# IGBT, 80 A, 1.55 V, 306 W, 1.2 kV, TO-247, 4 Pins

![Product image](https://novapart.co/image/farnell:3929762/)

**URL**: https://novapart.co/products/FGH4L40T120LQD/igbt-80-a-155-v-306-w-12-kv-to-247-4-pins
**SKU**: FGH4L40T120LQD
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || IGBTs || Single IGBTs
**Price**: €3.9400
**Stock**: 500+
**Lead Time**: 78 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 4Pins |
| Product Range | - |
| Power Dissipation | 306W |
| Transistor Mounting | Through Hole |
| Transistor Case Style | TO-247 |
| Operating Temperature Max | 175°C |
| Continuous Collector Current | 80A |
| Collector Emitter Voltage Max | 1.2kV |
| Collector Emitter Saturation Voltage | 1.55V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3929762/)

**DATA SHEET www.onsemi.com** ~~ee~~ 

## IGBT - Ultra Field Stop 1200 V, 40 A, VCE(Sat) = 1.55V, TO247 4L 

## FGH4L40T120LQD 

This Insulated Gate Bipolar Transistor (IGBT) features a robust and cost−effective Ultra Field Stop Trench construction, and provides superior performance in demanding switching applications, offering both low on−state voltage and minimal switching loss. The IGBT is well suited for motor driver applications. Incorporated into the device is a soft and fast co−packaged free−wheeling diode with a low forward voltage. 

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TO−247−4LD<br>CASE 340CJ<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAM** 

## **Features** 

- Extremely Efficient Trench with Field Stop Technology 

- Maximum Junction Temperature: TJ = 175°C 

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FGH40T<br>120LQD<br>$Y&Z&3&K<br>**----- End of picture text -----**<br>


- Fast and Soft Reverse Recovery Diode 

- Optimized for Low VCE(Sat) 

## **Typical Applications** 

- Solar Inverter and UPS 

- Industrial Switching 

- Welding 

FGH40T120LQD = Specific Device Code $Y = **onsemi** Logo &Z = Assembly Plant Code &3 = 3−Digit Date Code &K = 2−Digit Lot Traceability Code 

**MAXIMUM RATINGS** 

**Rating Symbol Value Unit** Collector−Emitter Voltage VCE 1200 V Gate−Emitter Voltage VGE ± 20 V Transient Gate−Emitter Voltage ± 30 Collector Current @ TC = 25 ° C (Note 1) IC 80 A @ TC = 100 ° C 40 Pulsed Collector Current (Note 2) ILM 160 A Pulsed Collector Current (Note 3) ICM 160 A Diode Forward Current IF A @ TC = 25 ° C (Note 1) 80 @ TC = 100 ° C 40 Maximum Power Dissipation PD W @ TC = 25 ° C 306 @ TC = 100 ° C 153 Operating Junction and Storage TJ, TSTG −55 to ° C Temperature Range +175 Maximum Lead Temp. for Soldering TL 260 ° C Purposes (1/8 ″ from case for 5 s) ~~=H~~ Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

**==> picture [157 x 99] intentionally omitted <==**

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PIN CONNECTIONS<br>C<br>E1: Kelvin Emitter<br>E2: Power Emitter<br>G<br>E1 E2<br>**----- End of picture text -----**<br>


## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**|
|---|---|---|
|FGH4L40T120LQD|TO−247|30 Units / Rail|



