# Silicon Carbide Schottky Diode, thinQ Gen V Series, Single, 650 V, 2 A, 4 nC, VSON

![Product image](https://novapart.co/image/farnell:3625460RL/)

**URL**: https://novapart.co/products/IDL02G65C5XUMA2/silicon-carbide-schottky-diode-thinq-gen-v-series
**SKU**: IDL02G65C5XUMA2
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Silicon Carbide Schottky Diodes
**Price**: €0.5290
**Stock**: 200+
**Lead Time**: 190 days (indicative)

## Description

Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (27-Jun-2018) |
| No. Of Pins | 4 Pin |
| Product Range | thinQ Gen V Series |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | VSON |
| Diode Configuration | Single |
| Average Forward Current | 2A |
| Total Capacitive Charge | 4nC |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 650V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3625460RL/)

## SiC 

Silicon Carbide Diode 

5[t h] Generation thinQ![TM] 650V SiC Schottky Diode IDL02G65C5 

## Final Data Sheet 

Rev. 2.0, 2013-12-05 

> [Power Management & Multimarket ] ~~ee~~ 

## Cinfineon 

## **5[th] Generation thinQ!™ SiC Schottky Diode** 

## **IDL02G65C5** 

## **1 Description** 

ThinQ!™ Generation 5 represents Infineon leading edge technology for the SiC Schottky Barrier diodes. The Infineon proprietary diffusion soldering process, already introduced with G3 is now combined with a new, more compact design and thin-wafer technology. The result is a new family of products showing improved efficiency over all load conditions, resulting from both the improved thermal characteristics and a lower figure of merit (Qc x Vf). 

The new thinQ!™ Generation 5 has been designed to complement our 650V CoolMOS™ families: this ensures meeting the most stringent application requirements in this voltage range. 

## **Features** 

- Revolutionary semiconductor material - Silicon Carbide 

- Benchmark switching behavior 

**==> picture [62 x 88] intentionally omitted <==**

**----- Start of picture text -----**<br>
ThinPAK 8x8<br>Bottom view<br>**----- End of picture text -----**<br>


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3,4 5<br>S onam<br>**----- End of picture text -----**<br>


- No reverse recovery/ No forward recovery 

- Temperature independent switching behavior 

- High surge current capability 

- Pb-free lead plating; RoHS compliant 

- Qualified according to JEDEC[1)] for target applications 

- Breakdown voltage tested at 4.5 mA[2)] 

- Optimized for high temperature operation 

## **Benefits** 

- System efficiency improvement over Si diodes 

- System cost / size savings due to reduced cooling requirements 

- Enabling higher frequency / increased power density solutions 

- Higher system reliability due to lower operating temperatures 

- Reduced EMI 

## **Applications** 

- Switch mode power supply 

- Power factor correction 

- Solar inverter 

|**arameter **|**Value**|**Unit**|
|---|---|---|
|_DC_|650|V|
|_C_; _V_R=400V|4|nC|
|_C_; _V_R=400V|0.8|µJ|
|_@ TC < 155_**_°_**_C_|2|A|



**Related Links** http://www.infineon.com/sic ThinPAK Webpage ThinPAK Application Note 

|**Table 2**<br>**Pin Definition **<br>**Pin 1**<br>**Pin 2**<br>**Pin3**<br>**Pin 4**<br>**Pin5**<br>n.c.<br>n.c.<br>A<br>A<br>C<br>~~[_ | | |~~<br>~~|}—!_~~|
|---|
|**Type /ordering Code**<br>**Package**<br>**Marking**<br>IDL02G65C5<br>PG-VSON-4<br>D0265C5<br>~~[_i]]~~|



- 1) J-STD20 and JESD22 

- 2) All devices tested under avalanche conditions for a time periode of 10ms 

Final Data Sheet 

Rev. 2.0, 2013-12-05 

2 

**5[th] Generation thinQ![TM] SiC Schottky Diode IDL02G65C5** 

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## **Table of contents** 

## **Table of Contents** 

|**1**|**Description .......................................................................................................................................... 2**|
|---|---|
|**2**|**Maximum ratings ................................................................................................................................ 4**|
|**3**|**Thermal characteristics ..................................................................................................................... 4**|
|**4**|**Electrical characteristics ................................................................................................................... 5**|
|**5**|**Electrical characteristics diagrams .................................................................................................. 6**|
|**6**|**Simplified Forward Characteristics Model ...................................................................................... 8**|
|**7**|**Package outlines ................................................................................................................................ 9**|
|**8**|**Revision History ............................................................................................................................... 10**|



