# Power MOSFET, N Channel, 200 V, 15 A, 0.14 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:1095052/)

**URL**: https://novapart.co/products/FQD18N20V2TM/power-mosfet-n-channel-200-v-15-a-014-ohm-to-252
**SKU**: FQD18N20V2TM
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.4790
**Stock**: 1000+
**Lead Time**: 78 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:15A; Drain Source Voltage Vds:200V; On Resistance Rds(on):0.14ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:5V; Power Dissipation Pd

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 200V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 15A |
| Drain Source On State Resistance | 0.14ohm |
| Gate Source Threshold Voltage Max | 5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1095052/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

**==> picture [419 x 40] intentionally omitted <==**

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April 2016<br>y ff<br>FQD18N20V2<br>**----- End of picture text -----**<br>


## **N-Channel QFET[®] MOSFET** 

## **200 V, 15 A, 140 mΩ** 

## **Description** 

## **Features** 

This N-Channel enhancement mode power MOSFET is • 15 A, 200 V, RDS(on) = 140 mΩ (Max.) @ VGS = 10 V, produced using Fairchild Semiconductor’s proprietary planar ID = 7.5 A stripe and DMOS technology. This advanced MOSFET technology has been especially tailored to reduce on-state • Low Gate Charge (Typ. 20 nC) resistance, and to provide superior switching performance • Low Crss (Typ. 25 pF) and high avalanche energy strength. These devices are suitable for switched mode power supplies, active power • 100% Avalanche Tested factor correction (PFC), and electronic lamp ballasts. 

|||||||||||**D**|||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||**D-PAK**<br>**G**<br>**S**<br>**D**<br>>|||**G**|**S**<br>~~@®~~|||||||||
|**Absolute Maximum Ratings  **T|||TC= 25°C unless otherwise noted.||||||||||||
|**Symbol**||**Parameter**|||||**FQD18N20V2TM**|||||||**Unit**|
|VDSS||Drain-Source Voltage|||||||200|||||V|
|ID<br>IDM||Drain Current<br>- Continuous (TC= 25°C)<br>15<br>- Continuous (TC= 100°C)<br>9.75<br>Drain Current<br>- Pulsed<br>(Note 1)<br>60<br>~~pf~~||||||||||||A<br>A<br>A|
|VGSS||Gate-Source Voltage|||||||± 30|||||V|
|EAS||Single Pulsed Avalanche Energy||(Note 2)|||||340|||||mJ|
|IAR||Avalanche Current||(Note 1)||||||15||||A|
|EAR||Repetitive Avalanche Energy||(Note 1)||||||8.3||||mJ|
|dv/dt||Peak Diode Recoverydv/dt||(Note 3)||||||6.5||||V/ns|
|PD||Power Dissipation  (TA= 25°C) *||||||||2.5||||W|
|TJ, TSTG||Power Dissipation  (TC= 25°C)<br>83<br>- Derate above 25°C<br>0.67<br>Operating and Storage Temperature Range<br>-55 to +150<br>~~——~~|||||||||||W<br>W/°C<br>°C||
|TL||Maximum Lead Lemperature for Loldering,<br>1/8" from Case for 5 Seconds.<br>300<br>~~ee~~||||||||||||°C|
|**Thermal Characteristics**||**Thermal Characteristics**|||||||||||||
|**Symbol**||**Parameter**||||||||**FQD18N20V2TM**||||**Unit**|
|RJC|Thermal Resistance, Junction to Case, Max.||||||||||1.5||||
|RJA|Thermal Resistance, Junction to Ambient(Minimum Pad of 2-oz Copper), Max.<br>Thermal Resistance, Junction to Ambient (*1 in2Pad of 2-oz Copper), Max.||||||||||110<br>50|||oC/W|



