# Power MOSFET, N Channel, 1 kV, 8 A, 1.2 ohm, TO-3PN, Through Hole

![Product image](https://novapart.co/image/farnell:2453888/)

**URL**: https://novapart.co/products/FQA8N100C/power-mosfet-n-channel-1-kv-8-a-12-ohm-to-3pn
**SKU**: FQA8N100C
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €2.4200
**Stock**: 500+
**Lead Time**: 78 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:8A; Drain Source Voltage Vds:1kV; On Resistance Rds(on):1.2ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:5V; Power Di

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 225W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-3PN |
| Drain Source Voltage Vds | 1kV |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 8A |
| Drain Source On State Resistance | 1.2ohm |
| Gate Source Threshold Voltage Max | 5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2453888/)

## **Is Now Part of** 

## **To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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## **FQA8N100C** 

## **N-Channel QFET[®] MOSFET** 

## **1000 V, 8 A, 1.45 Ω** 

## **Features** 

- RDS(on) = 1.45 Ω (Max.) @ VGS = 10 V, ID = 4 A 

- Low Gate Charge (Typ. 53 nC) 

- Low Crss (Typ. 16 pF) 

- 100% Avalanche Tested 

## **Description** 

These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology. 

This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficient switched mode power supplies. 

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G<br>D S TO-3PN<br>S<br>Absolute Maximum Ratings TC = 25°C unless otherwise noted.<br>CC Symbol Parameter FQA8N100C Unit<br>es VDSS nD Drain-Source Voltage ( 1000 (| V<br>ID Drain Current - Continuous (TC = 25°C) 8 A<br>lst. - Continuous (TC = 100°C) 5 A<br>rs IDM nD Drain Current - Pulsed 4  (Note 1) ( 32 §«§3=& A<br>VGSS Gate-Source voltage ±30 V<br>EAS Single Pulsed Avalanche Energy (Note 2) 850 mJ<br>esi (<br>IAR Avalanche Current (Note 1) 8 A<br>ee<br>T———S EAR Repetitive Avalanche Energy  . } (Note 1) }» | 22.5 a mJ «=~<br>dv/dt  ,—eee—=—ET Peak Diode Recovery dv/dt (Note 3) 4.0 V/ns<br>PD Power Dissipation (TC = 25°C) 225 W<br>- Derate above 25°C 1.79 W/°C<br>_ =—ti‘i‘(‘a<‘é<‘(#;T:”:;tCCLCO;CttCtCCS<br>lc TJ, TSTG  Operating and Storage Temperature Range -55 to +150 °C<br>TL Maximum Lead Temperature for Soldering Purpose, 300 °C<br>1/8” from Case for 5 Seconds<br>a — k;§——~—~—~—C—Ci‘( |) C)UC~;wé‘“C MEE,  ’CCOtC§@ se<br>**----- End of picture text -----**<br>


## **Thermal Characteristics** 

|**Symbol**|**Parameter**|**FQA8N100C**|**Unit**|
|---|---|---|---|
|RθJC|Thermal Resistance, Junction-to-Case, Max.|0.56|°C/W|
|RθCS|Thermal Resistance, Case-to-Sink, Typ.|0.24|°C/W|
|RθJA|Thermal Resistance, Junction-to-Ambient, Max.|40|°C/W|