1. Value limit by bond wire 

2. VCC = 600 V, VGE = 15 V, IC = 160 A, RG = 15 Inductive Load, 100% Tested 

3. Repetitive rating: Pulse width limited by max. junction temperature 

Publication Order Number: **FGH4L40T120LQD/D** 

**1** 

© Semiconductor Components Industries, LLC, 2021 **September, 2021 − Rev. 0** 

**FGH4L40T120LQD** 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**|**THERMAL CHARACTERISTICS**||||||
|---|---|---|---|---|---|---|
|**Rating**||**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|Thermal resistance junction−to−case, for IGBT||R�JC|−|0.38|0.49|°C/W|
|Thermal resistance junction−to−case, for Diode||R�JC|−|0.64|0.84|°C/W|
|Thermal resistance junction−to−ambient||R�JA|−|−|40|°C/W|
|**ELECTRICAL CHARACTERISTICS**(TJ= 25°C unless otherwise specified)|||||||
|**Parameter**|**Test Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTIC**|||||||
|Collector−Emitter Breakdown Voltage|VGE= 0 V, IC= 1 mA|BVCES|1200|−|−|V|
|Temperature Coefficient of Breakdown<br>Voltage|VGE= 0 V, IC= 1 mA|�BVCES/<br>�TJ|−|1.3|−|V/°C|
|Collector−Emitter Cut−Off Current|VGE= 0 V, VCE= 1200 V|ICES|−<br>−|−<br>500|40<br>−|�A|
|Gate Leakage Current|VGE= 20 V, VCE= 0 V|IGES|−|−|200|nA|
|**ON CHARACTERISTIC**|||||||
|Gate−Emitter Threshold Voltage|VGE= VCE, IC= 40 mA|VGE(th)|5.5|6.5|7.5|V|
|Collector−Emitter Saturation Voltage|VGE= 15 V, IC= 40 A, TJ= 25°C|VCE(sat)|−|1.55|1.80|V|
||VGE= 15 V, IC= 40 A, TJ= 175°C||−|2|−||
|**DYNAMIC CHARACTERISTIC**|||||||
|Input Capacitance|VCE= 30 V, VGE= 0 V, f = 1 MHz|Cies|−|5079|−|pF|
|Output Capacitance||Coes|−|113|−||
|Reverse Transfer Capacitance||Cres|−|62|−||
|Gate Charge Total|VCC= 600 V, IC= 40 A, VGE= 15 V|Qg|−|227|−|nC|
|Gate−to−Emitter Charge||Qge|−|40|−||
|Gate−to−Collector Charge||Qgc|−|108|−||
|**SWITCHING CHARACTERISTIC, INDUCTIVE LOAD**|||||||
|Turn−on Delay Time|TJ= 25°C<br>VCC= 600 V, IC= 20 A<br>Rg= 10�<br>VGE= 15 V<br>Inductive Load|td(on)|−|38|−|ns|
|Rise Time||tr|−|13|−||
|Turn−off Delay Time||td(off)|−|227|−||
|Fall Time||tf|−|51|−||
|Turn−on Switching Loss||Eon|−|0.63|−|mJ|
|Turn−off Switching Loss||Eoff|−|0.77|−||
|Total Switching Loss||Ets|−|1.40|−||
|Turn−on Delay Time|TJ= 25°C<br>VCC= 600 V, IC= 40 A<br>Rg= 10�<br>VGE= 15 V<br>Inductive Load|td(on)|−|42|−|ns|
|Rise Time||tr|−|19|−||
|Turn−off Delay Time||td(off)|−|218|−||
|Fall Time||tf|−|80|−||
|Turn−on Switching Loss||Eon|−|1.04|−|mJ|
|Turn−off Switching Loss||Eoff|−|1.35|−||
|Total Switching Loss||Ets|−|2.39|−||