www.fairchildsemi.com 

©2009 Fairchild Semiconductor Corporation 

**1** 

FQD18N20V2 Rev. 1.6 

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|||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
|Package Marking and Ordering Information|
|Part Number|Top Mark|Package|Packing Method|Reel Size|Tape Width|Quantity|
|FQD18N20V2TM|DV218N20|DPAK|Tape and Reel|330 mm|16 mm|2500 units|
|Electrical Characteristics|TC = 25°C unless otherwise noted.C = 25°C unless otherwise noted. = 25°C unless otherwise noted.|
|Symbol|Parameter|Test Conditions|Min.|Typ.|Max.|Unit|
|Off Characteristics|
|BVDSS|Drain-Source Breakdown Voltage|VGS = 0 V, ID = 250|µ|A|200|--|--|V|
|∆|/ BV|∆|TDSSJ|Breakdown Voltage Temperature Coefficient|ID = 250|µ|A, Referenced to 25°C|--|0.25|--|V/°C|
|IDSS|VDS = 200 V, VGS = 0 V|--|--|1|µ|A|
|Zero Gate Voltage Drain Current|VDS = 160 V, TC = 125°C|--|--|10|µ|A|
|IGSSF|Gate-Body Leakage Current, Forward|VGS = 30 V, VDS = 0 V|--|--|100|nA|
|———|IGSSR|Gate-Body Leakage Current, Reverse|VGS = -30 V, VDS = 0 V|--|--|-100|nA|
|On Characteristics|
|VGS(th)|Gate Threshold Voltage|VDS = VGS, ID = 250|µ|A|3.0|--|5.0|V|
|RDS(on)|Static Drain-Source On-Resistance|VGS = 10 V, ID = 7.5 A|--|0.12|0.14|Ω|
|gFS|Forward Transconductance|VDS = 40 V, ID = 7.5 A|--|11|--|S|
|a|
|Dynamic Characteristics|
|Tae|
|Ciss|Input Capacitance|VDS = 25 V, VGS = 0 V,|--|830|1080|pF|
|Coss|Output Capacitance|f = 1.0 MHz|--|200|260|pF|
|Crss|Reverse Transfer Capacitance|--|25|33|pF|
|Coss|Output Capacitance|VDS = 160 V, VGS = 0 V,|--|70|--|pF|
|f = 1.0 MHz|
|=|Coss eff.|Effective Output Capacitance|VDS = 0V to 160 V, VGS = 0 V|--|135|--|pF|
|Switching Characteristics|
|td(on)|Turn-On Delay Time|VDD = 100 V, ID = 18 A,|--|16|40|ns|
|tr|Turn-On Rise Time|RG = 25|Ω|--|133|275|ns|
|td(off)|Turn-Off Delay Time|--|38|85|ns|
|tf|Turn-Off Fall Time|(Note 4)|--|62|135|ns|
|Qg|Total Gate Charge|VDS = 160 V, ID = 18 A,|--|20|26|nC|
|Qgs|Gate-Source Charge|VGS = 10 V|--|5.6|--|nC|
|Qgd|Gate-Drain Charge|(Note 4)|--|10|--|nC|
|==|RG|Gate Resistance|f= 1MHz|0.5|--|2.5|Ω|
|Drain-Source Diode Characteristics and Maximum Ratings|
|IS|Maximum Continuous Drain-Source Diode Forward Current|--|--|15|A|
|ISM|Maximum Pulsed Drain-Source Diode Forward Current|--|--|60|A|
|VSD|Drain-Source Diode Forward Voltage|VGS = 0 V, IS = 15 A|--|--|1.5|V|
|trr|Reverse Recovery Time|VGS = 0 V, IS = 18 A,|--|158|--|ns|
|SSS|Qrr|Reverse Recovery Charge|dIF / dt = 100 A/|µ|s|--|1.0|--|µ|C|
|Notes:|
|1. Repetitive rating : pulse-width limited by maximum junction temperature.|

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## **Package Marking and Ordering Information** 

**Electrical Characteristics** TC = 25°C unless otherwise noted.C = 25°C unless otherwise noted. = 25°C unless otherwise noted. 

2. L = 1.58 mH, IAS = 18 A, VDD = 50 V, RG = 25 Ω, starting  TJ = 25°C. 

3. ISD ≤ 18 A, di/dt ≤ 200 A/ µ s, VDD ≤ BVDSS, starting  TJ = 25°C. 

4. Essentially independent of operating temperature. 

www.fairchildsemi.com 

©2009 Fairchild Semiconductor Corporation 

**2** 

FQD18N20V2 Rev. 1.6 

## **Typical Characteristics** 

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    VGS<br>Top :       15.0 V<br>   10.0 V<br>101   8.0 V<br>  7.0 V 101 150℃<br>  6.5 V ities salle Pan<br>  6.0 V<br>100 Bottom :    5.5 V 25℃<br>-55℃<br>100 ic<br>※  Notes :<br>10-1 1. 250μ s Pulse Test<br>2. TC = 25℃ ※2. 2501. V Notes :DS = 40Vμ s Pulse Test<br>10-1 100 101 10-1<br>VDS, Drain-Source Voltage [V] 4 5 VGS , Gate-Source Voltage  [V]6 7 8 9 10<br>Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics<br>0.5<br>0.4 VGS = 10V<br>101 fi-aaa<br>0.3 VGS = 20V<br>0.2<br>100 150℃ 25℃<br>0.1<br>※ Notes :<br>0.0 ※  Note : TJ = 25℃  1. V2. 250GS = 0Vμ s Pulse Test<br>0 10 20 30 40 50 60 10-1 Ti<br>0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6<br>ID, Drain Current [A] VSD , Source-Drain Voltage  [V]<br>Figure 3. On-Resistance Variation  vs. Figure 4. Body Diode Forward Voltage<br>Drain Current and Gate Voltage Variation vs. Source Current<br>and Temperature<br>2500 12<br>CCissoss = C = Cgsds + C + Cgdgd (Cds = shorted) VDS = 40V<br>2000 Crss = Cgd 10 VDS = 100V<br>VDS = 160V<br>1500 ※  Notes : 8<br>1. VGS = 0 V<br>2. f = 1 MHz 6<br>1000 Ciss<br>Coss<br>4<br>500<br>Crss 2<br>0 a e ※ Note : ID = 18A<br>10-1 100 101 0<br>0 5 10 15 20 25<br>VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC]<br>Figure 5. Capacitance Characteristics Figure 6. Gate  Charge Characteristics<br>, Drain Current [A]ID  , Drain Current  [A]ID<br>],<br>Ω<br>  [<br>DS(ON)<br>R<br> , Reverse Drain Current  [A]<br>Drain-Source On-Resistance IDR<br>Capacitance [pF]<br>, Gate-Source Voltage [V]<br>GS<br>V<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2009 Fairchild Semiconductor Corporation 

