# PFC INTELLIGENT POWER MODULE, 600V, 30A ![Product image](https://novapart.co/image/farnell:3617551/) **URL**: https://novapart.co/products/FPAM30LH60/pfc-intelligent-power-module-600v-30a **SKU**: FPAM30LH60 **Manufacturer**: ONSEMI **Category**: Semiconductors - Discretes || Intelligent Power Modules **Price**: €14.9900 **Stock**: 10+ **Lead Time**: 106 days (indicative) ## Specifications | Parameter | Value | |---|---| | Svhc | Lead (25-Jun-2025) | ## Datasheet 📄 [Download PDF](https://novapart.co/datasheet/farnell:3617551/) ## **Is Now Part of** ## **To learn more about ON Semiconductor, please visit our website at www.onsemi.com** Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. **==> picture [40 x 9] intentionally omitted <==** **----- Start of picture text -----**
July 2016
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## **FPAM30LH60** ## **PFC SPM[®] 2 Series for 2-Phase Interleaved PFC** ## **Features** - UL Certified No.E209204 (UL1557) - 600 V - 30 A 2-Phase Interleaved PFC with Integral Gate Driver and Protection - Very Low Thermal Resistance Using Al2O3 DBC Substrate - Full-Wave Bridge Rectifier and High-Performance Output Diode - Optimized for 20kHz Switching Frequency - Built-in NTC Thermistor for Temperature Monitoring ## **General Description** The FPAM30LH60 is a PFC SPM[®] 2 module providing a fully-featured, high-performance Interleaved PFC (Power Factor Correction) input power stage for consumer, medical, and industrial applications. These modules integrate optimized gate drive of the built-in IGBTs to minimize EMI and losses, while also providing multiple on-module protection features including under-voltage lockout, over-current shutdown, thermal monitoring, and fault reporting. These modules also feature a fullwave rectifier and high-performance output diodes for additional space savings and mounting convenience. - Isolation Rating: 2500 Vrms/min ## **Applications** - 2-Phase Interleaved PFC Converter **Fig. 1. Package Overview** **Package Marking and Ordering Information** **Device Device Marking Package Packing Type Quantity** FPAM30LH60 FPAM30LH60 S32EA-032 Rail 8 ~~Ee~~ 1 ©2012 Fairchild Semiconductor Corporation FPAM30LH60 Rev. 1.5 www.fairchildsemi.com ## **Integrated Drive, Protection and System Control Functions** - For IGBTs: gate drive circuit, Over-Current Protection (OCP), control supply circuit Under-Voltage Lock-Out (UVLO) Protection - Fault signal: corresponding to OC and UV fault - Built-in thermistor: temperature monitoring - Input interface : active-HIGH interface, works with 3.3 / 5 V logic, Schmitt trigger input **Pin Configuration** **==> picture [453 x 294] intentionally omitted <==** **----- Start of picture text -----**
(1)CSC (24)P
(2)COM (25)P
(3)VFO
(4)INX (26)PY
(5)INY
(6)COM (27)n.c.
(7)n.c.
(8)VCC (28)PX
(9)VCC Case temperature(TC)
(10)COM (11)RTH (29)X detecting point
(12)VTH
(13)NR
Ta (14)NR (30)Y
(15)n.c.
(16)n.c. (31)NP
(17)n.c.
(18)R
(19)R
(20)n.c. (32)PR
(21)n.c.
