# IGBT, General Purpose, 80 A, 1.8 V, 290 W, 600 V, TO-247AD, 3 Pins

![Product image](https://novapart.co/image/farnell:1885750/)

**URL**: https://novapart.co/products/FGH80N60FD2TU/igbt-general-purpose-80-a-18-v-290-w-600-to-247ad
**SKU**: FGH80N60FD2TU
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || IGBTs || Single IGBTs
**Price**: €1.6700
**Stock**: 10+

## Description

DC Collector Current:80A; Collector Emitter Saturation Voltage Vce(on):600V; Power Dissipation Pd:290W; Collector Emitter Voltage V(br)ceo:600V; Transistor Case Style:TO-247AD; No. of

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Product Range | - |
| Power Dissipation | 290W |
| Transistor Mounting | Through Hole |
| Transistor Case Style | TO-247AD |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 80A |
| Collector Emitter Voltage Max | 600V |
| Collector Emitter Saturation Voltage | 1.8V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1885750/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

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## **FGH80N60FD2 600 V Field Stop IGBT** 

## **Features** 

- High Current Capability 

- Low Saturation Coltage: VCE(sat)  = 1.8 V @ IC = 40 A 

- High Input Impedance 

- Fast Switching 

## **General Description** 

Using novel field stop IGBT technology, Fairchild's field stop IGBTs offer the optimum performance for induction heating and PFC applications where low conduction and switching losses are essential. 

- RoHS Compliant 

## **Applications** 

- Induction Heating, PFC 

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E<br>C<br>G<br>COLLECTOR<br>(FLANGE)<br>**----- End of picture text -----**<br>


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## **Absolute Maximum Ratings** 

|**Symbol**|**Description**|**Ratings**|**Unit**|
|---|---|---|---|
|VCES|Collector-Emitter Voltage|600|V|
|VGES|Gate-Emitter Voltage| 20|V|
|IC|Collector Current<br>@ TC= 25C|80|A|
||Collector Current<br>@ TC= 100C|40|A|
|ICM(1)|Pulsed Collector Current                           @ TC= 25C|160|A|
|PD|Maximum Power Dissipation<br>@ TC= 25C|290|W|
||Maximum Power Dissipation<br>@ TC= 100C|116|W|
|TJ|Operating Junction Temperature|-55 to +150|C|
|Tstg|Storage Temperature Range|-55 to +150|C|
|TL|Maximum Lead Temp. for soldering<br>Purposes, 1/8” from case for 5 seconds|300|C|



**Notes :** 

(1) Repetitive rating : Pulse width limited by max. junction temperature 

## **Thermal Characteristics** 

|**Symbol**|**Parameter**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|
|RJC(IGBT)|Thermal Resistance, Junction-to-Case|--|0.43|C/W|
|RJC(Diode)|Thermal Resistance, Junction-to-Case||1.45|C/W|
|RJA|Thermal Resistance, Junction-to-Ambient|--|40|C/W|



