# IGBT, 80 A, 1.45 V, 268 W, 650 V, TO-247, 4 Pins

![Product image](https://novapart.co/image/farnell:3929766/)

**URL**: https://novapart.co/products/FGHL50T65MQDTL4/igbt-80-a-145-v-268-w-650-to-247-4-pins
**SKU**: FGHL50T65MQDTL4
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || IGBTs || Single IGBTs
**Price**: €1.9600
**Stock**: 25+
**Lead Time**: 78 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 4Pins |
| Product Range | - |
| Power Dissipation | 268W |
| Transistor Mounting | Through Hole |
| Transistor Case Style | TO-247 |
| Operating Temperature Max | 175°C |
| Continuous Collector Current | 80A |
| Collector Emitter Voltage Max | 650V |
| Collector Emitter Saturation Voltage | 1.45V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3929766/)

## **ON Semiconductor** 

## **Is Now** 

**==> picture [390 x 69] intentionally omitted <==**

**To learn more about onsemi™, please visit our website at www.onsemi.com** 

**onsemi** and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as-is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. 

650 V, 50 A 

## Field Stop Trench IGBT 

## FGHL50T65MQDTL4 

Field stop 4[th] generation mid speed IGBT technology copacked with full rated current diode. 

## **Features** 

**www.onsemi.com** 

- Maximum Junction Temperature: TJ = 175°C 

- Positive Temperature Co−efficient for Easy Parallel Operating 

- High Current Capability 

- Low Saturation Voltage: VCE(Sat) = 1.45 V (Typ.) @ IC = 50 A 

**50 A, 650 V VCESat = 1.45 V** 

- 100% of the Parts are Tested for ILM (Note 2) 

- Smooth and Optimized Switching 

- Tight Parameter Distribution 

- RoHS Compliant 

## **Typical Applications** 

- Solar Inverter 

- UPS, ESS 

- PFC, Converters 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Parameter**|**Symbol**|**Value**|**Unit**|
|Collector to Emitter Voltage|VCES|650|V|
|Gate to Emitter Voltage<br>Transient Gate to Emitter Voltage|VGES|±20<br>±30|V|
|Collector Current (Note 1)<br>@ TC= 25°C<br>@ TC= 100°C|IC|80<br>50|A|
|Pulsed Collector Current (Note 2)|ILM|200|A|
|Pulsed Collector Current (Note 3)|ICM|200|A|
|Diode Forward Current (Note 1) @ TC =25°C<br>@ TC =100°C|IF|60<br>50|A|
|Pulsed Diode Maximum Forward Current|IFM|200|A|
|Maximum Power Dissipation @ TC= 25°C<br>@ TC= 100°C|PD|268<br>134|W|
|Operating Junction and Storage Temperature<br>Range|TJ,<br>TSTG|−55 to<br>+175|°C|
|Maximum Lead Temp. for Soldering<br>Purposes (1/8″from case for 5 s)|TL|260|°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

1. Value limit by bond wire 

2. VCC = 400 V, VGE = 15 V, IC = 200 A, Inductive Load, 100% tested 

3. Repetitive rating: pulse width limited by max. junction temperature 

**==> picture [161 x 193] intentionally omitted <==**

**----- Start of picture text -----**<br>
C<br>E1: Kelvin Emitter<br>E2: Power Emitter<br>G<br>E1 E2<br>TO−247−4LD<br>CASE 340CJ<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAM** 

**==> picture [191 x 217] intentionally omitted <==**

**----- Start of picture text -----**<br>
$Y&Z&3&K<br>FGHL50T65<br>MQDTL4<br>$Y = ON Semiconductor Logo<br>&Z = Assembly Plant Code<br>&3 = 3−Digit Date Code<br>&K = 2−Digit Lot Traceability Code<br>FGHL50T65MQDTL4 = Specific Device Code<br>ORDERING INFORMATION<br>Device Package Shipping<br>FGHL50T65MQDTL4 TO−247−4LD 30 Units / Tube<br>———<br>**----- End of picture text -----**<br>


