# MOSFET Relay, Low Leakage, SPST-NO (1 Form A), AC / DC, 20 V, 200 mA, Module, Surface Mount
**URL**: https://novapart.co/products/G3VM-21MT(TR01)/mosfet-relay-low-leakage-spst-no-1-form-a-ac-dc-20
**SKU**: G3VM-21MT(TR01)
**Manufacturer**: OMRON ELECTRONIC COMPONENTS
**Category**: Switches & Relays || Relays || Solid State Relays & Contactors || MOSFET Solid State Relays
**Price**: €16.0900
**Stock**: 50+
**Lead Time**: 260 days (indicative)
## Specifications
| Parameter | Value |
|---|---|
| Svhc | To Be Advised |
| Load Type | AC / DC |
| Contact Form | SPST-NO (1 Form A) |
| Load Current | 200mA |
| Product Range | G3VM Series |
| Relay Mounting | Surface Mount |
| Relay Terminals | Solder |
| Load Voltage Max | 20V |
| Isolation Voltage | 500V |
| I/O Capacitance Typ | - |
| On State Resistance Max | 12ohm |
| Mosfet Relay Package Style | Module |
| Off State Leakage Current Max | - |
## Datasheet
📄 [Download PDF](https://novapart.co/datasheet/farnell:3861021/)
**M** ■ **Application Examples o d • Semiconductor test equipment u l e**
## G3VM-21MT **MOS FET Relay Module**
## **MOS FET Relay in module package with very low leakage current**
- **Contribute to reduce the mounting space on the print circuit board by small package**
- **Current leakage when the main line is open and sub line is close :1 pA (Maximum) at VOFF =20 V**
- **Contact form: 1a (SPST-NO) + T-switch function**
- **Surface-mounting**
## ~~to~~ **RoHS Compliant**
- **Semiconductor test equipment**
**==> picture [9 x 79] intentionally omitted <==**
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G
3
V
M
I
2
1
M
T
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## ■ **Package**
5±0.1 3.75±0.1 ww
**(Unit: mm)** ■ **Model Number Legend G3VM-** @ @ @ @ ~~—— —~~ A **1 2 3 4** 2.7±0.2
**G3VM-** @ @ @ @ ~~—— —~~ **1 2 3 4 1. Load Voltage 2. Contact form 3. Package 4. Special function** 2: 20 V 1: 1a (SPST-NO) M: MOS FET T: T switch function **Note:** See Device Relay Function Modes Module on the page 5.
## ■ **Ordering Information**
**Continuous** Tape cut packaging **Tape packaging Package Contact form Terminals (peak value) Load voltage** * **(peak value) load current** * **Model package quantityMinimum Model package quantityMinimum** Surface1a Module mounting 20 V 200 mA G3VM-21MT 1 pc. G3VM-21MT (TR01) 100 pcs. (SPST-NO) Terminals **Note: 1.** To order tape packaging for Relays with surface-mounting terminals, add "(TR01)" to the end of the model number. Tape-cut packaging are packaged without humidity resistance. Use manual soldering to mount them. **Note: 2.** 500 pcs./reel packing is also available. Please contact your OMRON sales representative. * The AC peak and DC value are given for the load voltage and continuous load current. ■ **Absolute Maximum Rating (Ta = 25°C)** ~~OO~~ **Item Symbol G3VM-21MT Unit Measurement conditions** ~~ee~~ **LED forward current for main control** ~~Rn~~ IF Main 30 mA ~~a~~ **LED forward current for sub control** I ~~a~~ F Sub ~~a~~ 30 mA ~~ee ee~~ **Input** ~~a~~ **LED forward current reduction rate** ∆I ~~a~~ F/°C ~~a~~ -0.3 mA/°C ~~ee~~ Ta ≥ 25°C ~~ee es~~ **LED reverse voltage** ~~a~~ VR ~~a~~ 5 ~~ee~~ V ~~ee es~~ **Connection temperature** ~~a~~ Tj ~~a~~ 125 ~~ee~~ °C ~~ee a~~ **Load voltage (AC peak/DC)** ~~a~~ VOFF ~~a~~ 20 ~~ee~~ V ~~ee es~~ **Continuous load current (ACpeak/DC)** ~~ns~~ IO 200 mA **Output** ~~es~~ **ON current reduction rate** ~~Ns~~ ∆IO/°C ~~es~~ -2 mA/°C Ta ≥ 25°C ~~es~~ **Pulse ON current** ~~Ns~~ IOP ~~es~~ 600 mA t=100 ms, Duty=1/10 ~~ee~~ **Connection temperature** ~~Rs~~ Tj ~~ee~~ 125 °C ~~es~~ **Dielectric strength between I/O** * ~~ry~~ VI-O ~~Rn~~ 500 Vrms AC for 1 min **Ambient operating temperature** Ta -40 to 110 °C With no icing or condensation ~~iieeI~~ **Ambient storage temperatureSoldering temperature** ~~eeeI~~ T-stg ~~(~~ -40 to 125 ~~eeeLL~~ 260 °C°C 10 s * The dielectric strength between the input and output was checked by applying voltage between all pins as a group on the input (LED) side and all pins as a group on the output side (MOSFET).
**1**
G3VM-21MT
**MOS FET Relay Module**
**M o d u l e G 3 V M I 2 1 M T**
## ■ **Electrical Characteristics (Ta=25°C)**
|**Item**||**Symbol**|**Symbol**|**G3VM-21MT**|**Unit**|**Measurement conditions**|
|---|---|---|---|---|---|---|
|**Input**|**LED forward voltage for main control**
**LED forward voltage for sub control**
**Capacitance between main control terminals**
**Capacitance between sub control terminals**
**Trigger LED forward current**
**I **
**Release LED forward current**
**I **|**VF Main**
**Mi**
**Ty**
**Ma**|**nimum**|2.2|V|IF Main=10 mA|
||||**pical**|2.54|||
||||**ximum**|2.8|||
|||**VF Sub**
**Mi**
**Ty**
**Ma**|**nimum**|1.1||IF Sub=10 mA|
||||**pical**|1.27|||
||||**ximum**|1.4|||
|||**CT Main**
**Ty**|**pical**|15|pF|V=0, f=1 MHz|
|||**CT Sub**
**Ty**|**pical**|30|||
|||**FT Main/Sub**
**Ma**|**ximum**|3|mA|IO=100 mA|
|||**FC Main/Sub**
**Mi**|**nimum**|0.1||IOFF=10 uA|
|**Output**|**Maximum resistance with output ON**
**Current leakage when the main line is open and sub**
**line is close*1**
**I**
**Capacitance between terminals**
|**RON**
**Ty**
**Ma**|**pical**|8|Ω|IF Main=5 mA, t<1 s
IO=200 mA|
||||**ximum**|12|||
|||**LEAK**
**Ma**|**ximum**|1|pA|VDD=20 V *1|
|||**COFF**
**Ty**
**Ma**|**pical**|0.6|pF|V=0, f=1 MHz|
||||**ximum**|1|||
|**Capacitance between I/O terminals**
||**CI-O**
**Ty**|**pical**|1|||
|**Insulation resistance between I/O terminals**
||**RI-O**
**Mi**
**Ty**|**nimum**|1000|MΩ|VI-O=500 VDC, RoH≤60%|
||||**pical**|108|||
|**Main line Turn-ON time**
**t**||**ON Main**
**Ty**
**Ma**|**pical**|-|ms|VDD=10 V,
IF Main=5 mA, RL=200Ω*2|
||||**ximum**|0.3|||
|**Main line Turn-OFF time**
**t**||**OFF Main**
**Ty**
**Ma**|**pical**|-|||
||||**ximum**|0.3|||
|**Sub line Turn-ON time**
**t**||**ON Sub**
**Ty**
**Ma**|**pical**|-||VDD=10 V,
IF Main=5 mA, IF Sub=5 mA,
RL=200Ω*3|
||||**ximum**|0.3|||
|**Sub line Turn-OFF time**
**t**||**OFF Sub**
**Ty**
**Ma**|**pical**|-|||
||||**ximum**|0.3|||
- *1. ILEAK measurement condition
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VDD
x1
VDD Force Guard
A A
6 5 4 6 5 4
MOS FET MOS FET MOS FET MOS FET MOS FET MOS FET
RELAY C RELAY B RELAY A RELAY C RELAY B RELAY A
OR
1 2 3 1 2 3
I F I F
