GO1555IXTE3

**GO1555 Voltage Controlled Oscillator** 

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## **GO1555 Data Sheet** 

## **Key Features** 

- Generates 1.485GHz or 1.485/1.001GHz signal for Gennum ICs 

- Low power — 20mW less than GO1525 

- 50Ω output impedance 

- Operates from a single 2.5V supply 

- 8 pin tape on reel 

- Pb-free and RoHS Compliant 

## **Applications** 

Other Products: 

- GS4915 ClockCleaner[™] 

## **Description** 

The GO1555 is a self contained, miniature Voltage Controlled Oscillator (VCO). It produces a clean 1.485GHz reference clock signal with low spurious noise content. It is designed to drive 50Ω strip lines. 

The VCO requires a single 2.5V supply and draws a maximum of 8mA of current. It is packaged in a miniature 8-pin proprietary surface mount package and operates over the temperature range of -40°C to +85°C. 

The GO1555 can be used in place of the older GO1525 VCO. Compared to the GO1525, the GO1555 saves space, consumes less power and achieves better jitter performance. 

Deserializers: 

- GS1559, GS1560A, GS1561, GS9060 

Serializers: 

- GS1531, GS1532, GS9062 

Note: Optimal performance of the GO1555 is achieved using slightly different loop bandwidth component values than those used with the GO1525. 

This component and all homogeneous subcomponents are RoHS compliant. 

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VCTR VCC<br>STRIPLINE STRIPLINE<br>OUT<br>OSCILLATOR CIRCUIT<br>GND<br>**----- End of picture text -----**<br>


**GO1555 Functional Block Diagram** 

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**GO1555 Data Sheet** 

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## **Contents** 

Key Features.................................................................................................................1 Applications...................................................................................................................1 Description ....................................................................................................................1 1. Pin Out ......................................................................................................................3 1.1 Pin Assignment ...............................................................................................3 1.2 Pin Descriptions ..............................................................................................3 2. Electrical Characteristics...........................................................................................4 3. Soldering Recommendations ....................................................................................5 3.1 Reflow Conditions ...........................................................................................6 3.2 Soldering Flux .................................................................................................6 3.3 Rework or Repair ............................................................................................6 3.4 Endurance To Warp ........................................................................................6 4. Handling Recommendations .....................................................................................7 4.1 Cleaning ..........................................................................................................7 4.2 Storage ...........................................................................................................7 4.3 Transport .........................................................................................................7 4.4 ESD Warning ..................................................................................................7 5. Package & Ordering Information...............................................................................8 5.1 Package Dimensions ......................................................................................8 5.2 Packaging Data ...............................................................................................8 5.3 Tape and Reel Specification ...........................................................................9 5.4 PCB Footprint ...............................................................................................11 5.5 Marking Diagram ...........................................................................................11 5.6 Ordering Information .....................................................................................11 6. Revision History ......................................................................................................12 

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**GO1555 Data Sheet** 

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## **1. Pin Out** 

## **1.1 Pin Assignment** 

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NC GND O/P<br>3 2 1<br>GND 4 GO1555 8 GND<br>TOP VIEW<br>5 6 7<br>VCTR GND VCC<br>NOTE:  Pin numbers are arbitrary<br>            There are no pin markings on the device itself<br>**----- End of picture text -----**<br>


## **1.2 Pin Descriptions** 

**Table 1-1: Pin Descriptions** 

|**Pin Number**|**Name**|**Type**|**Description**|
|---|---|---|---|
|2, 4, 6, 8|GND|Power|Most negative power supply connections.|
|5|VCTR|Input|Control voltage for the VCO.|
|7|VCC|Power|Most positive power supply connection.|
|1|O/P|Output|VCO signal output.|
|3|NC|–|No connection.|



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**GO1555 Data Sheet** 

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## **2. Electrical Characteristics** 

## **Table 2-1: Electrical Characteristics** 

VCC = 2.5V ±0.25V, Temperature = -40°C to +85°C, unless otherwise shown 

|**Parameter**<br>**Symbol**|**Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>**Notes**|
|---|---|
|Supply Voltage<br>VCC|–<br>2.25<br>2.5<br>2.75<br>V<br>–|
|Supply Current<br>ΙS|–<br>–<br>–<br>8<br>mA<br>–|
|Control Voltage Range<br>VCTR|–<br>1.0<br>1.25<br>1.5<br>V<br>–|
|Control Voltage Sensitivity<br>df/dV|VCTR= 1.0V - 1.5V<br>35.5<br>–<br>48.5<br>MHz/V<br>–|
|Operating Frequency Range<br>ƒVCO|VCTR= 1.0V<br>–<br>–<br>1483.5<br>MHz<br>–<br>VCTR= 1.5V<br>1485.0<br>–<br>–<br>MHz|
|Output Signal Level<br>VOUT|–<br>-10.5<br>–<br>-3<br>dBm<br>–|
|Pushing Figure<br>–|VCC= 2.5V ± 0.25V, ref:<br>VCC= 2.5V<br>-1.5<br>–<br>+1.5<br>MHz<br>–|
|Pulling Figure<br>–|VSWR = 2.0 for all phase,<br>ref: 50Ω<br>-3<br>–<br>+3<br>MHz<br>–|
|Temperature Stability<br>TCOEF|-40°C to +85°C, ref. = 25°C<br>-3<br>–<br>4<br>MHz<br>–|
|Spurious Response<br>–|–<br>–<br>–<br>-10<br>dBc<br>–|
|Output Impedance<br>ZO|–<br>–<br>50<br>–<br>Ω<br>–|



