# Power MOSFET, P Channel, 60 V, 27 A, 0.07 ohm, TO-220, Through Hole

![Product image](https://novapart.co/image/farnell:9846530/)

**URL**: https://novapart.co/products/FQP27P06/power-mosfet-p-channel-60-v-27-a-007-ohm-to-220
**SKU**: FQP27P06
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.8700
**Stock**: 1000+
**Lead Time**: 78 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-27A; Drain Source Voltage Vds:-60V; On Resistance Rds(on):0.07ohm; Rds(on) Test Voltage Vgs:-10V; Threshold Voltage Vgs:-4V; Powe

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 120W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220 |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 27A |
| Drain Source On State Resistance | 0.07ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:9846530/)

## **ON Semiconductor** 

## **Is Now** 

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**To learn more about onsemi™, please visit our website at www.onsemi.com** 

**onsemi** and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as-is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. 

**==> picture [469 x 669] intentionally omitted <==**

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FQP27P06<br>P-Channel QFET [®]  MOSFET<br>- 60 V, - 27 A, 70 m Ω<br>Features<br>Description • - 27 A, - 60 V, RDS(on) = 70 m (Max.) @ VGS = - 10 V,<br>This P-Channel enhancement mode power MOSFET is  ID = - 13.5 A<br>produced  using  ON  Semiconductor’s  proprietary  • Low Gate Charge (Typ. 33 nC)<br>planar stripe and DMOS technology. This advanced  • Low Crss (Typ.  120 pF)<br>MOSFET technology has been especially tailored to reduce<br>on-state resistance, and to provide superior switching  • 100% Avalanche Tested<br>devices are suitable for switched mode power supplies, performance and high avalanche energy strength. These  • 175C Maximum Junction Temperature Rating<br>audio amplifier, DC motor control, and variable switching<br>power applications.<br>S<br><br>●<br>G G  ●<br>D TO-220 ▶ ▲<br>S<br>●<br>°<br><br>Absolute Maximum Ratings    TC = 25°C unless otherwise noted D<br>Symbol Parameter FQP27P06 Unit<br>VDSS Drain-Source Voltage -60 V<br>ID Drain Current - Continuous (TC = 25°C) -27 A<br>- Continuous (TC = 100°C) -19.1 A<br>IDM Drain Current - Pulsed (Note 1) -108 A<br>VGSS Gate-Source Voltage  25 V<br>EAS Single Pulsed Avalanche Energy (Note 2) 560 mJ<br>IAR Avalanche Current (Note 1) -27 A<br>EAR Repetitive Avalanche Energy (Note 1) 12 mJ<br>dv/dt Peak Diode Recovery dv/dt (Note 3) -7.0 V/ns<br>PD Power Dissipation (TC = 25°C) 120 W<br>- Derate above 25°C 0.8 W/°C<br>TJ, TSTG Operating and Storage Temperature Range -55 to +175 °C<br>Maximum lead temperature for soldering purposes,<br>TL 1/8 "  from case for 5 seconds 300 °C<br>|a es<br>ee<br>Thermal Characteristics<br>Symbol Parameter FQP27P06 Unit<br>RJC Thermal Resistance, Junction-to-Case, Max. 1.25 °C / W<br>RCS Thermal Resistance, Case-to-Sink, Typ. 0.5 °C / W<br>——————— RJA Thermal Resistance, Junction-to-Ambient, Max. 62.5 °C / W<br>©2001 Semiconductor Components Industries, LLC. Publication Order Number:<br>October-2017,Rev.3 FQP27P06/D<br>FQP27P06 P-Channel QFET<br>®<br> MOSFET<br>**----- End of picture text -----**<br>


