# IGBT Module, Dual Common Emitter Common Gate, 800 A, 2.3 V, 5.75 kW, 150 °C

![Product image](https://novapart.co/image/farnell:3912081/)

**URL**: https://novapart.co/products/GD800SGX170C3S/igbt-module-dual-common-emitter-gate-800-a-23-v
**SKU**: GD800SGX170C3S
**Manufacturer**: STARPOWER
**Category**: Semiconductors - Discretes || IGBTs || IGBT Modules
**Price**: €234.6000
**Stock**: 10+
**Lead Time**: 162 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | To Be Advised |
| Product Range | - |
| Igbt Technology | Trench Field Stop |
| Igbt Termination | Tab |
| Power Dissipation | 5.75kW |
| Igbt Configuration | Dual Common Emitter Common Gate |
| Transistor Mounting | Panel |
| Transistor Case Style | - |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 800A |
| Collector Emitter Voltage Max | 1.7kV |
| Collector Emitter Saturation Voltage | 2.3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3912081/)

GD800SGX170C3S                                                               IGBT Module 

## **STARPOWER** 

## 

## **IGBT** 

## **GD800SGX170C3S** 

## **1700V/800A 1 in one-package** 

## **General Description** 

STARPOWER IGBT Power Module provides ultra low conduction loss as well as short circuit ruggedness. They are designed for the applications such as general inverters and UPS. 

## **Features** 

- Low VCE(sat) Trench IGBT technology 

- 10μs short circuit capability 

- VCE(sat) with positive temperature coefficient 

- Low inductance case 

- Fast & soft reverse recovery anti-parallel FWD 

- Isolated copper baseplate using DBC technology 

## **Typical Applications** 

- AC inverter drives 

- Switching mode power supplies 

- Electronic welders 

## **Equivalent Circuit Schematic** 

**==> picture [83 x 35] intentionally omitted <==**

**==> picture [129 x 44] intentionally omitted <==**

©2021 STARPOWER Semiconductor Ltd.                6/1/2021             1/9              B01 

GD800SGX170C3S                                                               IGBT Module 

## **Absolute Maximum Ratings** TC=25[o] C unless otherwise noted 

## **IGBT** 

|**IGBT**||||
|---|---|---|---|
|**Symbol **|**Description **|**Value**|**Unit**|
|VCES|Collector-EmitterVoltage|1700|V|
|VGES|Gate-Emitter Voltage|±20|V|
|IC|CollectorCurrent|800|A|
|ICM|Pulsed Collector Current  tp=1ms|1600|A|
|PD|Maximum Power Dissipation@Tj=175oC|5.75|kW|
|**Diode**||||
|**Symbol**|**Description**|**Value**|**Unit**|
|VRRM|Repetitive Peak Reverse Voltage|1700|V|
|IF|Diode ContinuousForward Current|800|A|
|IFM|Diode Maximum Forward Current  tp=1ms|1600|A|



## **Module** 

|**Module**||||
|---|---|---|---|
|**Symbol**|**Description**|**Value**|**Unit**|
|Tjmax|MaximumJunction Temperature|175|oC|
|Tjop|OperatingJunction Temperature|-40 to +150|oC|
|TSTG|StorageTemperatureRange|-40to+125|oC|
|VISO|IsolationVoltageRMS,f=50Hz,t=1min|4000|V|



©2021 STARPOWER Semiconductor Ltd.                6/1/2021             2/9              B01 

GD800SGX170C3S                                                               IGBT Module 