Final Data Sheet 

Rev. 2.0, 2013-12-05 

3 

**==> picture [105 x 46] intentionally omitted <==**

## **5[th] Generation thinQ![TM] SiC Schottky Diode IDL02G65C5** 

## **Maximum ratings** 

## **2 Maximum ratings** 

## **Table 3 Maximum ratings** 

|**ble 3**<br>**Maximum ratings**|||||||
|---|---|---|---|---|---|---|
|**ameter**|**Symbol**||**Values**||**Unit**|**Note/Test Condition**|
|||**Min.**|**Typ. **|**Max.**|||
|ntinuous forward current|_I_F|–|–|2|A|_T_C< 135°C,D=1|
|ge non-repetitive forward current,<br>e halfwave|<br>_I_F,SM|–|–|21||_TC_= 25°C, _t_p=10 ms|
|||–|–|13||_T_C= 150°C, _t_p=10 ms|
|n-repetitivepeak forward current|_I_F,max|–|–|138||_T_C= 25°C, _t_p=10µs|
|alue|_∫ i²dt_|–|–|2.3|A²s|_TC_= 25°C, _t_p=10 ms|
|||–|–|0.9||_T_C= 150°C, _t_p=10 ms|
|petitivepeak reverse voltage|_V_RRM|–|–|650|V|_Tj_= 25°C|
|de dv/dt ruggedness|_dv/dt_|–|–|100|V/ns|_V_R=0..480 V|
|wer dissipation|_P_tot|–|–|46|W|_TC_= 25°C|
|eratingand storage temperature|_T_j_;T_stg|-55|–|150|°C||



## **3 Thermal characteristics** 

|**ble 4**<br>**Thermal characteristics**|**ble 4**<br>**Thermal characteristics**||||||
|---|---|---|---|---|---|---|
|**ameter**|**Symbol**||**Values**||**Unit**|**Note/Test Condition**|
|||**Min.**|**Typ. **|**Max.**|||
|ermal resistance, junction-case|_R_thJC|–|2.1|2.7|K/W||
|ermal resistance, junction-<br>bient|_R_thJA|–|–|45||SMD version, device on<br>PCB, 6cm² cooling area1)|



1) Device on 40mm*40mm*1.5mm one layer epoxy PCB FR4 with 6cm[2] copper area (thickness 70μm) for drain connection. PCB is vertical without air stream cooling. 

Final Data Sheet 

Rev. 2.0, 2013-12-05 

4 

**5[th] Generation thinQ![TM] SiC Schottky Diode IDL02G65C5** 

**==> picture [105 x 46] intentionally omitted <==**

## **Electrical characteristics** 

## **4 Electrical characteristics** 

## **Table 5 Static characteristics** 

|**ameter**|**Symbol**||**Values**||**Unit**|**Note/Test Condition**|
|---|---|---|---|---|---|---|
|||**Min.**|**Typ. **|**Max.**|||
|blockingvoltage|_V_DC|650|–|–|V|_I_R= 0.035 mA, _T_j=25°C|
|de forward voltage|_V_F|–|1.5|1.7||_I_F= 2 A, _T_j=25°C|
|||–|1.8|2.1||_I_F= 2 A, _T_j=150°C|
|erse current|_I_R|–|0.1|35|µA|_V_R=650 V, _T_j=25°C|
|||–|0.02|12||_V_R=600 V, _T_j=25°C|
|||–|0.4|240||_V_R=650 V, _T_j=150°C|



|**le 6**<br>**AC characteristics**|||||||
|---|---|---|---|---|---|---|
|**ameter**|**Symbol**||**Values**||**Unit**|**Note/Test Condition**|
|||**Min.**|**Typ. **|**Max.**|||
|al capacitive charge|_Q_c|–|4||nC|_V_R=400 V,_di/dt_=200A/µs,<br>_I_F≤_I_F,MAX, _T_j=150°C.|
|al Capacitance|_C_|–|70|–|pF|_V_R=1 V, _f_=1 MHz|
|||–|9.1|–||_V_R=300 V, _f_=1 MHz|
|||–|8.9|–||_V_R=600 V, _f_=1 MHz|



Final Data Sheet 

Rev. 2.0, 2013-12-05 

5 

**5[th] Generation thinQ![TM] SiC Schottky Diode IDL02G65C5** 

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## **Electrical characteristics diagrams** 

## **5 Electrical characteristics diagrams** 

## **Table 7** 

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**----- Start of picture text -----**<br>
Power dissipation  Maximal diode forward current<br>50 30<br>45 0.1<br>0.3<br>40 25 0.5<br>0.7<br>35 1<br>20<br>30<br>25 15<br>20<br>10<br>15<br>10<br>5<br>5<br>0 0<br>25 50 75 100 125 150 25 50 75 100 125 150<br>Tc [°C] Tc [°C]<br>P tot=f( T C);  R thJC,max I F=f( T C);  R thJC,max;  T j≤150°C; parameter  D =duty cycle<br> [A]<br>IF<br> [W]<br>tot<br>P<br>**----- End of picture text -----**<br>


## **Table 8** 

## **Typical forward characteristics** 

## **Typical forward characteristics in surge current** 

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**----- Start of picture text -----**<br>
4 20<br>-55 C<br>18<br>3.5<br>25 C<br>16<br>-55 C<br>3<br>100 C 14<br>25 C<br>2.5<br>12<br>100 C<br>2 150 C 10<br>8<br>1.5<br>6<br>1<br>4<br>150 C<br>0.5<br>2<br>0 0<br>0 0.5 1 1.5 2 2.5 0 1 2 3 4 5 6<br>V F [V] V F [V]<br>I F=f( V F); tp=200 µs; parameter:  T j I F=f( V F); tp=200 µs; parameter:  T j<br> [A]<br>IF<br> [A]<br>I F<br>**----- End of picture text -----**<br>


