# IGBT Module, Single Switch, 1.2 kA, 2.65 V, 3600 kW, 150 °C, Module

![Product image](https://novapart.co/image/farnell:4538805/)

**URL**: https://novapart.co/products/FZ1200R33HE4DB9BPSA1/igbt-module-single-switch-12-ka-265-v-3600-kw-150
**SKU**: FZ1200R33HE4DB9BPSA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || IGBTs || IGBT Modules
**Price**: €1484.2200
**Stock**: 10+
**Lead Time**: 148 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| Product Range | IHM-B Series |
| Igbt Technology | IGBT 4 [Trench/Field Stop] |
| Igbt Termination | Screw |
| Power Dissipation | 3600kW |
| Igbt Configuration | Single Switch |
| Transistor Mounting | Panel |
| Transistor Case Style | Module |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 1.2kA |
| Collector Emitter Voltage Max | 3.3kV |
| Collector Emitter Saturation Voltage | 2.65V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4538805/)

**FZ1200R33HE4D_B9 IHM-B module** ~~~~~~ 

## **Final datasheet** ~~**IHM-B module with Trench/Fieldstop IGBT4 and emitter controlled 4 diode**~~ 

## **Features** 

- Electrical features 

- VCES = 33 ~~0~~ 0 V 

- IC nom = 12 ~~00~~ A / ICRM = 2400 A 

- High current density 

- ~~High DC stability~~ 

- High short-circuit capability 

- ~~Low switching losses~~ 

- Low VCE,s ~~a~~ t 

- T = 150°C vj,op 

- Trench IG ~~B~~ T 4 

- Unbeatab ~~le rob~~ ustness 

- ~~V~~ CE,sat ~~with positive temperature coeficient~~ 

- Low Qg and Cres 

- Me ~~chan~~ ical features 

- AlSi ~~C b~~ ase plate for increased thermal cycling capability 

- High power density 

- Isolated base plate 

- Pa ~~ckage with CTI > 600~~ 

- RoHS compliant 

## **Potential applications** 

- ~~High~~ - ~~power converters~~ 

- Medium-voltage converters 

- Motor drives 

- Traction drives 

- UPS systems 

- Active frontend (energy recovery) 

## **Product validation** 

- Qualified for industrial applications according to the relevant tests of IEC 60747, 60749 and 60068 

## **Description** 

Please read the sections "Important notice" and "Warnings" at the end of this document 

Datasheet www.infineon.com 

Revision 1.00 2024-04-30 

**FZ1200R33HE4D_B9 IHM-B module** 

**Table of contents** 

**==> picture [105 x 47] intentionally omitted <==**

## **Table of contents** 

||**Description**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
|---|---|
||**Features**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1|
||**Potential applications**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
||**Product validation**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
||**Table of contents**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2|
|**1**|**Package**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3|
|**2**|**IGBT, Inverter**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3|
|**3**|**Diode, Inverter**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5|
|**4**|**Characteristics diagrams**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7|
|**5**|**Circuit diagram**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|
|**6**|**Package outlines**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11|
|**7**|**Module label code**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12|
||**Revision history**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13|
||**Disclaimer**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14|



Datasheet 

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**FZ1200R33HE4D_B9 IHM-B module** 

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## **1  Package** 

## **1 Package** 

|**1**<br>**Package**|**1**<br>**Package**|**1**<br>**Package**|**1**<br>**Package**|**1**<br>**Package**|||
|---|---|---|---|---|---|---|
|**Table 1**<br>**Insulation coordination**|||||||
|**Parameter**|**Symbol**|**Note or test condition**|||**Values**|**Unit**|
|Isolation test voltage|_V_ISOL|RMS, f = 50 Hz|||6.0|kV|
|Partial discharge<br>extinction voltage|_V_isol|RMS, f = 50 Hz, QPD≤ 10 pC|||2.6|kV|
|DC stability|_V_CE(D)|Tvj= 25 °C, 100 Fit|||2100|V|
|Material of module<br>baseplate|||||AlSiC||
|Creepage distance|_d_Creep nom|terminal to baseplate, nom.|||32.2|mm|
|Clearance|_d_Clear nom|terminal to baseplate, nom.|||19.1|mm|
|Comparative tracking<br>index|_CTI_||||> 600||



