# Power MOSFET, N Channel, 500 V, 15 A, 0.48 ohm, TO-3PN, Through Hole

![Product image](https://novapart.co/image/farnell:3368790/)

**URL**: https://novapart.co/products/FQA13N50CF/power-mosfet-n-channel-500-v-15-a-048-ohm-to-3pn
**SKU**: FQA13N50CF
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.3000
**Stock**: 200+
**Lead Time**: 2 days (indicative)

## Description

Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (15-Jan-2018) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | QFET FRFET |
| Qualification | - |
| Power Dissipation | 218W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-3PN |
| Drain Source Voltage Vds | 500V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 15A |
| Drain Source On State Resistance | 0.48ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3368790/)

## **Is Now Part of** 

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Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. 

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## **FQA13N50CF** 

## **N-Channel QFET[®] FRFET[®] MOSFET** 

## **500 V, 15 A, 480 mΩ Features** 

- 15 A, 500 V, RDS(on) = 480 mΩ (Max.) @ VGS = 10 V, ID = 7.5 A 

- Low Gate Charge (Typ. 43 nC) 

- Low Crss (Typ. 20 pF) 

- 100% Avalanche Tested 

- Fast Recovery Body Diode (Typ. 100 ns) 

## **Description** 

This N-Channel enhancement mode power MOSFET is produced using Fairchild Semiconductor’s proprietary planar stripe and DMOS technology. This advanced MOSFET technology has been especially tailored to reduce on-state resistance, and to provide superior switching performance and high avalanche energy strength. These devices are suitable for switched mode power supplies, active power factor correction (PFC), and electronic lamp ballasts. 

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**Absolute Maximum Ratings** TC = 25°C unless otherwise noted. 

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a Symbol ee Parameter QO FQA13N50CF Unit<br>VDSS Drain-Source Voltage 500 V<br>ID Drain Current  - Continuous (TC = 25°C) 15 A<br>— - Continuous (TC = 100°C) 9.5 A<br>a IDM Drain Current - Pulsed (Note 1) 60 A<br>VGSS Gate-Source Voltage ± 30 V<br>ee OO<br>EAS Single Pulsed Avalanche Energy (Note 2) 860 mJ<br>IAR Avalanche Current (Note 1) 15 A<br>TTF .}»||}»°©0CTx»»_y<br>a EAR OO Repetitive Avalanche Energy (Note 1) 21.8 mJ Cl<br>dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns<br>PD Power Dissipation (TC = 25°C) 218 W<br>- Derate above 25°C 1.56 W/°C<br>————eeE eee<br>OO TJ, TSTG Operating and Storage Temperature Range -55 to +150 °C<br>Maximum lead temperature for soldering purposes,<br>i TL 1/8''"from case for 5 seconds 300 § | 7... °C »|<br>j|. Mmit.?<br>**----- End of picture text -----**<br>


## **Thermal Characteristics** 

|**Symbol**|**Parameter**|**FQA13N50CF**|**Unit**|
|---|---|---|---|
|RθJC|Thermal Resistance, Junction-to-Case, Max.|0.58|°C/W|
|RθJS|Thermal Resistance, Case-to-Sink, Typ.|0.24|°C/W|
|RθJA|Thermal Resistance, Junction-to-Ambient, Max.|40|°C/W|



