# IGBT, 60 A, 2.9 V, 180 W, 1 kV, TO-264, 3 Pins

![Product image](https://novapart.co/image/farnell:1095037/)

**URL**: https://novapart.co/products/FGL60N100BNTD./igbt-60-a-29-v-180-w-1-kv-to-264-3-pins
**SKU**: FGL60N100BNTD.
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || IGBTs || Single IGBTs
**Price**: €3.0700
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Power Dissipation | 180W |
| Transistor Mounting | Through Hole |
| Transistor Case Style | TO-264 |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 60A |
| Collector Emitter Voltage Max | 1kV |
| Collector Emitter Saturation Voltage | 2.9V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1095037/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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March 2014<br>**----- End of picture text -----**<br>


## **FGL60N100BNTD** 

## **1000 V, 60 A NPT Trench IGBT** 

## **Features** 

- High Speed Switching 

- Low Saturation Voltage: VCE(sat) = 2.5 V @ IC = 60 A 

- High Input Impedance 

- Built-in Fast Recovery Diode 

## **Applications** 

## **General Description** 

Using Fairchild's proprietary trench design and advanced NPT technology, the 1000V NPT IGBT offers superior conduction and switching performances, high avalanche ruggedness and easy parallel operation. This device offers the optimum performance for hard switching application such as UPS, welder applications. 

- UPS, Welder 

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**----- Start of picture text -----**<br>
C<br>G<br>TO-264 3L<br>G  C  E<br>E<br>Absolute Maximum Ratings<br>a Symbol  a Description Ratings Unit<br>ee VCES EC Collector to Emitter Voltage 1000 V<br>VGES Gate to Emitter Voltage  25 V<br>a ES —e—E ET<br>pf Collector Current @ TC = 25 [o] C 60 A<br>IC Collector Current @ TC = 100 [o] C 42 A<br>_0—l eC ae<br>=, ICM (1) Pulsed Collector Current                                   @ TC = 25 [o] C   200 A<br>IF Diode Continuous Forward Current @ TC = 100 [o] C   15 A<br>OO ° »}» |) — ay<br>PD Maximum Power Dissipation          @ TC = 25 [o] C 180 W<br>a<br>Maximum Power Dissipation  @ TC = 100 [o] C 72 W<br>TJ . Operating Junction Temperature  |~§ may -55 to +150 oC |<br>||. Tstg Storage Temperature Range —6Ll ll -55 to +150 ee oC |<br>TL Maximum Lead Temp. for solderingPurposes, 1/8” from case for 5 seconds 300 oC<br>Notes:<br>1: Repetitive rating: Pulse width limited by max. junction temperature<br>Thermal Characteristics<br>Symbol Parameter Ratings Unit<br>RJC(IGBT) Thermal Resistance, Junction to Case  0.69 oC / W<br>RJC(Diode) Thermal Resistance, Junction to Case  2.08 oC / W<br>RJA Thermal Resistance, Junction to Ambient 25 oC / W<br>**----- End of picture text -----**<br>


**1** 

©2000 Fairchild Semiconductor Corporation FGL60N100BNTD Rev. C2 

www.fairchildsemi.com 

## **Package Marking and Ordering Information** 

|**Symbol**|**Parameter**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|**Off Characteristics**|||||||
|BVCES|Collector to Emitter Breakdown Voltage V|Collector to Emitter Breakdown Voltage VGE= 0 V, IC= 1 mA|1000|-|-|V|
|ICES|Collector Cut-Off Current|VCE= VCES, VGE= 0 V|-|-|1|mA|
|IGES|G-E Leakage Current|VGE= VGES, VCE= 0 V|-|-|±500|nA|
|**On Characteristics**|||||||
|VGE(th)|G-E Threshold Voltage|IC= 60 mA, VCE= VGE|4.0|5.0|7.0|V|
|VCE(sat)|Collector to Emitter Saturation Voltage|IC=10 A,VGE= 15 V|-|1.5|1.8|V|
|||IC= 60 A,VGE= 15 V,|-|2.5|2.9|V|
|**Dynamic Characteristics**|||||||
|Cies|Input Capacitance|VCE= 10 V,VGE= 0 V,<br>f = 1MHz|-|6000|-|pF|
|Coes|Output Capacitance||-|260|-|pF|
|Cres|Reverse Transfer Capacitance||-|200|-|pF|
|**Switching Characteristics**|||||||
|td(on)|Turn-On Delay Time|VCC= 600 V, IC= 60 A,<br>RG= 51, VGE= 15 V,<br>Inductive Load, TC= 25oC|-|140|-|ns|
|tr|Rise Time||-|320|-|ns|
|td(off)|Turn-Off Delay Time||-|630|-|ns|
|tf|Fall Time||-|130|-|ns|
|Qg|Total Gate Charge|VCE= 600 V, IC= 60 A,<br>VGE= 15 V, TC= 25oC|-|275|-|nC|
|Qge|Gate to Emitter Charge||-|45|-|nC|
|Qgc|Gate to Collector Charge||-|95|-|nC|