|**Elerical Characteristics**TC= 25°C unl|**Elerical Characteristics**TC= 25°C unl|ess otherwise noted|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|**Off Characteristics**|||||||
|BVDSS|Drain-Source Breakdown Voltage|VGS= 0 V, ID= -250A|-60|--|--|V|
|BVDSS<br>/TJ|Breakdown Voltage Temperature<br>Coefficient|ID= -250A, Referenced to 25°C|--|-0.06|--|V/°C|
|IDSS|Zero Gate Voltage Drain Current|VDS= -60 V, VGS= 0 V|--|--|-1|A|
|||VDS= -48 V, TC= 150°C|--|--|-10|A|
|IGSSF|Gate-Body Leakage Current, Forward|VGS= -25 V, VDS= 0 V|--|--|-100|nA|
|IGSSR|Gate-Body Leakage Current, Reverse|VGS= 25 V, VDS= 0 V|--|--|100|nA|
|**On Characteristics**|||||||
|VGS(th)|Gate Threshold Voltage|VDS= VGS, ID= -250A|-2.0|--|-4.0|V|
|RDS(on)|Static Drain-Source<br>On-Resistance|VGS= -10 V, ID= -13.5 A|--|0.055|0.07||
|gFS|Forward Transconductance|VDS= -30 V, ID= -13.5 A|--|12.4|--|S|
|**Dynamic Characteristics**|||||||
|Ciss|Input Capacitance|VDS= -25 V, VGS= 0 V,<br>f = 1.0 MHz|--|1100|1400|pF|
|Coss|Output Capacitance||--|510|660|pF|
|Crss|Reverse Transfer Capacitance||--|120|155|pF|
|**Switching Characteristics**|||||||
|td(on)|Turn-On Delay Time|VDD= -30 V, ID= -13.5 A,<br>RG= 25<br>(Note 4)|--|18|45|ns|
|tr|Turn-On Rise Time||--|185|380|ns|
|td(off)|Turn-Off Delay Time||--|30|70|ns|
|tf|Turn-Off Fall Time||--|90|190|ns|
|Qg|Total Gate Charge|VDS= -48 V, ID= -27 A,<br>VGS= -10 V<br>(Note 4)|--|33|43|nC|
|Qgs|Gate-Source Charge||--|6.8|--|nC|
|Qgd|Gate-Drain Charge||--|18|--|nC|
|**Drain-Source Diode Characteristics and Maximum Ratings**|||||||
|IS|Maximum Continuous Drain-Source Diode Forward Current||--|--|-27|A|
|ISM|Maximum Pulsed Drain-Source Diode Forward Current||--|--|-108|A|
|VSD|Drain-Source Diode Forward Voltage|VGS= 0 V, IS= -27 A|--|--|-4.0|V|
|trr|Reverse Recovery Time|VGS= 0 V, IS= -27 A,<br>dIF/ dt = 100 A/s|--|105|--|ns|
|Qrr|Reverse Recovery Charge||--|0.41|--|C|



**Notes:** 

1. Repetitive Rating : Pulse width limited by maximum junction temperature 

2. L = 0.9mH, IAS = -27A, VDD = -25V, RG = 25 Starting  TJ = 25°C 

3. ISD ≤ -27A, di/dt ≤ 300A/s, VDD ≤ BVDSS, Starting  TJ = 25°C 

4. Essentially independent of operating temperature 

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Typical Characteristics<br>102 Top :      - 15.0 V        VGS 102<br>- 10.0 V<br>- 8.0 V<br>- 7.0 V<br>- 6.0 V<br>- 5.5 V 101<br>- 5.0 V<br>101 Bottom :  - 4.5 V 175℃<br>100 25℃<br>-55℃<br>100 ※1. 250μs Pulse Test2. T Notes :C = 25℃ ※  1. V  2. 250μs Pulse Test Notes : DS = -30V<br>10-1 100 101 10-1 2 4 6 8 10<br>-VDS, Drain-Source Voltage [V] -VGS , Gate-Source Voltage  [V]<br>Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics<br>0.24 102<br>0.20<br>0.16 101<br>VGS = - 10V<br>0.12<br>VGS = - 20V<br>0.08 100<br>0.04 175 ℃ 25℃ ※ Notes :<br>※ Note : TJ = 25℃ 2. 250μs Pulse Test1. VGS = 0V<br>0.00 10-1<br>0 10 20 30 40 50 60 70 80 90 100 110 120 130 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8<br>-ID , Drain Current  [A] -VSD , Source-Drain Voltage  [V]<br>Figure 3. On-Resistance Variation  vs. Figure 4. Body Diode Forward Voltage<br>Drain Current and Gate Voltage Variation vs. Source Current<br>and Temperature<br>3000 12<br>Ciss = Cgs + Cgd (Cds = shorted)<br>C oss  = C ds  + C gd<br>2500 Crss = Cgd 10<br>Coss VDS = -30V<br>2000 Ciss ※ Notes : 8 VDS = -48V<br>1500 1. V 2. f = 1 MHz GS = 0 V 6<br>1000 4<br>Crss<br>500 2<br>※ Note : ID = -27 A<br>0 0<br>10-1 100 101 0 5 10 15 20 25 30 35<br>VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC]<br>Figure 5. Capacitance Characteristics Figure 6. Gate  Charge Characteristics<br>, Drain Current [A]-ID  , Drain Current  [A]-ID<br>],<br><br>  [<br>DS(on)<br>R<br>Drain-Source On-Resistance<br> , Reverse Drain Current  [A]<br>DR<br>-I<br>Capacitance [pF]<br>, Gate-Source Voltage [V]<br>GS<br>-V<br>**----- End of picture text -----**<br>