|Clearance<br>_d_Clear nom terminal to baseplate, no<br>Comparative tracking<br>index<br>_CTI_|Clearance<br>_d_Clear nom terminal to baseplate, no<br>Comparative tracking<br>index<br>_CTI_|Clearance<br>_d_Clear nom terminal to baseplate, no<br>Comparative tracking<br>index<br>_CTI_|m.|19.1<br>mm<br>> 600|19.1<br>mm<br>> 600|19.1<br>mm<br>> 600|19.1<br>mm<br>> 600|
|---|---|---|---|---|---|---|---|
|**Table 2**<br>**Characteristic values**||||||||
|**Parameter**|**Symbol**|**Note or test condition**||**Values**|||**Unit**|
|||||**Min.**|**Typ.**|**Max.**||
|Stray inductance module|_L_sCE||||6||nH|
|Module lead resistance,<br>terminals - chip|_R_AA'+CC'|TC= 25 °C, per switch|||0.08||mΩ|
|Module lead resistance,<br>terminals - chip|_R_CC'+EE'|TC= 25 °C, per switch|||0.14||mΩ|
|Storage temperature|_T_stg|||-40||150|°C|
|Mounting torque for<br>module mounting|_M_|- Mounting according to<br>valid application note|M6, Screw|4.25||5.75|Nm|
|Terminal connection<br>torque|_M_|- Mounting according to<br>valid application note|M4, Screw|1.8||2.1|Nm|
||||M8, Screw|8||10||
|Weight|_G_||||1200||g|



## **2 IGBT, Inverter** 

**Table 3 Maximum rated values** 

|**Parameter**|**Symbol**|**Note or test condition**|||**Values**|**Unit**|
|---|---|---|---|---|---|---|
|Collector-emitter voltage|_V_CES||_T_vj= -40 °C||3300|V|
||||_T_vj= 150 °C||3300||
|Continuous DC collector<br>current|_I_CDC|_T_vj max= 150 °C|_T_C= 105 °C||1200|A|
|Repetitive peak collector<br>current|_I_CRM|tplimited by Tvj op|||2400|A|
|Gate-emitter peak voltage|_V_GES||||±20|V|



