# IGBT Module, 25 A, 1.7 V, 20 mW, 175 °C, Module

![Product image](https://novapart.co/image/farnell:4412429/)

**URL**: https://novapart.co/products/FS3L40R12W2H7PB11BPSA1/igbt-module-25-a-17-v-20-mw-175-c
**SKU**: FS3L40R12W2H7PB11BPSA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || IGBTs || IGBT Modules
**Price**: €51.8100
**Stock**: 10+
**Lead Time**: 78 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| Product Range | EasyPACK 2B Series |
| Igbt Technology | - |
| Igbt Termination | Press Fit |
| Power Dissipation | 20mW |
| Igbt Configuration | - |
| Transistor Mounting | Panel |
| Transistor Case Style | Module |
| Operating Temperature Max | 175°C |
| Continuous Collector Current | 25A |
| Collector Emitter Voltage Max | 1.2kV |
| Collector Emitter Saturation Voltage | 1.7V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4412429/)

**FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** _— 

## **Final datasheet EasyPACK[™] 2B module and PressFIT / pre-applied thermal interface material / NTC** 

## **Features** 

- Electrical features 

- VCES = 1200 V 

- IC nom = 40 A / ICRM = 80 A 

- Ultra fast IGBT chips 

- Overload operation up to 175°C 

- Low switching losses 

- Low V CE,sat 

- Suitable Infineon gate drivers can be found under https://www.infineon.com/gdfinder 

- Mechanical features 

- 3 kV AC 1 minute insulation 

- Al2O3 substrate with low thermal resistance 

- Compact design 

- PressFIT contact technology 

- Rugged mounting due to integrated mounting clamps 

- Pre-applied thermal interface material 

## ~~**P**~~ **otential applications** 

- Three-level applications 

- Solar applications 

## **Product validation** 

- Qualified for industrial applications according to the relevant tests of IEC 60747, 60749 and 60068 

## **Description** 

**==> picture [6 x 6] intentionally omitted <==**

**----- Start of picture text -----**<br>
J<br>**----- End of picture text -----**<br>


Please read the sections "Important notice" and "Warnings" at the end of this document 

Datasheet www.infineon.com 

Revision 1.00 2023-12-12 

**FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** 

**Table of contents** 

**==> picture [105 x 47] intentionally omitted <==**

## **Table of contents** 

||**Description**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
|---|---|
||**Features**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1|
||**Potential applications**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
||**Product validation**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
||**Table of contents**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2|
|**1**|**Package**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3|
|**2**|**IGBT, T1-T2 / T5-T6 / T9-T10**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3|
|**3**|**Diode, D1-D2 / D5-D6 / D9-D10**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5|
|**4**|**IGBT, T3-T4 / T7-T8 / T11-T12**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6|
|**5**|**Diode, D3-D4 / D7-D8 / D11-D12**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7|
|**6**|**NTC-Thermistor**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8|
|**7**|**Characteristics diagrams**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9|
|**8**|**Circuit diagram**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17|
|**9**|**Package outlines**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18|
|**10**|**Module label code**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19|
||**Revision history**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20|
||**Disclaimer**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21|



Datasheet 

Revision 1.00 2023-12-12 

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**FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** 

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## **1  Package** 

## **1 Package** 

|**1**<br>**Package**|**1**<br>**Package**|**1**<br>**Package**|**1**<br>**Package**|**1**<br>**Package**|||
|---|---|---|---|---|---|---|
|**Table 1**<br>**Insulation coordination**|||||||
|**Parameter**|**Symbol**|**Note or test condition**|||**Values**|**Unit**|
|Isolation test voltage|_V_ISOL|RMS, f = 50 Hz,_t_= 1 min|||3.0|kV|
|Isolation test voltage NTC|_V_ISOL(NTC)|RMS, f = 50 Hz,_t_= 1 min|||3.0|kV|
|Internal isolation||basic insulation (class 1, IEC 61140)|||Al2O3||
|Comparative tracking<br>index|_CTI_||||> 225||
|Relative thermal index<br>(electrical)|_RTI_|housing|||140|°C|



**Table 2 Characteristic values** 

|**Parameter**|**Symbol**|**Note or test condition**|||**Values**||**Unit**|
|---|---|---|---|---|---|---|---|
|||||**Min.**|**Typ.**|**Max.**||
|Stray inductance module|_L_sCE||||30||nH|
|Module lead resistance,<br>terminals - chip|_R_CC'+EE'|TH= 25 °C, per switch|||7||mΩ|
|Storage temperature|_T_stg|||-40||125|°C|
|Maximum baseplate<br>operation temperature|_T_BPmax|||||125|°C|
|Mounting force per clamp|_F_|||40||80|N|
|Weight|_G_||||39||g|