**Electrical Characteristics of the Diode** TC = 25°C unless otherwise noted 

**Symbol Parameter Test Conditions Min. Typ. Max Unit** - 1.2 1.7 V VFM Diode Forward Voltage IF = 15 A - 1.8 2.1 V IF = 60 A - 1.2 1.5 us trr Diode Reverse Recovery Time IF = 60 A, di/dt = 20 A/us - 0.05 2.0 uA ~~SS~~ IR Instantaneous VRRM = 1000 V 

**2** 

©2000 Fairchild Semiconductor Corporation FGL60N100BNTD Rev. C2 

www.fairchildsemi.com 

## **Typical Performance Characteristics** 

**==> picture [417 x 363] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 90<br>Common Emitter 20V Common Emitter<br>80 T C  = 25℃ 15V10V 9V 8V 8070 VTT CCGE  =   25 = 125 = 15V℃℃ ------━━ T C  = 25 ℃<br>60<br>60 T C  = 125 ℃<br>50<br>40<br>40<br>30<br>7V<br>20 20<br>10<br>VGE = 6V<br>0 0<br>0 1 2 3 4 5 0 1 2 3 4<br>Collector-Emitter Voltage, VCE [V] Collector-Emitter Voltage, VCE [V]<br>Figure 3. Saturation Voltage vs. Case                          Figure 4. Saturation Voltage vs. VGE GE<br>                   Temperature at Variant Current Level<br>10<br>Common Emitter Common Emitter<br>VGE=15V T C = - 40 OC<br>3 80A 8<br>60A<br>6<br>2 30A 4 60A30A<br>80A<br>IC=10A 2<br>1 I C =10A<br>0<br>-50 0 50 100 150 4 8 12 16 20<br>Case Temperature, TC [℃] Gate-Emitter Voltage, VGE [V]<br>Collector Current, I  [A]C Collector Current, I  [A]C<br> [V]CE [V]CE<br>Collector-Emitter Voltage, V Collector-Emitter Voltage, V<br>**----- End of picture text -----**<br>


**Figure 3. Saturation Voltage vs. Case                          Figure 4. Saturation Voltage vs. VGE GE Temperature at Variant Current Level** 

**Figure 5. Saturation Voltage vs. VGE                            Figure 6. Saturation Voltage vs. VGE** 

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10 10<br>Common Emitter Common Emitter<br>T C  = 25℃ TC = 125℃<br>8 8<br>6 6 30A<br>60A<br>30A 80A<br>4 60A 4<br>80A<br>2 2<br>I C = 10A IC = 10A<br>0 0<br>4 8 12 16 20 4 8 12 16 20<br>Gate-Emitter Voltage, VGE [V] Gate-Emitter Voltage, VGE [V]<br> [V]  [V]<br>CE CE<br>Collector-Emitter Voltage, V Collector-Emitter Voltage, V<br>**----- End of picture text -----**<br>


**3** 

©2000 Fairchild Semiconductor Corporation FGL60N100BNTD Rev. C2 

www.fairchildsemi.com 

## **Typical Performance Characteristics** 

## **Figure 7. Capacitance Characteristics                         Figure 8. Switching Loss vs. Gate Resistance** 

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**----- Start of picture text -----**<br>
10000<br>10000 VCC=600V, IC=60A<br>Cies V GE =? 5V<br>T C =25oC Tdoff<br>1000 Tr<br>1000<br>Tdon<br>Tf<br>Coes<br>100 Cres 100<br>Common Emitter<br>V GE  = 0V, f = 1MHz<br>TC = 25℃<br>0 5 10 15 20 25 30 10<br>0 50 100 150 200<br>Collector-Emitter Voltage, VCE [V] Gate Resistance, RG [? ]<br>Figure 9. Switching Characteristics vs.                        Figure 10. Gate Charge Characteristics<br>                   Collector Current<br>1000 20<br> V  VCC GE= =± 600V, Rg 15V, T C= =25 51Ω ℃ Common EmitterVTC CC =25 =600V℃ , R L =10 Ω<br>15<br>Tdoff<br>Tf 10<br>Tr<br>5<br>100 Tdon<br>0<br>10 20 30 40 50 60 0 50 100 150 200 250 300<br>Collector Current, IC [A] Gate Charge, Qg [nC]<br>Figure 11. SOA Characteristics                                     Figure 12. Forward Characteristics<br>100<br>IC MAX. (Pulsed)<br>100<br>IC MAX. (Continuous) 50us<br>100us 10 TC = 100 ℃<br>10<br>1ms<br>DC Operation T C  = 25 ℃<br>1<br>1 Single Nonrepetitive Pulse<br>TC = 25℃<br>Curve must be darated<br>linearly with increase<br>in temperature<br>0.1 0.1<br>1 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5<br>Collector-Emitter Voltage, VCE [V]  Forward Voltage, VFM [V]<br>Capacitance [pF] Switching Time [ns]<br> [V]<br>Switching Time [ns] GE<br>Gate-Emitter Voltage,V<br>Collector Current , I  [A]C Forward Current, I[A]F<br>**----- End of picture text -----**<br>