(22)S
(23)S Dimension unit: millimeter
**----- End of picture text -----**
**Figure 2. Top View** 2 ©2012 Fairchild Semiconductor Corporation FPAM30LH60 Rev. 1.5 www.fairchildsemi.com ## **Pin Descriptions** |**Pin Number**|**Pin Name**|**Pin Description**| |---|---|---| |1|CSC|Signal Input for Over-Current Detection| |2,6,10|COM|Common Supply Ground| |3|VFO|Fault Output| |4|INX|PWM Input for X IGBT Drive| |5|INY|PWM Input for Y IGBT Drive| |7|N.C|No Connection| |8,9|VCC|Common Supply Voltage of IC for IGBT Drive| |11|RTH|Series Resistor for The Use of Thermistor| |12|VTH|Thermistor Bias Voltage| |13,14|NR|Negative DC-Link of Rectifier Diode| |15,16,17|N.C|No Connection| |18,19|R|AC Input for R-Phase| |20,21|N.C|No Connection| |22,23|S|AC Input for S-Phase| |24,25|P|Output of Diode| |26|PY|Input of Diode| |27|N.C|No Connection| |28|PX|Input of Diode| |29|X|Output of X Phase IGBT| |30|Y|Output of Y Phase IGBT| |31|NP|Negative DC-Link of IGBT| |32|PR|Positive DC-Link of Rectifier Diode| ## **Internal Equivalent Circuit** **==> picture [290 x 222] intentionally omitted <==** **----- Start of picture text -----**
(11)RTH (24)(25)P
THERMISTOR
(12)VTH (26)PY
(28)PX
(1)CSC
CSC
(29)X
(3)VFO
VFO
(30)Y
(4)INX
INX
(5)INY OUT X (32)PR
INY
(8)(9)VCC
VCC (18)(19)R
(2)(6)(10) OUT Y
(22)(23)S
COM
COM
(31)NP (13)(14)NR
**----- End of picture text -----**
**Figure 3. Internal Block Diagram** 3 ©2012 Fairchild Semiconductor Corporation FPAM30LH60 Rev. 1.5 www.fairchildsemi.com ## **Absolute Maximum Ratings** (TJ = 25°C, unless otherwise specified.) ## **Converter Part** |**Symbol**|**Parameter**|**Conditions**|**Rating**|**Unit**| |---|---|---|---|---| |Vi|Input Supply Voltage|Applied between R - S|264|Vrms| |VPN|Output Voltage|Applied between X - NP, Y - NP, P - PX, P - PY|450|V| |VPN(Surge)|Output Supply Voltage (Surge)|Applied between X - NP, Y - NP, P - PX, P - PY|500|V| |VCES|Collector-emitter Voltage|Breakdown Voltage between X - NP, Y - NP|600|V| |VRRM|Repetitive Peak Reverse Voltage of FRD|Breakdown Voltage between P - PX, P - PY|600|V| |VRRMR|Repetitive Peak Reverse Voltage of Rec-
tifier|Breakdown Voltage between PR- R, PR- S,
R - NR, S - NR|900|V| |*IF|FRD Forward Current|TC = 25°C, TJ < 125°C|30|A| |*IFSM|Peak Surge Current of FRD|Non-Repetitive, 60 Hz Single Half-Sine Wave|300|A| |*IFR|Rectified Forward Current|TC = 25°C, TJ < 125°C|30|A| |*IFSMR|Peak Surge Current of Rectifier|Non-Repetitive, 60 Hz Single Half-Sine Wave|300|A| |± *IC|Each IGBT Collector Current|TC = 25°C, TJ < 125°C|30|A| |± *ICP|Each IGBT Collector Current(Peak)|TC = 25°C, TJ < 125°C,
Under 1 ms Pulse Width|60|A| |*PC|Collector Dissipation|TC= 25°C per IGBT|107|W| |TJ|Operating Junction Temperature|(1st Note 1)|-40 ~ 125|°C| **1st Notes:** 1. The maximum junction temperature rating of the power chips integrated within the PFC SPM **[®]** product is 125°C. 2. Marking “ * “ is calculation value or design factor. ## **Control Part** |**Symbol**|**Parameter**|**Conditions**|**Rating**|**Unit**| |---|---|---|---|---| |VCC|Control Supply Voltage|Applied between VCC- COM|20|V| |VIN|Input Signal Voltage|Applied between INX, INY- COM|-0.3 ~ VCC+ 0.3|V| |VFO|Fault Output Supply Voltage|Applied between VFO- COM|-0.3 ~ VCC+ 0.3|V| |IFO|Fault Output Current|Sink Current at VFOPin|1|mA| |VSC|Current Sensing Input Voltage|Applied between CSC- COM|-0.3 ~ VCC+ 0.3|V| ## **Total System** |**Symbol**|**Parameter**|**Conditions**|**Rating**|**Unit**| |---|---|---|---|---| |TSTG|Storage Temperature||-40 ~ 125|°C| |VISO|Isolation Voltage|60 Hz, Sinusoidal, AC 1 Minute, Connect