_**Note** : Storage and shipment of modules with TIM => see AN2012-07_ 

_The current under continuous operation is limited to 25 A rms per connector pin._ 

## **2 IGBT, T1-T2 / T5-T6 / T9-T10** 

## **Table 3 Maximum rated values** 

|**Parameter**|**Symbol**|**Note or test condition**|**Note or test condition**|**Values**|**Unit**|
|---|---|---|---|---|---|
|Collector-emitter voltage|_V_CES||_T_vj= 25 °C|1200|V|
|Implemented collector<br>current|_I_CN|||40|A|
|Continuous DC collector<br>current|_I_CDC|_T_vj max= 175 °C|_T_H= 65 °C|25|A|
|Repetitive peak collector<br>current|_I_CRM|tplimited by Tvj op||80|A|
|Gate-emitter peak voltage|_V_GES|||±20|V|



Datasheet 

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**FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** 

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## **2  IGBT, T1-T2 / T5-T6 / T9-T10** 

|**Table 4**<br>**Characteristic values**|**Table 4**<br>**Characteristic values**|**Table 4**<br>**Characteristic values**||||||
|---|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Note or test condition**|||**Values**||**Unit**|
|||||**Min.**|**Typ.**|**Max.**||
|Collector-emitter<br>saturation voltage|_V_CE sat|_I_C= 40 A,_V_GE= 15 V|_T_vj= 25 °C||1.70|2.25|V|
||||_T_vj= 125 °C||1.90|||
||||_T_vj= 175 °C||2.00|||
|Gate threshold voltage|_V_GEth|_I_C= 8.16 mA, VCE= VGE,_T_vj= 25 °C||4.85|5.5|6.15|V|
|Gate charge|_Q_G|_V_GE= ±15 V,_V_CC= 600 V|||0.59||µC|
|Input capacitance|_C_ies|_f_= 100 kHz,_T_vj= 25 °C,_V_CE= 25 V,_V_GE= 0 V|||4.54||nF|
|Reverse transfer<br>capacitance|_C_res|_f_= 100 kHz,_T_vj= 25 °C,_V_CE= 25 V,_V_GE= 0 V|||0.086||nF|
|Collector-emitter cut-of<br>current|_I_CES|_V_CE= 1200 V,_V_GE= 0 V|_T_vj= 25 °C|||3.5|µA|
|Gate-emitter leakage<br>current|_I_GES|_V_CE= 0 V,_V_GE= 20 V,_T_vj= 25 °C||||100|nA|
|Turn-on delay time<br>(inductive load)|_t_don|_I_C= 40 A,_V_CC= 350 V,<br>_V_GE= ±15 V,_R_Gon= 0.51 Ω|_T_vj= 25 °C||0.021||µs|
||||_T_vj= 125 °C||0.025|||
||||_T_vj= 175 °C||0.026|||
|Rise time (inductive load)|_t_r|_I_C= 40 A,_V_CC= 350 V,<br>_V_GE= ±15 V,_R_Gon= 0.51 Ω|_T_vj= 25 °C||0.017||µs|
||||_T_vj= 125 °C||0.020|||
||||_T_vj= 175 °C||0.022|||
|Turn-of delay time<br>(inductive load)|_t_dof|_I_C= 40 A,_V_CC= 350 V,<br>_V_GE= ±15 V,_R_Gof= 0.62 Ω|_T_vj= 25 °C||0.110||µs|
||||_T_vj= 125 °C||0.140|||
||||_T_vj= 175 °C||0.160|||
|Fall time (inductive load)|_t_f|_I_C= 40 A,_V_CC= 350 V,<br>_V_GE= ±15 V,_R_Gof= 0.62 Ω|_T_vj= 25 °C||0.080||µs|
||||_T_vj= 125 °C||0.150|||
||||_T_vj= 175 °C||0.180|||
|Turn-on energy loss per<br>pulse|_E_on|_I_C= 40 A,_V_CC= 350 V,<br>_L_σ= 7 nH,_V_GE= ±15 V,<br>_R_Gon= 0.51 Ω, di/dt =<br>1130 A/ns (Tvj= 175 °C)|_T_vj= 25 °C||0.36||mJ|
||||_T_vj= 125 °C||0.51|||
||||_T_vj= 175 °C||0.58|||
|Turn-of energy loss per<br>pulse|_E_of|_I_C= 40 A,_V_CC= 350 V,<br>_L_σ= 7 nH,_V_GE= ±15 V,<br>_R_Gof= 0.62 Ω, dv/dt =<br>5300 V/µs (Tvj= 175 °C)|_T_vj= 25 °C||0.81||mJ|
||||_T_vj= 125 °C||1.22|||
||||_T_vj= 175 °C||1.45|||
|Thermal resistance,<br>junction to heat sink|_R_thJH|per IGBT, Valid with IFX pre-applied Thermal<br>Interface Material||||1.68|K/W|
|Temperature under<br>switching conditions|_T_vj op|||-40||175|°C|