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**GO1555 Data Sheet** 

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## **3. Soldering Recommendations** 

The device is manufactured with Matte-Sn terminations and is compatible with both standard eutectic and Pb-free solder reflow profiles. The recommended standard eutectic reflow profile is shown in Figure 3-1. The maximum recommended Pb-free reflow profile is shown in Figure 3-2. 

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Temperature 60-150 sec.<br>10-20 sec.<br>230˚C<br>220˚C<br> 3˚C/sec max<br>183˚C<br> 6˚C/sec max<br>150˚C<br>100˚C<br>25˚C<br>Time<br>120 sec. max<br>6 min. max<br>**----- End of picture text -----**<br>


**Figure 3-1: Standard Eutectic Solder Reflow Profile** 

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Temperature<br>Max 80 sec.<br>Max 10 sec.<br>260˚C<br>250˚C<br> 3˚C/sec max<br>220˚C<br> 6˚C/sec max<br>200˚C<br>150˚C<br>25˚C<br>Time<br>60-120 sec. max<br>8 min. max<br>**----- End of picture text -----**<br>


**Figure 3-2: Maximum Pb-free Solder Reflow Profile (Preferred)** 

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**GO1555 Data Sheet** 

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## **3.1 Reflow Conditions** 

The device will meet the data sheet specifications after completing the reflow process according to the profile shown in Figure 3-1 or Figure 3-2. Recommended soldering conditions are as follows: 

|Preheating|150±10°C, 60 to 120 sec.|
|---|---|
|Soldering|Peak 260°C|
||Over 220°C within 80 sec.|



## **3.2 Soldering Flux** 

Do not use cleaning type flux. Washing the devices after using cleaning type flux may damage inner parts and affect performance. 

## **3.3 Rework or Repair** 

Rework or repair must only be done once. Do not reflow the device more than twice; once for initial soldering and once for remounting after rework. 

Do not vibrate the VCO during reflow soldering. 

## **3.4 Endurance To Warp** 

When the device is soldered on a printed circuit board (dimension: 100mm x 100mm; thickness: 1.6mm) and the PCB is warped as shown in Figure 3-3, the device will not be cracked or damaged. 

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VCO<br>PCB<br>MAX 2mm<br>**----- End of picture text -----**<br>


**Figure 3-3: PCB Warp** 

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**GO1555 Data Sheet** 

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## **4. Handling Recommendations** 

## **4.1 Cleaning** 

There are two options for cleaning the devices. 

Option 1: 

1. Clean but do not use solvent cleaners. 

2. Thoroughly dry assemblies afterwards. 

Option 2: 

1. Mount device after board is cleaned. 

## **4.2 Storage** 

Store the devices out of direct sunlight, at a stable temperature and humidity. Avoid extreme temperatures, high humidity and wide temperature fluctuations. Condensation on the devices may result in reduced quality and lowered solderability. 

Avoid dust, sea breezes and corrosive gases (Cl 2 , NH 3 , SO 2 , NO X , etc.). 

Use within 6 months after delivery. If the devices are stored for more than one year, solderability may be degraded. 

## **4.3 Transport** 

Package the devices for transportation to avoid mechanical vibration or shock. 

## **4.4 ESD Warning** 

Avoid poor ground connections and electrostatic discharge or induction in production. 

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**GO1555 Data Sheet** 

## **5. Package & Ordering Information** 

## **5.1 Package Dimensions** 

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3 2 1 5 6 7<br>NC GND OUT 0.45+/-0.15<br>0.45+/-0.15<br>G55<br>4 GND GND 8 3.20+/-0.20 4 8 1.10+/-0.10 2.30+/-0.10<br>M D 1 2 3<br>VCTR GND VCC 0.45+/-0.15<br>es<br>5 6 7 3 2 1<br>0.30+/-0.15<br>0.90+/-0.10 1.10+/-0.10 0.90+/-0.10<br>HEP<br>4.50+/-0.20 2.10+/-0.10<br>NOTE:<br>The terminals are not marked on the case.<br>Terminals :  Gold plating<br>Solder plating<br>1.50 max.<br>Resist :  Cover of resist spreading<br>Unit (mm)<br>**----- End of picture text -----**<br>


## **5.2 Packaging Data** 

|**Parameter**|**Value**|
|---|---|
|Package Type|8L Proprietary Surface Mount|
|Package Drawing Reference|40567 rev.0|
|Pb-free and RoHS Compliant|Yes|



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## **5.3 Tape and Reel Specification** 

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Trailer<br>A Leader<br>B<br>Packaging units<br>2.00+/-0.05<br>  1.5 [+0.1] - 0 4.0+/-0.1<br>Direction<br>to pull<br>3.6+/-0.1 8.0+/-0.1<br>VCO<br>3.6+/-0.1<br>(DIMENSION) Unit [mm]<br>1.75+/-0.10<br>M M M 5.50+/-0.05<br>G55 G55 G55<br>4.9+/-0.1 VCO D123 D123 D123 12.0+/-0.2<br>(DIMENSION)<br>1.55+/-0.05<br>(DIMENSION)<br>**----- End of picture text -----**<br>


**Figure 5-1: Tape Specification** 

The dimensions of A (trailer of tape) include the one inserted in the reel core. 

