# IGBT Module, Half Bridge, 2.342 kA, 1.95 V, 9.37 kW, 150 °C, Module

![Product image](https://novapart.co/image/farnell:3549224/)

**URL**: https://novapart.co/products/GD1400HFX170P2S/igbt-module-half-bridge-2342-ka-195-v-937-kw-150-c
**SKU**: GD1400HFX170P2S
**Manufacturer**: STARPOWER
**Category**: Semiconductors - Discretes || IGBTs || IGBT Modules
**Price**: €528.4700
**Stock**: 10+
**Lead Time**: 162 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | To Be Advised |
| Product Range | - |
| Igbt Technology | Trench Field Stop |
| Igbt Termination | Stud |
| Power Dissipation | 9.37kW |
| Igbt Configuration | Half Bridge |
| Transistor Mounting | Panel |
| Dc Collector Current | 2.342kA |
| Power Dissipation Pd | 9.37kW |
| Transistor Case Style | Module |
| Operating Temperature Max | 150°C |
| Junction Temperature Tj Max | 150°C |
| Continuous Collector Current | 2.342kA |
| Collector Emitter Voltage Max | 1.7kV |
| Collector Emitter Voltage V(Br)Ceo | 1.7kV |
| Collector Emitter Saturation Voltage | 1.95V |
| Collector Emitter Saturation Voltage Vce(On) | 1.95V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3549224/)

GD1400HFX170P2S                                                             IGBT Module 

## **STARPOWER** 

## 

## **IGBT** 

## **GD1400HFX170P2S** 

**1700V/1400A 2 in one-package** 

## **General Description** 

STARPOWER IGBT Power Module provides ultra low conduction loss as well as short circuit ruggedness. They are designed for the applications such as wind and solar power. 

## **Features** 

- Low VCE(sat) Trench IGBT technology 

- 10μs short circuit capability 

- VCE(sat) with positive temperature coefficient 

- Maximum junction temperature 175[o] C 

- Enlarged Diode for regenerative operation 

- Isolated copper baseplate using DBC technology 

- High power and thermal cycling capability 

## **Typical Applications** 

- Auxiliary Inverters 

- High Power Converters 

- Wind Power 

- Traction Drives 

## **Equivalent Circuit Schematic** 

©2019 STARPOWER Semiconductor Ltd.        1/10/2019        1/10         preliminary 

GD1400HFX170P2S                                                             IGBT Module 

## **Absolute Maximum Ratings** TC=25[o] C unless otherwise noted 

## **IGBT** 

|**IGBT**||||
|---|---|---|---|
|**Symbol**|**Description**|**Value**|**Unit**|
|VCES|Collector-EmitterVoltage|1700|V|
|VGES|Gate-Emitter Voltage|±20|V|
|IC|Collector Current  @ TC=25~~o~~C<br>@ TC=100oC|2342<br>1400|A|
|ICM|PulsedCollectorCurrent  tp=1ms|2800|A|
|PD|Maximum Power Dissipation  @ Tj=175~~o~~C|9.37|kW|
|**Diode**||||
|**Symbol**|**Description**|**Value**|**Unit**|
|VRRM|Repetitive Peak ReverseVoltage|1700|V|
|IF|Diode Continuous Forward Current|1400|A|
|IFM|Diode Maximum ForwardCurrent  tp=1ms|2800|A|



## **Module** 

|**Module**||||
|---|---|---|---|
|**Symbol**|**Description**|**Value**|**Unit**|
|Tjmax|Maximum Junction Temperature|175|~~o~~C|
|Tjop|Operating Junction Temperature|-40to +150|~~o~~C|
|TSTG|Storage Temperature Range|-40 to +150|~~o~~C|
|VISO|Isolation Voltage  RMS,f=50Hz,t=1min|4000|V|



©2019 STARPOWER Semiconductor Ltd.        1/10/2019        2/10         preliminary 

GD1400HFX170P2S                                                             IGBT Module 

