# Power MOSFET, N Channel, 100 V, 1.7 A, 0.35 ohm, SOT-223, Surface Mount

![Product image](https://novapart.co/image/farnell:2101412RL/)

**URL**: https://novapart.co/products/FQT7N10LTF/power-mosfet-n-channel-100-v-17-a-035-ohm-sot-223
**SKU**: FQT7N10LTF
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3570
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:1.7A; Drain Source Voltage Vds:100V; On Resistance Rds(on):0.275oh; Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 4Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 2W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOT-223 |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 1.7A |
| Drain Source On State Resistance | 0.35ohm |
| Gate Source Threshold Voltage Max | 2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2101412RL/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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July 2015<br>**----- End of picture text -----**<br>


## **FQT7N10L** 

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N-Channel QFET [®]  MOSFET<br>**----- End of picture text -----**<br>


## **100 V, 1.7 A, 350 m** Ω 

## **Description** 

## **Features** 

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This N-Channel enhancement mode power MOSFET is  • 1.7 A, 100 V, RDS(on)=350 mΩ(Max.) @VGS=10 V, ID=0.85 A<br>produced using Fairchild Semiconductor’s proprietary  • Low Gate Charge (Typ. 5.8 nC)<br>planar stripe and DMOS technology. This advanced<br>MOSFET technology has been especially tailored to  • Low Crss (Typ. 10 pF)<br>reduce on-state resistance, and to provide superior  • 100% Avalanche Tested<br>switching performance and high avalanche energy<br>strength. These devices are suitable for switched mode<br>power supplies, audio amplifier, DC motor control, and<br>variable switching power applications.<br>D<br>!<br>D<br>"<br>! "<br>S G ! ""<br>Se G SOT-223 © !<br>S<br>Absolute Maximum Ratings    TA = 25°C unless otherwise noted<br>Symbol Parameter FQT7N10L Unit<br>VDSS Drain-Source Voltage 100 V<br>ID Drain Current  - Continuous (TA = 25°C) 1.7 A<br>- Continuous (TA = 70°C) 1.36 A<br>=<br>IDM Drain Current - Pulsed (Note 1) 6.8 A<br>VGSS Gate-Source Voltage ± 20 V<br>EAS Single Pulsed Avalanche Energy (Note 2) 50 mJ<br>IAR Avalanche Current (Note 1) 1.7 A<br>EAR Repetitive Avalanche Energy (Note 1) 0.2 mJ<br>dv/dt Peak Diode Recovery dv/dt (Note 3) 6.0 V/ns<br>PD Power Dissipation (TA = 25°C) 2.0 W<br>- Derate above 25°C 0.016 W/°C<br>TJ, TSTG Operating and Storage Temperature Range -55 to +150 °C<br>——— <<<<br>Maximum lead temperature for soldering purposes,<br>TL 1/8" from case for 5 seconds 300 °C<br>a<br>Thermal Characteristics<br>Symbol Parameter Typ Max Unit<br>RθJA Thermal Resistance, Junction-to-Ambient * -- 62.5 °C / W<br>* When mounted on the minimum pad size recommended (PCB Mount)<br>—<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2001 Fairchild Semiconductor Corporation FQT7N10L Rev. 1.3 

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FQT7N10L<br>N<br>-Channel MOSFET<br>**----- End of picture text -----**<br>


**Electrical Characteristics** TA = 25°C unless otherwise noted **Symbol Parameter Test Conditions Min Typ Max Unit Off Characteristics** BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 µA 100 -- -- V ∆/ ∆BVTJDSS Breakdown Voltage Temperature Coefficient ID = 250 µA, Referenced to 25°C -- 0.1 -- V/°C IDSS VDS = 100 V, VGS = 0 V -- -- 1 µA Zero Gate Voltage Drain Current VDS = 80 V, TC = 125°C -- -- 10 µA IGSSF Gate-Body Leakage Current, Forward VGS = 20 V, VDS = 0 V -- -- 100 nA IGSSR Gate-Body Leakage Current, Reverse VGS = -20 V, VDS = 0 V -- -- -100 nA **On Characteristics** ~~— eee~~ VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 µA 1.0 -- 2.0 V RDS(on) Static Drain-Source VGS = 10 V, ID = 0.85 A -- 0.275 0.35 Ω On-Resistance VGS = 5 V, ID = 0.85 A 0.300 0.38 gFS Forward Transconductance VDS = 30 V, ID = 0.85 A (Note 4) -- 2.75 -- S **Dynamic Characteristics** Ciss Input Capacitance VDS = 25 V, VGS = 0 V, -- 220 290 pF Coss Output Capacitance f = 1.0 MHz -- 55 72 pF ~~a~~ Crss Reverse Transfer Capacitance -- 12 15 pF **Switching Characteristics** td(on) Turn-On Delay Time VDD = 50 V, ID = 7.3 A, -- 9 30 ns tr Turn-On Rise Time RG = 25 Ω -- 100 210 ns td(off) Turn-Off Delay Time -- 17 45 ns tf Turn-Off Fall Time (Note 4, 5) -- 50 110 ns Qg Total Gate Charge VDS = 80 V, ID = 7.3 A, -- 4.6 6.0 nC Qgs Gate-Source Charge VGS = 5 V -- 1.0 -- nC Qgd Gate-Drain Charge (Note 4, 5) -- 2.6 -- nC **Drain-Source Diode Characteristics and Maximum Ratings** IS Maximum Continuous Drain-Source Diode Forward Current -- -- 1.7 A ISM Maximum Pulsed Drain-Source Diode Forward Current -- -- 6.8 A VSD Drain-Source Diode Forward Voltage VGS = 0 V, IS = 1.7 A -- -- 1.5 V trr Reverse Recovery Time VGS = 0 V, IS = 7.3 A, -- 70 -- ns Qrr Reverse Recovery Charge dIF / dt = 100 A/µs (Note 4) ~~=~~ -- 140 -- nC **Notes:** 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L = 26mH, IAS = 1.7A, VDD = 25V, RG = 25 Ω, Starting  TJ = 25°C ~~=~~ 3. ISD ≤ 7.3A, di/dt ≤ 300A/µs, VDD ≤ BVDSS, Starting  TJ = 25°C 4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2% 