**----- End of picture text -----**
- *2. Turn-ON and Turn-OFF Times (Main line)
*3. Turn-ON and Turn-OFF Times (Sub line)
**==> picture [498 x 137] intentionally omitted <==**
**----- Start of picture text -----**
VOUT VDD VOUT VDD
IF3
6 5 4 6 5 4
MOS FET RELAY C MOS FET RELAY B MOS FET RELAY A IF MOS FET RELAY C MOS FET RELAY B MOS FET RELAY A IF2
1 2 3 VOUT 10% 90% 1 2 3 VOUT 10% 90%
t ON t OFF t ON t OFF
I F I F2 I F3
**----- End of picture text -----**
**2**
G3VM-21MT
**MOS FET Relay Module**
**M o d u l e G 3 V M I 2 1 M T**
## ■ **Recommended Operating Conditions**
For usage with high reliability, Recommended Operation Conditions is a measure that takes into account the derating of Absolute Maximum Ratings and Electrical Characteristics.
Each item on this list is an independent condition, so it is not simultaneously satisfy conditions.
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**----- Start of picture text -----**
Item Symbol G3VM-21MT Unit
Load voltage (AC peak/DC) VDD Maximum 16 V
Minimum 5
Operating LED forward current IF Typical 7.5 mA
Maximum 20
Continuous load current (AC peak/DC) IO Maximum 200 mA
Minimum -20
Ambient operating temperature Ta °C
Maximum 85
■ Engineering Data
LED forward current vs. Continuous load current vs. LED forward current vs.
Ambient temperature Ambient temperature LED forward voltage
IF - Ta (Maximum value) 300 IO - Ta (Maximum value) 100 IF - VF (Average value)
35
Ta=25°C
30 250
Sub Main
25
200 10
20
150
15
10 100 1
5 50
0
-40 -20 0 20 40 60 80 100 120 0-40 -20 0 20 40 60 80 100 120 0.11.0 1.5 2.0 2.5
Ambient temperature Ta (°C)
Ambient temperature Ta (°C) LED forward voltage VF (V)
Continuous load current vs. On-state resistance vs.
On-state voltage Ambient temperature
200 IO - VON(Average value) 20 RON - Ta (Average value)
Ta=25°C
150 IF=5 mA, t<1 s IO=200 mA
100 15
50
0 10
-50
-100 5
-150
-200 0
-1.5 -1 -0.5 0 0.5 1 1.5
-40 -20 0 20 40 60 80 100 120
On-state voltage VON (V) Ambient temperature Ta (°C)
Trigger LED forward current vs.
Ambient temperature
IFT - Ta (Average value) IFT - Ta (Average value)
1.5 1.5
IO=100 mA, t<1 s IO=100 mA, t<1 s
Main
Sub
1.0 1.0
0.5 0.5
0 -40 -20 0 20 40 60 80 100 120 0
-40 -20 0 20 40 60 80 100 120
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
(mA)F (mA)O (mA)
F
LED forward current I
LED forward current I
Continuous load current I
)Ω
(
Continuous load current I (mA)O On-state resistance RON
(mA)
FT (mA)
Trigger LED forward current I FT
Trigger LED forward current I
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**3**
G3VM-21MT
**MOS FET Relay Module**
**M o d u l e G 3 V M I 2 1 M T**
## **Turn ON, Turn OFF time vs. LED forward current**
## **Current leakage vs.**
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LED forward current Load voltage
tON, tOFF - IF tON, tOFF - IF ILEAK - VOFF
10 (Average value) 10 (Average value) 1 (Average value)
Ta=25°C
VDD=10 V VDD=10 V 0.9
1 Ta=25 RL=200 Ω °C Main 1 Ta=25 RL=200 Ω °C Sub 0.8
0.7
tON t ON 0.6
0.1 0.1 0.5
0.4
0.3
0.01 tOFF 0.01 tOFF 0.2
0.1
0.001 0.001 0
0 5 10 15 20
1 10 100 1 10 100
LED forward current IF (mA) LED forward current IF (mA) Load voltage VOFF (V)
Turn ON, Turn OFF time vs.