Datasheet 

Revision 1.00 2023-12-12 

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**FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** 

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## **3  Diode, D1-D2 / D5-D6 / D9-D10** 

_**Note** : Tvj op > 150 °C is only allowed for operation at overload conditions. For detailed specifications please refer to AN 2018-14._ 

## **3 Diode, D1-D2 / D5-D6 / D9-D10** 

|**3**<br>**Diode, D1-D2 / D5-D6 / D9-D10**|**3**<br>**Diode, D1-D2 / D5-D6 / D9-D10**|**3**<br>**Diode, D1-D2 / D5-D6 / D9-D10**|||||
|---|---|---|---|---|---|---|
|**Table 5**<br>**Maximum rated values**|||||||
|**Parameter**|**Symbol**|**Note or test condition**|||**Values**|**Unit**|
|Repetitive peak reverse<br>voltage|_V_RRM||_T_vj= 25 °C||1200|V|
|Implemented forward<br>current|_I_FN||||40|A|
|Continuous DC forward<br>current|_I_F||||25|A|
|Repetitive peak forward<br>current|_I_FRM|_t_P= 1 ms|||80|A|
|I2t - value|_I_2_t_|_t_P= 10 ms,_V_R= 0 V|_T_vj= 125 °C||61|A²s|
||||_T_vj= 175 °C||35||



|**Table 6**<br>**Characteristic values**|**Table 6**<br>**Characteristic values**|**Table 6**<br>**Characteristic values**||||||
|---|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Note or test condition**|||**Values**||**Unit**|
|||||**Min.**|**Typ.**|**Max.**||
|Forward voltage|_V_F|_I_F= 40 A,_V_GE= 0 V|_T_vj= 25 °C||2.50|3.05|V|
||||_T_vj= 125 °C||2.18|||
||||_T_vj= 175 °C||1.98|||
|Peak reverse recovery<br>current|_I_RM|_V_CC= 350 V,_I_F= 40 A,<br>_V_GE= -15 V, -diF/dt = 2.1<br>kA/µs (Tvj= 175 °C)|_T_vj= 25 °C||36.4||A|
||||_T_vj= 125 °C||52.2|||
||||_T_vj= 175 °C||58.6|||
|Recovered charge|_Q_r|_V_CC= 350 V,_I_F= 40 A,<br>_V_GE= -15 V, -diF/dt = 2.1<br>kA/µs (Tvj= 175 °C)|_T_vj= 25 °C||0.68||µC|
||||_T_vj= 125 °C||1.61|||
||||_T_vj= 175 °C||2.22|||
|Reverse recovery energy|_E_rec|_V_CC= 350 V,_I_F= 40 A,<br>_V_GE= -15 V, -diF/dt = 2.1<br>kA/µs (Tvj= 175 °C)|_T_vj= 25 °C||0.214||mJ|
||||_T_vj= 125 °C||0.503|||
||||_T_vj= 175 °C||0.647|||
|Thermal resistance,<br>junction to heat sink|_R_thJH|per diode, Valid with IFX pre-applied<br>Thermal Interface Material||||2.07|K/W|
|Temperature under<br>switching conditions|_T_vj op|||-40||175|°C|



_**Note** : Tvj op > 150 °C is only allowed for operation at overload conditions. For detailed specifications please refer to AN 2018-14._ 

Datasheet 

Revision 1.00 2023-12-12 

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**FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** 

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**4  IGBT, T3-T4 / T7-T8 / T11-T12** 

## **4 IGBT, T3-T4 / T7-T8 / T11-T12** 

|**4**<br>**IGBT, T3-T4 / T7-T8 / T11-T12**|**4**<br>**IGBT, T3-T4 / T7-T8 / T11-T12**|**4**<br>**IGBT, T3-T4 / T7-T8 / T11-T12**|||||
|---|---|---|---|---|---|---|
|**Table 7**<br>**Maximum rated values**|||||||
|**Parameter**|**Symbol**|**Note or test condition**|||**Values**|**Unit**|
|Collector-emitter voltage|_V_CES||_T_vj= 25 °C||650|V|
|Implemented collector<br>current|_I_CN||||35|A|
|Continuous DC collector<br>current|_I_CDC|_T_vj max= 175 °C|_T_H= 65 °C||20|A|
|Repetitive peak collector<br>current|_I_CRM|tplimited by Tvj op|||70|A|
|Gate-emitter peak voltage|_V_GES||||±20|V|



