# Power MOSFET, P Channel, 500 V, 1.5 A, 8 ohm, TO-263 (D2PAK), Surface Mount

![Product image](https://novapart.co/image/farnell:3368800RL/)

**URL**: https://novapart.co/products/FQB1P50TM/power-mosfet-p-channel-500-v-15-a-8-ohm-to-263
**SKU**: FQB1P50TM
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.7350
**Stock**: 25+
**Lead Time**: 2 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Channel Type | P Channel |
| Power Dissipation | 63W |
| Transistor Mounting | Surface Mount |
| Drain Source On State Resistance | 8ohm |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3368800RL/)

## **Is Now Part of** 

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Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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MAY 2015<br>**----- End of picture text -----**<br>


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FQB1P50<br>**----- End of picture text -----**<br>


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P-Channel QFET [®] MOSFET<br>**----- End of picture text -----**<br>


## **- 500 V, - 1.5 A, 10.5 Ω** 

## **Features** 

## **Description** 

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This P-Channel enhancement mode power MOSFET is  • - 1.5 A, - 500 V, RDS(on) = 10.5 Ω (Max.) @ VGS = - 10 V,<br>produced using Fairchild Semiconductor’s proprietary  ID = - 0.75 A<br>planar stripe and DMOS technology. This advanced  • Low Gate Charge (Typ. 11 nC)<br>MOSFET technology has been especially tailored to<br>reduce on-state resistance, and to provide superior  • Low Crss (Typ. 6.0 pF)<br>switching performance and high avalanche energy  • 100% Avalanche Tested<br>strength. These devices are suitable for switched mode  • RoHS Compliant<br>power supplies, active power factor correction (PFC), and<br>electronic lamp ballasts.<br>S<br>D<br>G<br>G<br>S D [2] -PAK<br>> @<br>D<br>Absolute Maximum Ratings    TC = 25°C unless otherwise noted<br>Symbol Parameter FQB1P50TM Unit<br>VDSS Drain-Source Voltage -500 V<br>ID Drain Current  - Continuous (TC = 25°C) -1.5 A<br>- Continuous (TC = 100°C) -0.95 A<br>IDM Drain Current  - Pulsed (Note 1) -6.0 A<br>VGSS ——— Gate-Source Voltage ± 30 V<br>EAS Single Pulsed Avalanche Energy (Note 2) 110 mJ<br>IAR Avalanche Current (Note 1) -1.5 A<br>EAR Repetitive Avalanche Energy (Note 1) 6.3 mJ<br>dv/dt Peak Diode Recovery dv/dt (Note 3) -4.5 V/ns<br>PD Power Dissipation (TA = 25°C) * 3.13 W<br>Power Dissipation (TC = 25°C) 63 W<br>- Derate above 25°C 0.51 W/°C<br>TJ, TSTG = Operating and Storage Temperature Range -55 to +150 °C<br>TL es Maximum lead temperature for soldering,1/8 ”  from case for 5 seconds 300 °C<br>Thermal Characteristics<br>Symbol Parameter FQB1P50TM Unit<br>RJC Thermal Resistance, Junction to Case, Max     1.98<br>Thermal Resistance, Junction to Ambient (minimum pad of 2 oz copper), Max. 62.5 oC/W<br>RJA<br>———s Thermal Resistance, Junction to Ambient (1 in [2]  pad of 2 oz copper), Max.   40<br>©2000 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com<br>FQB1P50 Rev. 1.4<br>**----- End of picture text -----**<br>


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FQB1P50<br>P-Channel QFET<br>®<br> MOSFET<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