Ambient temperature
tON, tOFF - Ta tON, tOFF - Ta
(Average value) (Average value)
10 10
V DD =10 V V DD =10 V
RL=200 Ω RL=200 Ω
1 IF=5 mA Main 1 IF=5 mA Sub
tON tON
0.1 0.1
0.01 tOFF 0.01 tOFF
0.001 0.001
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Ambient temperature Ta (°C) Ambient temperature Ta (°C)
Current leakage vs. Output terminal capacitance vs.
Ambient temperature Load voltage
ILEAK-Ta COFF - VOFF
1 (Average value) 1.2 (Average value)
Ta=25°C
VOFF=20 V
1.0
0.8
0.1 0.6
0.4
0.2
0.01 0
-40 -20 0 20 40 60 80 100 120 0 5 10 15 20
Ambient temperature Ta (°C) Load voltage VOFF (V)
High-frequency Characteristics High-frequency Characteristics
(Isolation) * 1, * 2 (Insertion Loss) * 1, * 2
(Average value) (Average value)
0 0
-1
-10
-2
-3
-20
-4
-30 -5
-6
-40
-7
-8
-50
-9
-60 -10
0.0001 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1
Frequency (GHz) Frequency (GHz)
(pA)
(ms) (ms)
LEAK
OFF OFF
, t , t
ON ON
Current leakage I
Turn ON, Turn OFF time t Turn ON, Turn OFF time t
(ms) (ms)
OFF OFF
, t , t
ON ON
Turn ON, Turn OFF time t Turn ON, Turn OFF time t
(0V)
(pA) OFF
LEAK /C
OFF
Current leakage I
Output terminal capacitance C
Isolation (dB) Insertion Loss (dB)
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- *1. Ambient temperature condition: 25°C
- *2. The high-frequency characteristics depend on the mounting board. Be sure to check operation in actual equipment before use.
**4**
G3VM-21MT
**MOS FET Relay Module**
## ■ **Connection Example 1**
## ● **Device Functional Modes** *
|**Circuit**|**Control**|**MOS FET RELAY**
**A, C (Main line)**|**MOS FET RELAY**
**B (Sub line)**|
|---|---|---|---|
|ON|H|ON|OFF|
|OFF|L|OFF|ON|
|-|X|OFF|OFF|
- H: Optional setting, L: 0 V, X: don't care
## ● **Timing Diagram**
**==> picture [216 x 118] intentionally omitted <==**
**----- Start of picture text -----**
+
Control
0V
ON
MOS FET
RELAY A, C tON tOFF tON tOFF
OFF
ON
MOS FET tON tOFF tON
RELAY B OFF
**----- End of picture text -----**
- This products is recommended to use with dry switching (No Load & No Source when switching) for prevent short circuit happening.