**3** 

FQD18N20V2 Rev. 1.6 

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Typical Characteristics   (Continued)<br>1.2 3.0<br>2.5<br>1.1<br>2.0<br>1.0 1.5<br>1.0<br>※ Notes :<br>0.9<br>1. VGS = 0 V ※  Notes :<br>2. ID = 250 μ A 0.5 1. VGS = 10 V<br>2. ID = 7.5 A<br>0.8 0.0<br>-100 -50 0 50 100 150 200 -100 -50 0 50 100 150 200<br>TJ, Junction Temperature [oC] TJ, Junction Temperature [oC]<br>Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation<br>vs. Temperature vs. Temperature<br>20<br>Operation in This Area<br>102 is Limited by R DS(on)<br>15<br>100 us<br>101 1 ms<br>10 ms 10<br>DC<br>100 ※ Notes :<br>1. TC = 25 oC 5<br>2. TJ = 150 oC<br>3. Single Pulse<br>10-1 0<br>10 m 0 i 101 e 102 25 PS 50 75 100 125 150<br>VDS, Drain-Source Voltage [V] TC, Case Temperature [℃]<br>Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current<br>vs.  Case Temperature<br>1 0 0<br>D = 0 . 5<br>0 . 2<br>※  N o t e s  :<br>0 . 1    1 .  Z θ J C [( t)  =] [ 1 . 5  ] [℃] [/W] [ M] [a] [x .]<br>1 0 - 1 0 . 0 5   2 .  D u t y  F a c to r ,  D = t 1 /t 2<br>0 . 0 2    3 .  T J M  -  T C  =  P D M * Z θ J C [( t)]<br>0 . 0 1<br>PDM<br>1 0 - 2 s in g le  p u ls e t1 t2<br>2 [ndi] [k,] shi gee:<br>1 0 Se - 5 1 0 - 4 1 0 - 3 1 0 - 2 Saea 1 0 - 1 e s 1 0 P 0 ag 1 0 1<br>t 1 ,  S q u a r e  W a v e  P u ls e  D u r a t io n  [ s e c ]<br> , (Normalized)  , (Normalized)<br>DSS DS(ON)<br>BV R<br>Drain-Source On-Resistance<br>Drain-Source Breakdown Voltage<br>, Drain Current [A]ID , Drain Current [A]ID<br>oC/W](t), Thermal Response [<br>ZJC<br>**----- End of picture text -----**<br>


**Figure 11. Transient Thermal Response Curve** 

www.fairchildsemi.com 

©2009 Fairchild Semiconductor Corporation 

**4** 

FQD18N20V2 Rev. 1.6 

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VGS<br>Same Type<br>50KΩ as DUT Qg<br>12V 200nF 300nF 10V<br>VGS VDS Qgs Qgd<br>DUT<br>IG = const. 3mA<br>Charge<br> Figure 12. Gate Charge Test Circuit & Waveform<br>VDS RL VDS 90%<br>VGS VDD<br>RG<br>10%<br>V 10V GS DUT VGS<br>td(on) tr td(off) tf<br>t on t off<br>**----- End of picture text -----**<br>


**Figure 13. Resistive Switching Test Circuit & Waveforms** 

**==> picture [432 x 126] intentionally omitted <==**

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VDS L EAS = ----12 L IAS2 --------------------BVBVDSSDSS- VDD<br>I D BVDSSIAS<br>RG VDD ID (t)<br>VV 10V GSGS DUT VDD VDS (t)<br>t p t p Time<br>**----- End of picture text -----**<br>


**Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms** 

www.fairchildsemi.com 

©2009 Fairchild Semiconductor Corporation 

**5** 

FQD18N20V2 Rev. 1.6 

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**----- Start of picture text -----**<br>
DUT +<br>VDS<br>_<br>I SD<br>L<br>Driver<br>RG<br>Same Type<br>as DUT VDD<br>VGS • dv/dt controlled by  RG<br>• ISD controlled by pulse period<br>Gate Pulse Width<br>VGS D = --------------------------<br>Gate Pulse Period 10V<br>( Driver )<br>i<br>IFM , Body Diode Forward Current<br>I SD<br>( DUT ) di/dt<br>IRM<br>4Ne<br>Body Diode Reverse Current<br>VDS<br>( DUT ) Body Diode Recovery dv/dt<br>VSD VDD<br>tT<br>Body Diode<br>Forward Voltage Drop<br> Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2009 Fairchild Semiconductor Corporation 

**6** 

FQD18N20V2 Rev. 1.6 

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ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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