# IGBT Module, Half Bridge, 1.073 kA, 1.9 V, 4.2 kW, 150 °C, Module

![Product image](https://novapart.co/image/farnell:3549271/)

**URL**: https://novapart.co/products/GD650HFX170P1S/igbt-module-half-bridge-1073-ka-19-v-42-kw-150-c
**SKU**: GD650HFX170P1S
**Manufacturer**: STARPOWER
**Category**: Semiconductors - Discretes || IGBTs || IGBT Modules
**Price**: €253.2700
**Stock**: 10+
**Lead Time**: 162 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | To Be Advised |
| Product Range | - |
| Igbt Technology | Trench Field Stop |
| Igbt Termination | Stud |
| Power Dissipation | 4.2kW |
| Igbt Configuration | Half Bridge |
| Transistor Mounting | Panel |
| Dc Collector Current | 1.073kA |
| Power Dissipation Pd | 4.2kW |
| Transistor Case Style | Module |
| Operating Temperature Max | 150°C |
| Junction Temperature Tj Max | 150°C |
| Continuous Collector Current | 1.073kA |
| Collector Emitter Voltage Max | 1.7kV |
| Collector Emitter Voltage V(Br)Ceo | 1.7kV |
| Collector Emitter Saturation Voltage | 1.9V |
| Collector Emitter Saturation Voltage Vce(On) | 1.9V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3549271/)

## **STARPOWER** 

## 

## **IGBT** 

## **GD650HFX170P1S** 

**1700V/650A 2 in one-package** 

## **General Description** 

STARPOWER IGBT Power Module provides ultra low conduction loss as well as short circuit ruggedness. They are designed for the applications such as wind and solar power. 

## **Features** 

- Low VCE(sat) Trench IGBT technology 

- 10μs short circuit capability 

- VCE(sat) with positive temperature coefficient 

- Maximum junction temperature 175[o] C 

- Enlarged Diode for regenerative operation 

- Isolated copper baseplate using DBC technology  High power and thermal cycling capability 

## **Typical Applications** 

- High Power Converter 

- Wind and Solar Power 

- Traction Drive 

## **Equivalent Circuit Schematic** 

©2018 STARPOWER Semiconductor Ltd.         12/9/2018         1/10       preliminary 

GD650HFX170P1S                                                               IGBT Module 

## **Absolute Maximum Ratings** TC=25[o] C unless otherwise noted 

## **IGBT** 

|**IGBT**||||
|---|---|---|---|
|**Symbol**|**Description**|**Value**|**Unit**|
|VCES|Collector-EmitterVoltage|1700|V|
|VGES|Gate-Emitter Voltage|±20|V|
|IC|Collector Current  @ TC=25~~o~~C<br>@ TC=100oC|1073<br>650|A|
|ICM|PulsedCollectorCurrent  tp=1ms|1300|A|
|PD|Maximum Power Dissipation  @ Tj=175~~o~~C|4.2|kW|
|**Diode**||||
|**Symbol**|**Description**|**Value**|**Unit**|
|VRRM|Repetitive Peak ReverseVoltage|1700|V|
|IF|Diode Continuous Forward Current|650|A|
|IFM|Diode Maximum ForwardCurrent  tp=1ms|1300|A|



## **Module** 

|**Module**||||
|---|---|---|---|
|**Symbol**|**Description**|**Value**|**Unit**|
|Tjmax|Maximum Junction Temperature|175|~~o~~C|
|Tjop|Operating Junction Temperature|-40to +150|~~o~~C|
|TSTG|Storage Temperature Range|-40 to +150|~~o~~C|
|VISO|Isolation Voltage  RMS,f=50Hz,t=1min|4000|V|



©2018 STARPOWER Semiconductor Ltd.         12/9/2018         2/10       preliminary 

GD650HFX170P1S                                                               IGBT Module 