**==> picture [195 x 150] intentionally omitted <==**
**----- Start of picture text -----**
M ● Measurement Circuit
o Driver signal,
d DC source etc. DUT
u 6 5 4
l
e MOS FET MOS FET MOS FET
RELAY C RELAY B RELAY A
G
3
V
M 1 2 3
I Currentcontrol Currentcontrol
2 resistance resistance
1
M +Vcc
T
**----- End of picture text -----**
**Note:** The number from 1 to 6 are the pin numbers in the image shown here.
## ■ **Connection Example 2**
## ● **Device Functional Modes** *
|**IF Main**|**IF Sub**|**MOS FET RELAY**
**A, C (Main line)**|**MOS FET RELAY**
**B (Sub line)**|
|---|---|---|---|
|H|L|ON|OFF|
|L|H|OFF|ON|
|L|L|OFF|OFF|
## ● **Timing Diagram**
**==> picture [226 x 134] intentionally omitted <==**
**----- Start of picture text -----**
IF Main
IF Sub
ON
MOS FET
RELAY A, C tON tOFF tON tOFF
OFF
ON
MOS FETRELAY B OFF tON tOFF tON tOFF
**----- End of picture text -----**
* Both MOS FET relay A, C and MOS FET relay B may be ON at the same time. For that reason, even if pins 4, 5 and 6 are all connected, please design the circuit so that the equipment does not occur the damage.
## ● **Measurement Circuit**
**==> picture [356 x 121] intentionally omitted <==**
**----- Start of picture text -----**
Driver signal, DC source etc. DUT DC source etc. x1 Guard DUT
6 5 4 6 5 4
MOS FET MOS FET MOS FET MOS FET MOS FET MOS FET
RELAY C RELAY B RELAY A RELAY C RELAY B RELAY A
OR
1 2 3 1 2 3
IF Sub IF Main IF Sub IF Main
**----- End of picture text -----**
**5**
G3VM-21MT
**MOS FET Relay Module**
**M o d u l e**
**G 3 V M I 2 1 M T**
## ■ **Appearance / Terminal Arrangement / Internal Connections**
## ● **Appearance**
**==> picture [230 x 57] intentionally omitted <==**
**----- Start of picture text -----**
6 5 4
* Actual model name marking
for each model
0299M1 Lot No.
Pin 1 2TO Model name * G3VM-21MT Model Marking 2T0
mark
1 2 3
**----- End of picture text -----**
**Note 1.** The actual product is marked differently from the image shown here. **Note 2.** "G3VM" does not appear in the model number on the Relay.
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**----- Start of picture text -----**
● Terminal Arrangement/Internal Connections (Top view)
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**==> picture [178 x 84] intentionally omitted <==**
**----- Start of picture text -----**
6 5 4
1 2 3
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## ■ **Dimensions**
Please visit our website, which is noted on the last page.
(Unit: mm)
## **Surface-mounting Terminals**
**Weight: 0.11 g**
**==> picture [152 x 176] intentionally omitted <==**
**----- Start of picture text -----**
5±0.1
2.7±0.2
1.6±0.1
2.4±0.1
6-0.55±0.1
1 2 3
6-0.85±0.1
(0.23) (0.23)
6 5 4
**----- End of picture text -----**
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**----- Start of picture text -----**
Actual Mounting Pad Dimensions
3.75±0.1
(Recommended Value, Top view)
2.4 1.6
6-1
6-0.7
2.1
Unless otherwise specified, the
dimensional tolerance is ± 0.1 mm.
**----- End of picture text -----**
**Note:** The actual product is marked differently from the image shown here.
**6**
G3VM-21MT
**MOS FET Relay Module**
## ■ **Safety Precautions**
## **WARNING**
**Always turn OFF the power supply before wiring a Relay.**
**Not doing so may cause electrical shock.**
## ● **Typical Product Driving Circuit Examples**
The LED input side of the MOS FET is driven by current. If applying a Voltage, add resistance in series with the circuit, so the specified current is applied.
This resistance is referred as "LED current limiting resistance".