**1** 

©2008 Fairchild Semiconductor Corporation FGH80N60FD2 Rev. C1 

www.fairchildsemi.com 

|**Symbol**<br>~~es~~|**Parameter**<br>~~es~~|**Test Conditions**<br>~~es~~|**Min.**<br>~~es~~|**Typ.**<br>~~es~~|**Max.**<br>~~es~~|**Unit**<br>~~es~~|
|---|---|---|---|---|---|---|
|**Off Characteristics**<br>~~eses~~|||||||
|BVCES<br>~~i~~|Collector-Emitter Breakdown Voltage|VGE= 0 V, IC= 250 uA|600|--|--|V|
|BVCES/<br>TJ<br>~~i~~|Temperature Coefficient of Breakdown<br>Voltage|VGE= 0 V, IC= 250 uA|--|0.6|--|V/C|
|ICES<br>~~i~~<br>~~A—~~|Collector Cut-Off Current<br>~~ESSA~~|VCE= VCES, VGE= 0 V<br>~~ESSA~~|--<br>~~ESSA~~|--<br>~~ESSA~~|250<br>~~ESSA~~|uA<br>~~ESSA~~|
|IGES<br>~~i~~<br>~~A—~~|G-E Leakage Current<br>~~ESSA~~|VGE= VGES, VCE= 0 V<br>~~ESSA~~|--<br>~~ESSA~~|--<br>~~ESSA~~|±400<br>~~ESSA~~|nA<br>~~ESSA~~|
|**On Characteristics**<br>~~A —ESSA~~|||||||
|VGE(th)|G-E Threshold Voltage|IC= 250 uA, VCE= VGE|4.5<br>~~ee~~|5.5<br>~~ee~~|7.0<br>~~ee~~|V<br>~~ee~~|
|VCE(sat)<br>~~ees~~|Collector to Emitter<br>Saturation Voltage<br>~~ees~~|IC= 40 A,VGE= 15 V<br>~~ees~~|--<br>~~ees~~<br>~~ee~~|1.8<br>~~ees~~<br>~~ee~~|2.4<br>~~ees~~<br>~~ee~~|V<br>~~ees~~<br>~~ee~~|
|||IC= 40 A,VGE= 15 V,<br>TC= 125C<br>~~ees~~|--<br>~~ees~~<br>~~ee~~|2.05<br>~~ees~~<br>~~ee~~|--<br>~~ees~~<br>~~ee~~|V<br>~~ees~~<br>~~ee~~|
|**Dynamic Characteristics**<br>~~ees~~<br>~~ee ee~~|||||||
|Cies<br>~~—~~|Input Capacitance|VCE= 30 V,VGE= 0 V,<br>f = 1 MHz|--|2110|--|pF|
|Coes<br>~~—~~|Output Capacitance||--|200|--|pF|
|Cres<br>~~—~~|Reverse Transfer Capacitance||--|60|--|pF|
|**Switching Characteristics**<br>~~—~~|||||||
|td(on)|Turn-On Delay Time|VCC= 400 V, IC= 40 A,<br>RG= 10, VGE= 15 V,<br>Inductive Load, TC= 25C|--|21|--|ns|
|tr|Rise Time||--|56|--|ns|
|td(off)|Turn-Off Delay Time||--|126|--|ns|
|tf|Fall Time||--|50|100|ns|
|Eon|Turn-On Switching Loss||--|1|1.5|mJ|
|Eoff|Turn-Off Switching Loss||--|0.52|0.78|mJ|
|Ets|Total Switching Loss||--|1.52|2.28|mJ|
|td(on)|Turn-On Delay Time|VCC= 400 V, IC= 40 A,<br>RG= 10, VGE= 15 V,<br>Inductive Load, TC= 125C|--|20|--|ns|
|tr|Rise Time||--|54|--|ns|
|td(off)|Turn-Off Delay Time||--|131|--|ns|
|tf|Fall Time||--|70|--|ns|
|Eon|Turn-On Switching Loss||--|1.1|--|mJ|
|Eoff|Turn-Off Switching Loss||--|0.78|--|mJ|
|Ets|Total Switching Loss||--|1.88|--|mJ|
|Qg|Total Gate Charge|VCE= 400 V, IC= 40 A,<br>VGE= 15 V|--|120|--|nC|
|Qge|Gate-Emitter Charge||--|14|--|nC|
|Qgc|Gate-Collector Charge||--|58|--|nC|



**2** 

©2008 Fairchild Semiconductor Corporation FGH80N60FD2 Rev. C1 

www.fairchildsemi.com 

|**Symbol**|**Parameter**|**Test Conditions**|**Test Conditions**|**Min.**|**Typ.**|**Max**|**Unit**|
|---|---|---|---|---|---|---|---|
|VFM|Diode Forward Voltage|IF= 15 A|TC= 25C|-|1.2|1.5|V|
||||TC= 125C|-|1.0|-||
|trr|Diode Reverse Recovery Time|IF= 15 A,<br>diF/dt = 200 A/s|TC= 25C|-|61|-|ns|
||||TC= 125C|-|125|-||
|Irr|Diode Reverse Recovery Current||TC= 25C|-|4.8|-|A|
||||TC= 125C|-|8.4|-||
|Qrr|Diode Reverse Recovery Charge||TC= 25C|-|146|-|nC|
||||TC= 125C|-|525|-||