**IGBT Characteristics** TC=25[o] C unless otherwise noted 

|**IGBT**|**Characteristics**TC|=25oC unless otherwise n|oted||||
|---|---|---|---|---|---|---|
|**Symbol **|**Parameter **|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|VCE(sat)|Collector to Emitter<br>Saturation Voltage|IC=1400A,VGE=15V,<br>Tj=25oC||1.95|2.40|V|
|||IC=1400A,VGE=15V,<br>Tj=125oC||2.40|||
|||IC=1400A,VGE=15V,<br>Tj=150oC||2.50|||
|VGE(th)|Gate-Emitter Threshold<br>Voltage|IC=56.0mA,VCE=VGE,<br>Tj=25oC|5.6|6.2|6.8|V|
|ICES|Collector Cut-Off<br>Current|VCE=VCES,VGE=0V,<br>Tj=25oC|||5.0|mA|
|IGES|Gate-Emitter Leakage<br>Current|VGE=VGES,VCE=0V,<br>Tj=25oC|||400|nA|
|RGint|InternalGate Resistance|||1.6||Ω|
|Cies|Input Capacitance|VCE=25V,f=1MHz,<br>VGE=0V||169||nF|
|Cres|Reverse Transfer<br>Capacitance|||4.09||nF|
|QG|GateCharge|VGE=-15…+15V||13.2||μC|
|td(on)|Turn-On DelayTime|VCC=900V,IC=1400A,<br>RG=0.47Ω,<br>RGoff=0.68Ω,<br>VGE=±15V,<br>Tj=25oC||714||ns|
|tr|Rise Time|||99||ns|
|td(off)|Turn-Off DelayTime|||929||ns|
|tf|Fall Time|||250||ns|
|Eon|Turn-On Switching<br>Loss|||281||mJ|
|Eoff|Turn-Off Switching<br>Loss|||264||mJ|
|td(on)|Turn-On DelayTime|VCC=900V,IC=1400A,<br>RG=0.47Ω,<br>RGoff=0.68Ω,<br>VGE=±15V,<br>Tj=125oC||748||ns|
|tr|Rise Time|||109||ns|
|td(off)|Turn-Off DelayTime|||1037||ns|
|tf|Fall Time|||353||ns|
|Eon|Turn-On Switching<br>Loss|||443||mJ|
|Eoff|Turn-Off Switching<br>Loss|||462||mJ|
|td(on)|Turn-On DelayTime|VCC=900V,IC=1400A,<br>RG=0.47Ω,<br>RGoff=0.68Ω,<br>VGE=±15V,<br>Tj=150oC||757||ns|
|tr|Rise Time|||112||ns|
|td(off)|Turn-Off DelayTime|||1064||ns|
|tf|Fall Time|||379||ns|
|Eon|Turn-On Switching<br>Loss|||483||mJ|
|Eoff|Turn-Off Switching<br>Loss|||512||mJ|
|ISC|SC Data|tP≤10μs,VGE=15V,<br>Tj=150oC,VCC=1000V,<br>VCEM≤1700V||5600||A|



©2019 STARPOWER Semiconductor Ltd.        1/10/2019        3/10         preliminary 

GD1400HFX170P2S                                                             IGBT Module 

**Diode Characteristics** TC=25[o] C unless otherwise noted 

|**Symbol **|**Parameter **|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|VF|Diode Forward<br>Voltage|IF=1400A,VGE=0V,Tj=25~~o~~C||1.80|2.25|V|
|||IF=1400A,VGE=0V,Tj=125~~o~~C||1.90|||
|||IF=1400A,VGE=0V,Tj=150~~o~~C||1.95|||
|Qr|Recovered Charge|VR=900V,IF=1400A,<br>-di/dt=11500A/μs,VGE=-15V<br>Tj=25oC||380||μC|
|IRM|Peak Reverse<br>RecoveryCurrent|||1650||A|
|Erec|Reverse Recovery<br>Energy|||224||mJ|
|Qr|RecoveredCharge|VR=900V,IF=1400A,<br>-di/dt=11500A/μs,VGE=-15V<br>Tj=125oC||644||μC|
|IRM|Peak Reverse<br>Recovery Current|||1650||A|
|Erec|Reverse Recovery<br>Energy|||405||mJ|
|Qr|RecoveredCharge|VR=900V,IF=1400A,<br>-di/dt=11500A/μs,VGE=-15V<br>Tj=150oC||715||μC|
|IRM|Peak Reverse<br>Recovery Current|||1700||A|
|Erec|Reverse Recovery<br>Energy|||462||mJ|