## **C-MOS**
**Do not touch the current-carrying parts of the pin section of a product while the power is being supplied.**
**An electrical shock may occur.**
## **Precautions for Safe Use**
1. Do not apply overvoltages or overcurrents to the input or output
**M** circuits of the product.
**o** The product may fail or ignite.
**d** 2. Perform soldering and wiring correctly according to specified
**u** soldering conditions. **l** Using a product with incomplete soldering may cause overheating
**e** when power is applied, possibly resulting in burning.
**G 3 Precautions for Correct Use V M** ● **Derating I** You must consider derating to achieve the required system
**2 1** reliability. **M** To use a product with high reliability, consider derating the **T** maximum ratings and recommended operating conditions, and allow sufficient leeway in designs based on testing operation in the actual application under the actual operating conditions whenever possible.
Using a product with incomplete soldering may cause overheating
- (1) Maximum Ratings
- The maximum ratings must never be exceeded even instantaneously. This applies individually to each of the ratings. If any of the maximum ratings is exceeded, the internal parts of the product may deteriorate or the chip may be destroyed. To ensure high reliability in using a product, sufficiently derate the maximum voltage, current, and temperature ratings when designing the application.
- (2) Recommended Operating Conditions
- The recommended operating conditions are to ensure that the product turns ON and OFF reliably.
- To ensure high reliability in using a product, consider the recommended operating conditions when you design the application.
- (3) Fail-safe Design
- We recommend that you implement fail-safe measures in the design of the application if the failure of, deterioration of characteristics in, or functional errors in the product will have a serious affect on the safe operation of the system.
## ● **Countermeasures for static electricity**
There is a risk of damage to internal elements and impairment of functionality if static electricity is discharged to the pins due to product handling or otherwise.
Reduce the generation of static electricity as much as possible, and implement appropriate measures to prevent charge accumulation near the product.
**==> picture [202 x 398] intentionally omitted <==**
**----- Start of picture text -----**
at MAIN ON/SUB OFF
C-MOS
+Vcc
1 6 L
VF 2 5
R1 3 4
VIN VOL/OH
at MAIN OFF/SUB ON
C-MOS
+Vcc
1 6 L
VF
2 5 Leak pass
R1 3 4
VIN VOL/OH
Transistor
at MAIN ON/SUB OFF
+Vcc
1 6 L
10 to 100 k(bleeder resistor)Ω VF 2 5
R1 3 4
VOL/OH
VIN
at MAIN OFF/SUB ON
+Vcc
1 6 L
10 to 100 k(bleeder resistor)Ω R1 VF 2 5 Leak pass
3 4
VOL/OH
VIN
**----- End of picture text -----**
- To ensure that the product operates correctly, use the following formula to calculate the limiting resistance, and design the circuit accordingly.
- VCC − VOL − VF(ON)
- R1 =
IF
**Note:** To set the value of IF(ON), check the trigger LED current and recommended operation LED forward current indicated in the catalogue for each model, and set a high value with leeway.
- To ensure that the product resets reliably, calculate the reset voltage using the formula below, and control so that the voltage is lower than this value.
- VF(OFF)=VCC − IF(OFF)R1 − VOH
- **Note:** For the IF(OFF) value, set a value that is lower with leeway than the reset LED forward current indicated for each model in the catalogue.
- If the drive transistor has a large leakage current that may cause malfunctioning, add a bleeder resistance.
**7**
G3VM-21MT
**MOS FET Relay Module**
Ultrasonic wave output: 300 W max. (0.25 W/cm[2] max.) Cleaning time: 30 s max. **M** Also, suspend the products in the cleaning solution so that the **o d** product and PCB do not come into direct contact with the ultra- **u** sonic transducer. **l e** Dry thoroughly after washing so that there is no residue of washing liquid. **G 3 V Solder Mounting M** Perform solder mounting under the following recommended **I 2** conditions to prevent the temperature of the MOS FET Relays **1 M T**
- **Protection from Surge Voltage on the Input Pins**
- If any reversed surge voltage is imposed on the input pins, insert a diode in parallel with the input pins as shown in the following circuit diagram and do not impose a reversed voltage of 3 V or higher.