**Table 8 Characteristic values** 

|**Parameter**|**Symbol**|**Note or test condition**||**Values**|**Values**|**Values**|**Unit**|
|---|---|---|---|---|---|---|---|
|||||**Min.**|**Typ.**|**Max.**||
|Collector-emitter<br>saturation voltage|_V_CE sat|_I_C= 35 A,_V_GE= 15 V|_T_vj= 25 °C||1.42|1.90|V|
||||_T_vj= 125 °C||1.53|||
||||_T_vj= 175 °C||1.62|||
|Gate threshold voltage|_V_GEth|_I_C= 6.5 mA, VCE= VGE,_T_vj=|25 °C|3.25|4|4.75|V|
|Gate charge|_Q_G|_V_GE= ±15 V,_V_CC= 400 V|||0.143||µC|
|Input capacitance|_C_ies|_f_= 100 kHz,_T_vj= 25 °C,_V_CE= 25 V,_V_GE= 0 V|||25.2||nF|
|Reverse transfer<br>capacitance|_C_res|_f_= 100 kHz,_T_vj= 25 °C,_V_CE= 25 V,_V_GE= 0 V|||0.078||nF|
|Collector-emitter cut-of<br>current|_I_CES|_V_CE= 650 V,_V_GE= 0 V|_T_vj= 25 °C|||24|µA|
|Gate-emitter leakage<br>current|_I_GES|_V_CE= 0 V,_V_GE= 20 V,_T_vj= 25 °C||||100|nA|
|Turn-on delay time<br>(inductive load)|_t_don|_I_C= 35 A,_V_CC= 350 V,<br>_V_GE= ±15 V,_R_Gon= 1.5 Ω|_T_vj= 25 °C||0.010||µs|
||||_T_vj= 125 °C||0.011|||
||||_T_vj= 175 °C||0.012|||
|Rise time (inductive load)|_t_r|_I_C= 35 A,_V_CC= 350 V,<br>_V_GE= ±15 V,_R_Gon= 1.5 Ω|_T_vj= 25 °C||0.013||µs|
||||_T_vj= 125 °C||0.015|||
||||_T_vj= 150 °C||0.015|||
|Turn-of delay time<br>(inductive load)|_t_dof|_I_C= 35 A,_V_CC= 350 V,<br>_V_GE= ±15 V,_R_Gof= 1.5 Ω|_T_vj= 25 °C||0.075||µs|
||||_T_vj= 125 °C||0.092|||
||||_T_vj= 175 °C||0.099|||



**(table continues...)** 

Datasheet 

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**FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** 

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## **5  Diode, D3-D4 / D7-D8 / D11-D12** 

|**Table 8**<br>**(continued) Characteristic values**|**Table 8**<br>**(continued) Characteristic values**|**Table 8**<br>**(continued) Characteristic values**||||||
|---|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Note or test condition**||**Values**|||**Unit**|
|||||**Min.**|**Typ.**|**Max.**||
|Fall time (inductive load)|_t_f|_I_C= 35 A,_V_CC= 350 V,<br>_V_GE= ±15 V,_R_Gof= 1.5 Ω|_T_vj= 25 °C||0.036||µs|
||||_T_vj= 125 °C||0.051|||
||||_T_vj= 175 °C||0.071|||
|Turn-on energy loss per<br>pulse|_E_on|_I_C= 35 A,_V_CC= 350 V,<br>_L_σ= 7 nH,_V_GE= ±15 V,<br>_R_Gon= 1.5 Ω, di/dt =<br>1790 A/µs (Tvj= 175 °C)|_T_vj= 25 °C||0.13||mJ|
||||_T_vj= 125 °C||0.2|||
||||_T_vj= 175 °C||0.26|||
|Turn-of energy loss per<br>pulse|_E_of|_I_C= 35 A,_V_CC= 350 V,<br>_L_σ= 7 nH,_V_GE= ±15 V,<br>_R_Gof= 1.5 Ω, dv/dt =<br>7570 V/µs (Tvj= 175 °C)|_T_vj= 25 °C||0.432||mJ|
||||_T_vj= 125 °C||0.625|||
||||_T_vj= 175 °C||0.737|||
|Thermal resistance,<br>junction to heat sink|_R_thJH|per IGBT, Valid with IFX pre-applied Thermal<br>Interface Material||||2.59|K/W|
|Temperature under<br>switching conditions|_T_vj op|||-40||175|°C|



## **5 Diode, D3-D4 / D7-D8 / D11-D12** 

**Table 9 Maximum rated values** 

|**Parameter**|**Symbol**|**Note or test condition**||**Values**|**Unit**|
|---|---|---|---|---|---|
|Repetitive peak reverse<br>voltage|_V_RRM||_T_vj= 25 °C|650|V|
|Implemented forward<br>current|_I_FN|||50|A|
|Continuous DC forward<br>current|_I_F|||25|A|
|Repetitive peak forward<br>current|_I_FRM|_t_P= 1 ms||100|A|
|I2t - value|_I_2_t_|_t_P= 10 ms,_V_R= 0 V|_T_vj= 125 °C|87|A²s|
||||_T_vj= 175 °C|69.7||



|**Table 10**<br>**Characteristic values**|**Table 10**<br>**Characteristic values**|**Table 10**<br>**Characteristic values**||||||
|---|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Note or test condition**||**Values**|||**Unit**|
|||||**Min.**|**Typ.**|**Max.**||
|Forward voltage|_V_F|_I_F= 50 A,_V_GE= 0 V|_T_vj= 25 °C||1.65|2.15|V|
||||_T_vj= 125 °C||1.55|||
||||_T_vj= 175 °C||1.45|||