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## **2  IGBT, Inverter** 

## **Characteristic values** 

|||||||||
|---|---|---|---|---|---|---|---|
|**Table 4**<br>**Characteristic values**||||||||
|**Parameter**|**Symbol**|**Note or test condition**||**Values**|||**Unit**|
|||||**Min.**|**Typ.**|**Max.**||
|Collector-emitter<br>saturation voltage|_V_CE sat|_I_C= 1200 A,_V_GE= 15 V|_T_vj= 25 °C||2.40|2.65|V|
||||_T_vj= 125 °C||2.95|||
||||_T_vj= 150 °C||3.10|3.25||
|Gate threshold voltage|_V_GEth|_I_C= 47 mA, VCE= VGE,_T_vj=|25 °C|5.20|5.80|6.40|V|
|Gate charge|_Q_G|_V_GE= ±15 V,_V_CC= 1800 V|||20||µC|
|Internal gate resistor|_R_Gint|_T_vj= 25 °C|||1||Ω|
|Input capacitance|_C_ies|_f_= 1000 kHz,_T_vj= 25 °C,_V_CE= 25 V,_V_GE= 0 V|||140||nF|
|Reverse transfer<br>capacitance|_C_res|_f_= 1000 kHz,_T_vj= 25 °C,_V_CE= 25 V,_V_GE= 0 V|||4||nF|
|Collector-emitter cut-of<br>current|_I_CES|_V_CE= 3300 V,_V_GE= 0 V|_T_vj= 25 °C|||5|mA|
|Gate-emitter leakage<br>current|_I_GES|_V_CE= 0 V,_V_GE= 20 V,_T_vj= 25 °C||||400|nA|
|Turn-on delay time<br>(inductive load)|_t_don|_I_C= 1200 A,_V_CC= 1800 V,<br>_V_GE= ±15 V,_R_Gon= 1.2 Ω|_T_vj= 25 °C||0.540||µs|
||||_T_vj= 125 °C||0.670|||
||||_T_vj= 150 °C||0.700|||
|Rise time (inductive load)|_t_r|_I_C= 1200 A,_V_CC= 1800 V,<br>_V_GE= ±15 V,_R_Gon= 1.2 Ω|_T_vj= 25 °C||0.210||µs|
||||_T_vj= 125 °C||0.230|||
||||_T_vj= 150 °C||0.230|||
|Turn-of delay time<br>(inductive load)|_t_dof|_I_C= 1200 A,_V_CC= 1800 V,<br>_V_GE= ±15 V,_R_Gof= 6.2 Ω|_T_vj= 25 °C||3.900||µs|
||||_T_vj= 125 °C||4.200|||
||||_T_vj= 150 °C||4.300|||
|Fall time (inductive load)|_t_f|_I_C= 1200 A,_V_CC= 1800 V,<br>_V_GE= ±15 V,_R_Gof= 6.2 Ω|_T_vj= 25 °C||0.800||µs|
||||_T_vj= 125 °C||1.400|||
||||_T_vj= 150 °C||1.500|||
|Turn-on time (resistive<br>load)|_t_on_R|_I_C= 500 A,_V_CC= 2000 V,<br>_V_GE= ±15 V,_R_Gon= 1.2 Ω|_T_vj= 25 °C|1.20|||µs|
|Turn-on energy loss per<br>pulse|_E_on|_I_C= 1200 A,_V_CC= 1800 V,<br>_L_σ= 85 nH,_V_GE= ±15 V,<br>_R_Gon= 1.2 Ω, di/dt =<br>4400 A/µs (Tvj= 150 °C)|_T_vj= 25 °C||1680||mJ|
||||_T_vj= 125 °C||2490|||
||||_T_vj= 150 °C||2750|||
|Turn-of energy loss per<br>pulse|_E_of|_I_C= 1200 A,_V_CC= 1800 V,<br>_L_σ= 85 nH,_V_GE= ±15 V,<br>_R_Gof= 6.2 Ω, dv/dt =<br>1450 V/µs (Tvj= 150 °C)|_T_vj= 25 °C||1760||mJ|
||||_T_vj= 125 °C||2320|||
||||_T_vj= 150 °C||2490|||



**(table continues...)** 

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## **3  Diode, Inverter** 

|**Table 4**<br>**(continued) Characteristic values**|**Table 4**<br>**(continued) Characteristic values**|**Table 4**<br>**(continued) Characteristic values**|**Table 4**<br>**(continued) Characteristic values**|||||
|---|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Note or test condition**||**Values**|||**Unit**|
|||||**Min.**|**Typ.**|**Max.**||
|SC data|_I_SC|_V_GE≤ 15 V,_V_CC= 2400 V,<br>VCEmax=VCES-LsCE*di/dt|_t_P≤ 10 µs,<br>_T_vj≤ 150 °C||5200||A|
|Thermal resistance,<br>junction to case|_R_thJC|per IGBT||||11.9|K/kW|
|Thermal resistance, case to<br>heat sink|_R_thCH|per IGBT,λgrease= 1 W/(m·K)|||4.70||K/kW|
|Temperature under<br>switching conditions|_T_vj op|||-40||150|°C|



## **3 Diode, Inverter** 

|**3**<br>**Diode, Inverter**|**3**<br>**Diode, Inverter**|**3**<br>**Diode, Inverter**||||
|---|---|---|---|---|---|
|**Table 5**<br>**Maximum rated values**||||||
|**Parameter**|**Symbol**|**Note or test condition**||**Values**|**Unit**|
|Repetitive peak reverse<br>voltage|_V_RRM||_T_vj= -40 °C|3300|V|
||||_T_vj= 150 °C|3300||
|Continuous DC forward<br>current|_I_F|||1200|A|
|Repetitive peak forward<br>current|_I_FRM|_t_P= 1 ms||2400|A|
|I2t - value|_I_2_t_|_t_P= 10 ms,_V_R= 0 V|_T_vj= 125 °C|630|kA²s|
||||_T_vj= 150 °C|570||
|Maximum power<br>dissipation|_P_RQM||_T_vj= 150 °C|3600|kW|
|Minimum turn-on time|_t_onmin|||10|µs|