www.fairchildsemi.com 

©2005 Fairchild Semiconductor Corporation FQA8N100C Rev C1 

**1** 

## **Package Marking and Ordering Information** 

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||||||||||
|---|---|---|---|---|---|---|---|---|
|Part Number|Top Mark|Package|Packing Method|Reel Size|Tape Width|Quantity|
|FQA8N100C|FQA8N100C|TO-3PN|Tube|N/A|N/A|30 units|
|Electrical Characteristics|TC = 25°C unless otherwise noted.C = 25°C unless otherwise noted. = 25°C unless otherwise noted..|
|Symbol|Parameter|Conditions|Min.|Typ.|Max.|Unit|
|ee|
|Off Characteristics|
|—_——|BVDSS|Drain-Source Breakdown Voltage|VGS = 0V, ID = 250µA|1000|--|--|V|
|∆/     BV∆DSSTJ|Breakdown Voltage TemperatureCoefficient|ID = 250µA, Referenced to 25°C|--|1.4|--|V/°C|
|a|ee|ee ee|
|IDSS|Zero Gate Voltage Drain Current|VDS = 1000V, VGS = 0V|--|--|10|µA|
|VDS = 800V, TC = 125°C|--|--|100|µA|
|a|ee|ee|ee|
|IGSSF|Gate-Body Leakage Current, Forward|VGS = 30V, VDS = 0V|--|--|100|nA|
|ee|IGSSR|Gate-Body Leakage Current, Reverse|VGS = -30V, VDS = 0V|--|--|-100|nA|
|On Characteristics|
|VGS(th)|Gate Threshold Voltage|VDS = VGS, ID = 250µA|3.0|--|5.0|V|
|—_—|—_—_|—_—_—|—|
|R|Static Drain-Source|
|DS(on)|On-Resistance|VGS = 10V, ID = 4A|--|1.2|1.45|Ω|
|yy|@|
|gFS|Forward Transconductance|VDS = 50V, ID = 4A|--|8.0|--|S|
|eeTyx,_th—hlUcL——-_hhLULhlU(Cttn|I|
|Dynamic Characteristics|
|Ciss|Input Capacitance|VDS = 25V, VGS = 0V,|--|2475|3220|pF|
|Coss|Output Capacitance|f = 1.0MHz|--|195|255|pF|
|a|Crss|Reverse Transfer Capacitance|--|16|24|pF|
|Switching Characteristics|
|td(on)|Turn-On Delay Time|VDD = 500V, ID = 8A|--|50|110|ns|
|tr|Turn-On Rise Time|RG = 25Ω|--|95|200|ns|
|td(off)|Turn-Off Delay Time|--|122|254|ns|
|tf|Turn-Off Fall Time|(Note 4)|--|80|170|ns|
|=————|Qg|Total Gate Charge|VDS = 800V, ID = 8A|==|--|53|70|nC|
|Qgs|Gate-Source Charge|VGS = 10V|--|13|--|nC|
|Qgd|Gate-Drain Charge|(Note 4)|--|23|--|nC|
|—————sll|OE|PF||ft|
|Drain-Source Diode Characteristics and Maximum Ratings|
|————_—_~—|IS|Maximum Continuous Drain-Source Diode Forward Current|--|--|8|A|
|ISM|Maximum Pulsed Drain-Source Diode Forward Current|--|--|32|A|
|ee|VSD|Drain-Source Diode Forward Voltage|VGS = 0V, IS = 8A|--|--|1.4|V|
|ee|
|trr|Reverse Recovery Time|VGS = 0V, IS = 8A|--|620|--|ns|
|a|Qrr|Reverse Recovery Charge|dIF/dt =100A/µs|--|5.2|--|µC|
|NOTES:|
|1. Repetitive rating: pulse-width limited by maximum junction temperature.|

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**Electrical Characteristics** TC = 25°C unless otherwise noted.C = 25°C unless otherwise noted. = 25°C unless otherwise noted.. 