Publication Order Number: **FGHL50T65MQDTL4/D** 

**1** 

© Semiconductor Components Industries, LLC, 2020 **April, 2021 − Rev. 0** 

**FGHL50T65MQDTL4** 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Thermal resistance junction−to−case, for IGBT|R�JC|0.56|°C/W|
|Thermal resistance junction−to−case, for Diode|R�JC|0.74|°C/W|
|Thermal resistance junction−to−ambient|R�JA|40|°C/W|



## **ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted) 

|**Parameter**|**Test Conditions**||**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|---|
|**OFF CHARACTERISTICS**||||||||
|Collector to Emitter Breakdown Voltage|VGE= 0 V,<br>IC= 1 mA||BVCES|650|−|−|V|
|Temperature Coefficient of Breakdown<br>Voltage|VGE= 0 V,<br>IC= 1 mA||�BVCES<br>�TJ|−|0.6|−|V/°C|
|Collector to Emitter Cut−off Current|VGE= 0 V,<br>VCE= 650 V||ICES|−|−|250|�A|
|Gate Leakage Current|VGE= 20 V,<br>VCE= 0 V||IGES|−|−|±400|nA|
|**ON CHARACTERISTICS**||||||||
|Gate to Emitter Threshold Voltage|VGE= VCE, IC= 50 mA||VGE(th)|3.0|4.5|6.0|V|
|Collector to Emitter Saturation Voltage|VGE= 15 V, IC= 50 A, TJ= 25°C<br>VGE= 15 V, IC= 50 A, TJ= 175°C||VCE(sat)|−<br>−|1.45<br>1.65|1.8<br>−|V|
|**DYNAMIC CHARACTERISTICS**||||||||
|Input Capacitance|VCE= 30 V,<br>VGE= 0 V,<br>f = 1 MHz||Cies|−|3335|−|pF|
|Output Capacitance|||Coes|−|105|−||
|Reverse Transfer Capacitance|||Cres|−|11|−||
|Gate Charge Total|VCE= 400 V,<br>IC= 50 A,<br>VGE= 15 V||Qg|−|99|−|nC|
|Gate to Emitter Charge|||Qge|−|17|−||
|Gate to Collector Charge|||Qgc|−|24|−||
|**SWITCHING CHARACTERISTICS, INDUCTIVE LOAD**||||||||
|Turn−on Delay Time|TJ= 25°C,<br>VCC= 400 V,<br>IC= 25 A,<br>RG= 30�,<br>VGE= 15 V||td(on)|−|45|−|ns|
|Rise Time|||tr|−|18|−||
|Turn−off Delay Time|||td(off)|−|360|−||
|Fall Time|||tf|−|51|−||
|Turn−on Switching Loss|||Eon|−|0.44|−|mJ|
|Turn−off Switching Loss|||Eoff|−|0.35|−||
|Total Switching Loss|||Ets|−|0.79|−||
|Turn−on Delay Time|TJ= 25°C,<br>VCC= 400 V,<br>IC= 50 A,<br>RG= 30�,<br>VGE= 15 V||td(on)|−|50|−|ns|
|Rise Time|||tr|−|27|−||
|Turn−off Delay Time|||td(off)|−|336|−||
|Fall Time|||tf|−|37|−||
|Turn−on Switching Loss|||Eon|−|1.00|−|mJ|
|Turn−off Switching Loss|||Eoff|−|0.85|−||
|Total Switching Loss|||Ets|−|1.85|−||