## **Package Marking and Ordering Information** 

|**Package Marking and Ordering Information**|**Package Marking and Ordering Information**|**Package Marking and Ordering Information**|**Package Marking and Ordering Information**|**Package Marking and Ordering Information**|**Package Marking and Ordering Information**|**Package Marking and Ordering Information**|**Package Marking and Ordering Information**|
|---|---|---|---|---|---|---|---|
|**Device Marking**<br>**Device**<br>**Package**<br>**Reel Size**<br>**Tape Width**<br>**Quantity**<br>FQB1P50<br>FQB1P50TM<br>D2-PAK<br>330mm<br>24mm<br>800<br>**Elerical Characteristics**<br>TC= 25°C unless otherwise noted<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>**Off Characteristics**<br>BVDSS<br>Drain-Source Breakdown Voltage<br>VGS=0V,ID= -250 µA<br>-500<br>--<br>--<br>V<br>∆BVDSS<br>/∆TJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= -250µA, Referenced to 25°C<br>--<br>-<br>--<br>V/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>V~~DS~~= -500V,V~~GS~~=0V<br>--<br>--<br>-1<br>µA<br>VDS= -400V,TC= 125°C<br>--<br>--<br>-10<br>µA<br>IGSSF<br>Gate-Body Leakage Current, Forward<br>VGS= -30V,VDS=0V<br>--<br>--<br>-100<br>nA<br>IGSSR<br>Gate-Body Leakage Current, Reverse<br>VGS=30V,VDS=0V<br>--<br>--<br>100<br>nA<br>**On Characteristics**<br>VGS(th)<br>Gate Threshold Voltage<br>VDS= VGS,ID= -250 µA<br>-3.0<br>--<br>-5.0<br>V<br>RDS(on)<br>Static Drain-Source<br>On-Resistance<br>VGS= -10 V, ID= -0.75 A<br>--<br>8.0<br>10.5<br>Ω<br>gFS<br>Forward Transconductance<br>VDS= -50V,ID= -0.75A<br>--<br>1.26<br>--<br>S<br>**Dynamic Characteristics**<br>Ciss<br>Input Capacitance<br>VDS= -25 V, VGS= 0 V,<br>f = 1.0 MHz<br>--<br>270<br>350<br>pF<br>Coss<br>Output Capacitance<br>--<br>40<br>50<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>--<br>6.0<br>8.0<br>pF<br>~~eee~~<br>~~ae~~||||||||
|**Switching Characteristics**||||||||
|td(on)<br>Turn-On Delay Time<br>VDD= -250 V, I<br>RG= 25Ω<br>tr<br>Turn-On Rise Time<br>td(off)<br>Turn-Off Delay Time|= -250 V, ID= -1.5 A,||--<br>--<br>--|9.0<br>25<br>27||30<br>60<br>65|ns<br>ns<br>ns|
|tf<br>Turn-Off Fall Time|(Note 4)||--|30||70|ns|
|Qg<br>Total Gate Charge<br>VDS= -400 V, I|= -400 V, ID= -1.5 A,||--|11||14|nC|
|VGS= -10 V<br>Qgs<br>Gate-Source Charge|||--|2.0||--|nC|
|Qgd<br>Gate-Drain Charge|(Note 4)||--|5.6||--|nC|
|**Drain-Source Diode Characteristics and Maximum Ratings**<br>IS<br>Maximum Continuous Drain-Source Diode Forward Current<br>--<br>--<br>-1.5<br>A<br>ISM<br>Maximum Pulsed Drain-Source Diode Forward Current<br>--<br>--<br>-6.0<br>A<br>VSD<br>Drain-Source Diode Forward Voltage<br>VGS=0V,IS= -1.5A<br>--<br>--<br>-5.0<br>V<br>trr<br>Reverse Recovery Time<br>VGS= 0 V, IS= -1.5 A,<br>dIF/ dt = 100 A/µs<br>--<br>200<br>--<br>ns<br>Qrr<br>Reverse Recovery Charge<br>--<br>0.7<br>--<br>µC<br>~~os~~||||||||
|**Notes:**||||||||
|1. Repetitive Rating : Pulse width limited by maximum junction temperature||||||||
|2. L = 88mH, IAS= -1.5A, VDD= -50V, RG= 25Ω,Starting  TJ= 25°C||||||||



