**<br>**Control Section**|||||
|---|---|---|---|---|---|---|
|**Description**|**Symbol**|**Condition**|**Value**|||**Unit**|
||||**Min.**|**Typ. **|**Max.**||
|Input filter time ITRIP|tITRIP|VITRIP= 1 V|-|530|-|ns|
|Input filter time at LIN, HIN for turn<br>on and off|tFIL,IN|VLIN, HIN= 0 V or 5 V|-|290|-|ns|
|Fault clear time after ITRIP-fault|tFLTCLR||40|65|200|µs|
|ITRIP to fault propagation delay|tFLT|VLIN, HIN= 0 or VLIN, HIN= 5 V,<br>VITRIP= 1 V|-|680|1000|ns|
|Internal deadtime|DTIC||-|380|-|ns|
|Bootstrap diode reverse recovery<br>time|trr_BS|IF= 0.6 A, di/dt = 80 A/µs|-|50|-|ns|



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**CIPOS™ Mini IGCM10F60GA Thermistor** 

|**8**|**Thermistor**|||||||
|---|---|---|---|---|---|---|---|
||||||**Value**|||
||**Description**|**Symbol**|**Condition**|**Min.**|**Typ. **|**Max.**|**Unit**|
|Resistance|Resistance|RNTC|TNTC= 25°C|-|85|-|k|
|B-constant of NTC|B-constant of NTC|||||||
|(negative temperature coefficient)||B(25/100)||-|4092|-|K|
|thermistor||||||||



**==> picture [502 x 210] intentionally omitted <==**

**----- Start of picture text -----**<br>
3500<br>35<br>3000 ail  Min.<br>30  Typ.<br> Max.<br>25<br>2500 Ce] ReeE<br>20<br>2000 15<br>WEN<br>10<br>1500 \ CENCE EEE Po [as [oe |_|<br>5<br>POE) |  ee<br>0 EEEEEcEEEPTPRaH<br>1000 CAR) 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 125 130 96 1<br>Thermistor temperature [ ℃ ]<br>500 \ 120 2.900 3.024 3.149<br>0 LEASE EE<br>-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130<br>Thermistor temperature [ ℃ ]<br>]<br>Ω [kThermistor resistance  Ω ] Thermistor resistance [k<br>**----- End of picture text -----**<br>


**Figure 6 Thermistor resistance – temperature curve and table (For more information, please refer to the application note)** 

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**CIPOS™ Mini IGCM10F60GA** 

**Mechanical Characteristics and Ratings** 

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## **9 Mechanical Characteristics and Ratings** 

|**Description**|**Condition**||**Value**||**Unit**|
|---|---|---|---|---|---|
|||**Min.**|**Typ. **|**Max.**||
|Comparative trackingindex(CTI)||550|-|-|V|
|Mountingtorque|M3 screw and washer|0.59|0.69|0.78|Nm|
|Backside curvature|Refer to Figure 8|-50|-|100|µm|
|Weight||-|6.15|-|g|



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**CIPOS™ Mini IGCM10F60GA Qualification Information** 

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|**10**<br>**Qualification Information**|**10**<br>**Qualification Information**||
|---|---|---|
|**UL certification**|File number: E314539||
|**Moisture sensitivity level**<br>**(SOP23 only)**|-||
|**RoHS compliant**|Yes(Lead-free terminalplating)||
|**ESD**|HBM(human bodymodel)class|2|
||CDM(charged device model)<br>class|C3|



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**CIPOS™ Mini IGCM10F60GA Diagrams and Tables** 

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**----- Start of picture text -----**<br>
11 Diagrams and Tables<br>11.1 TC Measurement Point<br>- Tc<br>Figure 7 TC measurement point [1]<br>**----- End of picture text -----**<br>


## **11.2 Backside Curvature Measurment Point** 

**Figure 8 Backside curvature measurement position** 

1Any measurement except for the specified point in Figure 7 is not relevant for the temperature verification and brings wrong or different information. 

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## **Diagrams and Tables** 

## **11.3 Switching Time Definition** 

**==> picture [431 x 176] intentionally omitted <==**

**----- Start of picture text -----**<br>
HINx 2.1 V<br>LINx<br>0.9 V trr<br>toff ton irm<br>iCx 10% irm<br>90% 90%<br>tf tr<br>10%<br>10% 10% 10%<br>v CEx<br>tc(off) tc(on)<br>**----- End of picture text -----**<br>


**Figure 9 Switching time definition** 

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**CIPOS™ Mini IGCM10F60GA Application Guide** 