5. Essentially independent of operating temperature 

www.fairchildsemi.com 

©2001 Fairchild Semiconductor Corporation FQT7N10L Rev. 1.3 

## **Typical Characteristics** 

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Top :       10.0 V    VGS<br>  8.0 V<br>  6.0 V<br>  5.0 V<br>  4.5 V<br>  4.0 V<br>  3.5 V<br>Bottom :    3.0 V<br>150℃<br>100 100<br>25℃<br>-55℃<br>※ Notes : ※ Notes :<br>1. 2502. TA = 25μ s Pulse Test℃ 2. 2501. VDS = 30Vμ s Pulse Test<br>10-110 ia -1 100 t 101 10-1 0 in 2 4 ne 6 8 10<br>VDS, Drain-Source Voltage [V] VGS , Gate-Source Voltage  [V]<br>Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics<br>1.5<br>1.2<br>VGS = 5V<br>0.9<br>VGS = 10V 100<br>0.6<br>150℃ 25℃<br>0.3 — W2 54 ※ Notes :<br>※ Note : TJ = 25℃  2. 250 1. VGS = 0Vμ s Pulse Test<br>0.0 0 5 10 15 20 10-10.2 0.4 0.6 0.8 1.0 1.2 1.4<br>ID, Drain Current [A] VSD , Source-Drain Voltage  [V]<br>| |f//-<br>Figure 3. On-Resistance Variation  vs. Figure 4. Body Diode Forward Voltage<br>Drain Current and Gate Voltage Variation vs. Source Current<br>and Temperature<br>600 12<br>Ciss = Cgs + Cgd (Cds = shorted)<br>Coss = Cds + Cgd<br>500 Crss = Cgd 10<br>VDS = 50V<br>400 8<br>※ Notes : VDS = 80V<br>300 Ciss 2. f = 1 MHz1. VGS = 0 V 6<br>Coss<br>200 4<br>100 Crss 2<br>※ Note : ID = 7.3 A<br>0 SS 0<br>10-1 100 101 0 1 2 3 4 5 6 7 8<br>VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC]<br>Figure 5. Capacitance Characteristics Figure 6. Gate  Charge Characteristics<br>, Drain Current [A]ID  , Drain Current  [A]ID<br>],<br>Ω  [<br>DS(ON)<br>R<br> , Reverse Drain Current  [A]<br>IDR<br>Drain-Source On-Resistance<br>Capacitance [pF]<br>, Gate-Source Voltage [V]<br>GS<br>V<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2001 Fairchild Semiconductor Corporation FQT7N10L Rev. 1.3 