**IGBT Characteristics** TC=25[o] C unless otherwise noted 

|**IGBT**|**Characteristics**TC|=25oC unless otherwise n|oted||||
|---|---|---|---|---|---|---|
|**Symbol **|**Parameter **|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|VCE(sat)|Collector to Emitter<br>Saturation Voltage|IC=650A,VGE=15V,<br>Tj=25oC||1.90|2.35|V|
|||IC=650A,VGE=15V,<br>Tj=125oC||2.35|||
|||IC=650A,VGE=15V,<br>Tj=150oC||2.45|||
|VGE(th)|Gate-Emitter Threshold<br>Voltage|IC=24.0mA,VCE=VGE,<br>Tj=25oC|5.6|6.2|6.8|V|
|ICES|Collector Cut-Off<br>Current|VCE=VCES,VGE=0V,<br>Tj=25oC|||5.0|mA|
|IGES|Gate-Emitter Leakage<br>Current|VGE=VGES,VCE=0V,<br>Tj=25oC|||400|nA|
|RGint|InternalGate Resistance|||2.3||Ω|
|Cies|Input Capacitance|VCE=25V,f=1MHz,<br>VGE=0V||72.3||nF|
|Cres|Reverse Transfer<br>Capacitance|||1.75||nF|
|QG|GateCharge|VGE=-15…+15V||5.66||μC|
|td(on)|Turn-On DelayTime|VCC=900V,IC=650A,<br>RGon=1.8Ω,RGoff=2.7Ω,<br>VGE=±15V,Tj=25oC||468||ns|
|tr|Rise Time|||86||ns|
|td(off)|Turn-Off DelayTime|||850||ns|
|tf|Fall Time|||363||ns|
|Eon|Turn-On Switching<br>Loss|||226||mJ|
|Eoff|Turn-Off Switching<br>Loss|||161||mJ|
|td(on)|Turn-On DelayTime|VCC=900V,IC=650A,<br>RGon=1.8Ω,RGoff=2.7Ω,<br>VGE=±15V,Tj=125oC||480||ns|
|tr|Rise Time|||110||ns|
|td(off)|Turn-Off DelayTime|||1031||ns|
|tf|Fall Time|||600||ns|
|Eon|Turn-On Switching<br>Loss|||338||mJ|
|Eoff|Turn-Off Switching<br>Loss|||226||mJ|
|td(on)|Turn-On DelayTime|VCC=900V,IC=650A,<br>RGon=1.8Ω,RGoff=2.7Ω,<br>VGE=±15V,Tj=150oC||480||ns|
|tr|Rise Time|||120||ns|
|td(off)|Turn-Off DelayTime|||1040||ns|
|tf|Fall Time|||684||ns|
|Eon|Turn-On Switching<br>Loss|||368||mJ|
|Eoff|Turn-Off Switching<br>Loss|||242||mJ|
|ISC|SC Data|tP≤10μs,VGE=15V,<br>Tj=150oC,VCC=1000V,<br>VCEM≤1700V||2600||A|



©2018 STARPOWER Semiconductor Ltd.         12/9/2018         3/10       preliminary 

GD650HFX170P1S                                                               IGBT Module 

**Diode Characteristics** TC=25[o] C unless otherwise noted 

|**Symbol **|**Parameter **|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|VF|Diode Forward<br>Voltage|IF=650A,VGE=0V,Tj=25~~o~~C||1.85|2.30|V|
|||IF=650A,VGE=0V,Tj=125~~o~~C||1.98|||
|||IF=650A,VGE=0V,Tj=150~~o~~C||2.02|||
|Qr|Recovered Charge|VR=900V,IF=650A,<br>-di/dt=5980A/μs,VGE=-15V<br>Tj=25oC||176||μC|
|IRM|Peak Reverse<br>RecoveryCurrent|||765||A|
|Erec|Reverse Recovery<br>Energy|||87.4||mJ|
|Qr|RecoveredCharge|VR=900V,IF=650A,<br>-di/dt=5980A/μs,VGE=-15V<br>Tj=125oC||292||μC|
|IRM|Peak Reverse<br>Recovery Current|||798||A|
|Erec|Reverse Recovery<br>Energy|||159||mJ|
|Qr|RecoveredCharge|VR=900V,IF=650A,<br>-di/dt=5980A/μs,VGE=-15V<br>Tj=150oC||341||μC|
|IRM|Peak Reverse<br>Recovery Current|||805||A|
|Erec|Reverse Recovery<br>Energy|||192||mJ|



