# Power MOSFET, P Channel, 60 V, 12 A, 0.11 ohm, TO-251AA, Through Hole

![Product image](https://novapart.co/image/farnell:9846174/)

**URL**: https://novapart.co/products/FQU17P06TU/power-mosfet-p-channel-60-v-12-a-011-ohm-to-251aa
**SKU**: FQU17P06TU
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3420
**Stock**: 10+

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:12A; Drain Source Voltage Vds:-60V; On Resistance Rds(on):0.11ohm; Rds(on) Test Voltage Vgs:-10V; Threshold Voltage Vgs:-4V; Power Dissipation

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | Lead (17-Jan-2022) |
| No. Of Pins | 3Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 79W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-251AA |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 12A |
| Drain Source On State Resistance | 0.11ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:9846174/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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## **FQD17P06 / FQU17P06** 

## **P-Channel QFET[®] MOSFET** 

## **-60 V, -12 A, 135 mΩ** 

## **Description** 

## **Features** 

This P-Channel enhancement mode power MOSFET is • -12 A, -60 V, RDS(on) = 135 mΩ (Max.) @ VGS = -10 V, ID = -6 A produced using Fairchild Semiconductor’s proprietary planar • Low Gate Charge (Typ. 21 nC) stripe and DMOS technology. This advanced MOSFET technology has been especially tailored to reduce on-state • Low Crss (Typ. 80 pF) resistance, and to provide superior switching performance and • 100% Avalanche Tested high avalanche energy strength. These devices are suitable for switched mode power supplies, audio amplifier, DC motor control, and variable switching power applications. **S D G G S D-PAK I-PAK GDS D Absolute Maximum Ratings** TC = 25°C unless otherwise noted. **Symbol Parameter FQD17P06 / FQU17P06 Unit** VDSS Drain-Source Voltage -60 V ID Drain Current - Continuous (TC = 25°C) -12 A - Continuous (TC = 100°C) -7.6 A IDM Drain Current - Pulsed (Note 1) -48 A VGSS Gate-Source Voltage ± 25 V EAS Single Pulsed Avalanche Energy (Note 2) 300 mJ IAR Avalanche Current (Note 1) -12 A EAR Repetitive Avalanche Energy (Note 1) 4.4 mJ dv/dt Peak Diode Recovery dv/dt (Note 3) -7.0 V/ns PD Power Dissipation (TA = 25°C) * 2.5 W Power Dissipation (TC = 25°C) 44 W - Derate above 25°C 0.35 W/°C TJ, TSTG Operating and Storage Temperature Range -55 to +150 °C TL Maximum lead temperature for soldering purposes, 1/8” from case for 5 seconds. 300 °C **Thermal Characteristics Symbol Parameter FQD17P06 / FQU17P06 Unit** RθJC Thermal Resistance, Junction-to-Case, Max. 2.85 RθJA Thermal Resistance, Junction to Ambient (Minimum Pad of 2-oz Copper), Max. 110 °C / W ~~—————~~ RθJA Thermal Resistance, Junction to Ambient (*1 in[2] Pad of 2-oz Copper), Max. 50 

* When mounted on the minimum pad size recommended (PCB Mount) 