## **(table continues...)** 

Datasheet 

Revision 1.00 2023-12-12 

7 

**FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** 

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## **6  NTC-Thermistor** 

|**Table 10**<br>**(continued) Characteristic values**|**Table 10**<br>**(continued) Characteristic values**|**Table 10**<br>**(continued) Characteristic values**||||||
|---|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Note or test condition**|||**Values**||**Unit**|
|||||**Min.**|**Typ.**|**Max.**||
|Peak reverse recovery<br>current|_I_RM|_V_CC= 350 V,_I_F= 50 A,<br>-diF/dt = 1430 A/µs<br>(Tvj= 175 °C)|_T_vj= 25 °C||25.4||A|
||||_T_vj= 125 °C||33.3|||
||||_T_vj= 175 °C||37.8|||
|Recovered charge|_Q_r|_V_CC= 350 V,_I_F= 50 A,<br>-diF/dt = 1430 A/µs<br>(Tvj= 175 °C)|_T_vj= 25 °C||0.9||µC|
||||_T_vj= 125 °C||1.71|||
||||_T_vj= 175 °C||2.22|||
|Reverse recovery energy|_E_rec|_V_CC= 350 V,_I_F= 50 A,<br>-diF/dt = 1430 A/µs<br>(Tvj= 175 °C)|_T_vj= 25 °C||0.223||mJ|
||||_T_vj= 125 °C||0.428|||
||||_T_vj= 175 °C||0.555|||
|Thermal resistance,<br>junction to heat sink|_R_thJH|per diode, Valid with IFX pre-applied<br>Thermal Interface Material||||1.83|K/W|
|Temperature under<br>switching conditions|_T_vj op|||-40||175|°C|



## **6 NTC-Thermistor** 

|**6**<br>**NTC-Thermistor**|**6**<br>**NTC-Thermistor**|**6**<br>**NTC-Thermistor**|||||
|---|---|---|---|---|---|---|
|**Table 11**<br>**Characteristic values**|||||||
|**Parameter**|**Symbol**|**Note or test condition**||**Values**||**Unit**|
||||**Min.**|**Typ.**|**Max.**||
|Rated resistance|_R_25|_T_NTC= 25 °C||5||kΩ|
|Deviation of R100|Δ_R/R_|_T_NTC= 100 °C,_R_100= 493 Ω|-5||5|%|
|Power dissipation|_P_25|_T_NTC= 25 °C|||20|mW|
|B-value|_B_25/50|R2= R25exp[B25/50(1/T2-1/(298,15 K))]||3375||K|
|B-value|_B_25/80|R2= R25exp[B25/80(1/T2-1/(298,15 K))]||3411||K|
|B-value|_B_25/100|R2= R25exp[B25/100(1/T2-1/(298,15 K))]||3433||K|



_**Note** : For an analytical description of the NTC characteristics please refer to AN2009-10, chapter 4_ 

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## **7 Characteristics diagrams** 

**Output characteristic (typical), IGBT, T1-T2 / T5-T6 / T9-T10** 

IC = f(VCE) VGE = 15 V 

**Output characteristic field (typical), IGBT, T1-T2 / T5T6 / T9-T10** 

IC = f(VCE) T = 175 °C vj 

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**----- Start of picture text -----**<br>
80 80<br>70 70<br>60 60<br>50 50<br>40 40<br>30 30<br>20 20<br>10 10<br>0 0<br>0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0<br>Transfer characteristic (typical), IGBT, T1-T2 / T5-T6 / Gate charge characteristic (typical), IGBT, T1-T2 / T5-<br>T9-T10 T6 / T9-T10<br>IC = f(VGE) VGE = f(QG)<br>VCE = 20 V IC = 40 A, Tvj = 25 °C<br>80 15<br>70<br>10<br>60<br>5<br>50<br>40 0<br>30<br>-5<br>20<br>-10<br>10<br>0 -15<br>5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 0.00 0.10 0.20 0.30 0.40 0.50 0.60<br>**----- End of picture text -----**<br>


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## **7  Characteristics diagrams** 