www.fairchildsemi.com 

**1** 

©2007 Fairchild Semiconductor Corporation FQA13N50CF Rev C2 

## **Package Marking and Ordering Information** 

|**Symbol**<br>~~es~~|**Parameter**<br>~~(tn~~|**Test Conditions**<br>~~(tn~~|**Min**<br>~~(tn~~|**Typ**<br>~~(tn~~|**Max**<br>~~(tn~~|**Unit**<br>~~(tn~~|
|---|---|---|---|---|---|---|
|**Off Characteristics**<br>~~es(tn~~<br>~~———~~|||||||
|BVDSS<br>~~———~~|Drain-Source Breakdown Voltage<br>~~———~~|VGS= 0 V, ID= 250µA<br>~~———~~<br>~~ee~~|500<br>~~———~~<br>~~ee~~|--<br>~~———~~|--<br>~~———~~|V<br>~~———~~|
|∆BVDSS/<br>∆TJ<br>~~———~~<br>~~a~~|Breakdown Voltage Temperature Coefficient<br>~~———~~<br>~~ee~~|ID= 250µA, Referenced to 25°C<br>~~———~~<br>~~ee~~<br>~~ee~~|--<br>~~———~~<br>~~ee~~<br>~~ee~~|0.5<br>~~———~~<br>~~ee~~|--<br>~~———~~<br>~~ee~~|V/°C<br>~~———~~<br>~~ee~~|
|IDSS<br>~~a ~~<br>~~ee~~<br>~~—~~|Zero Gate Voltage Drain Current<br> ~~ee~~<br>~~ee~~<br>~~—~~|VDS= 500 V, VGS= 0 V<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee ee~~|--<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|--<br>~~ee~~<br>~~ee~~<br>~~ee~~|1<br>~~ee~~<br>~~ee~~<br>~~ee~~|µA<br>~~ee~~<br>~~ee~~<br>~~ee~~|
|||VDS= 400 V, TC= 125°C<br>~~ee~~<br>~~ee ee~~|--<br>~~ee~~<br>~~ee~~|--<br>~~ee~~<br>~~ee~~|10<br>~~ee~~<br>~~ee~~|µA<br>~~ee~~<br>~~ee~~|
|IGSSF<br>~~es~~<br>~~—~~|Gate-Body Leakage Current, Forward<br>~~es~~<br>~~—~~<br>~~—_~~|VGS= 30 V, VDS= 0 V<br>~~es~~<br>~~ee ee~~<br>~~Sl~~|--<br>~~es~~<br>~~ee~~<br>~~Sl~~|--<br>~~es~~<br>~~ee~~<br>~~COS~~|100<br>~~es~~<br>~~ee~~<br>~~COS~~|nA<br>~~es~~<br>~~ee~~<br>~~COS~~|
|IGSSR<br>~~es~~<br>~~—~~|Gate-Body Leakage Current, Reverse<br>~~es~~<br>~~—~~<br>~~—_~~|VGS= -30 V, VDS= 0 V<br>~~es~~<br>~~ee ee~~<br>~~Sl~~|--<br>~~es~~<br>~~ee~~<br>~~Sl~~|--<br>~~es~~<br>~~ee~~<br>~~COS~~|-100<br>~~es~~<br>~~ee~~<br>~~COS~~|nA<br>~~es~~<br>~~ee~~<br>~~COS~~|
|On Characteristics<br>~~es~~<br>~~ee ee~~<br>~~—~~<br>~~—_SlCOS~~<br>~~ee~~<br>~~re~~|||||||
|VGS(th)<br>~~—~~<br>~~ee~~|Gate Threshold Voltage<br>~~—~~<br>~~—_~~<br>~~ee~~|VDS= VGS, ID= 250µA<br>~~ee ee~~<br>~~Sl~~<br>~~re~~|2.0<br>~~ee~~<br>~~Sl~~<br>~~re~~|--<br>~~ee~~<br>~~COS~~<br>~~re~~|4.0<br>~~ee~~<br>~~COS~~<br>~~re~~|V<br>~~ee~~<br>~~COS~~<br>~~re~~|