www.fairchildsemi.com 

©2001 Fairchild Semiconductor Corporation FQD17P06 / FQU17P06 Rev C3 

**1** 

## **Package Marking and Ordering Information** 

|**Symbol**<br>~~es~~|**Parameter**<br>~~es~~|**Test Conditions**<br>~~es~~<br>~~Qs~~|**Min.**<br>~~es~~<br>~~Qs~~|**Typ.**<br>~~es~~|**Max.**<br>~~es~~|**Unit**<br>~~es~~|
|---|---|---|---|---|---|---|
|**Off Characteristics**<br>~~Qs~~<br>~~ST~~|||||||
|BVDSS<br>~~ST~~|Drain-Source Breakdown Voltage<br>~~ST~~|VGS= 0 V, ID= -250µA<br>~~ST~~|-60<br>~~ST~~|--<br>~~ST~~|--<br>~~ST~~|V<br>~~ST~~|
|∆BVDSS<br>/∆TJ<br>~~ST~~<br>~~a~~|Breakdown Voltage Temperature Coefficient<br>~~ST~~<br>~~a~~|ID= -250µA, Referenced to 25°C<br>~~ST~~<br>~~———~~|--<br>~~ST~~|-0.06<br>~~ST~~|--<br>~~ST~~|V/°C<br>~~ST~~|
|IDSS<br>~~ST~~<br>~~a~~|Zero Gate Voltage Drain Current<br>~~ST~~<br>~~a~~|VDS= -60 V, VGS= 0 V<br>~~ST~~<br>~~———~~|--<br>~~ST~~|--<br>~~ST~~|-1<br>~~ST~~|µA<br>~~ST~~|
|~~a~~||VDS= -48 V, TC= 125°C<br>~~———~~|--|--|-10|µA|
|IGSSF<br>~~a~~<br>~~Rs~~|Gate-Body Leakage Current, Forward<br>~~a~~<br>~~DQ~~|VGS= -25 V, VDS= 0 V<br>~~———~~<br>~~DQ~~|--<br>~~DQ~~|--<br>~~DQ~~|-100<br>~~DQ~~|nA<br>~~DQ~~|
|IGSSR<br>~~a~~<br>~~Rs~~|Gate-Body Leakage Current, Reverse<br>~~a~~<br>~~DQ~~|VGS= 25 V, VDS= 0 V<br>~~———~~<br>~~DQ~~|--<br>~~DQ~~|--<br>~~DQ~~|100<br>~~DQ~~|nA<br>~~DQ~~|
|**On Characteristics**<br>~~RsDQ~~|||||||
|VGS(th)<br>~~a~~|Gate Threshold Voltage<br>~~a~~|VDS= VGS, ID= -250µA<br>~~a~~|-2.0<br>~~a~~|--<br>~~a~~|-4.0<br>~~a~~|V<br>~~a~~|
|RDS(on)<br>~~a~~|Static Drain-Source<br>On-Resistance<br>~~a~~|VGS= -10 V, ID= -6.0 A<br>~~a~~|--<br>~~a~~|0.11<br>~~a~~|0.135<br>~~a~~|Ω<br>~~a~~|
|gFS<br>~~a~~<br>~~L———>_~~|Forward Transconductance<br>~~a~~<br>~~L———>_O~~|VDS= -30 V, ID= -6.0 A<br>~~a~~<br>~~OSC~~|--<br>~~a~~<br>~~C~~|8.7<br>~~a~~<br>~~C~~|--<br>~~a~~|S<br>~~a~~<br>~~CF~~|
|**Dynamic Characteristics**<br>~~a~~<br>~~L———>_OSC~~<br>~~CF~~|||||||
|Ciss<br>~~L———>_~~<br>~~————~~|Input Capacitance<br>~~L———>_ O~~<br>~~————~~|VDS= -25 V, VGS= 0 V,<br>f = 1.0 MHz<br>~~OSC~~<br>~~————~~|--<br>~~C~~<br>~~————~~|690<br>~~C~~<br>~~————~~|900<br>~~————~~|pF<br>~~CF~~<br>~~————~~|
|Coss<br>~~————~~|Output Capacitance<br>~~————~~||--<br>~~————~~|325<br>~~————~~|420<br>~~————~~|pF<br>~~————~~|
|Crss<br>~~————~~|Reverse Transfer Capacitance<br>~~————~~||--<br>~~————~~|80<br>~~————~~|105<br>~~————~~|pF<br>~~————~~|
|**Switching Characteristics**<br>~~————~~|||||||
|td(on)<br>~~————E~~|Turn-On Delay Time<br>~~————E~~|VDD= -30 V, ID= -8.5 A,<br>RG= 25Ω<br>(Note 4)<br>~~————E~~|--<br>~~————E~~|13<br>~~————E~~|35<br>~~————E~~|ns<br>~~————E~~|
|tr<br>~~————E~~|Turn-On Rise Time<br>~~————E~~||--<br>~~————E~~|100<br>~~————E~~|210<br>~~————E~~|ns<br>~~————E~~|
|td(off)<br>~~————E~~|Turn-Off Delay Time<br>~~————E~~||--<br>~~————E~~|22<br>~~————E~~|55<br>~~————E~~|ns<br>~~————E~~|
|tf<br>~~————E~~|Turn-Off Fall Time<br>~~————E~~||--<br>~~————E~~|60<br>~~————E~~|130<br>~~————E~~|ns<br>~~————E~~|
|Qg<br>~~————E~~<br>~~—————————~~|Total Gate Charge<br>~~————E~~<br>~~—————————~~|VDS= -48 V, ID= -17 A,<br>VGS= -10 V<br>(Note 4)<br>~~————E~~<br>~~—————————~~|--<br>~~————E~~<br>~~—————————~~|21<br>~~————E~~<br>~~—————————~~|27<br>~~————E~~<br>~~—————————~~|nC<br>~~————E~~<br>~~—————————~~|
|Qgs<br>~~—————————~~|Gate-Source Charge<br>~~—————————~~||--<br>~~—————————~~|4.2<br>~~—————————~~|--<br>~~—————————~~|nC<br>~~—————————~~|
|Qgd<br>~~—————————~~|Gate-Drain Charge<br>~~—————————~~||--<br>~~—————————~~|10<br>~~—————————~~|--<br>~~—————————~~|nC<br>~~—————————~~|
|**Drain-Source Diode Characteristics and Maximum Ratings**<br>~~—————————~~|||||||
|IS|Maximum Continuous Drain-Source Diode Forward Current||--|--|-12|A|
|ISM<br>~~See~~|Maximum Pulsed Drain-Source Diode Forward Current<br>~~See~~||--<br>~~See~~|--<br>~~See~~|-48<br>~~See~~|A<br>~~See~~|
|VSD<br>~~See~~|Drain-Source Diode Forward Voltage<br>~~See~~|VGS= 0 V, IS= -12 A<br>~~See~~|--<br>~~See~~|--<br>~~See~~|-4.0<br>~~See~~|V<br>~~See~~|
|trr<br>~~See~~|Reverse Recovery Time<br>~~See~~|VGS= 0 V, IS= -17 A,<br>dIF/ dt = 100 A/µs<br>~~See~~|--<br>~~See~~|92<br>~~See~~|--<br>~~See~~|ns<br>~~See~~|
|Qrr<br>~~See~~|Reverse Recovery Charge<br>~~See~~||--<br>~~See~~|0.32<br>~~See~~|--<br>~~See~~|µC<br>~~See~~|