**Capacity characteristic (typical), IGBT, T1-T2 / T5-T6 / T9-T10** 

C = f(VCE) 

f = 100 kHz, VGE = 0 V, Tvj = 25 °C 

**==> picture [228 x 252] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br>1<br>0.1<br>0.01<br>0 10 20 30 40 50 60 70 80 90 100<br>**----- End of picture text -----**<br>


**Switching times (typical), IGBT, T1-T2 / T5-T6 / T9-T10** t = f(RG) 

VGE = ±15 V, IC = 40 A, VCC = 350 V, Tvj = 175 °C 

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**----- Start of picture text -----**<br>
1<br>0.1<br>0.01<br>0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0<br>**----- End of picture text -----**<br>


## **Switching times (typical), IGBT, T1-T2 / T5-T6 / T9-T10** 

t = f(IC) 

VCC = 350 V, RGoff = 0.62 Ω, RGon = 0.51 Ω, VGE = ±15 V, Tvj = 175 °C 

**==> picture [229 x 252] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>0.1<br>0.01<br>0 10 20 30 40 50 60 70 80<br>**----- End of picture text -----**<br>


**Switching losses (typical), IGBT, T1-T2 / T5-T6 / T9-T10** E = f(IC) 

RGoff = 0.62 Ω, RGon = 0.51 Ω, VCC = 350 V, VGE = ± 15 V 

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**----- Start of picture text -----**<br>
3.00<br>2.75<br>2.50<br>2.25<br>2.00<br>1.75<br>1.50<br>1.25<br>1.00<br>0.75<br>0.50<br>0.25<br>0.00<br>0 10 20 30 40 50 60 70 80<br>**----- End of picture text -----**<br>


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**7  Characteristics diagrams** 

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## **Switching losses (typical), IGBT, T1-T2 / T5-T6 / T9-T10** 

E = f(RG) 

## IC = 40 A, VCC = 350 V, VGE = ± 15 V 

**Reverse bias safe operating area (RBSOA), IGBT, T1T2 / T5-T6 / T9-T10** 

IC = f(VCE) 

RGoff = 0.62 Ω, VGE = ±15 V, Tvj = 175 °C 

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**----- Start of picture text -----**<br>
3.00 90<br>2.75<br>80<br>2.50<br>70<br>2.25<br>2.00 60<br>1.75<br>50<br>1.50<br>40<br>1.25<br>1.00 30<br>0.75<br>20<br>0.50<br>10<br>0.25<br>0.00 0<br>0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 0 200 400 600 800 1000 1200 1400<br>Transient thermal impedance, IGBT, T1-T2 / T5-T6 / T9- Forward characteristic (typical), Diode, D1-D2 / D5-<br>T10 D6 / D9-D10<br>Zth = f(t) IF = f(VF)<br>10 80<br>70<br>60<br>50<br>1 40<br>30<br>20<br>10<br>0.1 0<br>0.001 0.01 0.1 1 10 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3<br>**----- End of picture text -----**<br>


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## **7  Characteristics diagrams** 

**==> picture [540 x 646] intentionally omitted <==**

**----- Start of picture text -----**<br>
Switching losses (typical), Diode, D1-D2 / D5-D6 / D9- Switching losses (typical), Diode, D1-D2 / D5-D6 / D9-<br>D10 D10<br>Erec = f(IF) Erec = f(RG)<br>VCE = 350 V, RG = 1.5 Ω VCE = 350 V, IF = 40 A<br>0.80 0.80<br>0.75 0.75<br>0.70 0.70<br>0.65 0.65<br>0.60 0.60<br>0.55 0.55<br>0.50 0.50<br>0.45 0.45<br>0.40 0.40<br>0.35 0.35<br>0 10 20 30 40 50 60 70 80 0.0 1.5 3.0 4.5 6.0 7.5 9.0 10.5 12.0 13.5 15.0<br>Transient thermal impedance, Diode, D1-D2 / D5-D6 / Output characteristic (typical), IGBT, T3-T4 / T7-T8 /<br>D9-D10 T11-T12<br>Zth = f(t) IC = f(VCE)<br>VGE = 15 V<br>10 70<br>60<br>50<br>40<br>1<br>30<br>20<br>10<br>0.1 0<br>0.001 0.01 0.1 1 10 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2<br>**----- End of picture text -----**<br>


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## **7  Characteristics diagrams** 

## **Output characteristic field (typical), IGBT, T3-T4 / T7T8 / T11-T12** 

IC = f(VCE) 