|RDS(on)<br>~~—~~<br>~~ee~~|Static Drain-Source On-Resistance<br>~~—~~<br>~~—_ ~~<br>~~ee~~|VGS= 10 V, ID= 7.5A<br>~~ee ee~~<br> ~~Sl~~<br>~~re~~|--<br>~~ee~~<br>~~Sl ~~<br>~~re~~|0.43<br>~~ee~~<br> ~~COS~~<br>~~re~~|0.48<br>~~ee~~<br>~~COS~~<br>~~re~~|Ω<br>~~ee~~<br>~~COS~~<br>~~re~~|
|gFS<br>~~ee~~<br>~~,~~|Forward Transconductance<br>~~ee~~<br>~~,~~|VDS= 40 V, ID= 7.5 A<br>~~re~~|--<br>~~re~~|15<br>~~re~~<br>~~WC~~|--<br>~~re~~<br>~~WC~~|S<br>~~re~~<br>~~WC~~|
|Dynamic Characteristics<br>~~ee~~<br>~~re~~<br>~~,~~<br>~~—llOOOOOOO—l~~<br>~~WC~~|||||||
|Ciss<br>~~,~~<br>~~—llOOOOOOO—l~~<br>~~=~~|Input Capacitance<br>~~,~~<br>~~—llOOOOOOO—l~~<br>~~=~~|VDS= 25 V, VGS= 0 V,<br>f = 1.0 MHz<br>~~—llOOOOOOO—l~~<br>~~=~~<br>~~—_~~|--<br>~~—llOOOOOOO—l~~<br>~~=~~|1580<br>~~—llOOOOOOO—l~~<br>~~WC~~<br>~~=~~|2055<br>~~—llOOOOOOO—l~~<br>~~WC~~<br>~~=~~|pF<br>~~—llOOOOOOO—l~~<br>~~WC~~<br>~~=~~|
|Coss<br>~~=~~|Output Capacitance<br>~~=~~||--<br>~~=~~|180<br>~~=~~|235<br>~~=~~|pF<br>~~=~~|
|Crss<br>~~=~~<br>~~**e**~~|Reverse Transfer Capacitance<br>~~=~~<br>~~**e**e~~||--<br>~~=~~<br>~~—_~~|20<br>~~=~~|25<br>~~=~~<br>~~=F~~|pF<br>~~=~~<br>~~=F~~|
|Switching Characteristics<br>~~=~~<br>~~[=~~<br>~~—_~~<br>~~=F~~<br>~~**e**e~~|||||||
|td(on)<br>~~[=~~<br>~~**e**~~|Turn-On Delay Time<br>~~[=~~<br>~~**e**e~~<br>~~h~~|VDD= 250 V, ID= 15A,<br>RG= 25Ω<br>(Note 4)<br>~~[=~~<br>~~—_~~<br>~~ee~~<br>~~h~~<br>~~**F**~~<br>~~©«(C}C'N~~|--<br>~~[=~~<br>~~—_~~<br>~~ee~~|25<br>~~[=~~<br>~~ee~~|60<br>~~[=~~<br>~~=F~~<br>~~ee~~|ns<br>~~[=~~<br>~~=F~~<br>~~ee~~|
|tr<br>~~[=~~<br>~~**e**~~<br>~~_—~~|Turn-On Rise Time<br>~~[=~~<br>~~**e**e~~<br>~~h~~<br>~~_—~~||--<br>~~[=~~<br>~~—_~~<br>~~ee~~<br>~~**F**P{|~~|100<br>~~[=~~<br>~~ee~~<br>~~{|~~<br>~~**|**~~|210<br>~~[=~~<br>~~=F~~<br>~~ee~~<br>~~|~~|ns<br>~~[=~~<br>~~=F~~<br>~~ee~~<br>~~|~~|
|td(off)<br>~~**e**~~<br>~~_—~~|Turn-Off Delay Time<br>~~**e**e~~<br>~~h~~<br>~~_—_~~<br>~~©©«(C}C'N~~||--<br>~~—_~~<br>~~ee~~<br>~~**F**P{|~~<br>~~f~~|130<br>~~ee~~<br>~~{|~~<br>~~**|**~~<br>~~f~~|270<br>~~=F~~<br>~~ee~~<br>~~|~~|ns<br>~~=F~~<br>~~ee~~<br>~~|~~|