**NTC Characteristics** TC=25[o] C unless otherwise noted 

|**Symbol**|**Parameter**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|R25|Rated Resistance|||5.0||kΩ|
|∆R/R|Deviation of R100|TC=100~~o~~C,R100=493.3Ω|-5||5|%|
|P25|Power<br>Dissipation||||20.0|mW|
|B25/50|B-value|R2=R25exp[B25/50(1/T2-<br>1/(298.15K))]||3375||K|
|B25/80|B-value|R2=R25exp[B25/80(1/T2-<br>1/(298.15K))]||3411||K|
|B25/100|B-value|R2=R25exp[B25/100(1/T2-<br>1/(298.15K))]||3433||K|



©2018 STARPOWER Semiconductor Ltd.         12/9/2018         4/10       preliminary 

GD650HFX170P1S                                                               IGBT Module 

**Module Characteristics** TC=25[o] C unless otherwise noted 

|**Symbol **|**Parameter **|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|LCE|StrayInductance||18||nH|
|RCC’+EE’|Module Lead Resistance,Terminal to Chip||0.30||mΩ|
|RthJC|Junction-to-Case (per IGBT)<br>Junction-to-Case(per Diode)|||35.8<br>71.3|K/kW|
|RthCH|Case-to-Heatsink (per IGBT)<br>Case-to-Heatsink (per Diode)<br>Case-to-Heatsink(per Module)||13.5<br>26.9<br>4.5||K/kW|
|M|Terminal Connection Torque, Screw M4<br>Terminal Connection Torque, Screw M8<br>MountingTorque,Screw M5|1.8<br>8.0<br>3.0||2.1<br>10.0<br>6.0|N.m|
|G|Weight of Module||810||g|



©2018 STARPOWER Semiconductor Ltd.         12/9/2018         5/10       preliminary 

GD650HFX170P1S                                                               IGBT Module 

**==> picture [513 x 680] intentionally omitted <==**

**----- Start of picture text -----**<br>
1300 1300<br>1200 1200<br>VGE=15V<br>1100 1100 VCE=20V<br>1000 1000<br>900 900<br>800 800<br>700 700<br>600 600<br>500 500<br>400 400<br>300 300<br>200 Tj=25℃ 200 Tj=25℃<br>Tj=125℃ Tj=125℃<br>100 Tj=150℃ 100 Tj=150℃<br>0 0<br>0 0.5 1 1.5 2 2.5 3 3.5 4 5 6 7 8 9 10 11 12 13<br>VCE  [V]  VGE [V]<br>Fig 1. IGBT Output Characteristics                          Fig 2. IGBT Transfer Characteristics<br>1200 1800<br>Eon Tj=125℃ Eon Tj=125℃ VCC=900V<br>Eoff Tj=125℃ 1600 Eoff Tj=125℃ IC=650A<br>1000 Eon Tj=150℃ Eon Tj=150℃ VGE= ± 15V<br>Eoff Tj=150℃ 1400 Eoff Tj=150℃<br>800 VCC=900V  1200<br>RGon=1.8Ω<br>RGoff=2.7Ω  1000<br>600 VGE= ± 15V<br>800<br>400 600<br>400<br>200<br>200<br>0 0<br>0 200 400 600 800 100012001400 0 3 6 9 12 15 18 21 24 27<br>IC [A]  RG [Ω]<br>Fig 3. IGBT Switching Loss vs. IC                              Fig 4. IGBT Switching Loss vs. RG<br> [A]   [A]<br>C C<br>I I<br>E [mJ]  E [mJ]<br>**----- End of picture text -----**<br>


©2018 STARPOWER Semiconductor Ltd.         12/9/2018         6/10       preliminary 

GD650HFX170P1S                                                               IGBT Module 