## **Surge Voltage Protection Circuit Example**
**==> picture [232 x 50] intentionally omitted <==**
**----- Start of picture text -----**
Main Sub
1 6 1 6
2 5 2 5
3 4 3 4
**----- End of picture text -----**
- **Protection from Spike Voltage on the Output Pins**
- If there is an inductive load or other condition that will cause overvoltage that exceeds the absolute maximum rating between the output pins, connect a protective circuit to limit the overvoltage.
- (3) During water washing, do not scrub the marks on the surface of the product with a brush or your hand while there is cleaning liquid on the product. The marks may come off.
- (4) Clean the flux from the products with the chemical action of the solvent for submersed cleaning, shower cleaning, or steam cleaning. To minimize the effect on the products, do not place the product in the solvent or steam for more than 1 minute at a temperature of 50°C.
- (5) If you use ultrasonic cleaning, keep the time short. If the cleaning time is too long, the sealing characteristics of the molded resin and frame materials may deteriorate.
- The recommended basic conditions are given below. Recommended Conditions for Ultrasonic Cleaning: Frequency: 27 to 29 kHz
## **Spike Voltage Protection Circuit Example**
**==> picture [109 x 143] intentionally omitted <==**
**----- Start of picture text -----**
1 6
2 5
3 4
1 6
2 5
3 4
1 6
2 5
3 4
**----- End of picture text -----**
## ● **Load Connection**
- (1) Do not short-circuit the input and output pins while the product is operating or it may malfunction.
- (2) Do not connect the input and output in reverse.
- (3) Do not construct a circuit so that overcurrent and burning occur if the 4, 5 and 6 pins are short-circuited.
## ● **Transportation**
- (1) When transportation and installing the product, do not drop the product or subject it to abnormal vibration or shock. It may cause deterioration of product characteristics, malfunction or failure.
- (2) Avoid transportation in the following conditions as it may cause failure or deterioration of characteristics.
- Circumstance subject to water or oil.
- Circumstance subject to high temperature or high humidity.
- Circumstance where the temperature changes radically and condensation occurs.
- State the product is not packed.
## ● **Cleaning Flux from the products**
- (1) Clean flux from the product so that there will be no residue of reactive ions, such as sodium or chlorine.
- Some organic solvents will react with water to produce hydrogen chloride or other corrosive gases, which may cause deterioration of the products.
- (2) When washing off the flux with water, make sure that there will be no residue of reactive ions, particularly sodium or chlorine.
- (6) Dry thoroughly after washing so that there is no residue of washing liquid.
## ● **Solder Mounting**
Perform solder mounting under the following recommended conditions to prevent the temperature of the MOS FET Relays from rising.
## **(Lead-free solder) SnAgCu recommended profile**
**==> picture [207 x 127] intentionally omitted <==**
**----- Start of picture text -----**
250°C PEAK
245
3°C/s 6°C/s
217
200
150
25
60 to 120 30 MAX
Reflow repititions: Up to twice 60 to 150
Time (s)
)
(°C
Surface Temperature of Package
**----- End of picture text -----**
- **Note 1.** We recommend that you verify the suitability of solder mounting under actual conditions.
- **Note 2.** When product is ordered with (TR01), tape package product is delivered in moisture-proof packaging. If ordered without (TR01), tape-cut product is delivered in non moisture-proof packaging. Mount a tape cut product by manual soldering. Tape cut products absorb moisture because a non moisture-proof package is used. Risk of package cracking or other damage due to thermal stress if reflow soldering is performed.
## **Manual Soldering** (Once Only)
Perform manual soldering at 260°C for 10 s or less.
## ● **Storage Conditions**
- (1) Store the products where they will not be subjected to water leaks or direct sunlight.
- (2) When transporting or storing the product, observe all precautions on the packaging boxes.
- (3) Keep the storage location at normal temperature, normal humidity, and normal pressure. Guidelines for the temperature and humidity are 5 to 35°C and a relative humidity of 45% to 75%.
- (4) Do not store the product in locations that are subject to corrosive gases, such as hydrogen sulfide gas, or to salt spray, and do not store them where there is visually apparent dust, iron powder or dirt.