|tf<br>~~**e**~~<br>~~_—~~|Turn-Off Fall Time<br>~~**e**e~~<br>~~h~~<br>~~_—_~~<br>~~©©«(C}C'N~~||--<br>~~—_~~<br>~~ee~~<br>~~**F**P{|~~<br>~~f~~|100<br>~~ee~~<br>~~{|~~<br>~~**|**~~<br>~~f~~|210<br>~~=F~~<br>~~ee~~<br>~~|~~|ns<br>~~=F~~<br>~~ee~~<br>~~|~~|
|Qg<br>~~**e**~~<br>~~_—~~<br>~~a~~|Total Gate Charge<br>~~**e**e~~<br>~~h~~<br>~~_— _~~<br>~~©©«(C}C'N~~<br>~~a~~|VDS= 400 V, ID= 15A,<br>VGS= 10 V<br>(Note 4)<br>~~—_~~<br>~~ee~~<br>~~h~~<br>~~**F**~~<br>~~©«(C}C'N~~<br>~~ee~~<br>~~|~~|--<br>~~—_~~<br>~~ee~~<br>~~**F**P {|~~<br>~~f~~<br>~~ee~~|43<br>~~ee~~<br>~~{|~~<br>~~**|**~~<br>~~f~~<br>~~ee~~|56<br>~~=F~~<br>~~ee~~<br>~~|~~<br>~~ee~~|nC<br>~~=F~~<br>~~ee~~<br>~~|~~<br>~~ee~~|
|Qgs<br>~~a~~<br>~~——T———~~|Gate-Source Charge<br>~~a~~<br>~~——T———~~<br>~~|~~||--<br>~~ee~~<br>~~Ff~~|7.5<br>~~ee~~<br>~~Ff~~<br>~~|~~|--<br>~~ee~~<br>~~Ff~~<br>~~|~~|nC<br>~~ee~~<br>~~Ff~~|
|Qgd<br>~~a~~<br>~~——T———~~|Gate-Drain Charge<br>~~a~~<br>~~——T———~~<br>~~|~~||--<br>~~ee~~<br>~~Ff~~|18.5<br>~~ee~~<br>~~Ff~~<br>~~|~~|--<br>~~ee~~<br>~~Ff~~<br>~~|~~|nC<br>~~ee~~<br>~~Ff~~|
|Drain-Source Diode Characteristics and Maximum Ratings<br>~~a~~<br>~~ee~~<br>~~——T———~~<br>~~|~~<br>~~Ff~~<br>~~|~~<br>~~——_——(—(~~|||||||
|IS<br>~~——_——(—(~~|Maximum Continuous Drain-Source Diode Forward Current<br>~~——_——(—(~~||--<br>~~——_——(—(~~|--<br>~~——_——(—(~~|15<br>~~——_——(—(~~|A<br>~~——_——(—(~~|
|ISM<br>~~——_——(—(~~<br>~~pS~~|Maximum Pulsed Drain-Source Diode Forward Current<br>~~——_——(—(~~<br>~~pS~~||--<br>~~——_——(—(~~<br>~~pS~~|--<br>~~——_——(—(~~<br>~~pS~~|60<br>~~——_——(—(~~<br>~~pS~~|A<br>~~——_——(—(~~<br>~~pS~~|
|VSD<br>~~pS~~<br>~~OE~~|Drain-Source Diode Forward Voltage<br>~~pS~~<br>~~OE~~|VGS= 0 V, IS= 15 A<br>~~pS~~<br>~~ss~~|--<br>~~pS~~<br>~~ss~~|--<br>~~pS~~<br>~~ss~~|1.4<br>~~pS~~<br>~~ss~~|V<br>~~pS~~<br>~~ss~~|
|trr<br>~~pS~~<br>~~OE~~|Reverse Recovery Time<br>~~pS~~<br>~~OE~~|VGS= 0 V, IS= 15 A,<br>dIF/ dt = 100 A/µs<br>~~pS~~<br>~~ss~~|--<br>~~pS~~<br>~~ss~~|100<br>~~pS~~<br>~~ss~~|--<br>~~pS~~<br>~~ss~~|ns<br>~~pS~~<br>~~ss~~|
|~~**NOTES:**~~<br>Qrr<br>~~pS~~<br>~~OE~~|Reverse Recovery Charge<br>~~pS~~<br>~~OE~~||--<br>~~pS~~<br>~~ss~~|0.4<br>~~pS~~<br>~~ss~~|--<br>~~pS~~<br>~~ss~~|µC<br>~~pS~~<br>~~ss~~|