## T = 175 °C vj 

## **Transfer characteristic (typical), IGBT, T3-T4 / T7-T8 / T11-T12** 

IC = f(VGE) VCE = 20 V 

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**----- Start of picture text -----**<br>
70 70<br>60 60<br>50 50<br>40 40<br>30 30<br>20 20<br>10 10<br>0 0<br>0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5<br>Gate charge characteristic (typical), IGBT, T3-T4 / T7- Capacity characteristic (typical), IGBT, T3-T4 / T7-T8 /<br>T8 / T11-T12 T11-T12<br>VGE = f(QG) C = f(VCE)<br>IC = 35 A, Tvj = 25 °C f = 100 kHz, VGE = 0 V, Tvj = 25 °C<br>15 100<br>10<br>10<br>5<br>0 1<br>-5<br>0.1<br>-10<br>-15 0.01<br>0.000 0.030 0.060 0.090 0.120 0.150 0 10 20 30 40 50 60 70 80 90 100<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Switching times (typical), IGBT, T3-T4 / T7-T8 / T11-<br>T12<br>**----- End of picture text -----**<br>


**==> picture [32 x 11] intentionally omitted <==**

**----- Start of picture text -----**<br>
t = f(IC)<br>**----- End of picture text -----**<br>


RGoff = 1.5 Ω, RGon = 1.5 Ω, VGE = ±15 V, VCC = 350 V 

**==> picture [228 x 252] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>0.1<br>0.01<br>0.001<br>0 10 20 30 40 50 60 70<br>**----- End of picture text -----**<br>


## **Switching losses (typical), IGBT, T3-T4 / T7-T8 / T11T12** 

E = f(IC) 

RGoff = 1.5 Ω, RGon = 1.5 Ω, VCC = 350 V, VGE = ± 15 V 

**==> picture [228 x 252] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.80<br>1.60<br>1.40<br>1.20<br>1.00<br>0.80<br>0.60<br>0.40<br>0.20<br>0.00<br>0 10 20 30 40 50 60 70<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Switching times (typical), IGBT, T3-T4 / T7-T8 / T11-<br>T12<br>**----- End of picture text -----**<br>


t = f(RG) VGE = ±15 V, IC = 35 A, VCC = 350 V 

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**----- Start of picture text -----**<br>
1<br>0.1<br>0.01<br>0.001<br>0.0 1.5 3.0 4.5 6.0 7.5 9.0 10.5 12.0 13.5 15.0<br>**----- End of picture text -----**<br>


**Switching losses (typical), IGBT, T3-T4 / T7-T8 / T11T12** 

E = f(RG) IC = 35 A, VCC = 350 V, VGE = ± 15 V 

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**----- Start of picture text -----**<br>
1.80<br>1.60<br>1.40<br>1.20<br>1.00<br>0.80<br>0.60<br>0.40<br>0.20<br>0.00<br>0.0 1.5 3.0 4.5 6.0 7.5 9.0 10.5 12.0 13.5 15.0<br>**----- End of picture text -----**<br>


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## **7  Characteristics diagrams** 

## **Reverse bias safe operating area (RBSOA), IGBT, T3T4 / T7-T8 / T11-T12** 

IC = f(VCE) 

**Transient thermal impedance, IGBT, T3-T4 / T7-T8 / T11-T12** 

Zth = f(t) 

RGoff = 1.5 Ω, VGE = ±15 V, Tvj = 175 °C 

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**----- Start of picture text -----**<br>
80<br>70<br>60<br>50<br>40<br>30<br>20<br>10<br>0<br>0 100 200 300 400 500 600 700<br>**----- End of picture text -----**<br>


## **Forward characteristic (typical), Diode, D3-D4 / D7D8 / D11-D12** 

IF = f(VF) 

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**----- Start of picture text -----**<br>
100<br>90<br>80<br>70<br>60<br>50<br>40<br>30<br>20<br>10<br>0<br>0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 2.20<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
10<br>1<br>0.1<br>0.001 0.01 0.1 1 10<br>**----- End of picture text -----**<br>


**Switching losses (typical), Diode, D3-D4 / D7-D8 / D11D12** 

Erec = f(IF) VCE = 350 V, RG = 0.51 Ω 

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**----- Start of picture text -----**<br>
1.00<br>0.90<br>0.80<br>0.70<br>0.60<br>0.50<br>0.40<br>0.30<br>0.20<br>0.10<br>0.00<br>0 10 20 30 40 50 60 70 80<br>**----- End of picture text -----**<br>


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## **7  Characteristics diagrams** 

