# Silicon Carbide Schottky Diode, thinQ Gen V Series, Dual Common Cathode, 650 V, 10 A, 15 nC

![Product image](https://novapart.co/image/farnell:3625466/)

**URL**: https://novapart.co/products/IDW20G65C5BXKSA2/silicon-carbide-schottky-diode-thinq-gen-v-series
**SKU**: IDW20G65C5BXKSA2
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Silicon Carbide Schottky Diodes
**Price**: €3.5700
**Stock**: 10+
**Lead Time**: 358 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3 Pin |
| Product Range | thinQ Gen V Series |
| Qualification | - |
| Diode Mounting | Through Hole |
| Diode Case Style | TO-247 |
| Diode Configuration | Dual Common Cathode |
| Average Forward Current | 10A |
| Total Capacitive Charge | 15nC |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 650V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3625466/)

## SiC 

Silicon Carbide Diode 

5[t h] Generation thinQ![TM] 

650V SiC Schottky Diode IDW20G65C5B 

## Final Datasheet 

Rev. 2.0, 2015-04-13 

> [Power Management & Multimarket ] ~~ee~~ 

## Cinfineon 

## **5[th] Generation thinQ!™ SiC Schottky Diode** 

## **IDW20G65C5B** 

## **1 Description** 

ThinQ!™ Generation 5 represents Infineon leading edge technology for the SiC Schottky Barrier diodes. A combination with a new, more compact design and thinwafer technology results is a new family of products showing improved efficiency over all load conditions, resulting from both the improved thermal characteristics and a lower figure of merit (Qc x Vf). 

The new thinQ!™ Generation 5 has been designed to complement our 650V CoolMOS™ families: this ensures meeting the most stringent application requirements in this voltage range. 

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## **Features** 

- Revolutionary semiconductor material - Silicon Carbide 

- Benchmark switching behavior 

- No reverse recovery/ No forward recovery 

- Temperature independent switching behavior 

- High surge current capability 

- Pb-free lead plating; RoHS compliant 

- Qualified according to JEDEC[1)] for target applications 

- Breakdown voltage tested at 9 mA[2) 3)] 

- Optimized for high temperature operation 

## **Benefits** 

- System efficiency improvement over Si diodes 

- System cost / size savings due to reduced cooling requirements 

- Enabling higher frequency / increased power density solutions 

- Higher system reliability due to lower operating temperatures 

- Reduced EMI 

## **Applications** 

- Switch mode power supply 

- Power factor correction 

- Solar inverter 

- Uninterruptible power supply 

|**Parameter **|**Value**|**Unit**|
|---|---|---|
|_VDC_|650|V|
|_QC_; _V_R=400V|2 x 15|nC|
|_EC_; _V_R=400V|2 x3.5|µJ|
|_IF @ TC < 125°C_|2 x 10|A|



|**Table 2**<br>**Pin Definition **||||
|---|---|---|---|
|**Pin 1**<br>**Pin 2**<br>**Pin3**<br>A<br>C<br>A<br>~~[|~~<br>~~— | —~~||||
|**Type / ordering Code**<br>**Package**<br>IDW20G65C5B<br>PG-TO247-3<br>~~Ce~~||**Marking**<br>D2065B5|**Related links**<br>www.infineon.com/sic|



1) J-STD20 and JESD22 

- 2) All devices tested under avalanche conditions for a time periode of 10ms 3) Per Leg 

- 4) Per Device 

Final Datasheet 

Rev. 2.0, 2015-04-13 

2 

**==> picture [105 x 46] intentionally omitted <==**

## **5[th] Generation thinQ![TM] SiC Schottky Diode IDW20G65C5B** 

## **Table of contents** 

|**Table**|**of Contents**|
|---|---|
|**1**|**Description .......................................................................................................................................... 2**|
|**2**|**Maximum ratings ................................................................................................................................ 4**|
|**3**|**Thermal characteristics ..................................................................................................................... 4**|
|**4**|**Electrical characteristics ................................................................................................................... 5**|
|**5**|**Electrical characteristics diagrams .................................................................................................. 6**|
|**6**|**Simplified Forward Characteristics Model ...................................................................................... 8**|
|**7**|**Package outlines ................................................................................................................................ 9**|
|**8**|**Revision History ............................................................................................................................... 10**|



Final Datasheet 

Rev. 2.00, 2015-04-13 

3 

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## **5[th] Generation thinQ![TM] SiC Schottky Diode IDW20G65C5B** 