**Table 5-1: Tape Dimensions** 

|Trailer|A<br>Empty cavities|>=40mm|
|---|---|---|
|Leader|B<br>Empty cavities, Cover tape leader|>=400mm|
|Packaging Units|3000pcs||
|Partial absence in carrier tape|More than two successive empty cavities will|not occur.|
|Minimum order quantity|3000pcs / Reel||



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**GO1555 Data Sheet** 

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R80<br>  10 R135<br>R55<br>22<br>120<br>W1<br>W2<br>Reel Internal  : W1 13.5 +/- 0.5<br>Reel External  : W2 17.5 +/- 1.0<br>Unit         : mm<br>/- 1<br>6 0.6 PS<br> 330 +/- 2  100 +  13 +/- 0.2<br>**----- End of picture text -----**<br>


**Figure 5-2: Reel Specification** 

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**GO1555 Data Sheet** 

## **5.4 PCB Footprint** 

Recommended Footprint for PCB Layout 

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3 2 1<br>4 8<br>0.8<br>0.85<br>5 6 7<br>ate<br>0.55<br>0.75<br>1.05<br>1.70<br>A 1.9 ~<br>C 2.55 ~<br>i<br>Unit [mm]<br>NOTE:<br>Please make the GND pattern under the VCO and coat the painted part with solder resist.<br>Please decide the dimensions of A, B and C as per the mounting accuracy of the chip mounter.<br>3 2 1<br>NC GND OUT<br>Date Code :<br>G55 1 : Last digit of the year<br>4 8 2,3: Week No.<br>GND GND<br>M D 1 2 3<br>VCTR GND VCC<br>5 6 7<br>0.55 0.80 1.05 B 1.90 ~<br>**----- End of picture text -----**<br>


NOTE: 

Please make the GND pattern under the VCO and coat the painted part with solder resist. Please decide the dimensions of A, B and C as per the mounting accuracy of the chip mounter. 

## **5.5 Marking Diagram** 

## **5.6 Ordering Information** 

|**Part Number**|**Package**|**Pb-free**|**Temperature Range**|
|---|---|---|---|
|GO1555-IXTE3|8-pin tape on reel|Yes|-40°C to +85°C|



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**GO1555 Data Sheet** 

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## **6. Revision History** 

|**Version**|**ECR**|**PCN**|**Date**||**Changes/Modification**|
|---|---|---|---|---|---|
|0|141912|–|September|2006|New Document.|
|1|142967|–|November|2006|Converting to Data Sheet. Added section|
||||||5.3 Tape and Reel Specification. Modified|
||||||minimum output signal level to -10.5dBm|
||||||inElectrical Characteristics.|



## **CAUTION** 

ELECTROSTATIC SENSITIVE DEVICES 

DO NOT OPEN PACKAGES OR HANDLE EXCEPT AT A STATIC-FREE WORKSTATION 

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## DOCUMENT IDENTIFICATION 

## **DATA SHEET** 

The product is in production. Gennum reserves the right to make changes to the product at any time without notice to improve reliability, function or design, in order to provide the best product possible. 

## **GENNUM CORPORATION** 

**Mailing Address: P.O. Box 489, Stn. A, Burlington, Ontario, Canada L7R 3Y3 Shipping Address: 970 Fraser Drive, Burlington, Ontario, Canada L7L 5P5 Tel. +1 (905) 632-2996   Fax. +1 (905) 632-5946** 

## **GENNUM JAPAN CORPORATION** 

**Shinjuku Green Tower Building 27F, 6-14-1, Nishi Shinjuku, Shinjuku-ku, Tokyo, 160-0023 Japan Tel. +81 (03) 3349-5501, Fax. +81 (03) 3349-5505** 

## **GENNUM UK LIMITED** 

**25 Long Garden Walk, Farnham, Surrey, England GU9 7HX Tel. +44 (0)1252 747 000  Fax +44 (0)1252 726 523** 

**Gennum Corporation assumes no liability for any errors or omissions in this document, or for the use of the circuits or devices described herein. The sale of the circuit or device described herein does not imply any patent license, and Gennum makes no representation that the circuit or device is free from patent infringement. GENNUM and the G logo are registered trademarks of Gennum Corporation.** 

**© Copyright September 2006 Gennum Corporation.  All rights reserved. Printed in Canada.** 

**www.gennum.com** 

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