2. L = 25 mH, IAS = 8 A, VDD = 50 V, RG = 25 Ω, starting TJ = 25°C. 

3. ISD ≤ 8 A, di/dt ≤ 200 A/μs, VDD ≤ BVDSS, starting TJ = 25°C. 

4. Essentially independent of operating temperature typical characteristics. 

www.fairchildsemi.com 

©2005 Fairchild Semiconductor Corporation FQA8N100C Rev C1 

**2** 

## **Typical Performance Characteristics** 

**Figure 1. On-Region Characteristics** 

**Figure 2. Transfer Characteristics** 

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                    VTop :       15.0 VGS<br>                10.0 V<br>                  8.0 V<br>101                   7.0 V                  6.5 V 101<br>                  6.0 V<br>Bottom :    5.5 V<br>150oC<br>100 100 25oC<br>-55oC<br>※ Notes : ※ Notes :<br>10-1    1. 250µs Pulse Test   2. TC = 25℃    1. V    250µ s Pulse Test2. DS = 50V<br>10-1<br>10-1 100 101 2 4 6 8 10<br>VDS, Drain-Source Voltage [V] VGS, Gate-Source Voltage [V]<br>Figure 3. On-Resistance Variation vs.  Figure 4. Body Diode Forward Voltage<br> Drain Current and Gate Voltage Variation vs. Source Current<br>and Temperatue<br>3.0<br>2.5 101<br>VGS = 10V<br>2.0<br>1.5 100<br>VGS = 20V<br>150℃ 25℃<br>1.0 ※ Notes :<br>※ Note : TJ = 25℃    1. V    250µ s Pulse Test2. GS = 0V<br>0.5 10-1<br>0 5 10 15 20 25 0.2 0.4 0.6 0.8 1.0 1.2 1.4<br>ID, Drain Current [A] VSD, Source-Drain voltage [V]<br>Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics<br>4000 12<br>35003000 Ciss CCCissosrsss = C = = C Cgsgdds + C + Cgdgd (Cds = shorted) 10 VDS = 500VVDS = 200V<br>8 VDS = 800V<br>2500<br>2000 Coss 6<br>1500 ※ Notes :<br>   2. f = 1 MHz   1. VGS = 0 V 4<br>1000<br>Crss 2<br>500<br>※ Note : ID = 8A<br>0 0<br>10-1 100 101 0 10 20 30 40 50 60 70<br>VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC]<br>, Drain Current [A]ID , Drain Current [A]ID<br>],<br>Ω<br> [<br>DS(ON)<br>R<br>Drain-Source On-Resistance , Reverse Drain Current [A]<br>IDR<br>Capacitance [pF]<br>, Gate-Source Voltage [V]<br>GS<br>V<br>**----- End of picture text -----**<br>


**Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage** 

**Figure 5. Capacitance Characteristics** 

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©2005 Fairchild Semiconductor Corporation FQA8N100C Rev C1 

**3** 

## **Typical Performance Characteristics** (Continued) 

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Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation<br> vs. Temperature   vs. Temperature<br>1.2 3.0<br>2.5<br>1.1<br>2.0<br>1.0 1.5<br>1.0<br>0.9 ※ Notes :<br>   2. I   1. VDGS = 250 µA = 0 V 0.5    2. I※   1. V Notes :DGS = 4 A = 10 V<br>0.8 0.0<br>-100 -50 0 50 100 150 200 -100 -50 0 50 100 150 200<br>TJ, Junction Temperature [oC] TJ, Junction Temperature [oC]<br>Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current<br> vs. Case Temperature<br>Operation in This Area<br>102 is Limited by R DS(on) 8<br>101010 Son| 50550“7 - - - Ae-6A- 7 Oe- -<oN~AS. > xaxaSs x DC s~ ~ees 10 ms Ne~ SS= ~ 1 ms =| x Ss 100  Nys µ x 10  ~ s srs µ .x] s . 64<br>10-1    1. T※   2. T   3. Single Pulse Notes :CJ = 150  = 25 oCoC | 2<br>10-2100 101 102 103 025 50 75 100 125 150<br>VDS, Drain-Source Voltage [V] TC, Case Temperature [℃]<br>Figure 11. Transient Thermal Response Curve<br>10 0<br>D = 0.5<br>0.2 ※  N otes :<br>10 -1 0.1    3. T   1. Z   2. D JMθutJC - Ty Factor, D =t(t) = 0.56  C = P DM * Z℃ /W  M ax.1 θ/tJC2 (t)<br>0.05 PDM<br>0.02 t1<br>0.01 t2<br>10 -2 single pulse<br>10 -5 10 -4 10 -3 10 -2 10 -1 10 0 1 0 1<br>t1, S quare W ave P ulse D uration [sec]<br>, (Normalized) , (Normalized)<br>DSS DS(ON)<br>BV R<br>Drain-Source On-Resistance<br>Drain-Source Breakdown Voltage<br>, Drain Current [A]ID , Drain Current [A]ID<br>oC/W](t), Thermal Response [<br>ZJ Cθ<br>**----- End of picture text -----**<br>