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**2** 

**FGH4L40T120LQD** 

## **ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise specified) 

|**Parameter**|**Test Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|**SWITCHING CHARACTERISTIC, INDUCTIVE LOAD**|||||||
|Turn−on Delay Time|TJ= 175°C<br>VCC= 600 V, IC= 20 A<br>Rg= 10�<br>VGE= 15 V<br>Inductive Load|td(on)|−|32|−|ns|
|Rise Time||tr|−|12|−||
|Turn−off Delay Time||td(off)|−|264|−||
|Fall Time||tf|−|156|−||
|Turn−on Switching Loss||Eon|−|1.05|−|mJ|
|Turn−off Switching Loss||Eoff|−|1.62|−||
|Total Switching Loss||Ets|−|2.67|−||
|Turn−on Delay Time|TJ= 175°C<br>VCC= 600 V, IC= 40 A<br>Rg= 10�<br>VGE= 15 V<br>Inductive Load|td(on)|−|36|−|ns|
|Rise Time||tr|−|20|−||
|Turn−off Delay Time||td(off)|−|236|−||
|Fall Time||tf|−|204|−||
|Turn−on Switching Loss||Eon|−|1.62|−|mJ|
|Turn−off Switching Loss||Eoff|−|2.51|−||
|Total Switching Loss||Ets|−|4.13|−||
|**DIODE CHARACTERISTIC**|||||||
|Forward Voltage|VGE= 0 V, IF= 40 A, TJ= 25°C|VF|−|3.31|3.80|V|
||VGE= 0 V, IF= 40 A, TJ= 175°C||−|2.97|−||
|Reverse Recovery Energy|TJ= 25°C<br>IF= 40 A, VR= 600 V<br>diF/dt = 1000 A/�s|EREC|−|126|−|�J|
|Diode Reverse Recovery Time||Trr|−|59|−|ns|
|Diode Reverse Recovery Charge||Qrr|−|804|−|nC|
|Reverse Recovery Energy|TJ= 175°C<br>IF= 20 A, VR= 600 V<br>diF/dt = 1000 A/�s|EREC|−|540|−|�J|
|Diode Reverse Recovery Time||Trr|−|115|−|ns|
|Diode Reverse Recovery Charge||Qrr|−|2090|−|nC|
|Reverse Recovery Energy|TJ= 175°C<br>IF= 40 A, VR= 600 V<br>diF/dt = 1000 A/�s|EREC|−|667|−|�J|
|Diode Reverse Recovery Time||Trr|−|127|−|ns|
|Diode Reverse Recovery Charge||Qrr|−|2613|−|nC|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

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**3** 

**FGH4L40T120LQD** 

## **TYPICAL CHARACTERISTICS** 

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160 160<br>20 V 15 V 12 V 20 V 15 V<br>12 V<br>120 120<br>10 V 10 V<br>80 80<br>40 40<br>VGE = 8 VGE = 8 V = 8 V<br>VGE = 8 V<br>0 0<br>0 1 2 3 4 5 0 1 2 3 4 5<br>VCE, COLLECTOR−EMITTER VOLTAGE (V) VCE, COLLECTOR−EMITTER VOLTAGE (V)CE, COLLECTOR−EMITTER VOLTAGE (V), COLLECTOR−EMITTER VOLTAGE (V)<br>Figure 1. Typical Output Characteristics Figure 2. Typical Output Characteristics<br>(TJ = 25 � C) (TJ = 175 � C)<br>160 80<br>VGE = 15 V Common Emitter<br>VCE = 20 V<br>120 60<br>TJ = 25 ° C TJ = 175 ° C<br>80 40<br>40 20<br>TJ = 175 ° C TJ = 25 ° C<br>0 0<br>0 1 2 3 4 5 6 7 0 2 4 6 8 10 12 14<br>VCE, COLLECTOR−EMITTER VOLTAGE (V) VGE, GATE EMITTER VOLTAGE (V)<br>Figure 3. Typical Saturation Voltage Figure 4. Typical Transfer Characteristics<br>Characteristics<br>3.5 100K<br>Common Emitter<br>3.0 VGE = 15 V 10K Ciss<br>IC = 80 A 1K<br>2.5<br>Coss<br>100<br>2.0 IC = 40 A Crss<br>10<br>IC = 25 A<br>1.5 Common Emitter<br>1 f = 1 MHz<br>IC = 20 A<br>VGE = 0 V<br>1.0 0.1<br>−100 −50 0 50 100 150 200 0.1 1 10 30<br>TJ, JUNCTION TEMPERATURE ( ° C) VCE, COLLECTOR−TO−EMITTER VOLTAGE (V)<br>, COLLECTOR CURRENT (A) , COLLECTOR CURRENT (A)<br>IC ICC<br>, COLLECTOR CURRENT (A) , COLLECTOR CURRENT (A)<br>IC IC<br>CAPACITANCE (pF)<br>, COLLECTOR−EMITTER SATURATION (V)<br>CE(sat)<br>V<br>**----- End of picture text -----**<br>