**NTC Characteristics** TC=25[o] C unless otherwise noted 

|**Symbol**|**Parameter**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|R25|Rated Resistance|||5.0||kΩ|
|∆R/R|Deviation of R100|TC=100~~o~~C,R100=493.3Ω|-5||5|%|
|P25|Power<br>Dissipation||||20.0|mW|
|B25/50|B-value|R2=R25exp[B25/50(1/T2-<br>1/(298.15K))]||3375||K|
|B25/80|B-value|R2=R25exp[B25/80(1/T2-<br>1/(298.15K))]||3411||K|
|B25/100|B-value|R2=R25exp[B25/100(1/T2-<br>1/(298.15K))]||3433||K|



©2019 STARPOWER Semiconductor Ltd.        1/10/2019        4/10         preliminary 

GD1400HFX170P2S                                                             IGBT Module 

## **Module Characteristics** TC=25[o] C unless otherwise noted 

|**Symbol **|**Parameter **|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|LCE|StrayInductance||10||nH|
|RCC’+EE’|Module Lead Resistance,Terminal to Chip||0.20||mΩ|
|RthJC|Junction-to-Case (per IGBT)<br>Junction-to-Case(per Diode)|||16.0<br>35.7|K/kW|
|RthCH|Case-to-Heatsink (per IGBT)<br>Case-to-Heatsink (per Diode)<br>Case-to-Heatsink(per Module)||8.7<br>19.4<br>3.0||K/kW|
|M|Terminal Connection Torque, Screw M4<br>Terminal Connection Torque, Screw M8<br>MountingTorque, ScrewM5|1.8<br>8.0<br>3.0||2.1<br>10.0<br>6.0|N.m|
|G|Weight of Module||1200||g|



©2019 STARPOWER Semiconductor Ltd.        1/10/2019        5/10         preliminary 

GD1400HFX170P2S                                                             IGBT Module 

**==> picture [513 x 657] intentionally omitted <==**

**----- Start of picture text -----**<br>
2800 2800<br>2400 VGE=15V  2400 VCE=20V<br>2000 2000<br>1600 1600<br>1200 1200<br>800 800<br>400 Tj=25℃ 400 Tj=25℃<br>Tj=125℃ Tj=125℃<br>Tj=150℃ Tj=150℃<br>0 0<br>0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 6 7 8 9 10 11 12 13<br>VCE  [V]  VGE [V]<br>Fig 1. IGBT Output Characteristics                          Fig 2. IGBT Transfer Characteristics<br>1,800 2,000<br>Eon Tj=125℃ Eon Tj=125℃<br>Eoff Tj=125℃ Eoff Tj=125℃<br>1,500 Eon Tj=150℃ Eon Tj=150℃<br>1,600<br>Eoff Tj=150℃ Eoff Tj=150℃<br>1,200 VCC=900V<br>RGon=0.47Ω  1,200<br>RGoff=0.68Ω<br>900 VGE= ± 15V<br>800<br>600<br>400<br>300 VCC=900V<br>IC=1400A<br>VGE= ± 15V<br>0 0<br>0 700 1400 2100 2800 0 1 2 3 4 5 6 7<br>IC [A]  RG [Ω]<br> [A]   [A]<br>C C<br>I I<br>E [mJ]  E [mJ]<br>**----- End of picture text -----**<br>


Fig 3. IGBT Switching Loss vs. IC                              Fig 4. IGBT Switching Loss vs. RG 

©2019 STARPOWER Semiconductor Ltd.        1/10/2019        6/10         preliminary 

GD1400HFX170P2S                                                             IGBT Module 