**8**
**MOS FET Relay Module**
**M** ● **Usage Conditions o d** Do not install the product with oil or metal powder. **u l** This may cause insulation deterioration. **e **
## G3VM-21MT
- (5) Store the product in a location that has a relatively stable temperature. Radical changes in temperature during storage will cause condensation, which may oxidize or corrode the leads and interfere with solder wetting.
- (6) If you remove products from the packages and then store them again, use storage containers that have measures to prevent static electricity.
- (7) Do not under any circumstances apply any force to the products that would deform or alter them in any way.
- (8) This product is warranted for one year from the date of purchase or the date of delivery to the specified location. If the products are stored for more than about one year under normal conditions, we recommend that you confirm solderability before you use the products.
## ****
- Be sure to turn off the power when replacing parts. There is a risk of electric shock.
## ****
- This product uses GaAs (Gallium arsenide). Because the powder and substance are harmful to the human body, do not destroy, cut, crush or disassemble chemically.
## ● **Considerations when handling Products**
## ****
Surface mount products may have a crack when thermal stress is applied during surface mount assembly after they absorb atmospheric moisture. Therefore, please observe the following precautions.
- (1) This moisture proof bag may be stored unopened within 12 months at the following conditions. Temperature: 5°C to 30°C
- Humidity: 90% (Max.)
- **G** The electrical characteristics of the products are limited by the **3** application temperature. **V M** If you use them at temperatures outside of the operating **I** temperature range, the electrical characteristics of the products **2** will not be achieved and the products may deteriorate. For that
- **1**
- **M** reason, you must determine the temperature characteristics in
- **T** advance and apply derating* to the design of the application. (*Derating reduces stress.) Consider derating in the operating temperature conditions and apply the recommended operating temperature as a guideline.
## ****
If the products are used for a long period of time at high humidity, humidity will penetrate the products and the internal chips may deteriorate or fail. In systems with high signal source impedance, leaks in the board or leaks between the leads of the products can cause malfunctions. If these are issues, consider applying humidity-resistant processing to the surfaces of the products. On the other hand, at low humidity, damage from the discharge of static electricity becomes a problem. Low humidity may cause damage due to electrostatic discharge. Unless moisture proofing is implemented, use within a relative humidity range of 40 to 60%.
- (2) After opening the moisture proof bag, the devices should be assembled within 48 hours in an environment of 5°C to 30°C / 60%RH or below.
- (3) If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to pink) or the expiration date has passed, the devices should be baked in taping with reel. After baking, use the baked devices within 48 hours, but perform baking only once.
- Baking conditions: 120±5°C. For 72 hours.
- Expiration date: 12 months from sealing date, which is imprinted on the label affixed.
- (4) Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting. Furthermore, prevent the devices from being destructed against static electricity for baking of it.
- (5) If the packing material of laminate would be broken the hermeticity would deteriorate. Therefore, do not throw or drop the packed devices.
- (6) Tape-cut products are packaged without humidity resistance. Use manual soldering to mount them. (MSL not supported)
Please check each region's Terms & Conditions by region website.
## **OMRON Corporation Electronic and Mechanical Components Company**
## **Regional Contact**
**Americas Europe** https://www.components.omron.com/ http://components.omron.eu/ **Asia-Pacific China** https://ecb.omron.com.sg/ https://www.ecb.omron.com.cn/ **Korea Japan** https://www.omron-ecb.co.kr/ https://www.omron.co.jp/ecb/
© OMRON Corporation 2019 All Rights Reserved. In the interest of product improvement, specifications are subject to change without notice.
**Cat. No. K317-E1-01** 1119(1119)(O)
**9**
## Links
- [View this product on Novapart](https://novapart.co/products/G3VM-21MT(TR01)/mosfet-relay-low-leakage-spst-no-1-form-a-ac-dc-20)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/omron/g3vm-21mt-tr01/mosfet-relay-spst-no-0-2a-20v/dp/3861021)
---
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