# Power MOSFET, P Channel, 100 V, 33.5 A, 0.06 ohm, TO-263AB, Surface Mount

![Product image](https://novapart.co/image/farnell:2453432/)

**URL**: https://novapart.co/products/FQB34P10TM/power-mosfet-p-channel-100-v-335-a-006-ohm-to
**SKU**: FQB34P10TM
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.2300
**Stock**: 1000+
**Lead Time**: 106 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-33.5A; Drain Source Voltage Vds:-100V; On Resistance Rds(on):0.049ohm; Rds(on) Test Voltage Vgs:-10V; Threshold Voltage

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 3.75W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-263AB |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 33.5A |
| Drain Source On State Resistance | 0.06ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2453432/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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  March 2016<br>**----- End of picture text -----**<br>


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FQB34P10<br>**----- End of picture text -----**<br>


## **P-Channel QFET[®] MOSFET** 

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100 V, -33.5 A, 60 mΩ<br>**----- End of picture text -----**<br>


## **Description** 

## **Features** 

This P-Channel enhancement mode power MOSFET is • -33.5 A, -100 V, RDS(on) = 60 m Ω (Max.) @ VGS = .10 V, produced using Fairchild Semiconductor’s proprietary planar ID = -16.75 A stripe and DMOS technology. This advanced MOSFET technology has been especially tailored to reduce on-state • Low Gate Charge (Typ. 85 nC) resistance, and to provide superior switching performance • Low Crss (Typ. 170 pF) and high avalanche energy strength. These devices are suitable for switched mode power supplies, audio amplifier, • 100% Avalanche Tested DC motor control, and variable switching power applications. 