**Electrical Characteristics** TC = 25°C unless otherwise noted. 

2. L = 5.6 mH, IAS = 15 A, VDD = 50 V, RG = 25 Ω, starting TJ = 25°C. 

3. ISD ≤ 15 A, di/dt ≤ 200 A/µs, VDD ≤ BVDSS, starting TJ = 25°C. 

4. Essentially independent of operating temperature typical characteristics. 

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**2** 

©2007 Fairchild Semiconductor Corporation FQA13N50CF Rev C2 

## **Typical Performance Characteristics** 

## **Figure 1. On-Region Characteristics** 

## **Figure 2. Transfer Characteristics** 

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Top :        15.0 V         VGS<br>      10.0 V<br>   8.0 V<br>101    7.0 V   6.0 V 101<br>   5.5 V 150°C<br>   5.0 V<br>Bottom :    4.5 V<br>-55°C<br>25°C<br>100 100<br> Notes :<br>   1. 250us Pulse Test  Notes :<br>   2. TC = 25°C  1. VDS = 40V<br>10-110-1 100 101 10-1 2 4 6  2. 2508µs Pulse Test 10<br>VDS, Drain-Source Voltage [V] VGS, Gate-Source Voltage [V]<br>, Drain Current [A]ID , Drain Current [A]ID<br>**----- End of picture text -----**<br>


## **Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage** 

**Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperatue** 

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1.5<br>101<br>VGS = 10VGS = 10V = 10V<br>1.0<br>100<br>VGS = 20VGS = 20V = 20V 150°C<br>0.5  Note : TJ = 25°CJ = 25°C = 25°C°CC 25°C  Notes :1. V2. 250GS = 0Vµs Pulse Test<br>10-1 AE<br>0 5 10 15 20 25 30 35 0.2 0.4 0.6 0.8 1.0 1.2 1.4<br>ID, Drain Current [A]D, Drain Current [A], Drain Current [A] VSD, Source-Drain voltage [V]<br>Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics<br>12<br>3000<br>2500 CCCissossrss = C = C = Cgsgdds + C + Cgdgd (Cds = shorted) 10 VDS = 250VVDS = 100V<br>2000 Ciss 8 VDS = 400V<br>1500 Coss 6<br>1000  Notes ; 4<br> 1. VGS = 0 V<br>Crss  2. f = 1 MHz<br>500 2<br> Note : ID = 15A<br>0<br>10-1 100 101 0 0 10 20 30 40 50<br>VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC]<br>],<br>Ω<br> [<br>DS(ON)<br>R<br>Drain-Source On-Resistance , Reverse Drain Current [A]<br>IDR<br>Capacitance [pF]<br>, Gate-Source Voltage [V]<br>GS<br>V<br>**----- End of picture text -----**<br>


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1.5<br>VGS = 10VGS = 10V = 10V<br>1.0<br>VGS = 20VGS = 20V = 20V<br>0.5<br> Note : TJ = 25°CJ = 25°C = 25°C°CC<br>0 5 10 15 20 25 30 35<br>ID, Drain Current [A]D, Drain Current [A], Drain Current [A]<br>],<br>Ω<br> [<br>DS(ON)<br>R<br>Drain-Source On-Resistance<br>**----- End of picture text -----**<br>


## **Figure 5. Capacitance Characteristics** 

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©2007 Fairchild Semiconductor Corporation FQA13N50CF Rev C2 

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Typical Performance Characteristics   (Continued)<br>**----- End of picture text -----**<br>