2. L = 2.4 mH, IAS = -12 A, VDD = -25 V, RG = 25 Ω, starting TJ = 25°C. 

3. ISD ≤  -17 A, di/dt ≤ 300 A/µs, VDD ≤ BVDSS, starting TJ = 25°C. 

4. Essentially independent of operating temperature typical characteristics. 

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©2001 Fairchild Semiconductor Corporation FQD17P06 / FQU17P06 Rev C3 

**2** 

## **Typical Performance Characteristics** 

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Top :      - 15.0 V        V GS<br>           - 10.0 V<br>    - 8.0 V<br>101     - 7.0 V     - 6.0 V 101<br>    - 5.5 V<br>    - 5.0 V<br>Bottom :  - 4.5 V<br>150∩<br>100<br>100 25∩<br>∝ 1. 2502. T  Notes : C = 25∩ レ s Pulse Test -55∩ ∝  1. V 2. 250  Notes : DS = -30V レ s Pulse Test<br>10-1 100 101 10-1 2 4 6 8 10<br>-VDS, Drain-Source Voltage [V] -VGS , Gate-Source Voltage  [V]<br>Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics<br>0.40<br>0.36<br>0.32<br>101<br>0.28 V GS  = - 10V<br>0.24<br>0.20 V GS  = - 20V<br>0.16 100<br>0.12<br>0.08 150∩ 25∩ ∝  Notes :<br>0.04 ∝  Note : T J = 25∩ 1. V2. 250 GS レ = 0Vs Pulse Test<br>0.00 Ve 10-1<br>0 10 20 30 40 50 60 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4<br>-ID , Drain Current  [A] -VSD , Source-Drain Voltage  [V]<br>Figure 3. On-Resistance Variation  vs. Figure 4. Body Diode Forward Voltage<br>Drain Current and Gate Voltage Variation vs. Source Current<br>and Temperature<br>2000 12<br>C iss  = C gs  + C gd  (C ds  = shorted)<br>1800 Coss = Cds + Cgd<br>Crss = Cgd 10<br>1600 VDS = -30V<br>1400 C oss 8 V DS  = -48V<br>12001000 Ciss ∝ 1. V2. f = 1 MHz Notes : GS  = 0 V 6<br>800<br>4<br>600 Crss<br>400<br>2<br>200 ∝  Note : ID = -17 A<br>0 0<br>10-1 100 101 0 4 8 12 16 20 24<br>VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC]<br>Figure 5. Capacitance Characteristics Figure 6. Gate  Charge Characteristics<br>, Drain Current [A]-ID  , Drain Current  [A]-ID<br>],<br>Ω<br>  [<br>DS(on)<br>R<br>Drain-Source On-Resistance  , Reverse Drain Current  [A]<br>DR<br>-I<br>Capacitance [pF]<br>, Gate-Source Voltage [V]<br>GS<br>-V<br>**----- End of picture text -----**<br>


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©2001 Fairchild Semiconductor Corporation FQD17P06 / FQU17P06 Rev C3 