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160<br>20 V 15 V<br>12 V<br>120<br>10 V<br>80<br>40<br>VGE = 8 VGE = 8 V = 8 V<br>0<br>0 1 2 3 4 5<br>VCE, COLLECTOR−EMITTER VOLTAGE (V)CE, COLLECTOR−EMITTER VOLTAGE (V), COLLECTOR−EMITTER VOLTAGE (V)<br>, COLLECTOR CURRENT (A)<br>ICC<br>**----- End of picture text -----**<br>


**Figure 5. Saturation Voltage vs. Junction Temperature** 

**Figure 6. Capacitances Characteristics** 

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**FGH4L40T120LQD** 

## **TYPICAL CHARACTERISTICS** 

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15 300<br>VCC = 400 V<br>12 VCC = 500 V 100<br>VCC = 600 V 10  � s<br>9 10 100  � s<br>6 1 ms<br>10 ms<br>1<br>3 TC = 25 ° C<br>Common EmitterIC = 40 A Single PulseTJ = 175 ° C DC<br>0 0.1<br>0 50 100 150 200 250 1 10 100 1000<br>Qg, GATE CHARGE (nC) VCE, COLLECTOR−EMITTER VOLTAGE (V)<br>Figure 7. Gate Charge Characteristics Figure 8. SOA Characteristics (FBSOA)<br>1000 1000<br>VCC = 600 V TJ = 25 ° C td(off)<br>VGE = 15 V T J  = 175 ° C<br>I C  = 40 A<br>100 td(on) 100 tf<br>t r<br>V CC  = 600 V<br>VGE = 15 V TJ = 25 ° C<br>IC = 40 A TJ = 175 ° C<br>10 10<br>0 10 20 30 40 50 0 10 20 30 40 50<br>RG, GATE RESISTANCE ( � ) RG, GATE RESISTANCE ( � )<br>Figure 9. Turn−on Characteristics vs. Gate Figure 10. Turn−off Characteristics vs. Gate<br>Resistance Resistance<br>200 500<br>td(off)<br>100<br>td(on)<br>100 tf<br>10 tr VCC = 600 V V CC  = 600 V<br>VGE = 15 V V GE = 15 V<br>R G  = 10  � RG = 10  �<br>TJ = 25 ° C TJ = 25 ° C<br>TJ = 175 ° C TJ = 175 ° C<br>1 10<br>0 10 20 30 40 50 60 70 80 90 0 10 20 30 40 50 60 70 80 90<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>, GATE−EMITTER VOLTAGE (V) , COLLECTOR CURRENT (A)<br>IC<br>GE<br>V<br>SWITCHING TIME (ns) SWITCHING TIME (ns)<br>SWITCHING TIME (ns) SWITCHING TIME (ns)<br>**----- End of picture text -----**<br>


