# MEMS Module, 6-Axis MotionTracking Device, 3-Axis Gyroscope/Accelerometer, 1.71 V to 3.6 V, LGA-14

![Product image](https://novapart.co/image/farnell:3132265/)

**URL**: https://novapart.co/products/ICM-42605/mems-module-6-axis-motiontracking-device-3
**SKU**: ICM-42605
**Manufacturer**: TDK INVENSENSE
**Category**: Semiconductors - ICs || IC Sensors || MEMS Modules
**Price**: €1.8200
**Stock**: 10+
**Lead Time**: 123 days (indicative)

## Description

MEMS Module Function:Tri-Axis Gyroscope, Tri-Axis Accelerometer; Supply Voltage Min:1.71V; Supply Voltage Max:3.6V; Sensor Case Style:LGA; No. of Pins:14Pins; Gyroscope Range:± 1

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 3 - 168 hours |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 14Pins |
| Sensor Type | Accelerometer, Gyroscope |
| Sensing Axis | X, Y, Z |
| Product Range | - |
| Output Interface | I2C, I3C, SPI |
| Sensor Case Style | LGA |
| Supply Voltage Max | 3.6V |
| Supply Voltage Min | 1.71V |
| Mems Module Function | Tri-Axis Gyroscope, Tri-Axis Accelerometer |
| Sensor Case / Package | LGA |
| Operating Temperature Max | 85°C |
| Operating Temperature Min | -40°C |
| Sensing Range - Gyroscope | ± 15.625°/s, ± 31.25°/s, ± 62.5°/s, ± 125°/s, ± 250°/s, ± 500°/s, ± 1000°/s, ± 2000°/s |
| Temperature Sensing Range | - |
| Sensing Range - Accelerometer | ± 2g, ± 4g, ± 8g, ± 16g |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3132265/)

_**ICM-42605**_ 

## Low Power Hi h Performance 6-Axis MEMS MotionTrackin Device g g[TM] 

## **GENERAL DESCRIPTION** 

## **APPLICATIONS** 

The ICM-42605 is a 6-axis MotionTracking device that combines a 3-axis gyroscope, and a 3-axis accelerometer in a small 2.5x3x0.91 mm (14-pin LGA) package.  It also features a 2K-byte FIFO that can lower the traffic on the serial bus interface, and reduce power consumption by allowing the system processor to burst read sensor data and then go into a low-power mode. ICM-42605, with its 6-axis integration, enables manufacturers to eliminate the costly and complex selection, qualification, and system level integration of discrete devices, guaranteeing optimal motion performance for consumers. 

The gyroscope supports eight programmable full-scale range settings from ±15.625dps to ±2000dps, and the accelerometer supports eight programmable full-scale range settings from ±2g to ±16g. 

Other industry-leading features include programmable digital filters, an embedded temperature sensor, and programmable interrupts. The device features I3C[SM] , I[2] C and SPI serial interfaces, a VDD operating range of 1.71 V to 3.6 V, and a separate digital IO supply, VDDIO from 1.71 V to 3.6 V. 

The host interface can be configured to support I3C[SM] slave, I[2] C slave, or SPI slave modes.  The I3C[SM] interface supports speeds up to 12.5MHz (data rates up to 12.5Mbps in SDR mode, 25Mbps in DDR mode), the I[2] C interface supports speeds up to 1 MHz, and the SPI interface supports speeds up to 24 MHz. 

- Smartphones and Tablets 

- Wearable Sensors 

- Virtual Reality headsets and controllers 

- IoT Applications 

## **FEATURES** 

- Gyroscope programmable full-scale range of ±15.625, ±31.25, ±62.5, ±125, ±250, ±500, ±1000, and ±2000 degrees/sec 

- Accelerometer programmable full-scale range of 

   - ±2 _g_ , ±4 _g_ , ±8 _g_ and ±16 _g_ 

- Low-Noise mode 6-axis current consumption of 0.65mA 

      - Gyroscope Noise: 3.8mdps/Hz 

      - Accelerometer Noise: 70µg/Hz 

- 2K-byte FIFO reduces traffic on serial bus interface 

- EIS FSYNC support 

- User-programmable digital filters for gyroscope, accelerometer, and temperature sensor 

- User-programmable interrupts 

- APEX Motion Functions: Pedometer, Tilt Detection, Raise to Wake/Sleep, Tap Detection, Wake on Motion, Significant Motion Detection 

- Host interface: 12.5MHz I3C[SM] , 1MHz I[2] C, 24MHz SPI 

- Digital-output temperature sensor 

- Nominal VDD operation at 1.8V 

- 20,000 _g_ shock tolerant 

- RoHS and Green compliant 

By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the package size down to a footprint and thickness of 2.5x3x0.91 mm (14-pin LGA), to provide a very small yet high performance low cost package. The device provides high robustness by supporting 20,000 _g_ shock reliability. 

## **ORDERING INFORMATION** 

|**PART**|**TEMP RANGE**|**PACKAGE**|
|---|---|---|
|ICM-42605†|−40°C to +85°C|14-Pin LGA|



†Denotes RoHS and Green-Compliant Package 

## **BLOCK DIAGRAM** 

**TDK Corporation** 1745 Technology Drive, San Jose, CA 95110 U.S.A +1(408) 988–7339 www.invensense.com 

InvenSense reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 

Document Number: PB-000070 Revision: 1.0 Revision Date: 03/07/2019 



## Links

- [View this product on Novapart](https://novapart.co/products/ICM-42605/mems-module-6-axis-motiontracking-device-3)
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- [Supplier page](https://es.farnell.com/tdk-invensense/icm-42605/mems-mod-3-axis-gyroscope-accelerometer/dp/3132265)
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