**==> picture [540 x 613] intentionally omitted <==**

**----- Start of picture text -----**<br>
Switching losses (typical), Diode, D3-D4 / D7-D8 / D11- Transient thermal impedance, Diode, D3-D4 / D7-D8 /<br>D12 D11-D12<br>Erec = f(RG)rec = f(RG) = f(RG)G)) Zth = f(t)th = f(t) = f(t)<br>VCE = 350 V, IF = 50 ACE = 350 V, IF = 50 A = 350 V, IF = 50 AF = 50 A = 50 A<br>1.00 10<br>0.90<br>0.80<br>0.70<br>0.60<br>0.50 1<br>0.40<br>0.30<br>0.20<br>0.10<br>0.00 0.1<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.001 0.01 0.1 1 10<br>Temperature characteristic (typical), NTC-Thermistor<br>R = f(TNTC)NTC))<br>100000<br>10000<br>1000<br>100<br>10<br>0 25 50 75 100 125 150 175<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Switching losses (typical), Diode, D3-D4 / D7-D8 / D11- Transient thermal impedance, Diode, D3-D4 / D7-D8 /<br>D12 D11-D12<br>Erec = f(RG)rec = f(RG) = f(RG)G)) Zth = f(t)th = f(t) = f(t)<br>VCE = 350 V, IF = 50 ACE = 350 V, IF = 50 A = 350 V, IF = 50 AF = 50 A = 50 A<br>1.00 10<br>0.90<br>0.80<br>0.70<br>0.60<br>0.50 1<br>0.40<br>0.30<br>0.20<br>0.10<br>0.00 0.1<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.001 0.01 0.1 1 10<br>Temperature characteristic (typical), NTC-Thermistor<br>R = f(TNTC)NTC))<br>100000<br>10000<br>1000<br>100<br>10<br>0 25 50 75 100 125 150 175<br>**----- End of picture text -----**<br>


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## **8  Circuit diagram** 

## **8 Circuit diagram** 

**==> picture [523 x 106] intentionally omitted <==**

**----- Start of picture text -----**<br>
P1<br>D4 E3 G3T3 T1 D1 D8 E7 G7T7 T5 D5 D12 E11 G11T11 T9 D9<br>G1 G5 G9<br>X7<br>E1 E5 E9<br>X2 X1 X4 X3 X6 X5 J NTC<br>X8<br>T2 T6 T10<br>T4 G4 E4 D3 G2 D2 T8 G8 E8 D7 G6 D6 T12G12 E12 D11 G10 D10<br>E2 E6<br>N1<br>**----- End of picture text -----**<br>


## **Figure 1** 

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## **9  Package outlines** 

**==> picture [541 x 622] intentionally omitted <==**

**----- Start of picture text -----**<br>
9 Package outlines<br>26,5<br>21,25 21,25<br>G3 E3 E1 G1 G7 E7 G5 E5 G9 E9 E11<br>16<br>12,8 G11<br>P1 P1<br>9,6<br>X8 X7<br>6,4<br>Y 3,2 X1 X3 X5<br>X<br>0 0<br>X2 X4 X6<br>6,4<br>4x ( n 2,3) E2 N1 E6<br>12,8<br>j n 0,4 A<br>16<br>G4 E4 G2 G8 E8 N1 G6G10 E12 G12<br>21,25 B 21,25<br>26,5<br>56,7  ` 0,3<br>A j 0,7CZ A<br>j 1 A<br>(47,5)<br>Restricted area for Thermal Interface Material<br>25,5 0 25,5 25,5 24 20,8 17,6 14,4 11,2 8 4,8 1,6 0 1,6 4,8 8 11,2 14,4 17,6 20,8 24 25,5<br>0,3<br> `<br>48<br>12<br>16,4<br>(33)<br>W00215113.05<br>**----- End of picture text -----**<br>


**Figure 2** 

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## **10  Module label code** 

## **10 Module label code** 

|**Module label code**|**Module label code**|**Module label code**|**Module label code**|**Module label code**|
|---|---|---|---|---|
|Code format|Data Matrix||Barcode Code128||
|Encoding|ASCII text||Code Set A||
|Symbol size|16x16||23 digits||
|Standard|IEC24720 and IEC16022||IEC8859-1||
||||||
|Code content|_Content_<br>Module serial number<br>Module material number<br>Production order number<br>Date code (production year)<br>Date code (production week)|_Digit_<br>1 – 5<br>6 - 11<br>12 - 19<br>20 – 21<br>22 – 23||_Example_<br>71549<br>142846<br>55054991<br>15<br>30|
|Example|71549142846550549911530<br>71549142846550549911530||||



## **Figure 3** 

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**Revision history** 

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## **Revision history** 

|**Revision history**|||
|---|---|---|
|**Document revision**|**Date of release**|**Description of changes**|
|0.10|2023-01-26|Initial version|
|1.00|2023-12-12|Final datasheet|



Datasheet 

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20 

## **Trademarks** 

All referenced product or service names and trademarks are the property of their respective owners. 

**Edition 2023-12-12 Important notice Published by** The information given in this document shall in no event be regarded as a guarantee of conditions or **Infineon Technologies AG** characteristics (“Beschaffenheitsgarantie”). **81726 Munich, Germany** 

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**Do you have a question about any aspect of this document?** In addition, any information given in this document is **Email: erratum@infineon.com** subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning **Document reference** customer’s products and any use of the product of **IFX-ABF403-002** Infineon Technologies in customer’s applications. 

## **Warnings** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 



## Links

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---

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