**www.onsemi.com** 

**2** 

**FGHL50T65MQDTL4** 

**ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted) 

|**Parameter**|**Test Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|**SWITCHING CHARACTERISTICS, INDUCTIVE LOAD**|||||||
|Turn−on Delay Time|TJ= 175°C,<br>VCC= 400 V,<br>IC= 25 A,<br>RG= 30�,<br>VGE= 15 V|td(on)|−|40|−|ns|
|Rise Time||tr|−|22|−||
|Turn−off Delay Time||td(off)|−|389|−||
|Fall Time||tf|−|85|−||
|Turn−on Switching Loss||Eon|−|0.84|−|mJ|
|Turn−off Switching Loss||Eoff|−|0.61|−||
|Total Switching Loss||Ets|−|1.45|−||
|Turn−on Delay Time|TJ= 175°C,<br>VCC= 400 V,<br>IC= 50 A,<br>RG= 30�,<br>VGE= 15 V|td(on)|−|43|−|ns|
|Rise Time||tr|−|35|−||
|Turn−off Delay Time||td(off)|−|365|−||
|Fall Time||tf|−|72|−||
|Turn−on Switching Loss||Eon|−|1.60|−|mJ|
|Turn−off Switching Loss||Eoff|−|1.30|−||
|Total Switching Loss||Ets|−|2.90|−||
|**DIODE CHARACTERISTICS**|||||||
|Diode Forward Voltage|IF= 50 A, TJ= 25°C|VF|−|1.65|2.1|V|
||IF= 50 A, TJ= 175°C||−|1.55|−||
|**DIODE SWITCHING CHARACTERISTICS, INDUCTIVE LOAD**|||||||
|Reverse Recovery Energy|TJ= 25°C, VCE= 400 V, IF= 25 A,<br>diF/dt = 1000 A/�s|Erec|−|65|−|�J|
|Diode Reverse Recovery Time||Trr|−|44|−|ns|
|Diode Reverse Recovery Charge||Qrr|−|387|−|nC|
|Diode Reverse Recovery Current||Irr|−|18|−|A|
|Reverse Recovery Energy|TJ= 25°C, VCE= 400 V, IF= 50 A,<br>diF/dt = 1000 A/�s|Erec|−|128|−|�J|
|Diode Reverse Recovery Time||Trr|−|79|−|ns|
|Diode Reverse Recovery Charge||Qrr|−|681|−|nC|
|Diode Reverse Recovery Current||Irr|−|17|−|A|
|Reverse Recovery Energy|TJ= 175°C, VCE= 400 V, IF= 25 A,<br>diF/dt = 1000 A/�s|Erec|−|380|−|�J|
|Diode Reverse Recovery Time||Trr|−|102|−|ns|
|Diode Reverse Recovery Charge||Qrr|−|1482|−|nC|
|Diode Reverse Recovery Current||Irr|−|29|−|A|
|Reverse Recovery Energy|TJ= 175°C, VCE= 400 V, IF= 50 A,<br>diF/dt = 1000 A/�s|Erec|−|544|−|�J|
|Diode Reverse Recovery Time||Trr|−|135|−|ns|
|Diode Reverse Recovery Charge||Qrr|−|2023|−|nC|
|Diode Reverse Recovery Current||Irr|−|30|−|A|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

**www.onsemi.com** 

**3** 

**FGHL50T65MQDTL4** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [237 x 175] intentionally omitted <==**

**----- Start of picture text -----**<br>
200<br>20 V TJ = 25 ° C<br>15 V<br>150 12 V<br>VGE = 8 V<br>10 V<br>100<br>50<br>0<br>0 1 2 3 4 5<br>VCE, Collector−Emitter Voltage (V)<br>, Collector Current (A)<br>IC<br>**----- End of picture text -----**<br>


**Figure 1. Typical Output Characteristics (TJ = 25** � **C)** 

**==> picture [237 x 174] intentionally omitted <==**

**----- Start of picture text -----**<br>
200<br>TJ = 175 ° C 20 V<br>15 V<br>150 12 V<br>10 V<br>VGE = 8 V<br>100<br>50<br>0<br>0 1 2 3 4 5<br>VCE, Collector−Emitter Voltage (V)<br>, Collector Current (A)<br>IC<br>**----- End of picture text -----**<br>