**3** 

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Typical Performance Characteristics   (Continued)<br>1.2 2.5<br>2.0<br>1.1<br>1.5<br>1.0<br>1.0<br>0.9 ∝  Notes :<br> 1. V 2. IDGS = -250  = 0 V レ A 0.5 ∝  2. I 1. V  Notes : DGS = -6.0 A = -10 V<br>0.8 0.0<br>-100 -50 0 50 100 150 200 -100 -50 0 50 100 150 200<br>TJ, Junction Temperature [oC] TJ, Junction Temperature [oC]<br>Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation<br>vs. Temperature vs. Temperature<br>12<br>Operation in This Area<br>102 is Limited by R DS(on) 10<br>100 µs<br>8<br>101 1 ms<br>10 ms<br>6<br>DC<br>4<br>100<br>∝  Notes :<br>1. T C  = 25  o C 2<br>2. TJ = 150  o C<br>3. Single Pulse<br>10-1100 101 102 025 50 75 100 125 150<br>-VDS, Drain-Source Voltage [V] TC, Case Temperature [∩]<br>Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current<br>vs.  Case Temperature<br>D = 0 .5<br>1 0 0 ∝  N o te s  :<br>0 .2   1 . Z ヨ J C (t) =  2 .8 5  ∩/W  M a x.<br>  2 . D u ty  F a c to r ,  D = t 1 /t 2<br>0 .1 3 . T J M  - T C  =  P D M  * Z ヨ J C (t)<br>0 .0 5<br>1 0 -1 0 .0 2<br>0 .0 1 PDM<br>s in g le  p u ls e t1<br>t 2<br>1 0 -21 0 -5 1 0 -4 1 0 -3 1 0 -2 1 0 -1 1 0 0 1 0 1<br>t 1 , S q u a re  W a v e  P u ls e  D u ra tio n  [s e c ]<br>Figure 11. Transient Thermal Response Curve<br>, (Normalized) , (Normalized)<br>DSS DS(ON)<br>-BV R<br>Drain-Source On-Resistance<br>Drain-Source Breakdown Voltage<br>, Drain Current [A]-ID , Drain Current [A]-ID<br>oC/W](t), Thermal Response [<br>ZJC<br>**----- End of picture text -----**<br>


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©2001 Fairchild Semiconductor Corporation FQD17P06 / FQU17P06 Rev C3 

**4** 

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VGS<br>Same Type<br>50KΩ as DUT Qg<br>12V 200nF<br>300nF<br>VGS VDS Qgs Qgd<br>DUT<br>IG = const.<br>Charge<br> Figure 12. Gate Charge Test Circuit & Waveform<br>RL<br>VDS t on t off<br>RG VGS VDD VGS 10% td(on) tr td(off) tf<br>VGS DUT<br>ai VDS 90%<br> Figure 13. Resistive Switching Test Circuit & Waveforms<br>L BVDSS<br>VDS EAS = -1---2 L IAS2 --------------------BVDSS - VDD<br>t p Time<br>I D<br>RG VDD VDD VDS (t)<br>ID (t)<br>VGS DUT<br>IAS<br>t p BVDSS<br>**----- End of picture text -----**<br>


**Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms** 

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©2001 Fairchild Semiconductor Corporation FQD17P06 / FQU17P06 Rev C3 

**5** 

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+<br>VDS<br>DUT<br>_<br>I SD<br>L<br>Driver<br>RG<br>Compliment of DUT<br>(N-Channel) VDD<br>VGS • dv/dt controlled by  RG<br>• ISD controlled by pulse period<br>Pulse Wid<br>VGS D = --- [Gate] ---------------------- [th] -<br>Gate Pulse Period 10V<br>( Driver )<br>a-~<br>Body Diode Reverse Current<br>I SD<br>( DUT ) IRM<br>di/dt<br>a IFM , Body Diode Forward Current<br>VDS VSD<br>( DUT )<br>Body Diode VDD<br>Forward Voltage Drop<br>J Body Diode Recovery Ay dv/dt<br>**----- End of picture text -----**<br>


## **Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms** 

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©2001 Fairchild Semiconductor Corporation FQD17P06 / FQU17P06 Rev C3 

**6** 

## **Mechanical Dimensions** 

## **Figure 16. TO252 (D-PAK), Molded, 3-Lead, Option AA&AB** 

_Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products._ 

_Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT252-003_ 

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©2001 Fairchild Semiconductor Corporation FQD17P06 / FQU17P06 Rev C3 

**7** 

## **Mechanical Dimensions** 

## **Figure 17. TO251 (I-PAK), Molded, 3-Lead** 

_Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products._ 

_Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:_ 

_http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TO251-003_ 

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**8** 

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## **PRODUCT STATUS DEFINITIONS** 

## **Definition of Terms** 

|**Definition of Terms**|||
|---|---|---|
|**Datasheet Identification**|**Product Status**|**Definition**|
|Advance Information|Formative / In Design|Datasheet contains the design specifications for product development. Specifications<br>may change in any manner without notice.|
|Preliminary|First Production|Datasheet contains preliminary data; supplementary data will be published at a later<br>date. Fairchild Semiconductor reserves the right to make changes at any time without<br>notice to improve design.|
|No Identification Needed|Full Production|Datasheet contains final specifications. Fairchild Semiconductor reserves the right to<br>make changes at any time without notice to improve the design.|
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Rev. I68 

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©2001 Fairchild Semiconductor Corporation FQD17P06 / FQU17P06 Rev C3 

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## Links

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---

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