**Table 6 Characteristic values** 

|**Parameter**|**Symbol**|**Note or test condition**||**Values**|**Values**|**Values**|**Unit**|
|---|---|---|---|---|---|---|---|
|||||**Min.**|**Typ.**|**Max.**||
|Forward voltage|_V_F|_I_F= 1200 A,_V_GE= 0 V|_T_vj= 25 °C||2.60|3.00|V|
||||_T_vj= 125 °C||2.30|||
||||_T_vj= 150 °C||2.20|2.50||
|Peak reverse recovery<br>current|_I_RM|_V_CC= 1800 V,_I_F= 1200 A,<br>_V_GE= -15 V, -diF/dt =<br>4400 A/µs (Tvj= 150 °C)|_T_vj= 25 °C||1280||A|
||||_T_vj= 125 °C||1460|||
||||_T_vj= 150 °C||1520|||



## **(table continues...)** 

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## **3  Diode, Inverter** 

|**Table 6**<br>**(continued) Characteristic values**|**Table 6**<br>**(continued) Characteristic values**|**Table 6**<br>**(continued) Characteristic values**||||||
|---|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Note or test condition**||**Values**|||**Unit**|
|||||**Min.**|**Typ.**|**Max.**||
|Recovered charge|_Q_r|_V_CC= 1800 V,_I_F= 1200 A,<br>_V_GE= -15 V, -diF/dt =<br>4400 A/µs (Tvj= 150 °C)|_T_vj= 25 °C||585||µC|
||||_T_vj= 125 °C||1150|||
||||_T_vj= 150 °C||1350|||
|Reverse recovery energy|_E_rec|_V_CC= 1800 V,_I_F= 1200 A,<br>_V_GE= -15 V, -diF/dt =<br>4400 A/µs (Tvj= 150 °C)|_T_vj= 25 °C||545||mJ|
||||_T_vj= 125 °C||1230|||
||||_T_vj= 150 °C||1460|||
|Thermal resistance,<br>junction to case|_R_thJC|per diode||||16.7|K/kW|
|Thermal resistance, case to<br>heat sink|_R_thCH|per diode,λgrease= 1 W/(m·K)|||6.45||K/kW|
|Temperature under<br>switching conditions|_T_vj op|||-40||150|°C|



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**4  Characteristics diagrams** 

**4 Characteristics diagrams** 

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## **Output characteristic (typical), IGBT, Inverter** 

IC = f(VCE) 

VGE = 15 V 

**Output characteristic field (typical), IGBT, Inverter** IC = f(VCE) 

T = 150 °C vj 

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**----- Start of picture text -----**<br>
2400 2400<br>2200 2200<br>2000 2000<br>1800 1800<br>1600 1600<br>1400 1400<br>1200 1200<br>1000 1000<br>800 800<br>600 600<br>400 400<br>200 200<br>0 0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>Transfer characteristic (typical), IGBT, Inverter Gate charge characteristic (typical), IGBT, Inverter<br>IC = f(VGE) VGE = f(QG)<br>VCE = 20 V IC = 1200 A, Tvj = 25 °C<br>2400 15<br>13<br>2200<br>11<br>2000<br>9<br>1800<br>7<br>1600 5<br>3<br>1400<br>1<br>1200<br>-1<br>1000<br>-3<br>800 -5<br>-7<br>600<br>-9<br>400<br>-11<br>200<br>-13<br>0 -15<br>5 6 7 8 9 10 11 12 13 0 2 4 6 8 10 12 14 16 18 20<br>**----- End of picture text -----**<br>


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**4  Characteristics diagrams** 

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## **Capacity characteristic (typical), IGBT, Inverter** 

## C = f(VCE) 

f = 100 kHz, VGE = 0 V, Tvj = 25 °C 

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250<br>200<br>150<br>100<br>50<br>0<br>0.1 1 10 100<br>**----- End of picture text -----**<br>