**Figure 2. Typical Output Characteristics (TJ = 175** � **C)** 

**==> picture [487 x 387] intentionally omitted <==**

**----- Start of picture text -----**<br>
200 100<br>Common Emitter Common Emitter<br>VGE = 15 V VCE = 15 V<br>TJ = 25 ° C 80 TJ = 25 ° C<br>150 T J  = 175 ° C TJ = 175 ° C<br>60<br>100<br>40<br>50<br>20<br>0 0<br>0 1 2 3 4 5 0 2 4 6 8 10<br>VCE, Collector−Emitter Voltage (V) VGE, Gate−Emitter Voltage (V)<br>Figure 3. Typical Saturation Voltage Characteristics Figure 4. Typical Transfer Characteristics<br>2.5 10000<br>Common Emitter<br>VGE = 15 V Cies<br>1000<br>2.0<br>100 A<br>100<br>Coes<br>1.5<br>50 A<br>10<br>Cres<br>Common Emitter<br>IC = 25 A V GE  = 0 V, f = 1 MHz<br>1.0 1<br>−100 −50 0 50 100 150 200 1 10 30<br>TJ, Junction Temperature ( ° C) VCE, Collector−Emitter Voltage (V)<br>, Collector Current (A) , Collector Current (A)<br>IC IC<br>C, Capacitance (pF)<br>, Collector−Emitter Saturation (V)<br>CE(Sat)<br>V<br>**----- End of picture text -----**<br>


**Figure 5. Saturation Voltage vs. Junction Temperature** 

**Figure 6. Capacitance Characteristics** 

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**4** 

**FGHL50T65MQDTL4** 

## **TYPICAL CHARACTERISTICS** (continued) 

**==> picture [490 x 601] intentionally omitted <==**

**----- Start of picture text -----**<br>
15 1000<br>Common Emitter<br>IC = 50 A VCC = 200 V<br>12<br>100 10  � s<br>300 V DC 100  � s<br>9 1 ms<br>400 V<br>10 10 ms<br>6<br>*Notes:<br>1<br>3 1. TC = 25 ° C<br>2. TJ = 175 ° C<br>3. Single Pulse<br>0 0.1<br>0 20 40 60 80 100 1 10 100 1000<br>Qg, Gate Charge (nC) VCE, Collector−Emitter Voltage (V)<br>Figure 7. Gate Charge Characteristics Figure 8. SOA Characteristics<br>100 1000<br>Common Emitter Common Emitter<br>TTVI CJ J CC  = 50 A = 25 = 175 = 400 V, V ° C ° C GE  = 15 V td(on) T VI TCJJ CC = 50 A  = 25 = 175  = 400 V, V ° C ° C GE = 15 V td(off)<br>100<br>tr<br>tf<br>10 10<br>0 10 20 30 40 50 0 10 20 30 40 50<br>Rg, Gate Resistance ( � ) Rg, Gate Resistance ( � )<br>Figure 9. Turn−on Characteristics vs. Gate Resistance Figure 10. Turn−off Characteristics vs. Gate Resistance<br>1000<br>Common Emitter Common Emitter<br>VCC = 400 V, VGE = 15 V VCC = 400 V, VGE = 15 V<br>R G  = 30  � RG = 30  �<br>T J  = 25 ° C 100 TJ = 25 ° C tf<br>100 T J = 175 ° C tr TJ = 175 ° C<br>td(on) td(off)<br>10<br>1 10<br>0 30 60 90 120 150 0 30 60 90 120 150<br>IC, Collector Current (A) IC, Collector Current (A)<br>, Collector Current (A)<br>, Gate−Emitter Voltage (V)GE IC<br>V<br>Switching Time (ns) Switching Time (ns)<br>Switching Time (ns) Switching Time (ns)<br>**----- End of picture text -----**<br>


**Figure 11. Turn−on Characteristics vs. Collector Current Figure 12. Turn−off Characteristics vs. Collector Current** 

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**5** 

**FGHL50T65MQDTL4** 

## **TYPICAL CHARACTERISTICS** (continued) 

**==> picture [238 x 175] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br>Common Emitter<br>VCC = 400 V, VGE = 15 V<br>IC = 50 A<br>TT J J = 175= 25 ° C ° C Eon<br>1<br>Eoff<br>0.1<br>0 10 20 30 40 50<br>Rg, Gate Resistance ( � )<br>Switching Loss (mJ)<br>**----- End of picture text -----**<br>