## **Figure 9. Switching Characteristics vs.                        Figure 10. Gate Charge Characteristics Collector Current** 

## **Figure 11. SOA Characteristics                                     Figure 12. Forward Characteristics** 

**4** 

©2000 Fairchild Semiconductor Corporation FGL60N100BNTD Rev. C2 

www.fairchildsemi.com 

## **Typical Performance Characteristics** 

**Figure 13. Reverse Recovery Characteristics     Figure 14. Reverse Recovery Characteristics vs. di/dt                                                                                    vs. Forward Current** 

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1.19 119<br>1.02 IT F =60AC=25? 102 1.2 di/dt=-20A/us T C =25? 12<br>0.85 85 1.0 10<br>t rr<br>0.68 t rr 68<br>0.8 8<br>0.51 51 Irr<br>0.34 34 0.6 6<br>0.17 I rr 17<br>0.4 4<br>0.00 0<br>0 40 80 120 160 200 240 10 20 30 40 50 60<br>di/dt [A/us] Forward Current, IF [A]<br>Figure 15. Reverse  Current vs. Reverse Voltage    Figure 16. Junction Capacitance<br>1000 250<br>TC = 25 ℃<br>100<br>TC = 150℃ 200<br>10<br>150<br>1<br>100<br>0.1<br>0.01 T C = 25℃ 50<br>1E-3<br>0<br>0 300 600 900<br>0.1 1 10 100<br>Reverse Voltage, VR [V] Reverse Voltage, VR [V]<br>Figure 17.Transient Thermal Impedance of IGBT<br>1 0<br>1<br>0 . 5<br>0 . 2<br>0 . 1 0 . 1<br>0 . 0 5<br>0 . 0 2 P DM<br>0 . 0 1 t1<br>0 . 0 1 t2<br>1 E - 3 s i n g l e  p u l s e<br>1 0 - 4 1 0 - 3 1 0 - 2 1 0 - 1 1 0 0 1 0 1<br>R e c t a n g u l a r  P u l s e  D u r a t i o n  [ s e c ]<br> [us]rr  [us]rr<br>Reverse Recovery Time, t rrReverse Recovery Current  I [A] Reverse Recovery Time,  t rrReverse Recovery Current   I [A]<br> [uA]R<br>Reverse Current, I Capacitance, C [pF]j<br>/W]<br>℃<br> [<br>THJC<br>Thermal Response, Z<br>**----- End of picture text -----**<br>


**Figure 15. Reverse  Current vs. Reverse Voltage    Figure 16. Junction Capacitance** 

**5** 

©2000 Fairchild Semiconductor Corporation FGL60N100BNTD Rev. C2 

www.fairchildsemi.com 

## **Mechanical Dimensions** 

## **Figure 18.  TO-264 3L - 3LD; TO264; MOLDED; JEDEC VARIATION AA** 

_Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products._ 

_Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:_ 

_http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TO264-003_ 

**6** 

©2000 Fairchild Semiconductor Corporation FGL60N100BNTD Rev. C2 

www.fairchildsemi.com 

## **TRADEMARKS** 

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 

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|---|---|---|---|---|---|---|
|AccuPower™|F-PFS™|Sync-Lock™|
|AX-CAP|[®]|*|FRFET|[®]|®|®*|
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|E|GENERALSYSTEM|
|Build it Now™|GreenBridge™|PowerXS™|
|CorePLUS™|Green FPS™|Programmable Active Droop™|TinyBoost|[®]|
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|CTL™|GTO™|Quiet Series™|TinyLogic|[®]|
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|EfficentMax™|MegaBuck™|SignalWise™|TriFault Detect™|
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|XS™|

**----- End of picture text -----**<br>


*Trademarks of System General Corporation, used under license by Fairchild Semiconductor. 

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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. 

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Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. 

## **PRODUCT STATUS DEFINITIONS Definition of Terms** 

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|---|---|---|
|Datasheet Identification|Product Status|Definition|
|Advance Information|Formative / In Design|Datasheet contains the design specifications for product development. Specifications|
|may change in any manner without notice.|
|Datasheet contains preliminary data; supplementary data will be published at a later|
|Preliminary|First Production|date. Fairchild Semiconductor reserves the right to make changes at any time without|
|notice to improve design.|
|No Identification Needed|Full Production|Datasheet contains final specifications. Fairchild Semiconductor reserves the right to|
|make changes at any time without notice to improve the design.|
|Obsolete|Not In Production|Datasheet contains specifications on a product that is discontinued by Fairchild|
|Semiconductor. The datasheet is for reference information only.|

**----- End of picture text -----**<br>


Rev. I66 

©2000 Fairchild Semiconductor Corporation FGL60N100BNTD Rev. C2 

www.fairchildsemi.com 

**7** 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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