**Figure 11. Turn−on Characteristics vs. Collector Current** 

**Figure 12. Turn−off Characteristics vs. Collector Current** 

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**FGH4L40T120LQD** 

## **TYPICAL CHARACTERISTICS** 

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10 10<br>VCC = 600 V VCC = 600 V Eoff<br>VGE = 15 V VGE = 15 V<br>IC = 40 A IC = 40 A<br>5<br>R G  = 10  �<br>Eoff<br>E on 1<br>Eon<br>TJ = 25 ° C TJ = 25 ° C<br>TJ = 175 ° C TJ = 175 ° C<br>0.5 0.1<br>0 10 20 30 40 50 0 10 20 30 40 50 60 70 80 90<br>RG, GATE RESISTANCE ( � ) IC, COLLECTOR CURRENT (A)<br>Figure 13. Switching Loss vs. Gate Resistance Figure 14. Switching Loss vs. Collector<br>Current<br>80 50<br>40<br>60<br>di/dt 1000 A/ � s<br>30<br>40<br>TJ = 175 ° C 20 di/dt 500 A/ � s<br>TJ = 25 ° C<br>20<br>10<br>TJ = 25 ° C<br>TJ = 175 ° C<br>0 0<br>0 1 2 3 4 0 10 20 30 40 50 60 70 80 90<br>VF, FORWARD VOLTAGE (V) IF, FORWARD CURRENT (A)<br>Figure 15. (Diode) Forward Characteristics Figure 16. (Diode) Reverse Recover Current<br>vs. Forward Current<br>200 4000<br>TJ = 25 ° C<br>di/dt 1000 A/ � s T J  = 175 ° C<br>150 3000<br>di/dt 1000 A/ � s<br>di/dt 500 A/ � s<br>100 2000<br>di/dt 500 A/ � s<br>50 1000<br>TJ = 25 ° C<br>TJ = 175 ° C<br>0 0<br>0 10 20 30 40 50 60 70 80 90 0 10 20 30 40 50 60 70 80 90<br>IF, FORWARD CURRENT (A) IF, FORWARD CURRENT (A)<br>SWITCHING LOSS (mJ) SWITCHING LOSS (mJ)<br>, FORWARD CURRENT (A)<br>IF<br>, REVERSE RECOVERY CURRENT (A)<br>Irr<br>C)<br>, REVERSE RECOVERY TIME (ns) �<br>trr , REVERSE RECOVERY CHARGE (<br>rr<br>Q<br>**----- End of picture text -----**<br>


**Figure 17. (Diode) Reverse Recovery Time** 

**Figure 18. (Diode) Stored Charge** 

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**FGH4L40T120LQD** 

## **TYPICAL CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
1<br>0.5 Duty Cycle<br>0.1 0.2 Duty Factor, D = t1/t2<br>0.1 PDM Peak TJ = PDM x Z � JC + TC<br>0.05 t1 R1 R2<br>0.02<br>0.01 t2<br>0.01 C1 = t1 / R1 C2 = t2 / R2<br>Single Pulse i: 1 2 3 4<br>ri [K/W]: 0.01438 0.08956 0.07977 0.09921<br>T [s]: 1.452E−05 2.162E−04 6.944E−04 3.525E−03<br>0.001<br>10 [−5] 10 [−4] 10 [−3] 10 [−2] 10 [−1] 10 [0] 10 [1]<br>RECTANGULAR PULSE DURATION (sec)<br>Figure 19. Transient Thermal Impedance of IGBT<br>1<br>0.5 Duty Cycle<br>0.2 Duty Factor, D = t1/t2<br>PDM Peak TJ = PDM x Z � JC + TC<br>0.1 0.1 t1 R1 R2<br>0.05<br>0.02 t2<br>0.01 C1 = t1 / R1 C2 = t2 / R2<br>i: 1 2 3 4<br>Single Pulse<br>ri [K/W]: 0.0291 0.0619 0.1610 0.1572<br>T [s]: 4.272E−06 5.358E−05 3.408E−04 2.119E−03<br>0.01<br>10 [−5] 10 [−4] 10 [−3] 10 [−2] 10 [−1] 10 [0] 10 [1]<br>RECTANGULAR PULSE DURATION (sec)<br>, THERMAL RESPONSE (K/W)<br>JC<br>�<br>Z<br>, THERMAL RESPONSE (K/W)<br>JC<br>�<br>Z<br>**----- End of picture text -----**<br>


**Figure 20. Transient Thermal Impedance of Diode** 

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**7** 

**FGH4L40T120LQD** 

**Figure 21. Test Circuits for Switching Characteristics** 

**Figure 22. Definition of Turn−On Waveforms** 

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**FGH4L40T120LQD** 

**Figure 23. Definition of Turn−Off Waveforms** 

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**9** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

## **TO−247−4LD** CASE 340CJ ISSUE A 

## DATE 16 SEP 2019 

**DOCUMENT NUMBER: 98AON13852G** 

**DESCRIPTION: TO−247−4LD** 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

**PAGE 1 OF 1** 

ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

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**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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