**Figure 13. Switching Loss vs. Gate Resistance** 

**==> picture [240 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br>Eon<br>1<br>Eoff<br>Common Emitter<br>VCC = 400 V, VGE = 15 V<br>RG = 30  �<br>TJ = 25 ° C<br>TJ = 175 ° C<br>0.1<br>0 30 60 90 120 150<br>IC, Collector Current (A)<br>Switching Loss (mJ)<br>**----- End of picture text -----**<br>


**Figure 14. Switching Loss vs. Collector Current** 

**==> picture [484 x 387] intentionally omitted <==**

**----- Start of picture text -----**<br>
200 35<br>Common Emitter VR = 400 V<br>150 T T J J  = 25  = 175 ° C ° C 30 ITT F JJ = 25 = 175= 50 A ° C ° C<br>25<br>20<br>100<br>15<br>10<br>50<br>5<br>0 0<br>0 1 2 3 4 5 400 600 800 1000 1200<br>VF, Forward Voltage (V) diF/dt, Diode Current Slop (A/ � s)<br>Figure 15. Forward Characteristics Figure 16. Reverse Recovery Current<br>250 2500<br>VR = 400 V<br>I F  = 50 A<br>200 TT J J = 25 = 175 ° C ° C 2000<br>VR = 400 V<br>150 1500 I F  = 50 A<br>T J  = 25 ° C<br>TJ = 175 ° C<br>100 1000<br>50 500<br>0 0<br>400 600 800 1000 1200 400 600 800 1000 1200<br>diF/dt, Diode Current Slop (A/ � s) diF/dt, Diode Current Slop (A/ � s)<br>, Forward Current (A)<br>IF<br>, Reverse Recovery Current (A)<br>Irr<br>, Reverse Recovery Time (ns)<br>trr , Reverse Recovery Charge (nC)rr<br>Q<br>**----- End of picture text -----**<br>


**Figure 17. Reverse Recovery Time** 

**Figure 18. Stored Charge** 

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**6** 

**FGHL50T65MQDTL4** 

## **TYPICAL CHARACTERISTICS** (continued) 

**==> picture [457 x 478] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>0.5 P DM<br>0.2 t1<br>0.1 t2<br>0.1<br>Duty Factor, D = t1 / t2<br>0.05 Peak Tj = Pdm x Zthjc + Tc<br>R1 R2<br>0.02<br>0.01<br>0.01<br>C1 = t1 / R1 C2 = t2 / R2<br>i: 1 2 3 4<br>Single Pulse ri [K/W]: 0.0546 0.1050 0.1612 0.0849<br>�  [s]: 7.970E−5 5.307E−4 5.680E−3 2.391E−2<br>0.001<br>10 [−6] 10 [−5] 10 [−4] 10 [−3] 10 [−2] 10 [−1] 10 [0] 10 [1]<br>Rectangular Pulse Duration (s)<br>Figure 19. Transient Thermal Impedance of IGBT<br>1<br>0.5<br>P DM<br>0.2<br>t1<br>0.1 0.1 t2<br>0.05 Duty Factor, D = t1 / t2<br>0.02 Peak Tj = Pdm x Zthjc + Tc<br>0.01 R1 R2<br>0.01<br>Single Pulse<br>C1 = t1 / R1 C2 = t2 / R2<br>i: 1 2 3 4<br>ri [K/W]: 0.0601 0.1621 0.1795 0.1784<br>�  [s]: 1.271E−5 4.801E−4 4.265E−3 3.207E−2<br>0.001<br>10 [−6] 10 [−5] 10 [−4] 10 [−3] 10 [−2] 10 [−1] 10 [0] 10 [1]<br>Rectangular Pulse Duration (s)<br>, Thermal Response (K/W)<br>thjc<br>Z<br>, Thermal Response (K/W)<br>thjc<br>Z<br>**----- End of picture text -----**<br>


**Figure 20. Transient Thermal Impedance of Diode** 

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**7** 

**FGHL50T65MQDTL4** 

## **PACKAGE DIMENSIONS** 

**TO−247−4LD** CASE 340CJ ISSUE A 

**==> picture [492 x 489] intentionally omitted <==**

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**8** 

**FGHL50T65MQDTL4** 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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