- 175°C Maximum Junction Temperature Rating 

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D<br>G<br>G<br>S D [2] -PAK<br>> ©<br>D<br>Absolute Maximum Ratings    TC = 25°C unless otherwise noted.<br>Symbol Parameter FQB34P10TM Unit<br>VDSS Drain-Source Voltage -100 V<br>ID Drain Current  - Continuous (TC = 25°C) -33.5 A<br>- Continuous (TC = 100°C) -23.5 A<br>IDM Drain Current  - Pulsed (Note 1) -134 A<br>VGSS ———— Gate-Source Voltage ± 25 V<br>EAS Single Pulsed Avalanche Energy (Note 2) 2200 mJ<br>IAR Avalanche Current (Note 1) -33.5 A<br>EAR Repetitive Avalanche Energy (Note 1) 15.5 mJ<br>dv/dt Peak Diode Recovery dv/dt (Note 3) -6.0 V/ns<br>PD Power Dissipation  (TA = 25°C) * 3.75 W<br>Power Dissipation  (TC = 25°C) 155 W<br>- Derate above 25°C 1.03 W/°C<br>TJ, TSTG ———$— Operating and Storage Temperature Range -55 to +175 °C<br>Maximum lead temperature for soldering,<br>TL 1/8 "  from case for 5 seconds 300 °C<br>eeee<br>Thermal Characteristics<br>Symbol Parameter FQB34P10TM Unit<br>RJC Thermal Resistance, Junction to Case, Max.             0.97<br>Thermal Resistance, Junction to Ambient (Minimum Pad of 2-oz Copper), Max. 62.5 oC/W<br>ne RJA Thermal Resistance, Junction to Ambient (*1 in [2] Pad of 2-oz Copper), Max.   40<br>©2000 Fairchild Semiconductor Corporation  1 www.fairchildsemi.com<br>FQB34P10 Rev. 1.4<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**Package Marking and Ordering Information Part Number Top Mark Package Packing Method Reel Size Tape Width Quantity** FQB34P10TM FQB34P10 D[2] -PAK Tape and Reel 330 mm 24 mm 800 units **Electrical Characteristics** TC = 25°C unless otherwise noted. **Symbol Parameter Test Conditions Min. Typ. Max. Unit Off Characteristics** BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = -250 µ A -100 -- -- V ∆ / BV ∆ TDSSJ Breakdown Voltage Temperature Coefficient ID = -250 µ A, Referenced to 25°C -- -0.1 -- V/°C IDSS VDS = -100 V, VGS = 0 V -- -- -1 µ A Zero Gate Voltage Drain Current VDS = -80 V, TC = 150°C -- -- -10 µ A IGSSF Gate-Body Leakage Current, Forward VGS = -25 V, VDS = 0 V -- -- -100 nA ~~eee~~ IGSSR Gate-Body Leakage Current, Reverse VGS = 25 V, VDS = 0 V -- -- 100 nA **On Characteristics** VGS(th) Gate Threshold Voltage VDS = VGS, ID = -250 µ A -2.0 -- -4.0 V RDS(on) Static Drain-Source On-Resistance VGS = -10 V, ID = -16.75 A -- 0.049 0.06 Ω gFS Forward Transconductance VDS = -40 V, ID = -16.75 A -- 23 -- S **Dynamic Characteristics** Ciss Input Capacitance VDS = -25 V, VGS = 0 V, -- 2240 2910 pF Coss Output Capacitance f = 1.0 MHz -- 730 950 pF ~~ae~~ Crss Reverse Transfer Capacitance -- 170 220 pF **Switching Characteristics** td(on) Turn-On Delay Time VDD = -50 V, ID = -33.5 A, -- 25 60 ns tr Turn-On Rise Time RG = 25 Ω -- 250 510 ns td(off) Turn-Off Delay Time -- 160 330 ns tf Turn-Off Fall Time (Note 4) -- 210 430 ns Qg Total Gate Charge VDS = -80 V, ID = -33.5 A, -- 85 110 nC Qgs Gate-Source Charge VGS = -10 V -- 15 -- nC Qgd Gate-Drain Charge (Note 4) -- 45 -- nC **Drain-Source Diode Characteristics and Maximum Ratings** IS Maximum Continuous Drain-Source Diode Forward Current -- -- -33.5 A ISM Maximum Pulsed Drain-Source Diode Forward Current -- -- -134 A VSD Drain-Source Diode Forward Voltage VGS = 0 V, IS = -33.5 A -- -- -4.0 V trr Reverse Recovery Time VGS = 0 V, IS = -33.5 A, -- 160 -- ns ~~SS~~ Qrr Reverse Recovery Charge dIF / dt = 100 A/ µ s -- 0.88 -- µ C **Notes:** 1. Repetitive rating : pulse-width limited by maximum junction temperature. 2. L =  mH, IAS = -33.5A, VDD = -25 V, RG = 25 Ω, starting  TJ = 25°C. 3. ISD ≤ -33.5 A, di/dt ≤ 300 A/ µ s  , VDD ≤ BVDSS, starting  TJ = 25°C. 4. Essentially independent of operating temperature. ~~&~~ ©2000 Fairchild Semiconductor Corporation **2** www.fairchildsemi.com FQB34P10 Rev. 1.4 