3. ISD ≤ -1.5A, di/dt ≤ 200A/µs, VDD ≤ BVDSS, Starting  TJ = 25°C 

4. Essentially independent of operating temperature 

www.fairchildsemi.com 

**2** 

©2000 Fairchild Semiconductor Corporation FQB1P50 Rev. 1.4 

## **Typical Characteristics** 

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Top :       -15.0 V   VGS<br>   -10.0 V<br>   -8.0 V<br>   -7.0 V<br>100    -6.5 V<br>   -6.0 V<br>Bottom :    -5.5 V<br>100<br>150℃<br>10-1<br>25℃<br>※ Notes : ※ Notes :<br> 2. T 1. 250C = 25μs Pulse Test℃ -55℃  2. 250 1. VDS = -50Vμs Pulse Test<br>10-210-1 100 101 10-1 2 4 6 8 10<br>-VDS, Drain-Source Voltage [V] -VGS , Gate-Source Voltage  [V]<br>Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics<br>16<br>14<br>VGS = - 10V<br>12 VGS = - 20V 100<br>10<br>150℃ 25℃<br>8 ※ Notes :<br>※ Note : TJ = 25℃  1. V 2. 250GS = 0Vμs Pulse Test<br>6 BAVA 10-1<br>0 1 2 4 0.0 0.5 1.0 1.5 2.0 2.5 3.0<br>-ID , Drain Current  [A] -VSD , Source-Drain Voltage  [V]<br>Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage<br>Drain Current and Gate Voltage Variation vs. Source Current<br>and Temperature<br>600 12<br>500 CCCissossrss = C = C = Cgsgdds + C + Cgdgd (Cds = shorted) 10 VDS = -100V<br>VDS = -250V<br>400 Ciss 8 VDS = -400V<br>300 6<br>Coss<br>200 ※ Notes : 4<br>Crss  1. V 2. f = 1 MHzGS = 0 V<br>100 2<br>※ Note : ID = -1.5 A<br>010-1 100 101 0 0 2 6 8 10 12<br>-VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC]<br>, Drain Current [A]-ID  , Drain Current  [A]-ID<br>],<br>Ω<br>   [<br>DS(on)<br>R<br>Drain-Source On-Resistance  , Reverse Drain Current  [A]<br>DR<br>-I<br>Capacitance [pF]<br>, Gate-Source Voltage [V]<br>GS<br>-V<br>**----- End of picture text -----**<br>


**Figure 5. Capacitance Characteristics** 

**Figure 6. Gate Charge Characteristics** 

www.fairchildsemi.com 

©2000 Fairchild Semiconductor Corporation FQB1P50 Rev. 1.4 

**3** 

## **Typical Characteristics** (Continued) 

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1.2 2.5<br>2.0<br>1.1<br>1.5<br>1.0<br>1.0<br>0.9 ※ Notes :<br> 1. V 2. IDGS = -250  = 0 VμA 0.5 ※  2. I  1. V Notes :DGS = -0.75 A = -10 V<br>0.8 0.0<br>-100 -50 0 50 100 150 200 -100 -50 0 50 100 150 200<br>TJ, Junction Temperature [oC] TJ, Junction Temperature [oC]<br>Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation<br>vs. Temperature vs. Temperature<br>1.5<br>Operation in This Area<br>101 is Limited by R DS(on)<br>1.2<br>1 ms 100 µs<br>100 10 ms 0.9<br>DC<br>0.6<br>10-1<br>※ Notes :<br> 1. TC = 25 oC 0.3<br> 3. Single Pulse 2. TJ = 150 oC<br>10-2100 101 102 103 0.025 ch 50 75 100 125 150<br>-VDS, Drain-Source Voltage [V] TC, Case Temperature [℃]<br>Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current<br>vs. Case Temperature<br>1 0 0 D = 0 .5<br>0 .2 ※   1 . Z N o te s  :θ J C (t) =  1 .9 8   ℃ /W  M a x .<br>0 .1    2 . D   3 . T J Mu ty F a c to r, D  - T C  =  P D M *= tZ 1 /tθ 2J C (t)<br>1 0 -1 0 .0 5<br>0 .0 2 PDM<br>0 .0 1<br>s in g le  p u ls e t1 t2<br>1 0 -21 0 e -5 1 0 -4 1 0 e -3 1 0 -2 1 0 e -1 1 0 0 1 0 1<br>t 1 , S q u a re  W a v e  P u ls e  D u ra tio n  [s e c ]<br>Figure 11. Transient Thermal Response Curve<br>, (Normalized)  , (Normalized)<br> DSS DS(ON)<br>-BV R<br>Drain-Source On-Resistance<br>Drain-Source Breakdown Voltage<br>, Drain Current [A]-ID , Drain Current [A]-ID<br>oC/W](t), Thermal Response [<br>ZJC<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2000 Fairchild Semiconductor Corporation FQB1P50 Rev. 1.4 