**IGBT Characteristics** TC=25[o] C unless otherwise noted 

|**IGBT**|**Characteristics**TC|=25oC unless otherwise n|oted||||
|---|---|---|---|---|---|---|
|**Symbol **|**Parameter **|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|VCE(sat)|Collector to Emitter<br>Saturation Voltage|IC=800A,VGE=15V,<br>Tj=25oC||1.85|2.30|V|
|||IC=800A,VGE=15V,<br>Tj=125oC||2.25|||
|||IC=800A,VGE=15V,<br>Tj=150oC||2.35|||
|VGE(th)|Gate-Emitter Threshold<br>Voltage|IC=32.0mA,VCE=VGE,<br>Tj=25oC|5.6|6.2|6.8|V|
|ICES|Collector Cut-Off<br>Current|VCE=VCES,VGE=0V,<br>Tj=25oC|||1.0|mA|
|IGES|Gate-Emitter Leakage<br>Current|VGE=VGES,VCE=0V,<br>Tj=25oC|||400|nA|
|RGint|InternalGateResistance|||1.1||Ω|
|Cies|Input Capacitance|VCE=25V,f=1MHz,<br>VGE=0V||96.3||nF|
|Cres|Reverse Transfer<br>Capacitance|||2.34||nF|
|QG|Gate Charge|VGE=-15…+15V||7.54||μC|
|td(on)|Turn-On DelayTime|VCC=900V,IC=800A,<br>RG=2.4Ω,<br>VGE=-9/+15V,<br>LS=65nH, Tj=25oC||457||ns|
|tr|RiseTime|||104||ns|
|td(off)|Turn-Off DelayTime|||1250||ns|
|tf|Fall Time|||66||ns|
|Eon|Turn-On Switching<br>Loss|||265||mJ|
|Eoff|Turn-Off Switching<br>Loss|||124||mJ|
|td(on)|Turn-On DelayTime|VCC=900V,IC=800A,<br>RG=2.4Ω,<br>VGE=-9/+15V,<br>LS=65nH, Tj=125oC||502||ns|
|tr|Rise Time|||133||ns|
|td(off)|Turn-Off DelayTime|||1404||ns|
|tf|Fall Time|||113||ns|
|Eon|Turn-On Switching<br>Loss|||385||mJ|
|Eoff|Turn-Off Switching<br>Loss|||157||mJ|
|td(on)|Turn-On DelayTime|VCC=900V,IC=800A,<br>RG=2.4Ω,<br>VGE=-9/+15V,<br>LS=65nH, Tj=150oC||515||ns|
|tr|Rise Time|||141||ns|
|td(off)|Turn-Off DelayTime|||1446||ns|
|tf|Fall Time|||116||ns|
|Eon|Turn-On Switching<br>Loss|||421||mJ|
|Eoff|Turn-Off Switching<br>Loss|||169||mJ|
|ISC|SC Data|tP≤10μs,VGE=15V,<br>Tj=150oC,VCC=1000V,<br>VCEM≤1700V||3200||A|



©2021 STARPOWER Semiconductor Ltd.                6/1/2021             3/9              B01 

## **Diode Characteristics** TC=25[o] C unless otherwise noted 

|**Symbol**|**Parameter**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|VF|Diode Forward<br>Voltage|IF=800A,VGE=0V,Tj=25oC||1.80|2.25|V|
|||IF=800A,VGE=0V,Tj=125oC||1.90|||
|||IF=800A,VGE=0V,Tj=150oC||1.95|||
|Qr|Recovered Charge|VCC=900V,IF=800A,<br>-di/dt=6150A/μs,VGE=-9V,<br>LS=65nH, Tj=25oC||107||μC|
|IRM|Peak Reverse<br>RecoveryCurrent|||717||A|
|Erec|Reverse Recovery<br>Energy|||189||mJ|
|Qr|Recovered Charge|VCC=900V,IF=800A,<br>-di/dt=6150A/μs,VGE=-9V,<br>LS=65nH, Tj=125oC||225||μC|
|IRM|Peak Reverse<br>Recovery Current|||734||A|
|Erec|Reverse Recovery<br>Energy|||312||mJ|
|Qr|Recovered Charge|VCC=900V,IF=800A,<br>-di/dt=6150A/μs,VGE=-9V,<br>LS=65nH, Tj=150oC||256||μC|
|IRM|Peak Reverse<br>Recovery Current|||737||A|
|Erec|Reverse Recovery<br>Energy|||343||mJ|



**Module Characteristics** TC=25[o] C unless otherwise noted 

|**Symbol **|**Parameter **|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|LCE|StrayInductance||12||nH|
|RCC’+EE’|Module Lead Resistance,Terminal to Chip||0.19||mΩ|
|RthJC|Junction-to-Case (per IGBT)<br>Junction-to-Case(per Diode)|||26.1<br>40.3|K/kW|
|RthCH|Case-to-Heatsink (per IGBT)<br>Case-to-Heatsink (per Diode)<br>Case-to-Heatsink(per Module)||9.9<br>15.3<br>6.0||K/kW|
|M|Power Terminal Screw:M4<br>Power Terminal Screw:M8<br>MountingScrew:M6|1.8<br>8.0<br>4.25||2.1<br>10.0<br>5.75|N.m|
|G|Weightof Module||1500||g|



©2021 STARPOWER Semiconductor Ltd.                6/1/2021             4/9              B01 

GD800SGX170C3S                                                               IGBT Module 

**==> picture [513 x 657] intentionally omitted <==**

**----- Start of picture text -----**<br>
1600 1600<br>1400 VGE=15V  1400<br>VCE=20V<br>1200 1200<br>1000 1000<br>800 800<br>600 600<br>400 400<br>Tj=25℃<br>Tj=25℃<br>200 Tj=125℃ 200<br>Tj=125℃<br>Tj=150℃ Tj=150℃<br>0 0<br>0 0.5 1 1.5 2 2.5 3 3.5 4 4 5 6 7 8 9 10 11 12 13<br>VCE  [V]  VGE [V]<br>Fig 1. IGBT Output Characteristics                          Fig 2. IGBT Transfer Characteristics<br>1200 2000<br>Eon Tj=125℃ Eon Tj=125℃<br>Eoff Tj=125℃ Eoff Tj=125℃<br>Eon Tj=150℃ Eon Tj=150℃<br>1600<br>Eoff Tj=150℃ Eoff Tj=150℃<br>900<br>VCC=900V<br>RG=2.4Ω  1200<br>VGE=-9/+15V<br>600<br>800<br>VCC=900V<br>IC=800A<br>300<br>VGE=-9/+15V<br>400<br>0 0<br>0 400 800 1200 1600 0 3 6 9 12 15 18 21 24<br>IC [A]  RG [Ω]<br> [A]   [A]<br>C C<br>I I<br>E [mJ]  E [mJ]<br>**----- End of picture text -----**<br>