**3** 

©2008 Fairchild Semiconductor Corporation FGH80N60FD2 Rev. C1 

www.fairchildsemi.com 

## **Typical Performance Characteristics** 

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Figure 1. Typical Output Characteristics                       Figure 2. Typical Saturation Voltage<br>                                                                                                          Characteristics<br>160 160<br>TC = 25oC 15V TC = 125oC 15V<br>20V 20V<br>12V 12V<br>120 120<br>PLE Ef FEE 10V<br>10V<br>80 Poo 80 Peo<br>40 Piet) VGE = 8V 40 EFT VGE = 8V<br>0 74 0 (FO<br>0 2 4 6 8 10 0 2 4 6 8 10<br>Collector-Emitter Voltage, VCE [V] Collector-Emitter Voltage, VCE [V]<br>Figure 3. Typical Saturation Voltage                                 Figure 4. Transfer Characteristics<br>                       Characteritics<br>160 160<br>Common Emitter<br>Common Emitter<br>V GE  = 15V VCE = 20V<br>o<br>120 TTCC = 25 = 125oCoC TL 120 TTCC = 25 = 125C o C Ly.<br>80 80<br>40 40<br>0 TTA) = 0 Ea<br>0 1 2 3 4 5 6 2 4 6 8 10 12<br>Collector-Emitter Voltage, VCE [V] Gate-Emitter Voltage,VGE [V]<br>Figure 5. Saturation Voltage vs. Case                               Figure 6. Saturation Voltage vs. Vge<br>3.5    Temperature at Variant Current Level<br>20<br>Common Emitter<br>TC = 25 o C<br>3.02.5 80A 1612 |<br>40A<br>2.0 8 |ee<br>40A<br>1.5 20A 4 |e<br>80A<br>Common Emitter<br>VGE = 15V pC IC = 20A<br>1.0 ce 0 et<br>25 50 75 100 125 4 8 12 16 20<br>Case Temperature, TC [ [o] C] Gate-Emitter Voltage, VGE [V]<br> [A]C  [A]C<br>Collector Current, I Collector Current, I<br>Collector Current, I [A]C Collector Current, I [A]C<br> [V]<br>CE  [V]<br>CE<br>V<br>,<br>Collector-Emitter Voltage, V<br>Collector-Emitter Voltage<br>**----- End of picture text -----**<br>


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Figure 3. Typical Saturation Voltage                                 Figure 4. Transfer Characteristics<br>                       Characteritics<br>**----- End of picture text -----**<br>


**Figure 5. Saturation Voltage vs. Case                               Figure 6. Saturation Voltage vs. Vge** 

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## **Typical Performance Characteristics  (Continued)** 

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Figure 7. Saturation Voltage vs. Vge                             Figure 8. Capacitance Characteristics<br>20 5000<br>Common Emitter Common Emitter<br>TC = 125 o C V GE  = 0V, f = 1MHz<br>16 qT 4000 C iss TC = 25 o C<br>12 SPS 3000 ES<br>8 2000 Coss<br>40A<br>4 SEE 80A 1000 ES<br>Crss<br>I C  = 20A<br>0 tees 0 FSS<br>4 8 12 16 20 0.1 1 10 30<br>Gate-Emitter Voltage, VGE [V] Collector-Emitter Voltage, VCE [V]<br>Figure 9. Gate Charge Characteristics                          Figure 10. SOA Characteeristics<br>15 400<br>Common Emitter<br>TC = 25 o C 100 10  s<br>12<br>200V 100  s<br>a Vcc = 100V 300V 2 10 SE<br>9<br>1ms<br>10 ms<br>1<br>6 aA] SS DC<br>Single Nonrepetitive<br>Pulse TC = 25 [o] C<br>3 ee 0.1 Curves must be derated<br>linearly with increase<br>in temperature<br>0 Pe 0.01 rat<br>0 50 100 150 1 10 100 1000<br>Gate Charge, Qg [nC] Collector-Emitter Voltage, VCE [V]<br>Figure 11. Turn-Off Switching  SOA                        Figure 12. Turn-On Characteristics vs.<br>                  Characteristics                                                           Gate Resistance<br>200 200<br>100<br>100<br>t r<br>10 AT | ft<br>Common Emitter<br>td(on) VCC = 400V, VGE = 15V<br>IC = 40A<br>Safe Operating Area 10 T C  = 25 o C<br>1 TL VGE = 20V, TC = 100oC 5 Fe T C  = 125 o C<br>1 10 100 1000 0 10 20 30 40 50<br>Collector-Emitter Voltage, VCE [V] Gate Resistance, RG [  ]<br>]<br>V<br>[<br>CE<br>Collector-Emitter Voltage, V Capacitance [pF]<br> [V]<br>GE Collector Current, I [A]c<br>Gate-Emitter Voltage, V<br> [A]<br>C<br>Switching Time [ns]<br>Collector Current, I<br>**----- End of picture text -----**<br>