Pins to Heat-Sink Plate|2500|Vrms| ## **Thermal Resistance** |**Symbol**|**Parameter**|**Condition**|**Min.**|**Typ.**|**Max.**|**Unit**| |---|---|---|---|---|---|---| |Rth(j-c)Q|Junction to Case Thermal
Resistance|Each IGBT under Operating Condition|-|-|0.93|°C/W| |Rth(j-c)D||Each Diode under Operating Condition|-|-|1.42|°C/W| |Rth(j-c)R||Each Rectifier under Operating Condition|-|-|0.74|°C/W| 4 ©2012 Fairchild Semiconductor Corporation FPAM30LH60 Rev. 1.5 www.fairchildsemi.com **Electrical Characteristics** (TJ = 25°C, unless otherwise specified.) ## **Converter Part** |**Symbol**|**Parameter**|**Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**| |---|---|---|---|---|---|---| |VCE(SAT)|IGBT Saturation Voltage
V|CC= 15 V, VIN= 5 V, IC= 30 A|-|1.7|2.2|V| |VFF|FRD Forward Voltage
IF|= 30 A|-|1.9|2.4|V| |VFR|Rectifier Forward Voltage
IF|R= 30 A|-|1.10|1.25|V| |IRR|Switching Characteristic
VP
VI
pe|N= 400 V, VCC= 15 V, IC= 15 A,
N= 0 V5 V, Inductive Load (1st Note 3
r IGBT|),
-
-
-
-
-
-|11|-|A| |tRR||||41|-|ns| |tON||||700|-|ns| |tOFF||||852|-|ns| |tC(ON)||||104|-|ns| |tC(OFF)||||102|-|ns| |ICES|Collector - Emitter
Leakage Current
V|CES= 600 V|-|-|250|A| ## **1st Notes:** 3. tON and tOFF include the propagation delay of the internal drive IC. tC(ON) and tC(OFF) are the switching time of IGBT itself under the given gate driving condition internally. For the detailed information, please see Figure 4. **==> picture [350 x 230] intentionally omitted <==** **----- Start of picture text -----**
100% IC 100% IC
tRR
VCE IRR IC
90% IC
10% IC
10% IC 10% VCE 10% VCE
VIN
tON tOFF
tC(ON) tC(OFF)
(a) turn-on (b) turn-off
**----- End of picture text -----**
**Figure 4. Switching Time Definition** 5 ©2012 Fairchild Semiconductor Corporation FPAM30LH60 Rev. 1.5 www.fairchildsemi.com ## **Control Part** |**Symbol**|**Parameter**|**Parameter**|**Conditions**|**Conditions**|**Conditions**|**Conditions**|**Conditions**|**Conditions**|**Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**| |---|---|---|---|---|---|---|---|---|---|---|---|---|---| |IQCC|Quiescent VCCSupply
Current||VCC= 15 V, INX, INY- COM = 0 V, Supply current
between VCCand COM|||||||-|-|2.65|mA| |IPCC|Operating VCCSupply
Current||VCC= 15 V, fPWM= 20 kHz, Duty = 50%
Applied to One PWM Signal Input per IGBT
Supply Current between VCCand COM|||||||-|-|6.0|mA| |VFOH|Fault Output Voltage||VSC= 0 V, VFOCircuit: 10 kto 5 V Pull-up|||||||4.5|-|-|V| |VFOL|||VSC= 1 V, VFOCircuit: 10 kto 5 V Pull-up|||||||-|-|0.5|V| |VSC(Ref)|Over-Current Protection Trip
Level Voltage of CSC Pin||VCC= 15 V|||||||0.45|0.50|0.55|V| |UVCCD|Supply Circuit Under-