Fig 3. IGBT Switching Loss vs. IC                              Fig 4. IGBT Switching Loss vs. RG 

©2021 STARPOWER Semiconductor Ltd.                6/1/2021             5/9              B01 

GD800SGX170C3S                                                               IGBT Module 

**==> picture [513 x 712] intentionally omitted <==**

**----- Start of picture text -----**<br>
2000 100<br>Module<br>IGBT<br>1600<br>10<br>1200<br>800<br>1<br>400 RG=2.4Ω  i:                  1            2            3            4<br>VT GE=150=-9/+15V  [o] C  rτii[K/kW]:    9.1350   9.1350    5.2200   2.6100 [s]:             0.0200   0.0600    0.1000   0.3000<br>j<br>0 0.1<br>0 200 400 600 800 1000 0.001 0.01 0.1 1 10<br>VCE [V]  t [s]<br>Fig 5. RBSOA                                       Fig 6. IGBT Transient Thermal Impedance<br>1600 700<br>Tj=25℃<br>Erec Tj=125℃<br>Tj=125℃<br>1400<br>Tj=150℃ 600 Erec Tj=150℃<br>1200<br>500<br>1000<br>400<br>800<br>300<br>600<br>200<br>400 VCC=900V<br>RG=2.4Ω<br>200 100 VGE=-9V<br>0 0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 400 800 1200 1600<br>VF  [V]  IF [A]<br>Fig 7. Diode Forward Characteristics    Fig 8. Diode Switching Loss vs. IF<br>©2021 STARPOWER Semiconductor Ltd.                6/1/2021             6/9              B01<br> [A]<br>C  [K/kW]<br>I thJC<br>Z<br> [A]<br>F<br>I E [mJ]<br>**----- End of picture text -----**<br>


GD800SGX170C3S                                                               IGBT Module 

**==> picture [513 x 314] intentionally omitted <==**

**----- Start of picture text -----**<br>
500 100<br>Erec Tj=125℃<br>Diode<br>Erec Tj=150℃<br>400<br>300<br>10<br>200<br>100 VCC=900V  i:                  1            2             3           4<br>ri[K/kW]:   14.1050  14.1050  8.0600  4.0300<br>IF=800A  τi[s]:             0.0200    0.0060   0.1000   0.3000<br>VGE=-9V<br>0 1<br>0 3 6 9 12 15 18 21 24 0.001 0.01 0.1 1 10<br>RG [Ω]  t [s]<br> [K/kW]<br>E [mJ]<br>thJC<br>Z<br>**----- End of picture text -----**<br>


Fig 9. Diode Switching Loss vs. RG                      Fig 10. Diode Transient Thermal Impedance 

©2021 STARPOWER Semiconductor Ltd.                6/1/2021             7/9              B01 

GD800SGX170C3S                                                               IGBT Module 

## **Circuit Schematic** 

## **Package Dimensions** 

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                                                        Dimensions in Millimeters<br>**----- End of picture text -----**<br>


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for M4<br>**----- End of picture text -----**<br>


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©2021 STARPOWER Semiconductor Ltd.                6/1/2021             8/9              B01<br>**----- End of picture text -----**<br>


GD800SGX170C3S                                                               IGBT Module 

## **Terms and Conditions of Usage** 

The data contained in this product datasheet is exclusively intended for technically trained staff. you and your technical departments will have to evaluate the suitability of the product for the intended application and the completeness of the product data with respect to such application. 

This product data sheet is describing the characteristics of this product for which a warranty is granted. Any such warranty is granted exclusively pursuant the terms and conditions of the supply agreement. There will be no guarantee of any kind for the product and its characteristics. 

Should you require product information in excess of the data given in this product data sheet or which concerns the specific application of our product, please contact the sales office, which is responsible for you (see www.powersemi.cc), For those that are specifically interested we may provide application notes. 

Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact the sales office, which is responsible for you. 

Should you intend to use the Product in aviation applications, in health or live endangering or life support applications, please notify. 

If and to the extent necessary, please forward equivalent notices to your customers. Changes of this product data sheet are reserved. 

©2021 STARPOWER Semiconductor Ltd.                6/1/2021             9/9              B01 



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