**==> picture [513 x 680] intentionally omitted <==**

**----- Start of picture text -----**<br>
3000 100<br>Module<br>2500<br>IGBT<br>2000<br>1500 10<br>1000<br>RGoff=0.68Ω<br>i:                  1            2            3            4<br>500 VGE= ± 15V  ri[K/kW]:   1.0         11.7       2.3         1.0<br>T =150 [o] C  τi[s]:            0.001     0.03       0.1         1.1<br>j<br>0 1<br>0 300 600 900 1200 1500 1800 0.001 0.01 0.1 1 10<br>VCE [V]  t [s]<br>Fig 5. RBSOA                                       Fig 6. IGBT Transient Thermal Impedance<br>2800 600<br>Tj=25℃ Erec Tj=125℃<br>Tj=125℃<br>2400 Erec Tj=150℃<br>Tj=150℃ 500<br>2000<br>400<br>1600<br>300<br>1200<br>200<br>800<br>VCC=900V<br>100 RGon=0.47Ω<br>400 VGE=-15V<br>0 0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 700 1400 2100 2800<br>VF  [V]  IF [A]<br>Fig 7. Diode Forward Characteristics    Fig 8. Diode Switching Loss vs. IF<br> [A]<br>C  [K/kW]<br>I thJC<br>Z<br> [A]<br>F<br>I E [mJ]<br>**----- End of picture text -----**<br>


©2019 STARPOWER Semiconductor Ltd.        1/10/2019        7/10         preliminary 

GD1400HFX170P2S                                                             IGBT Module 

**==> picture [513 x 314] intentionally omitted <==**

**----- Start of picture text -----**<br>
500 100<br>Erec Tj=125℃<br>Erec Tj=150℃<br>Diode<br>450<br>400<br>350 10<br>300<br>250 VCC=900V  ri:                  1            2            3            4 i[K/kW]:   2.2         3.0         28.6      1.9<br>IF=1400A  τi[s]:            0.003     0.005     0.04      1<br>VGE=-15V<br>200 1<br>0 1 2 3 4 5 0.001 0.01 0.1 1 10<br>RG [Ω]  t [s]<br> [K/kW]<br>E [mJ]<br>thJC<br>Z<br>**----- End of picture text -----**<br>


Fig 9. Diode Switching Loss vs. RG                      Fig 10. Diode Transient Thermal Impedance 

**==> picture [257 x 337] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>10<br>1<br>0.1<br>0 30 60 90 120 150<br>TC [ [o] C]<br>Fig 11. NTC Temperature Characteristic<br>R [kΩ]<br>**----- End of picture text -----**<br>


©2019 STARPOWER Semiconductor Ltd.        1/10/2019        8/10         preliminary 

GD1400HFX170P2S                                                             IGBT Module 

## **Circuit Schematic** 

**==> picture [96 x 135] intentionally omitted <==**

**----- Start of picture text -----**<br>
9/11<br>5<br>4<br>6<br>3<br>8<br>7<br>1<br>2<br>10/12<br>**----- End of picture text -----**<br>


## **Package Dimensions** 

**==> picture [276 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
                                                        Dimensions in Millimeters<br>**----- End of picture text -----**<br>


©2019 STARPOWER Semiconductor Ltd.        1/10/2019        9/10         preliminary 

GD1400HFX170P2S                                                             IGBT Module 

## **Terms and Conditions of Usage** 

The data contained in this product datasheet is exclusively intended for technically trained staff. you and your technical departments will have to evaluate the suitability of the product for the intended application and the completeness of the product data with respect to such application. 

This product data sheet is describing the characteristics of this product for which a warranty is granted. Any such warranty is granted exclusively pursuant the terms and conditions of the supply agreement. There will be no guarantee of any kind for the product and its characteristics. 

Should you require product information in excess of the data given in this product data sheet or which concerns the specific application of our product, please contact the sales office, which is responsible for you (see www.powersemi.cc), For those that are specifically interested we may provide application notes. 

Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact the sales office, which is responsible for you. 

Should you intend to use the Product in aviation applications, in health or live endangering or life support applications, please notify. 

If and to the extent necessary, please forward equivalent notices to your customers. Changes of this product data sheet are reserved. 

©2019 STARPOWER Semiconductor Ltd.        1/10/2019        10/10         preliminary 



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