Voltage Protection||Detection Level|||||||10.5|-|13.0|V| |UVCCR|||Reset Level|||||||11.0|-|13.5|V| |tFOD|Fault-Out Pulse Width|||||||||30|-|-|s| |VIN(ON)|ON Threshold Voltage||Applied between INX, INY- COM|||||||2.6|-|-|V| |VIN(OFF)|OFF Threshold Voltage||Applied between INX, INY- COM|||||||-|-|0.8|V| |RTH|Resistance|of Thermistor|at TTH= 25°C (1st Note 4, Figure 5)|||||||-|47|-|k| ||||at TTH= 100°C (1st Note 4, Figure 5)|||||||-|2.9|-|k| |**1st Notes:**
4. TTHis the temperature of therm

0
50
100
150
200
**Resistance RTH[k****]**||ister itself. To know ca|se temperature ( TC), please make the experiment considering yo||||||||||| |||||**R-T Curve**|||||||||| ||||**Resistance RTH[k****]**|1
2
3
4|||||||||| ||||||||||||||| ||||||95
1|00
1|||||||| ||||||||||||||| **Figure 5. R-T Curve of The Built-in Thermistor** 6 ©2012 Fairchild Semiconductor Corporation FPAM30LH60 Rev. 1.5 www.fairchildsemi.com **Recommended Operating Conditions** (TJ = 25°C, unless otherwise specified.) |**Recommended Operating Conditions** (TJ = 25°C, unless otherwise specified.)J = 25°C, unless otherwise specified.)= 25°C, unless otherwise specified.)|||||| |---|---|---|---|---|---| |**Mechanical Characteristics and Ratings**
**Symbol**
**Parameter**
**Conditions**
**Min.**
Vi
Input Supply Voltage
Applied between R - S
187
Ii
Input Current
TC< 100°C, Vi= 220 V, VO= 360 V,
fPWM= 20 kHz per IGBT
-
VPN
Supply Voltage
Applied between X - NP, Y - NP, P - PX, P - PY
-
VCC
Control Supply Voltage
Applied between VCC - COM
13.5
dVCC/dt
Supply Variation
-1
IFO
Fault Output Current
Sink Current at VFOPin
-
fPWM
PWM Input Frequency
-40°C < TJ< 125°C per IGBT
-
**Parameter**
**Conditions**
**Min.**
Mounting Torque
Mounting Screw: M4
Recommended 0.98 N•m
0.78
Recommended 10 kg•cm
8
Device Flatness
See Figure 6
0
Weight
-
~~on~~||**Typ.**
-
-
-
15.0
-
-
20
**Typ.**
0.98
10
-
32|**Max.**
253
21
400
16.5
1
1
-
**Max.**
1.17
12
+150
-||**Unit**
Vrms
Arms
V
V
V /s
mA
kHz
**Unit**
N•m
kg•cm
m
g| |**Figure 6. Flatness Measurement Position**|||||| 7 ©2012 Fairchild Semiconductor Corporation FPAM30LH60 Rev. 1.5 www.fairchildsemi.com ## **Time Charts of Protective Function** **==> picture [328 x 183] intentionally omitted <==** **----- Start of picture text -----**
Input Signal
Protection
RESET SET RESET
Circuit State
UVCCR
a1 a6
Control UVCCD a3
Supply Voltage
a2
a4 a7
Output Current
a5
Fault Output Signal
**----- End of picture text -----**
a1 : Control supply voltage rises: after the voltage rises UVCCR, the circuits start to operate when the next input is applied. a2 : Normal operation: IGBT ON and carrying current. a3 : Under-voltage detection (UVCCD). a4 : IGBT OFF in spite of control input condition. a5 : Fault output operation starts. a6 : Under-voltage reset (UVCCR). a7 : Normal operation: IGBT ON and carrying current. **Figure 7. Under-Voltage Protection** (with the external over current detection circuit) c1 : Normal operation: IGBT ON and carrying current. c2 : Over-current detection (OC trigger). c3 : Hard IGBT gate interrupt. c4 : IGBT turns OFF. **==> picture [316 x 223] intentionally omitted <==** **----- Start of picture text -----**
Input Voltage (VIN)
c6 c7
Internal IGBT
c4
Gate-Emitter Voltage c3 c4 : IGBT turns OFF.
c2
OC
c1 c8 : IGBT OFF state.