## **Typical Characteristics** 

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Typical Characteristics      (Continued)<br>1.2 2.5<br>2.0<br>1.1<br>1.5<br>1.0<br>1.0<br>0.9 ※ Notes :<br> 1. V 2. IDGS = -250 μA = 0 V 0.5 ※ 2. I1. V  Notes : DGS = -13.5 A = -10 V<br>0.8 0.0<br>-100 -50 0 50 100 150 200 -100 -50 0 50 100 150 200<br>TJ, Junction Temperature [oC] TJ, Junction Temperature [oC]<br>Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation<br>vs. Temperature vs. Temperature<br>30<br>Operation in This Area<br>102 is Limited by R  DS(on) 25<br>100 s<br>1 ms 20<br>10 ms<br>101 DC 15<br>10<br>100 ※ Notes :<br>1. TC = 25 oC 5<br>2. T J  = 175 oC<br>3. Single Pulse<br>10-1100 101 102 025 50 75 100 125 150 175<br>-VDS, Drain-Source Voltage [V] TC, Case Temperature [℃]<br>Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current<br>vs.  Case Temperature<br>1 0 0<br>D = 0 .5<br>※  N o te s  :<br>0 .2   1 . Z θ J C [(t) =  1 .2 5  ] ℃ /W  M a x .<br>  2 . D u ty  F a c to r , D = t 1 /t 2<br>0 .1   3 . T J M  - T C  =  P D M  * Z θ J C [(t)]<br>1 0 -1<br>0 .0 5<br>PDM<br>0 .0 2<br>0 .0 1 t 1<br>s in g le  p u ls e t2<br>1 0 -21 0 -5 1 0 -4 1 0 -3 1 0 -2 1 0 -1 1 0 0 1 0 1<br>t 1 , S q u a re  W a v e  P u ls e  D u ra tio n  [s e c ]<br>Figure 11. Transient Thermal Response Curve<br>, (Normalized) , (Normalized)<br>DSS DS(ON)<br>-BV R<br>Drain-Source On-Resistance<br>Drain-Source Breakdown Voltage<br>, Drain Current [A]-ID , Drain Current [A]-ID<br>(t), Thermal Response<br>JC<br>Zθ<br>**----- End of picture text -----**<br>


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 Gate Charge Test Circuit & Waveform<br>VGS<br>Same Type<br>50KΩ as DUT Qg<br>12V 200nF 300nF -10V<br>VGS VDS Qgs Qgd<br>DUT<br>-3mA<br>Charge<br> Resistive Switching Test Circuit & Waveforms<br>RL<br>VDS t on t off<br>RG VGS VDD VGS 10% td(on) tr td(off) tf<br>DUT<br>-10V<br>VDS 90%<br> Unclamped Inductive Switching Test Circuit & Waveforms<br>VDS L EAS = ----12 L IAS2 --------------------BVBVDSSDSS- VDD<br>t p Time<br>I D<br>RG VDD VDD VDS (t)<br>ID (t)<br>-10V DUT<br>IAS<br>t p BVDSS<br>**----- End of picture text -----**<br>


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## **Peak Diode Recovery dv/dt Test Circuit & Waveforms** 

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+<br>VDS<br>DUT<br>_<br>I SD<br>L<br>Driver<br>RG<br>Compliment of DUT<br>(N-Channel) VDD<br>VGS • dv/dt controlled by  RG<br>• ISD controlled by pulse period<br>Gate Pulse Width<br>VGS D = --------------------------Gate Pulse Period 10V<br>( Driver )<br>Body Diode Reverse Current<br>I SD<br>( DUT ) IRM<br>di/dt<br>IFM , Body Diode Forward Current<br>VDS VSD<br>( DUT )<br>Body Diode VDD<br>Forward Voltage Drop<br>Body Diode Recovery dv/dt<br>**----- End of picture text -----**<br>


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Package Dimensions<br>**----- End of picture text -----**<br>


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TO-220<br>**----- End of picture text -----**<br>


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FQP27P06 P-Channel QFET<br>®<br> MOSFET<br>**----- End of picture text -----**<br>


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ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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