## **Maximum ratings** 

## **2 Maximum ratings** 

|**able 3**<br>**Maximum ratings**|**able 3**<br>**Maximum ratings**||||||
|---|---|---|---|---|---|---|
|**arameter**|**Symbol**||**Values**||**Unit**|**Note/Test Condition**|
|||**Min.**|**Typ. **|**Max.**|||
|ontinuous forward current1)|_I_F|–|–|10|A|_T_C< 125°C,D=1|
|urge non-repetitive forward current, sine<br>alfwave1)|<br>_I_F,SM|–|–|58||_TC_= 25°C, _t_p=10 ms|
|||–|–|46||_T_C= 150°C, _t_p=10 ms|
|on-repetitivepeak forward current1)|_I_F,max|–|–|431||_T_C= 25°C, _t_p=10µs|
|t value1)|_∫ i²dt_|–|–|16.6|A²s|_TC_= 25°C, _t_p=10 ms|
|||–|–|10.5||_T_C= 150°C, _t_p=10 ms|
|epetitivepeak reverse voltage|_V_RRM|–|–|650|V|_Tj_= 25°C|
|iode dv/dt ruggedness|_dv/dt_|–|–|100|V/ns|_V_R=0..480 V|
|ower dissipation2)|_P_tot|–|–|130|W|_TC_= 25°C|
|peratingand storage temperature|_T_j_;T_stg|-55|–|175|°C||
|ountingtorque||–|50|70|Ncm|M3 screws|



## **3 Thermal characteristics** 

|**able 4**<br>**Thermal characteristics TO-247-3**|**able 4**<br>**Thermal characteristics TO-247-3**|**able 4**<br>**Thermal characteristics TO-247-3**|||||
|---|---|---|---|---|---|---|
|**arameter**|**Symbol**||**Values**||**Unit**|**Note/Test Condition**|
|||**Min.**|**Typ. **|**Max.**|||
|hermal resistance, junction-case1)|_R_thJC|–|1.8|2.3|K/W||
|hermal resistance, junction-ambient1)|_R_thJA|–|–|62||leaded|
|oldering temperature, wavesoldering<br>nlyallowed at leads|_T_sold|–|–|260|°C|1.6mm (0.063 in.) from<br>case for 10 s|



1) Per Leg 2) Per Device 

Final Datasheet 

Rev. 2.0, 2015-04-13 

4 

**5[th] Generation thinQ![TM] SiC Schottky Diode IDW20G65C5B** 

**==> picture [105 x 46] intentionally omitted <==**

## **Electrical characteristics** 

## **4 Electrical characteristics** 

## **Table 5 Static characteristics** 

|**arameter**|**Symbol**||**Values**||**Unit**|**Note/Test Condition**|
|---|---|---|---|---|---|---|
|||**Min.**|**Typ. **|**Max.**|||
|C blockingvoltage **1)**|_V_DC|650|–|–|V|_T_j=25°C|
|iode forward voltage1)|_V_F|–|1.5|1.7||_I_F= 10 A, _T_j=25°C|
|||–|1.8|2.1||_I_F= 10 A, _T_j=150°C|
|everse current1)|_I_R|–|0.5|180|µA|_V_R=650 V, _T_j=25°C|
|||–|0.1|60||_V_R=600 V, _T_j=25°C|
|||–|2.0|1250||_V_R=650 V, _T_j=150°C|



|**able 6**<br>**AC characteristics**|||||||
|---|---|---|---|---|---|---|
|**arameter**|**Symbol**||**Values**||**Unit**|**Note/Test Condition**|
|||**Min.**|**Typ. **|**Max.**|||
|otal capacitive charge1)|_Q_c|–|15||nC|_V_R=400 V,_di/dt_=200A/µs,<br>_I_F≤_I_F,MAX, _T_j=150°C|
|otal Capacitance1)|_C_|–|300|–|pF|_V_R=1 V, _f_=1 MHz|
|||–|40|–||_V_R=300 V, _f_=1 MHz|
|||–|39|–||_V_R=600 V, _f_=1 MHz|



1) Per Leg 2) Per Device 

Final Datasheet 

Rev. 2.0, 2015-04-13 

5 

**==> picture [105 x 46] intentionally omitted <==**

## **5[th] Generation thinQ![TM] SiC Schottky Diode IDW20G65C5B** 

## **Electrical characteristics diagrams** 

## **5 Electrical characteristics diagrams** 

## **Table 7** 

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**----- Start of picture text -----**<br>
Power dissipation  [1)] Maximal diode forward current  [1)]<br>70 80<br>0.1<br>60 70 0.3<br>0.5<br>60 0.7<br>50<br>1<br>50<br>40<br>40<br>30<br>30<br>20<br>20<br>10 10<br>0 0<br>25 50 75 100 125 150 175 25 50 75 100 125 150 175<br>TC[°C] TC[°C]<br>P tot=f( T C);  R thJC,max I F=f( T C);  R thJC,max; T j≤175°C; parameter  D =duty cycle<br>Table 8<br>Typical forward characteristics  [1)] Typical forward characteristics in surge current  [1)]<br>20 100<br>18 -55°C  90<br>16 25°C  80<br>14 100°C  70<br>-55°C<br>12 60<br>25°C<br>10 50<br>100°C<br>8 40<br>6 150°C  30<br>4 175°C  20<br>150°C<br>2 10<br>175°C<br>0<br>0<br>0 1 2 3 0 1 2 3 4 5 6<br>V F [V] V F [V]<br>I F=f( V F); tp=200 µs; parameter:  T j I F=f( V F); tp=200 µs; parameter:  T j<br>[W]<br>tot<br>P<br>[A] I F<br> [A]  [A]<br>I F I F<br>**----- End of picture text -----**<br>