Output Current c8
Input signal to CSC
SET RESET
pin for Protection
Fault Output Signal c5
**----- End of picture text -----**
c5 : Fault output timer operation starts. c6 : Input “LOW”: IGBT OFF state. c7 : Input “HIGH”: IGBT ON state, but during the active period of fault output the IGBT doesn’t turn ON. **Figure 8. Over-Current Protection** 8 ©2012 Fairchild Semiconductor Corporation FPAM30LH60 Rev. 1.5 www.fairchildsemi.com **==> picture [468 x 271] intentionally omitted <==** **----- Start of picture text -----**
Input signal for over +5 V
Current sensing
current protection RT
RTH P
V TH THERMISTOR PX
+5 V RSCF PY
CSC
RFO CSCF X
VFO Y
L
C F L VDC
INX OUT X PR
R F C F INY VAC
R F +15 V VCC OUT Y RS
COM
DY DX
NP N R
MCU /
Controller
**----- End of picture text -----**
## **Figure 9. Typical Application Circuit** ## **2nd Notes:** 1. To avoid malfunction, the wiring of each input should be as short as possible(less than 2 ~ 3 cm). 2. VFO output is open-drain type. This signal line should be pulled up to the positive-side of the MCU or control power supply with a resistor that makes IFO up to 1 mA. 3. Input signal is active-HIGH type. There is a 5 k Ω resistor inside the IC to pull-down each input signal line to GND. RC coupling circuits is recommanded for the prevention of input signal oscillation. RFCF constant should be selected in the range 50~150ns(recommended RF = 100 Ω , CF = 1 nF). 4. To prevent error of the protection function, the wiring related with RSCF and CSCF should be as short as possible. 5. In the over current protection circuit, please select the RSCF , CSCF time constant in the range 1.5 ~ 2 μ s. 6. Each capacitors should be mounted as close to the PFC SPM **[®]** product pins as possible. 7. Relays are used at almost every systems of electrical equipments of home appliances. In these cases, there should be sufficient distance between the MCU / controller and the relays. 8. Internal NTC thermistor can be used for monitoring of the case temperature and protecting the device from the overheating operation. Select an appropriate resistor RT according to the application. 9. It is recommended that anti-parallel diode ( DX , DY) be connected with each IGBT. 9 ©2012 Fairchild Semiconductor Corporation FPAM30LH60 Rev. 1.5 www.fairchildsemi.com ## **Detailed Package Outline Drawings** **==> picture [426 x 537] intentionally omitted <==** _Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or data on the drawing and contact a FairchildSemiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide therm and conditions, specifically the the warranty therein, which covers Fairchild products._ _Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:_ _- https://www.fairchildsemi.com/package drawings/MO/MOD32BA.pdf_ 10 ©2012 Fairchild Semiconductor Corporation FPAM30LH60 Rev. 1.5 www.fairchildsemi.com ## **TRADEMARKS** The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 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This product may not be used in the following applications, unless specifically approved in writing by a Fairchild officer: (1) automotive or other transportation, (2) military/aerospace, (3) any safety critical application – including life critical medical equipment – where the failure of the Fairchild product reasonably would be expected to result in personal injury, death or property damage. Customer’s use of this product is subject to agreement of this Authorized Use policy. In the event of an unauthorized use of Fairchild’s product, Fairchild accepts no liability in the event of product failure. In other respects, this product shall be subject to Fairchild’s Worldwide Terms and Conditions of Sale, unless a separate agreement has been signed by both Parties. ## **ANTI-COUNTERFEITING POLICY** Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Terms of Use Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. ## **PRODUCT STATUS DEFINITIONS** ## **Definition of Terms** ## **Datasheet Identification Product Status Definition** Advance Information Formative / In Design Preliminary First Production No Identification Needed Full Production Obsolete Not In Production Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. 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