**4** 

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 Figure 12. Gate Charge Test Circuit & Waveform<br>VGS<br>Same Type<br>50KΩ as DUT Qg<br>12V 200nF 300nF -10V<br>VGS VDS Qgs Qgd<br>DUT<br>IG = const. -3mA<br>Charge<br>ms | Le<br> Figure 13. Resistive Switching Test Circuit & Waveforms<br>RL<br>VDS t on t off<br>RG VGS VDD VGS 10% td(on) tr td(off) tf<br>-10V VGS DUT<br>i VDS 90%<br> Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms<br>VDS L EAS = ----12 L IAS2 --------------------BVBVDSSDSS- VDD<br>t p Time<br>I D<br>RG VDD VDD VDS (t)<br>ID (t)<br>-10V VGS DUT<br>IAS<br>t p BVDSS<br>FQB1P50<br>®<br>P-Channel QFET MOSFET<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2000 Fairchild Semiconductor Corporation FQB1P50 Rev. 1.4 

**5** 

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 Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms<br>+<br>VDS<br>DUT<br>_<br>I SD<br>L<br>Driver<br>RG<br>Compliment of DUT<br>(N-Channel) VDD<br>VGS • dv/dt controlled by  RG<br>• ISD controlled by pulse period<br>Gate Pulse Width<br>VGS D = --------------------------<br>Gate Pulse Period 10V<br>( Driver )<br>ee<br>Body Diode Reverse Current<br>I SD<br>( DUT ) IRM<br>di/dt<br>a IFM , Body Diode Forward Current Ae<br>VDS VSD<br>( DUT )<br>Body Diode VDD<br>Forward Voltage Drop<br>J Body Diode Recovery Ay dv/dt<br>©2000 Fairchild Semiconductor Corporation 6<br>FQB1P50 Rev. 1.4<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

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10.67 -A- 10.67<br>9.65<br>1.68<br>4 1.00 4<br>9.45<br>9.65<br>8.38<br>10.00<br>1.78 MAX 2<br>2 0.25 MAX<br>PLASTIC BODY 3.80<br>STUB<br>1 3 1 3<br>(2.12) 1.781.14 1.05<br>0.99 0.25 M B A M 5.08<br>0.51<br>LAND PATTERN RECOMMENDATION<br>5.08<br>UNLESS NOTED, ALL DIMS TYPICAL<br>FRONT VIEW - DIODE PRODUCTS VERSION<br>ALTERNATIVE SUPPLIER DETAIL -B-<br>4.83<br>4.06<br>6.22 MIN<br>1.65<br>1.14<br>4 4<br>6.86 MIN<br>15.88<br>14.61 SEE<br>DETAIL A<br>2<br>2<br>3 1 3 1<br>BACK VIEW - DIODE PRODUCTS VERSION NOTES: UNLESS OTHERWISE SPECIFIED<br>ALTERNATIVE SUPPLIER DETAIL    A)  ALL DIMENSIONS ARE IN MILLIMETERS.<br>   B)  REFERENCE JEDEC, TO-263, VARIATION AB.<br>   C)  DIMENSIONING AND TOLERANCING PER<br>GAGE PLANE        DIMENSIONING AND TOLERANCING PER<br>       ASME Y14.5 - 2009.<br>0.74    D)  LOCATION OF THE PIN HOLE MAY VARY<br>0.25 0.33 ��        (LOWER LEFT CORNER, LOWER CENTER<br>��         AND CENTER OF THE PACKAGE).<br>   E)  LANDPATTERN RECOMMENDATION PER IPC<br>         TO254P1524X482-3N<br>2.79 0.10 B    F)  FILENAME: TO263A02REV8<br>1.78 ��<br>0.25 MAX (5.38) ��<br>SEATING<br>PLANE<br>���������������������<br>SCALE: 2X<br>**----- End of picture text -----**<br>


ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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