## **Switching times (typical), IGBT, Inverter** 

## t = f(RG) 

IC = 1200 A, VCC = 1800 V, VGE = ± 15 V, Tvj = 150 °C 

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**----- Start of picture text -----**<br>
10<br>1<br>0.1<br>0 2 4 6 8 10 12 14 16 18 20<br>**----- End of picture text -----**<br>


## **Switching times (typical), IGBT, Inverter** 

## t = f(IC) 

RGoff = 6.2 Ω, RGon = 1.2 Ω, VCC = 1800 V, VGE = ± 15 V, Tvj = 150 °C 

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10<br>1<br>0.1<br>0.01<br>0 300 600 900 1200 1500 1800 2100 2400<br>**----- End of picture text -----**<br>


## **Switching losses (typical), IGBT, Inverter** E = f(IC) 

RGoff = 6.2 Ω, RGon = 1.2 Ω, VCC = 1800 V, VGE = ± 15 V 

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**----- Start of picture text -----**<br>
7200<br>6600<br>6000<br>5400<br>4800<br>4200<br>3600<br>3000<br>2400<br>1800<br>1200<br>600<br>0<br>0 300 600 900 1200 1500 1800 2100 2400<br>**----- End of picture text -----**<br>


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**4  Characteristics diagrams** 

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## **Switching losses (typical), IGBT, Inverter** 

E = f(RG) 

## IC = 1200 A, VCC = 1800 V, VGE = ± 15 V 

## **Reverse bias safe operating area (RBSOA), IGBT, Inverter** 

IC = f(VCE) 

RGoff = 6.2 Ω, VGE = 15 V, Tvj = 150 °C 

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**----- Start of picture text -----**<br>
12000 3000<br>11000<br>2700<br>10000<br>2400<br>9000<br>2100<br>8000<br>1800<br>7000<br>6000 1500<br>5000<br>1200<br>4000<br>900<br>3000<br>600<br>2000<br>300<br>1000<br>0 0<br>0 2 4 6 8 10 12 14 16 18 20 0 500 1000 1500 2000 2500 3000 3500<br>Transient thermal impedance, IGBT, Inverter Forward characteristic (typical), Diode, Inverter<br>Zth = f(t) IF = f(VF)<br>100 2400<br>2200<br>2000<br>10 1800<br>1600<br>1400<br>1 1200<br>1000<br>800<br>0.1 600<br>400<br>200<br>0.01 0<br>0.001 0.01 0.1 1 10 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0<br>**----- End of picture text -----**<br>


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**4  Characteristics diagrams** 

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## **Switching losses (typical), Diode, Inverter** 

Erec = f(IF) 

VCE = 1800 V, RGon = RGon(IGBT) 

## **Switching losses (typical), Diode, Inverter** 

Erec = f(RG) VCE = 1800 V, IF = 1200 A 

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**----- Start of picture text -----**<br>
2000 2000<br>1800 1800<br>1600 1600<br>1400 1400<br>1200 1200<br>1000 1000<br>800 800<br>600 600<br>400 400<br>200 200<br>0 0<br>0 300 600 900 1200 1500 1800 2100 2400 0 2 4 6 8 10 12 14 16 18 20<br>Safe operating area (SOA), Diode, Inverter Transient thermal impedance, Diode, Inverter<br>IR = f(VR) Zth = f(t)<br>T  = 150 °C<br>vj<br>2700 100<br>2400<br>2100<br>1800 10<br>1500<br>1200<br>900 1<br>600<br>300<br>0 0.1<br>0 500 1000 1500 2000 2500 3000 3500 0.001 0.01 0.1 1 10<br>**----- End of picture text -----**<br>


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## **5  Circuit diagram** 

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5 Circuit diagram<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
9 7 5<br>3<br>T1.1 T1.2 T1.3<br>2 D1.1 D1.2 D1.3<br>1<br>8 6 4<br>external connection to be done<br>**----- End of picture text -----**<br>