## **Typical CharacteristicsTypical Characteristics** 

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-15.0V Top = ee 102<br>-8.0V-10.0V AaBA<br>-7.0V OYA Cl Va<br>-5.5V 4<br>a Zo 101 175℃<br>25℃<br>10 E==ae 100 -55℃<br>2.>1.  Tj=25°CNotes:250ms Pulse Test ※1. V 2. 250μs Pulse Test  Notes : DS  = -40V<br>19! 10-1<br>10° L 10° 10 : 2 4 6 8 10<br>-VDS, Drain-Source Voltage [V] -VGS , Gate-Source Voltage  [V]<br>Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics<br>102<br>a re 101<br>' ' iY '<br>1H1t Dt '1 Vgg \ = -20V '1 ' 100<br>175℃ 25℃<br>※ Notes :<br>' ' ! ! ' ' Note: Ty = 25°C  1. V GS  = 0V<br> 2. 250μs Pulse Test<br>' : : :<br>0.00 10-1<br>0 20 40 60 80 100 120 140 160 180 0.0 0.5 1.0 1.5 2.0 2.5 3.0<br>-ID , Drain Current  [A] -VSD , Source-Drain Voltage  [V]<br>Figure 3. On-Resistance Variation  vs. Figure 4. Body Diode Forward Voltage<br>Drain Current and Gate Voltage Variation vs. Source Current<br>and Temperature<br>6500 12<br>600055005000 Coss CCC issossrss  = C = C = C gsgdsd  + C + C gdgd  (C ds  = shorted) 10 VDS = -50VVDS = -20V<br>4500 C iss 8 VDS = -80V<br>4000 ※ Notes :<br>3500 2. f = 1 MHz1. V GS  = 0 V<br>6<br>3000<br>2500 Crss<br>2000 4<br>1500<br>1000 2<br>500 ※ Note : ID = -33.5 A<br>010-1 100 101 0 0 20 40 60 80 100<br>VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC]<br> , Drain Current  [A]-ID  , Drain Current  [A]-ID<br>],<br>Ω<br>  [<br>DS(on)<br>R<br>Drain-Source On-Resistance  , Reverse Drain Current  [A]DR<br>-I<br>Capacitances [pF]<br>, Gate-Source Voltage [V]<br>GS<br>-V<br>**----- End of picture text -----**<br>


**Figure 5. Capacitance Characteristics** 

**Figure 6. Gate  Charge Characteristics** 

www.fairchildsemi.com 

©2000 Fairchild Semiconductor Corporation FQB34P10 Rev. 1.4 

**3** 

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Typical Characteristics   (Continued)<br>1.2 2.5<br>2.0<br>1.1<br>1.5<br>1.0<br>1.0<br>0.9 ※ Notes :<br>1. V2. IDGS = -250 μA = 0 V 0.5 ※ 1. V2. I  Notes : DGS = -16.75 A = -10 V<br>0.8 0.0<br>-100 -50 0 50 100 150 200 -100 -50 0 50 100 150 200<br>TJ, Junction Temperature [oC] TJ, Junction Temperature [oC]<br>Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation<br>vs. Temperature vs. Temperature<br>40<br>Operation in This Area<br>is Limited by R  DS(on) 35<br>102 100  μ s<br>30<br>1 ms<br>10 ms 25<br>101<br>DC 20<br>15<br>100 ※ Notes : 10<br>  1. T  2. TC J  = 175 = 25 oC o C 5<br>  3. Single Pulse<br>10-1100 101 102 025 50 75 100 125 150 175<br>-VDS, Drain-Source Voltage [V] TC, Case Temperature [℃]<br>Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current<br>vs.  Case Temperature<br>10 0<br>D =0.5<br>0.2<br>※  Notes :<br>10 -1 0.050.1  3. 1.2. Duty Factor, D=tTZ θ JM JC -( Tt)C = 0.97 =  P DM ℃* Z/W  Max. 1 θ/tJC 2 [(t)]<br>0.02 P DM<br>0.01 t1<br>single pulse t2<br>10 -2<br>10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1<br>t1, Square W ave Pulse Duration [sec]<br>Figure 11. Transient Thermal Response Curve<br>, (Normalized) , (Normalized)<br>DSS DS(ON)<br>-BV R<br>Drain-Source On-Resistance<br>Drain-Source Breakdown Voltage<br>, Drain Current [A]-ID , Drain Current [A]-ID<br>oC/W](t), Thermal Response [<br>ZJC<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2000 Fairchild Semiconductor Corporation FQB34P10 Rev. 1.4 

**4** 

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VGS<br>Same Type<br>50KΩ as DUT Qg<br>12V 200nF<br>300nF<br>VGS VDS Qgs Qgd<br>DUT<br>IG = const.<br>Charge<br>ms T L<br> Figure 12. Gate Charge Test Circuit & Waveform<br>RL<br>VDS t on t off<br>RG VGS VDD VGS 10% td(on) tr td(off) tf<br>VGS DUT<br>a VDS 90%<br> Figure 13. Resistive Switching Test Circuit & Waveforms<br>L BVDSS<br>VDS EAS = -1---2 L IAS2 --------------------BVDSS - VDD<br>t p Time<br>I D<br>RG VDD VDD VDS (t)<br>ID (t)<br>VGS DUT<br>IAS<br>t p BVDSS<br>FQB34P10 —<br>P<br>-Channel QFET<br>®<br> MOSFET<br>**----- End of picture text -----**<br>


**Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms** 

www.fairchildsemi.com 

©2000 Fairchild Semiconductor Corporation FQB34P10 Rev. 1.4 

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+<br>VDS<br>DUT<br>_<br>I SD<br>L<br>Driver<br>RG<br>Compliment of DUT<br>(N-Channel) VDD<br>VGS • dv/dt controlled by  RG<br>• ISD controlled by pulse period<br>Pulse Wid<br>VGS D = --- [Gate] ---------------------- [th] -<br>Gate Pulse Period 10V<br>( Driver )<br>Tt<br>Body Diode Reverse Current<br>I SD<br>( DUT ) IRM<br>di/dt<br>IFM , Body Diode Forward Current<br>TE —<br>VDS VSD<br>( DUT )<br>Body Diode VDD<br>Forward Voltage Drop<br>Body Diode Recovery dv/dt<br>7 Ty<br> Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2000 Fairchild Semiconductor Corporation FQB34P10 Rev. 1.4 

**6** 

## **Mechanical Dimensions** 

www.fairchildsemi.com 

**7** 

©2000 Fairchild Semiconductor Corporation FQB34P10 Rev. 1.4 

## **TRADEMARKS** 

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 

AccuPower™ F-PFS™ OPTOPLANAR[®] ®* AttitudeEngine™ FRFET[®] [Ecce Awinda[®] Global Power Resource[SM] tm[®] AX-CAP[®] * GreenBridge™ Power Supply WebDesigner™ TinyBoost[®] BitSiC™ Green FPS™ PowerTrench[®] TinyBuck[®] Build it Now™ Green FPS™ e-Series™ PowerXS™ TinyCalc™ CorePLUS™ G _max_ ™ Programmable Active Droop™ TinyLogicTINYOPTO™[®] CorePOWER™ GTO™ QFET[®] _CROSSVOLT_ ™ IntelliMAX™ QS™ TinyPower™ CTL™ ISOPLANAR™ Quiet Series™ TinyPWM™ TinyWire™ Current Transfer Logic™DEUXPEED[®] Marking Small Speakers Sound Louderand Better™ RapidConfigure™™ TranSiC™ TriFault Detect™ Dual Cool™ MegaBuck™ 2) TRUECURRENT[®] * EcoSPARKEfficentMax™[®] MICROCOUPLER™MicroFET™ Saving our world, 1mW/W/kW at a time™SignalWise™ μSerDes™ ESBC™ MicroPak™ SmartMax™ ® MicroPak2™ SMART START™ MillerDrive™ Solutions for Your Success™ UHC[®] ~~a~~ WZ... Fairchild[®] MotionMax™ SPM[®] Ultra FRFET™ Fairchild Semiconductor[®] MotionGrid[®] STEALTH™ UniFET™ FACT Quiet Series™ MTi[®] SuperFET[®] VCX™ FACT[®] MTx[®] SuperSOT™-3 VisualMax™ FastvCore™ MVN[®] SuperSOT™-6 VoltagePlus™ FETBench™ mWSaver[®] SuperSOT™-8 XS™ FPS™ OptoHiT™ SupreMOS[®] Xsens™ OPTOLOGIC[®] SyncFET™ 仙童[®] Sync-Lock™ 

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## **PRODUCT STATUS DEFINITIONS** 

## **Definition of Terms** 

|**Definition of Terms**|||
|---|---|---|
|**Datasheet Identification**|**Product Status**|**Definition**|
|Advance Information|Formative / In Design|Datasheet contains the design specifications for product development. Specifications<br>may change in any manner without notice.|
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Rev. I77 

©2000 Fairchild Semiconductor Corporation FQB34P10 Rev. 1.4 

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**8** 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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