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Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation<br> vs. Temperature   vs. Temperature<br>1.2 3.0<br>2.5<br>1.1<br>2.0<br>1.0 1.5<br>1.0<br>0.9  Notes :<br> 1. V 2. IDGS = 250  = 0 VµA 0.5  Notes :1. VGS = 10 V<br>2. ID = 7.5 A<br>0.8 0.0<br>-100 -50 0 50 100 150 200 -100 -50 0 50 100 150 200<br>TJ, Junction Temperature [°C] TJ, Junction Temperature [°C]<br>Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current<br> vs. Case Temperature<br>16<br>Operation in This Area<br>102 is Limited by R DS(on) 14<br>eee eee eeae Seewo}seepaAcON,eeex eee~ 6 Neee 100  -_ µs10 µ | s 12<br>101 2 7 - XN ~ Nae~T x nal 1 ms . al1 10<br>’ . . 10 ms .<br>a 7 4 . 100 ms . . ~s x L ‘ x 41 8<br>a DC ~ . ss 1<br>y . > TyN 6<br>100 Neraae<br> Notes : < <1 4<br>1. TC = 25°C<br>2. TJ = 150°C 2<br>3. Single Pulse<br>10-1100 101 102 103 025 50 75 100 125 150<br>VDS, Drain-Source Voltage [V] TC, Case Temperature [°C]<br>Figure 11. Transient Thermal Response Curve<br>1 0 0<br>D = 0 .5<br>Zaz<br>Z<br>0 .2  N o te s  :<br>1 0 -1    1 . Z θ J C (t) =  0 .5 8   ° C /W  M a x .<br>0 .1   2 . D u ty F a c to r, D = t 1 /t 2<br>   3 . T J M  - T C  =  P D M  * Z θ J C (t)<br>0 .0 5<br>0 .0 2 PDM<br>0 .0 1 t1<br>1 0 -2 s in g l e u ls e t2<br>1 0 -5 1 0 -4 1 0 -3 1 0 -2 1 0 -1 1 0 0 1 0 1<br>t 1 , S q u a re  W a v e  P u ls e  D u ra tio n  [s e c ]<br>, (Normalized) , (Normalized)<br>DSS DS(ON)<br>BV R<br>Drain-Source On-Resistance<br>Drain-Source Breakdown Voltage<br>, Drain Current [A]ID , Drain Current [A]ID<br>oC/W](t), Thermal Response [<br>ZJ Cθ<br>**----- End of picture text -----**<br>


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©2007 Fairchild Semiconductor Corporation FQA13N50CF Rev C2 

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VGS<br>Same Type<br>50KΩ as DUT Qg<br>12V 200nF 300nF 10V<br>VGS VDS Qgs Qgd<br>DUT<br>IG = const.<br>Charge<br> Figure 12. Gate Charge Test Circuit & Waveform<br>VDS RL VDS 90%<br>VGS VDD<br>RG<br>10%<br>VGS DUT VGS<br>td(on) tr td(off) tf<br>t on t off<br> Figure 13. Resistive Switching Test Circuit & Waveforms<br>L BVDSS<br>VDS EAS [=] --21-- L IAS2 --------------------BVDSS - VDD<br>I D BVDSSIAS<br>RG VDD ID (t)<br>V GS DUT VDD VDS (t)<br>t p t p Time<br>**----- End of picture text -----**<br>


**Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms** 

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©2007 Fairchild Semiconductor Corporation FQA13N50CF Rev C2 

**==> picture [335 x 523] intentionally omitted <==**

**----- Start of picture text -----**<br>
DUT +<br>VDS<br>_<br>I SD<br>L<br>Driver<br>RG<br>Same Type<br>as DUT VDD<br>VGS • dv/dt controlled by  RG<br>• ISD controlled by pulse period<br>Gate Pulse Width<br>VGS D = --------------------------<br>Gate Pulse Period 10V<br>( Driver )<br>— ay<br>IFM , Body Diode Forward Current<br>I SD<br>( DUT ) di/dt<br>IRM<br>4 Ne<br>Body Diode Reverse Current<br>VDS<br>( DUT ) Body Diode Recovery dv/dt<br>VSD VDD<br>TT<br>Body Diode<br>Forward Voltage Drop<br>**----- End of picture text -----**<br>


**Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms** 

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**6** 

©2007 Fairchild Semiconductor Corporation FQA13N50CF Rev C2 

## **Mechanical Dimensions** 

## **Figure 16. TO3PN, 3-Lead, Plastic, EIAJ SC-65** 

_Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products._ 

_Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:_ 

_http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT3PN-003_ 

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**7** 

©2007 Fairchild Semiconductor Corporation FQA13N50CF Rev C2 

## **TRADEMARKS** 

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 

|AccuPower™<br>AX-CAP®*<br>BitSiC™<br>Build it Now™<br>CorePLUS™<br>CorePOWER™<br>_CROSSVOLT_™<br>CTL™<br>Current Transfer Logic™<br>DEUXPEED®<br>Dual Cool™<br>EcoSPARK®<br>EfficentMax™<br>ESBC™<br>Fairchild®<br>Fairchild Semiconductor®<br>FACT Quiet Series™<br>FACT®<br>FAST®<br>FastvCore™<br>FETBench™<br>FPS™<br>®<br>~~F~~|F-PFS™<br>FRFET®<br>Global Power ResourceSM<br>GreenBridge™<br>Green FPS™<br>Green FPS™ e-Series™<br>G_max_™<br>GTO™<br>IntelliMAX™<br>ISOPLANAR™<br>Marking Small Speakers Sound Louder<br>and Better™<br>MegaBuck™<br>MICROCOUPLER™<br>MicroFET™<br>MicroPak™<br>MicroPak2™<br>MillerDrive™<br>MotionMax™<br>mWSaver®<br>OptoHiT™<br>OPTOLOGIC®<br>OPTOPLANAR®|PowerTrench®<br>PowerXS™<br>Programmable Active Droop™<br>QFET®<br>QS™<br>Quiet Series™<br>RapidConfigure™<br>Saving our world, 1mW/W/kW at a time™<br>SignalWise™<br>SmartMax™<br>SMART START™<br>Solutions for Your Success™<br>SPM®<br>STEALTH™<br>SuperFET®<br>SuperSOT™-3<br>SuperSOT™-6<br>SuperSOT™-8<br>SupreMOS®<br>SyncFET™<br>Sync-Lock™<br>™<br>tm®|®*<br>TinyBoost®<br>TinyBuck®<br>TinyCalc™<br>TinyLogic®<br>TINYOPTO™<br>TinyPower™<br>TinyPWM™<br>TinyWire™<br>TranSiC™<br>TriFault Detect™<br>TRUECURRENT®*<br>μSerDes™<br>UHC®<br>Ultra FRFET™<br>UniFET™<br>VCX™<br>VisualMax™<br>VoltagePlus™<br>XS™<br>仙童™<br>[Ec<br>"ZA...|
|---|---|---|---|



*Trademarks of System General Corporation, used under license by Fairchild Semiconductor. 

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As used here in: 

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## **ANTI-COUNTERFEITING POLICY** 

Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support. 

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. 

## **PRODUCT STATUS DEFINITIONS Definition of Terms** 

|**Definition of Terms**|||
|---|---|---|
|**Datasheet Identification**|**Product Status**|**Definition**|
|Advance Information|Formative / In Design|Datasheet contains the design specifications for product development. Specifications<br>may change in any manner without notice.|
|Preliminary|First Production|Datasheet contains preliminary data; supplementary data will be published at a later<br>date. Fairchild Semiconductor reserves the right to make changes at any time without<br>notice to improve design.|
|No Identification Needed|Full Production|Datasheet contains final specifications. Fairchild Semiconductor reserves the right to<br>make changes at any time without notice to improve the design.|
|Obsolete|Not In Production|Datasheet contains specifications on a product that is discontinued by Fairchild<br>Semiconductor. The datasheet is for reference information only.|



Rev. I68 

©2007 Fairchild Semiconductor Corporation FQA13N50CF Rev C2 

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**8** 

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