Final Data Sheet 

Rev. 2.0, 2013-12-05 

6 

**==> picture [105 x 46] intentionally omitted <==**

## **5[th] Generation thinQ![TM] SiC Schottky Diode IDL02G65C5** 

## **Electrical characteristics diagrams** 

## **Table 9** 

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**----- Start of picture text -----**<br>
Typ. capacitance charge vs. current slope [1)] Typ. reverse current vs. reverse voltage<br>4.5<br>1.E-05<br>4<br>3.5<br>1.E-06<br>3<br>2.5<br>1.E-07<br>2<br>1.5<br>150 C<br>1.E-08<br>1<br>-55 C<br>100 C<br>0.5 25 C<br>1.E-09<br>0<br>100 200 300 400 500 600<br>100 300 500 700 900<br>VR [V]<br>d I F/dt [A/µs]<br>Q C=f(d I F/dt);  T j=150°C;  V R=400 V;  I F≤ I F,max I R=f( V R); parameter:  T j;<br> [A]<br>IR<br>[nC]<br>C<br>Q<br>**----- End of picture text -----**<br>


1) Only capacitive charge, guaranteed by design. 

## **Table 10** 

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**----- Start of picture text -----**<br>
Max. transient thermal impedance  Typ. capacitance vs. reverse voltage<br>10 90<br>80<br>70<br>60<br>1<br>50<br>0.5 40<br>0.2<br>0.1 30<br>0.1 0.05<br>0.02<br>0.01 20<br>Single Pulse<br>10<br>0<br>0.01 0 1 10 100 1000<br>1E-6 1E-3 1E0<br>V R [V]<br>tp [s]<br>Zth,jc =f( t P); parameter: D= t P/ T C= f( V R);  T j=25°C;  f =1 MHz<br> [K/W]<br> [pF]<br>thjc C<br>Z<br>**----- End of picture text -----**<br>


Final Data Sheet 

Rev. 2.0, 2013-12-05 

7 

**5[th] Generation thinQ![TM] SiC Schottky Diode IDL02G65C5** 

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## **Electrical characteristics diagrams** 

## **Table 11** 

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**----- Start of picture text -----**<br>
Typ. capacitance stored energy<br>2<br>1.8<br>1.6<br>1.4<br>1.2<br>1<br>0.8<br>0.6<br>0.4<br>0.2<br>0<br>0 200 400 600<br>V R [V]<br>E C=f( V R)<br>[µJ]<br>C<br>E<br>**----- End of picture text -----**<br>


## **6 Simplified Forward Characteristics Model** 

## **Table 12** 

**Equivalent forward current curve Mathematical Equation** _V_  _V_  _R_  _I F TH DIFF F VTH_  _Tj_   .0001  _Tj_  .104  V _RDIFF_  _Tj_  6.42  10-6  _Tj_ 2  6.42  10-4  _Tj_  0.232  **1/R diff V th** _**V**_ **F [V]** _V_ F=f( _I_ F) _T_ j in °C; -55°C < _T_ j < 150°C; _I_ F < 4 A 

Final Data Sheet 

Rev. 2.0, 2013-12-05 

8 

**5[th] Generation thinQ![TM] SiC Schottky Diode IDL02G65C5** 

Cinfi 

## **Package outlines** 

## **7** 

## **Package outlines** 

**Figure 1 Outlines ThinPAK 8x8, dimensions in mm/inches** 

Final Data Sheet 

Rev. 2.0, 2013-12-05 

9 

**5[th] Generation thinQ![TM] SiC Schottky Diode IDL02G65C5** 

## Cinfineon 

## **Revision History** 

## **8 Revision History** 

## **5** ~~**[th]**~~ **Generation thinQ!** ~~**[TM]**~~ **SiC Schottky Diode** 

**Revision History: 2013-12-05, Rev. 2.0** 

|**Revision History: 2013-12-05, Rev. 2.0y: 2013-12-05, Rev. 2.0: 2013-12-05, Rev. 2.0, Rev. 2.0 Rev. 2.0**|**Revision History: 2013-12-05, Rev. 2.0y: 2013-12-05, Rev. 2.0: 2013-12-05, Rev. 2.0, Rev. 2.0 Rev. 2.0**|
|---|---|
|**Previous Revision:**||
|**Revision**|**Subjects(major changes since last version)**|
|2.0|Release of the final data sheet|



## **We Listen to Your Comments** 

Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. 

Please send your proposal (including a reference to this document) to: **erratum@infineon.com** 

Edition 2013-05-13 

Published by Infineon Technologies AG 81726 Munich, Germany © 2013 Infineon Technologies AG All Rights Reserved. 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office ( **www.infineon.com** ). 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. 

The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

Final Data Sheet 

Rev. 2.0, 2013-12-05 

10 

w w w . i n f i n e o n . c o m 

Published by Infineon Technologies AG 



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