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## **12 Application Guide** 

## **12.1 Typical Application Schematic** 

**==> picture [436 x 315] intentionally omitted <==**

**----- Start of picture text -----**<br>
NC (24)<br>P (23)<br>(1) VS(U)<br>(2) VB(U) VB1 HO1<br>RBS1 VS1 U (22)<br>(3) VS(V)<br>#4<br>(4) VB(V) VB2 HO2<br>RBS2 VS2 V (21) 3-ph AC<br>Motor<br>(5) VS(W)<br>(6) VB(W) VB3 HO3<br>RBS3 VS3 W (20)<br>#1 #5<br>(7) HIN(U) HIN1<br>(8) HIN(V) HIN2 LO1<br>(9) HIN(W) HIN3 NU (19)<br>(10) LIN(U) LIN1<br>ControllerMicro (11) LIN(V)(12) LIN(W) LIN2LIN3 LO2 #6 #7<br>NV (18)<br>VDD line (13) VDD VDD Power<br>(14) VFO VFO GND line<br>(15) ITRIP ITRIP LO3<br>5 or 3.3V line (16) VSS VSS NW (17)<br>Thermistor<br>#3<br>U-phase current sensing<br>Temperature monitor #2 V-phase current sensing<br>W-phase current sensing<br><Signal for protection><br><Signal for protection><br>GND line Control<br>**----- End of picture text -----**<br>


## **Figure 10 Typical application circuit** 

- #1 Input circuit 

   - RC filter circuit can be used to reduce input signal noise (e.g. 100  , 1 nF). 

   - The filter capacitors should be placed close to the IPM (to VSS pin especially). 

- #2 ITRIP circuit 

   - To prevent protection function errors, RC filter circuit is recommended. 

   - The filter capacitor should be placed close to ITRIP and VSS pins. 

- #3 VFO circuit 

   - VFO pin is an open-drain output. This signal line should be pulled up to the bias voltage of the 5 V/3.3 V with a proper resistor. 

   - It is recommended that RC filter circuit is placed close to the controller. 

- #4 VB-VS circuit 

   - Capacitors for high-side floating supply voltage should be placed close to VB and VS pins. 

- #5 Snubber capacitor 

   - The wiring among the IPM, snubber capacitor and shunt resistors should be short as possible. 

- #6 Shunt resistor 

   - SMD-type resistors are strongly recommended to minimize stray inductance. 

- #7 Ground pattern 

   - Power ground and signal ground should be connected at a single point. It is recommended to connect them at the end of shunt resistor. 

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**CIPOS™ Mini IGCM10F60GA Application Guide** 

**==> picture [104 x 46] intentionally omitted <==**

## **12.2 Performance Chart** 

**==> picture [339 x 274] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br>VDC = 300 V, VDD = VBS = 15 V, SVPWM<br>TJ    150 [o] C, TC    125 [o] C, M.I. = 0.8, P.F. = 0.8<br>8<br>6 f SW  = 5 kHz<br>fSW = 15 kHz<br>4<br>2<br>0<br>0 25 50 75 100 125 150<br>Case temperature, TC [ [o] C]<br>]<br>RMS<br> [A<br>O<br>Maximum output current, I<br>**----- End of picture text -----**<br>


**Figure 11 Maximum operating current SOA[1]** 

1This maximum operating current SOA is just one of example based on typical characteristics for this product. It can be changed by each user’s actual operating conditions. 

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**CIPOS™ Mini IGCM10F60GA Package Outline** 

**13** 

## **Package Outline** 

**Figure 12 IGCM10F60GA** 

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**CIPOS™ Mini IGCM10F60GA Revision history** 

**==> picture [104 x 46] intentionally omitted <==**

## **Revision history** 

|**Document**<br>**version**|**Date of release**|**Description of changes**|
|---|---|---|
|2.9|Sep. 2017|Maximum operating case temperature, TC= 125°C<br>Package outline update|
|3.0|Jan. 2023|Updated Figure 11|
|3.1|Jun. 2023|Corrected error in IIN-|



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## **Trademarks** 

All referenced product or service names and trademarks are the property of their respective owners. 

## **IMPORTANT NOTICE** 

**Edition 2023-06-23** The information given in this document shall in no event be regarded as a guarantee of conditions or **Published by** characteristics  (“Beschaffenheitsgarantie”) . **Infineon Technologies AG** With respect to any examples, hints or any typical **81726 Munich, Germany** values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all **© 2023 Infineon Technologies AG.** warranties and liabilities of any kind, including without limitation warranties of non-infringement **All Rights Reserved.** of intellectual property rights of any third party. **Do you have a question about this** In addition, any information given in this document **document?** is subject to customer’s compliance with its obligations stated in this document and any **Email: erratum@infineon.com** applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in **Document reference** customer’s applications. 

**Document reference ifx1** 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

Please note that this product is not qualified according to the AEC Q100 or AEC Q101 documents of the Automotive Electronics Council. 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



## Links

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---

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