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**----- Start of picture text -----**<br>
1400 100<br>1200 Module  IGBT<br>1000<br>800<br>10<br>600<br>400<br>RGon=1.8Ω<br>200 RVGoffGE==2.7Ω  ± 15V  ri:                  1            2            3            4 τii[K/kW]:   1.3         7.4         24.3       2.8 [s]:            0.0008   0.013     0.05       0.6<br>T =150 [o] C<br>j<br>0 1<br>0 300 600 900 1200 1500 1800 0.001 0.01 0.1 1 10<br>VCE [V]  t [s]<br>Fig 5. RBSOA                                       Fig 6. IGBT Transient Thermal Impedance<br>1300 275<br>1200 Tj=25℃ Erec Tj=125℃<br>250<br>Tj=125℃<br>1100 Tj=150℃ 225 Erec Tj=150℃<br>1000<br>200<br>900<br>175<br>800<br>700 150<br>600 125<br>500<br>100<br>400<br>75<br>300<br>200 50 VCC=900V<br>25 RGoff=2.7Ω<br>100 VGE= ± 15V<br>0 0<br>0 0.5 1 1.5 2 2.5 3 0 200 400 600 800 100012001400<br>VF  [V]  IF [A]<br> [A]<br>C  [K/kW]<br>I thJC<br>Z<br> [A]<br>F<br>I E [mJ]<br>**----- End of picture text -----**<br>


Fig 7. Diode Forward Characteristics Fig 8. Diode Switching Loss vs. IF 

©2018 STARPOWER Semiconductor Ltd.         12/9/2018         7/10       preliminary 

GD650HFX170P1S                                                               IGBT Module 

**==> picture [516 x 680] intentionally omitted <==**

**----- Start of picture text -----**<br>
200 100<br>Erec Tj=125℃ Diode<br>180<br>Erec Tj=150℃<br>160<br>140<br>120<br>100 10<br>80<br>60<br>40 VCC=900V  i:                  1            2            3            4<br>ri[K/kW]:  5.9         16.8      47.3       1.4<br>IF=650A  τi[s]:           0.0008   0.013    0.05       0.6<br>20<br>VGE=-15V<br>0 1<br>0 3 6 9 12 15 18 0.001 0.01 0.1 1 10<br>RG [Ω]  t [s]<br>Fig 9. Diode Switching Loss vs. RG                      Fig 10. Diode Transient Thermal Impedance<br>100<br>10<br>1<br>0.1<br>0 30 60 90 120 150<br>TC [ [o] C]<br>Fig 11. NTC Temperature Characteristic<br> [K/kW]<br>E [mJ]<br>thJC<br>Z<br>R [kΩ]<br>**----- End of picture text -----**<br>


©2018 STARPOWER Semiconductor Ltd.         12/9/2018         8/10       preliminary 

GD650HFX170P1S                                                               IGBT Module 

## **Circuit Schematic** 

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9<br>5<br>4<br>6<br>3<br>8<br>7<br>1<br>2<br>10<br>**----- End of picture text -----**<br>


## **Package Dimensions** 

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                                                        Dimensions in Millimeters<br>**----- End of picture text -----**<br>


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©2018 STARPOWER Semiconductor Ltd.         12/9/2018         9/10       preliminary<br>**----- End of picture text -----**<br>


GD650HFX170P1S                                                               IGBT Module 

## **Terms and Conditions of Usage** 

The data contained in this product datasheet is exclusively intended for technically trained staff. you and your technical departments will have to evaluate the suitability of the product for the intended application and the completeness of the product data with respect to such application. 

This product data sheet is describing the characteristics of this product for which a warranty is granted. Any such warranty is granted exclusively pursuant the terms and conditions of the supply agreement. There will be no guarantee of any kind for the product and its characteristics. 

Should you require product information in excess of the data given in this product data sheet or which concerns the specific application of our product, please contact the sales office, which is responsible for you (see www.powersemi.cc), For those that are specifically interested we may provide application notes. 

Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact the sales office, which is responsible for you. 

Should you intend to use the Product in aviation applications, in health or live endangering or life support applications, please notify. 

If and to the extent necessary, please forward equivalent notices to your customers. Changes of this product data sheet are reserved. 

©2018 STARPOWER Semiconductor Ltd.         12/9/2018         10/10       preliminary 



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