**5** 

©2008 Fairchild Semiconductor Corporation FGH80N60FD2 Rev. C1 

www.fairchildsemi.com 

**Typical Performance Characteristics  (Continued)** 

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2000 200<br>Common Emitter Common Emitter<br>1000 VCC = 400V, VGE = 15V VGE = 15V, RG = 10 <br>IT T CC C  = 40A = 25  = 125 oC   o C | | | 100 T T C C  = 25 = 125 oC   oC  a t r<br>td(off)<br>100<br>tf t<br>d(on)<br>10 eo) 10<br>0 10 20 30 40 50 20 40 60 80<br>Gate Resistance, RG [  ] Collector Current, IC [A]<br>Figure 15. Turn-Off Characteristics vs. Figure 16. Switching Loss vs Gate Resistance<br>                  Collector Current<br>500 5<br>Common Emitter Common Emitter<br>VGE = 15V, RG = 10  VCC = 400V, VGE = 15V<br>TC = 25oC   I C  = 40A<br>T C  = 125 o C  TC = 25oC<br>td(off) TC = 125oC Eon<br>100<br>1 E off<br>t f<br>20 SPT 0.3<br>20 40 60 | 80 0 eT 10 20 30 40 50<br>Collector Current, IC [A] Gate Resistance, RG [  ]<br>Figure 17. Switching Loss vs Collector Current<br>10<br>Common Emitter<br>V GE  = 15V, R G  = 10 <br>T C  = 25 o C    E on<br>TC = 125oC<br>1 Eoff<br>oie<br>0.1 ae<br>20 40 60 80<br>Collector Current, IC [A]<br>Switching Time [ns] Switching Time [ns]<br>Switching Time [ns] Switching Loss [mJ]<br>Switching Loss [mJ]<br>**----- End of picture text -----**<br>


**Figure 15. Turn-Off Characteristics vs. Figure 16. Switching Loss vs Gate Resistance Collector Current** 

**Figure 17. Switching Loss vs Collector Current** 

**6** 

©2008 Fairchild Semiconductor Corporation FGH80N60FD2 Rev. C1 

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## **Typical Performance Characteristics  (Continued)** 

**Figure 18. Transient Thermal Impedance of IGBT** 

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1<br>0.5<br>0.1 0.2<br>0.1 =<br>0.05<br>0.02<br>0.01 0.01 P DM<br>single pulse t1<br>t 2<br>Duty Factor, D = t1/t2<br>[Peak T][j][ = Pdm x Zthjc + T] C<br>1E-3 Pawa<br>1E-5 1E-4 1E-3 0.01 0.1 1<br>Rectangular Pulse Duration [sec]<br>Figure 19. Forward Characteristics                              Figure 20. Stored Charge<br>1000<br>800<br>10 fi<br>TC = 125oC | | |pe 125 o C<br>TC = 25 o C 600<br>1 ir)/ 400 Geepe<br>200 25 o C<br>0.1 eo) 0 e eee<br>0 1 2 3 100 200 300 400<br>Forward Voltage , VF [V]<br>di/dt ,[A/  s]<br>Figure 21. Reverse Recovery Time                               Figure 22. Reverse Recovery Current<br>160 20<br>140<br>15<br>120<br>4 125 o C Ee<br>100<br>10 125oC<br>80<br>pas) Ler<br>60<br>5<br>25 o C 25oC<br>40 SHS eee<br>20 Se 0<br>1005 200 eee 300 ee 400 1005 ee 200 300 400<br>di/dt, [A/  s] di/dt, [A/  s]<br>Thermal Response [Zthjc]<br> [nC]<br>rr<br> [A]<br>F<br>Forward Current , I<br>Stored Recovery Charge , Q<br> [A]<br> [ns] rr<br>rr<br>Reverse Recovery Time, t Reverse Recovery Current, I<br>**----- End of picture text -----**<br>


**Figure 19. Forward Characteristics                              Figure 20. Stored Charge** 

**Figure 21. Reverse Recovery Time                               Figure 22. Reverse Recovery Current** 

**7** 

©2008 Fairchild Semiconductor Corporation FGH80N60FD2 Rev. C1 

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## **Mechanical Dimensions** 

## **Figure 23.   TO-247 3L - TO-247,MOLDED,3 LEAD,JEDEC VARIATION AB** 

_Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products._ 

_Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:_ 

_http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TO247-003_ 

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## **TRADEMARKS** 

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## **PRODUCT STATUS DEFINITIONS Definition of Terms** 

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|Datasheet Identification|Product Status|Definition|
|Advance Information|Formative / In Design|Datasheet contains the design specifications for product development. Specifications|
|may change in any manner without notice.|
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Rev. I66 

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©2008 Fairchild Semiconductor Corporation FGH80N60FD2 Rev. C1 

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---

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