1) Per Leg 2) Per Device 

Final Datasheet 

Rev. 2.0, 2015-04-13 

6 

**==> picture [105 x 46] intentionally omitted <==**

## **5[th] Generation thinQ![TM] SiC Schottky Diode IDW20G65C5B** 

## **Electrical characteristics diagrams** 

## **Table 9** 

**==> picture [497 x 271] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typ. capacitance charge vs. current slope  [1)] Typ. Reverse current vs. reverse voltage  [1)]<br>16 1.E-5<br>14<br>12 1.E-6<br>10<br>8 1.E-7 175°C<br>6 150°C<br>4 1.E-8 100°C<br>-55°C<br>2 25°C<br>0 1.E-9<br>100 400 700 1000 100 200 300 400 500 600<br>dIF/dt [A/µs] V R [V]<br>Q C=f(diF/dt);  T j=150°C;  V R=400 V;  I F≤ I F,max I R=f( V R); parameter:  T j<br> [A]<br>I R<br>Qc [nC]<br>**----- End of picture text -----**<br>


## **Table 10** 

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**----- Start of picture text -----**<br>
Max. transient thermal impedance  [1)] Typ. capacitance vs. reverse voltage  [1)]<br>400<br>350<br>1<br>300<br>250<br>0.5<br>0.2 200<br>0.1<br>0.1<br>0.05 150<br>0.02<br>0.01 100<br>single pulse<br>50<br>0.01 0<br>1.E-06 1.E-03 1.E+00 0  1  10  100  1000<br>t p [s] V R [V]<br>Zth,jc =f( t P); parameter: D= t P/ T C= f( V R);  T j=25°C;  f =1 MHz<br> [K/W]<br>th,jc<br>Z<br> [pF]<br>C<br>**----- End of picture text -----**<br>


1) Per Leg 2) Per Device 

Final Datasheet 

Rev. 2.0, 2015-04-13 

7 

**5[th] Generation thinQ![TM] SiC Schottky Diode IDW20G65C5B** 

**==> picture [105 x 46] intentionally omitted <==**

## **Electrical characteristics diagrams** 

## **Table 11** 

**==> picture [249 x 268] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typ. capacitance stored energy  [1)]<br>10<br>9<br>8<br>7<br>6<br>5<br>4<br>3<br>2<br>1<br>0<br>0 200 400 600<br>VR [V]<br>E C=f( V R)<br> [µJ]<br>C<br>E<br>**----- End of picture text -----**<br>


## **6 Simplified Forward Characteristics Model** 

## **Table 12** 

**Equivalent forward current curve[1)] Mathematical Equation** _V_  _V_  _R_  _I F TH DIFF F VTH_  _Tj_   .0001  _Tj_  .104  V _RDIFF_  _Tj_  1.29  10-6  _Tj_ 2  1.29  10-4  _Tj_  0.047  **1/R diff V th** _**V**_ **F [V]** _V_ F=f( _I_ F) _T_ j in °C; -55°C < _T_ j < 175°C; _I_ F < 20 A 

1) Per Leg 2) Per Device 

Final Datasheet 

Rev. 2.0, 2015-04-13 

8 

Cinfineon_ 

**5[th] Generation thinQ![TM] SiC Schottky Diode IDW20G65C5B** 

## **7** 

## **Package outlines** 

## **Figure 1 Outlines TO-247, dimensions in mm/inches** 

1) Per Leg 

2) Per Device 

Final Datasheet 

Rev. 2.0, 2015-04-13 

9 

**5[th] Generation thinQ![TM] SiC Schottky Diode IDW20G65C5B** 

## Cinfineon 

## **Revision History** 

## **8 Revision History** 

## **5** ~~**[th]**~~ **Generation thinQ!** ~~**[TM]**~~ **SiC Schottky Diode** 

**Revision History: 2015-04-13, Rev. 2.0** 

|**Revision History: 2015-04-13, Rev. 2.0y: 2015-04-13, Rev. 2.0: 2015-04-13, Rev. 2.0, Rev. 2.0 Rev. 2.0**|**Revision History: 2015-04-13, Rev. 2.0y: 2015-04-13, Rev. 2.0: 2015-04-13, Rev. 2.0, Rev. 2.0 Rev. 2.0**|
|---|---|
|**Previous Revision:**||
|**Revision**|**Subjects(major changes since last version)**|
|2.0|Release of the final datasheet.|



## **We Listen to Your Comments** 

Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. 

Please send your proposal (including a reference to this document) to: **erratum@infineon.com** Edition 2015-04-13 

Published by Infineon Technologies AG 81726 Munich, Germany © 2015 Infineon Technologies AG All Rights Reserved. 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office ( **www.infineon.com** ). 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. 

The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

Final Datasheet 

Rev. 2.0, 2015-04-13 

10 

w w w . i n f i n e o n . c o m 

Published by Infineon Technologies AG 



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