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©2005 Fairchild Semiconductor Corporation FQA8N100C Rev C1 

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VGS<br>Same Type<br>50KΩ as DUT Qg<br>12V 200nF 300nF 10V<br>VGS VDS Qgs Qgd<br>DUT<br>IG = const.<br>Charge<br> Figure 12. Gate Charge Test Circuit & Waveform<br>VDS RL VDS 90%<br>VGS VDD<br>RG<br>10%<br>VGS DUT VGS<br>td(on) tr td(off) tf<br>t on t off<br> Figure 13. Resistive Switching Test Circuit & Waveforms<br>L BVDSS<br>VDS EAS [=] --21-- L IAS2 --------------------BVDSS - VDD<br>I D BVDSSIAS<br>RG VDD ID (t)<br>V GS DUT VDD VDS (t)<br>t p t p Time<br>**----- End of picture text -----**<br>


**Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms** 

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©2005 Fairchild Semiconductor Corporation FQA8N100C Rev C1 

**5** 

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DUT +<br>VDS<br>_<br>I SD<br>L<br>Driver<br>RG<br>Same Type<br>as DUT VDD<br>VGS • dv/dt controlled by  RG<br>• ISD controlled by pulse period<br>Gate Pulse Width<br>VGS D = --------------------------<br>Gate Pulse Period 10V<br>( Driver )<br>— ay<br>IFM , Body Diode Forward Current<br>I SD<br>( DUT ) di/dt<br>IRM<br>4 Ne<br>Body Diode Reverse Current<br>VDS<br>( DUT ) Body Diode Recovery dv/dt<br>VSD VDD<br>TT<br>Body Diode<br>Forward Voltage Drop<br>**----- End of picture text -----**<br>


**Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms** 

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©2005 Fairchild Semiconductor Corporation FQA8N100C Rev C1 