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Typical Characteristics      (Continued)<br>1.2 3.0<br>2.5<br>1.1<br>2.0<br>1.0 1.5<br>1.0<br>0.9 ※ Notes :<br>2. I1. VDGS = 250  = 0 Vμ A 0.5 ※2. I1. V Notes :DGS = 0.85 A = 10 V<br>0.8 0.0<br>-100 -50 0 50 100 150 200 -100 -50 0 50 100 150 200<br>TJ, Junction Temperature [oC] TJ, Junction Temperature [oC]<br>Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation<br>vs. Temperature vs. Temperature<br>2.0<br>Operation in This Area<br>101 is Limited by R DS(on)<br>1.6<br>100 µs<br>1 ms<br>100 100 ms10 ms 1.2<br>DC<br>0.8<br>10-1<br>※3. Single Pulse1. T2. T Notes :AJ = 150  = 25 oCoC 0.4<br>10-210 aS -1 100 101 102 0.025 | 50 75 100 125 150<br>VDS, Drain-Source Voltage [V] TA, Ambient Temperature [℃]<br>Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current<br>vs.  Ambient Temperature<br>1 0 2 D = 0 .5 ————<br>1 0 1 e 0 .2 e ※12. Duty Factor, D = t. Z N otes  :  θ  J A (t) = 62.5  [o] C/W Max. 1   / t 2<br>0 .1 3. T J M  - T C  = P D M  * Z  θ  J A (t)<br>0 .0 5 Se<br>1 0 0 0 .0 10 .0 2 | PDM<br>s in g le  p u ls e t1 t2<br>1 0 -11 0 -5 1 0 -4 1 0 -3 1 0 -2 1 0 -1 1 0 0 1 0 1 1 0 2 1 0 3<br>t 1 , S qu a re W a ve  P ulse  D u ration  [se c]<br>Figure 11. Transient Thermal Response Curve<br>, (Normalized)  , (Normalized)<br>DSS DS(ON)<br>BV R<br>Drain-Source On-Resistance<br>Drain-Source Breakdown Voltage<br>, Drain Current [A]ID , Drain Current [A]ID<br>e s p o n s e<br> t ) ,  T h e r m a l  R(θ JA<br>Z<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2001 Fairchild Semiconductor Corporation FQT7N10L Rev. 1.3 

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 Gate Charge Test Circuit & Waveform<br>VGS<br>Same Type<br>50KΩ as DUT Qg<br>12V 200nF 300nF 5V<br>VGS VDS Qgs Qgd<br>DUT<br>3mA<br>Charge<br> Resistive Switching Test Circuit & Waveforms<br>VDS RL VDS 90%<br>VGS VDD<br>RG<br>10%<br>5V DUT VGS<br>td(on) tr td(off) tf<br>t on t off<br> Unclamped Inductive Switching Test Circuit & Waveforms<br>VDS L EAS = ----12 L IAS2 --------------------BVBVDSSDSS- VDD<br>I D BVDSSIAS<br>RG VDD ID (t)<br>10V DUT VDD VDS (t)<br>t p t p Time<br>FQT7N10L<br>N<br>-Channel MOSFET<br>**----- End of picture text -----**<br>


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©2001 Fairchild Semiconductor Corporation<br>FQT7N10L Rev. 1.3<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

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 Peak Diode Recovery dv/dt Test Circuit & Waveforms<br>**----- End of picture text -----**<br>


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DUT +<br>VDS<br>_<br>I SD<br>L<br>Driver<br>RG<br>Same Type<br>as DUT VDD<br>VGS • dv/dt controlled by  RG<br>• ISD controlled by pulse period<br>Gate Pulse Width<br>VGS D = --------------------------Gate Pulse Period 10V<br>( Driver )<br>as<br>IFM , Body Diode Forward Current<br>I SD<br>( DUT ) di/dt<br>IRM<br>Neo<br>Body Diode Reverse Current<br>VDS<br>( DUT ) Body Diode Recovery dv/dt<br>VSD VDD<br>TT<br>Body Diode<br>Forward Voltage Drop<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2001 Fairchild Semiconductor Corporation FQT7N10L Rev. 1.3 

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6.70<br>B<br>6.20<br>0.10 C B<br>3.10<br>2.90 3.25<br>4<br>1.90<br>A<br>3.70<br>6.10<br>3.30<br>1.90<br>1 3<br>0.84<br>0.60<br>2.30<br>0.95 2.30<br>4.60<br>0.10 C B LAND PATTERN RECOMMENDATION<br>SEE DETAIL A<br>1.80 MAX<br>0.08 C 7.30<br>C 6.70<br>0.10<br>0.00<br>NOTES: UNLESS OTHERWISE SPECIFIED<br>   A)  DRAWING BASED ON JEDEC REGISTRATION<br>        TO-261C, VARIATION AA.<br>   B)  ALL DIMENSIONS ARE IN MILLIMETERS.<br>R0.15±0.05<br>10°    C) DIMENSIONS DO NOT INCLUDE BURRS<br>GAGE 5°        OR MOLD FLASH. MOLD FLASH OR BURRS<br>R0.15±0.05        DOES NOT EXCEED 0.10MM.<br>PLANE<br>   D) DIMENSIONING AND TOLERANCING PER<br>        ASME Y14.5M-2009.<br>10° 0.35    E)  LANDPATTERN NAME: SOT230P700X180-4BN<br>0° [ TYP] 0.20    F)  DRAWING FILENAME: MKT-MA04AREV3<br>0.25 10°<br>5° 0.60 MIN<br>SEATING<br>1.70<br>PLANE<br>DETAIL A<br>SCALE: 2:1<br>**----- End of picture text -----**<br>


ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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