## **Figure 1** 

**6** 

## **Package outlines** 

**==> picture [517 x 374] intentionally omitted <==**

**----- Start of picture text -----**<br>
2 2 2 2<br>E 38,5 1<br>( � 7)<br>2 62<br>screw in depth<br>max. 16<br>20<br>Y<br>X<br>0<br>20<br>62<br>2<br>5<br>D 85,5 3x (M4) 6x (M8) � 6x � 1,6 A D E 28<br>screw in depth<br>max. 8<br>A  3x<br>M PCB hole pattern<br>190  � 0,5<br>3x  � 5 � 0,1 3<br>� � 0,4 CZ<br>3x<br>K Y<br>X<br>0<br>H  �  K<br>� 0,2 M-M<br>H<br>Recommended design height for lower side busbar to baseplate       38,2 �      mm.0,2 1 35,5<br>Recommended tolerance of threaded holes in heatsink  �      mm.0,1 2 40<br>45,2<br>Recommended hole diameter for PCB 3<br>Dimensions according to ISO 14405 GG (Method of least squares (LSQ)).<br>Reference D and E defined with GG<br>ISO 8015 - Independency principle<br>35,9476�<br>85,5 48,5 28,5 0 12,8 28,5 74 85,5<br>0,5<br> �<br>140<br>62<br>7)<br>� (<br>97,6 79,4 41,3 20,3 0<br>**----- End of picture text -----**<br>


**Figure 2** 

Datasheet 

Revision 1.00 2024-04-30 

11 

**FZ1200R33HE4D_B9 IHM-B module** 

**==> picture [105 x 47] intentionally omitted <==**

## **7  Module label code** 

## **7 Module label code** 

|**Module label code**|**Module label code**|**Module label code**|**Module label code**|**Module label code**|
|---|---|---|---|---|
|Code format|Data Matrix||Barcode Code128||
|Encoding|ASCII text||Code Set A||
|Symbol size|16x16||23 digits||
|Standard|IEC24720 and IEC16022||IEC8859-1||
||||||
|Code content|_Content_<br>Module serial number<br>Module material number<br>Production order number<br>Date code (production year)<br>Date code (production week)|_Digit_<br>1 – 5<br>6 - 11<br>12 - 19<br>20 – 21<br>22 – 23||_Example_<br>71549<br>142846<br>55054991<br>15<br>30|
|Example|71549142846550549911530<br>71549142846550549911530||||



## **Figure 3** 

Datasheet 

Revision 1.00 2024-04-30 

12 

**FZ1200R33HE4D_B9 IHM-B module** 

**Revision history** 

**==> picture [105 x 47] intentionally omitted <==**

## **Revision history** 

|**Revision history**|||
|---|---|---|
|**Document revision**|**Date of release**|**Description of changes**|
|0.10|2024-03-18|Initial version|
|1.00|2024-04-30|Final datasheet|



Datasheet 

Revision 1.00 2024-04-30 

13 

## **Trademarks** 

All referenced product or service names and trademarks are the property of their respective owners. 

**Edition 2024-04-30 Important notice Published by** The information given in this document shall in no event be regarded as a guarantee of conditions or **Infineon Technologies AG** characteristics (“Beschaffenheitsgarantie”). **81726 Munich, Germany** 

With respect to any examples, hints or any typical values stated herein and/or any information regarding **© 2024 Infineon Technologies AG** the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities **All Rights Reserved.** of any kind, including without limitation warranties of non-infringement of intellectual property rights of any **Do you have a question about any** third party. **aspect of this document?** In addition, any information given in this document is **Email: erratum@infineon.com** subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning **Document reference** customer’s products and any use of the product of **IFX-ABJ734-002** Infineon Technologies in customer’s applications. 

Please note that this product is not qualified according to the AEC Q100 or AEC Q101 documents of the Automotive Electronics Council. 

## **Warnings** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 



## Links

- [View this product on Novapart](https://novapart.co/products/FZ1200R33HE4DB9BPSA1/igbt-module-single-switch-12-ka-265-v-3600-kw-150)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/infineon/fz1200r33he4db9bpsa1/igbt-module-3-3kv-single-switch/dp/4538805)
---

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