**6** 

## **Mechanical Dimensions** 

**Figure 16. TO3PN, 3-Lead, Plastic, EIAJ SC-65** _Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products._ 

_Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT3PN-003_ 

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**7** 

## **TRADEMARKS** 

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 

|AccuPower™<br>AX-CAP®*<br>BitSiC™<br>Build it Now™<br>CorePLUS™<br>CorePOWER™<br>_CROSSVOLT_™<br>CTL™<br>Current Transfer Logic™<br>DEUXPEED®<br>Dual Cool™<br>EcoSPARK®<br>EfficentMax™<br>ESBC™<br>Fairchild®<br>Fairchild Semiconductor®<br>FACT Quiet Series™<br>FACT®<br>®<br>~~F~~|AccuPower™<br>AX-CAP®*<br>BitSiC™<br>Build it Now™<br>CorePLUS™<br>CorePOWER™<br>_CROSSVOLT_™<br>CTL™<br>Current Transfer Logic™<br>DEUXPEED®<br>Dual Cool™<br>EcoSPARK®<br>EfficentMax™<br>ESBC™<br>Fairchild®<br>Fairchild Semiconductor®<br>FACT Quiet Series™<br>FACT®<br>®<br>~~F~~|AccuPower™<br>AX-CAP®*<br>BitSiC™<br>Build it Now™<br>CorePLUS™<br>CorePOWER™<br>_CROSSVOLT_™<br>CTL™<br>Current Transfer Logic™<br>DEUXPEED®<br>Dual Cool™<br>EcoSPARK®<br>EfficentMax™<br>ESBC™<br>Fairchild®<br>Fairchild Semiconductor®<br>FACT Quiet Series™<br>FACT®<br>®<br>~~F~~|AccuPower™<br>AX-CAP®*<br>BitSiC™<br>Build it Now™<br>CorePLUS™<br>CorePOWER™<br>_CROSSVOLT_™<br>CTL™<br>Current Transfer Logic™<br>DEUXPEED®<br>Dual Cool™<br>EcoSPARK®<br>EfficentMax™<br>ESBC™<br>Fairchild®<br>Fairchild Semiconductor®<br>FACT Quiet Series™<br>FACT®<br>®<br>~~F~~|AccuPower™<br>AX-CAP®*<br>BitSiC™<br>Build it Now™<br>CorePLUS™<br>CorePOWER™<br>_CROSSVOLT_™<br>CTL™<br>Current Transfer Logic™<br>DEUXPEED®<br>Dual Cool™<br>EcoSPARK®<br>EfficentMax™<br>ESBC™<br>Fairchild®<br>Fairchild Semiconductor®<br>FACT Quiet Series™<br>FACT®<br>®<br>~~F~~|AccuPower™<br>AX-CAP®*<br>BitSiC™<br>Build it Now™<br>CorePLUS™<br>CorePOWER™<br>_CROSSVOLT_™<br>CTL™<br>Current Transfer Logic™<br>DEUXPEED®<br>Dual Cool™<br>EcoSPARK®<br>EfficentMax™<br>ESBC™<br>Fairchild®<br>Fairchild Semiconductor®<br>FACT Quiet Series™<br>FACT®<br>®<br>~~F~~|F-PFS™<br>FRFET®<br>Global Power ResourceSM<br>GreenBridge™<br>Green FPS™<br>Green FPS™ e-Series™<br>G_max_™<br>GTO™<br>IntelliMAX™<br>ISOPLANAR™<br>Marking Small Speakers Sound Louder<br>and Better™<br>MegaBuck™<br>MICROCOUPLER™<br>MicroFET™<br>MicroPak™<br>MicroPak2™<br>MillerDrive™<br>MotionMax™<br>mWSaver®|PowerTrench®<br>PowerXS™<br>Programmable Active Droop™<br>QFET®<br>QS™<br>Quiet Series™<br>RapidConfigure™<br>Saving our world, 1mW/W/kW at a time™<br>SignalWise™<br>SmartMax™<br>SMART START™<br>Solutions for Your Success™<br>SPM®<br>STEALTH™<br>SuperFET®<br>SuperSOT™-3<br>™<br>tm®<br>2|®*<br>TinyBoost®<br>TinyBuck®<br>TinyCalc™<br>TinyLogic®<br>TINYOPTO™<br>TinyPower™<br>TinyPWM™<br>TinyWire™<br>TranSiC™<br>TriFault Detect™<br>TRUECURRENT®*<br>μSerDes™<br>UHC®<br>Ultra FRFET™<br>UniFET™<br>[Eceveaa<br>"Z4...|
|---|---|---|---|---|---|---|---|---|
|FAST®<br>FastvCore™<br>FETBench™||||||OptoHiT™<br>OPTOLOGIC®<br>OPTOPLANAR®|SuperSOT™-6<br>SuperSOT™-8<br>SupreMOS®|VCX™<br>VisualMax™<br>VoltagePlus™|
|FPS™|||||||SyncFET™|XS™|
||||||||Sync-Lock™|仙童™|



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## **PRODUCT STATUS DEFINITIONS Definition of Terms** 

|**Definition of Terms**|||
|---|---|---|
|**Datasheet Identification**|**Product Status**|**Definition**|
|Advance Information|Formative / In Design|Datasheet contains the design specifications for product development. Specifications<br>may change in any manner without notice.|
|Preliminary|First Production|Datasheet contains preliminary data; supplementary data will be published at a later<br>date. Fairchild Semiconductor reserves the right to make changes at any time without<br>notice to improve design.|
|No Identification Needed|Full Production|Datasheet contains final specifications. Fairchild Semiconductor reserves the right to<br>make changes at any time without notice to improve the design.|
|Obsolete|Not In Production|Datasheet contains specifications on a product that is discontinued by Fairchild<br>Semiconductor. The datasheet is for reference information only.|



Rev. I67 

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©2005 Fairchild Semiconductor Corporation FQA8N100C Rev C1 

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## Links

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---

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