# IGBT, N Channel, 80 A, 2.3 V, 428 W, 1.2 kV, TO-247, 3 Pins

![Product image](https://novapart.co/image/farnell:2610670/)

**URL**: https://novapart.co/products/FGH12040WD-F155/igbt-n-channel-80-a-23-v-428-w-12-kv-to-247-3-pins
**SKU**: FGH12040WD-F155
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || IGBTs || Single IGBTs
**Price**: €4.6300
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Product Range | Trench |
| Power Dissipation | 428W |
| Transistor Mounting | Through Hole |
| Transistor Case Style | TO-247 |
| Operating Temperature Max | 175°C |
| Continuous Collector Current | 80A |
| Collector Emitter Voltage Max | 1.2kV |
| Collector Emitter Saturation Voltage | 2.3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2610670/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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December 2014<br>**----- End of picture text -----**<br>


## **FGH12040WD** 

## **1200 V, 40 A Field Stop Trench IGBT** 

## **Features** 

- Maximum Junction Temperature : TJ = 175[o] C 

- Positive Temperature Co-efficient for Easy Parallel Operating 

- Low Saturation Voltage: VCE(sat) = 2.3 V ( Typ.) @ IC = 40 A 

- • 100% of The Parts Tested for ILM(1) 

## **General Description** 

Using novel field stop IGBT technology, Fairchild’s new series of field stop 2[nd] generation IGBTs offer the optimum performance for welder applications where low conduction and switching losses are essential. 

- Short Circuit Ruggedness > 5 us @ 150[o] C 

- High Input Impedance 

- RoHS Compliant 

## **Applications** 

- Only for Welder 

**==> picture [275 x 66] intentionally omitted <==**

**----- Start of picture text -----**<br>
C<br>G<br>G C TO-247<br>E<br>long leads E<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Absolute Maximum Ratings TC = 25°C unless otherwise noted<br>DO Symbol Description FGH12040WD_F155 Unit<br>a VCES Collector to Emitter Voltage 1200 V<br>VGES a Gate to Emitter Voltage ±25 V<br>a Transient Gate to Emitter Voltage ±30 V<br>IC Or Collector Current                                       @ TC = 25 [o] C 80 A<br>Collector Current                                       @ TC = 100 [o] C 40 A<br>ILM (1) Clamped Inductive Load Current               @ TC = 25 [o] C   100 A<br>Rs—_— =F eaei-ahay l<br>I Pulsed Collector Current                                    100 A<br>CM (2)<br>es G<br>IF Diode Continuous Forward Current           @ TC = 25 [o] C   80 A<br>——_ 8€=—¢_ wc tk$lO<br>Ge Diode Continuous Forward Current           @ TC = 100 [o] C   40 A<br>I Diode Maximum Forward Current 100 A<br>FM (2)<br>TEE [ }|}§]<br>SCWT (3)  O Short Circuit Withstand Time,                    @ TC = 150 [o] C 5 us<br>es PD a Maximum Power Dissipation                     @ TC = 25 [o] C £4 428 W «l h<br>Cee Maximum Power Dissipation                     @ TC = 100 [o] C 214 W<br>TJ t“‘(‘(LUOCtCt(‘( Operating Junction Temperature -55 to +175 oC<br>ee = 4| A o<br>Ce Tstg Storage Temperature Range -55 to +175 ==— | tC C<br>TL Purposes, 1/8” from case for 5 secondsMaximum Lead Temp. for soldering  300 oC<br>Notes:<br>**----- End of picture text -----**<br>


1. VCC = 600 V, VGE = 15 V, IC = 100 A, RG = 23 Ω, Inductive Load 

2. Repetitive rating : Pulse width limited by max, junction temperature 

3. VCC = 600 V, VGE = 12 V 

**1** 

©2014 Fairchild Semiconductor Corporation FGH12040WD Rev. C7 

www.fairchildsemi.com 

**Thermal Characteristics** 

|**Symbol**|**Parameter**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|**Off Characteristics**|||||||
|BVCES|Collector to Emitter Breakdown Voltage V|Collector to Emitter Breakdown Voltage VGE= 0 V, IC= 250 uA|1200|-|-|V|
|∆BVCES/<br>∆TJ|Temperature Coefficient of Breakdown<br>Voltage|VGE= 0 V, IC= 250 uA|-|1.2|-|V/oC|
|ICES|Collector Cut-Off Current|VCE= VCES, VGE= 0 V|-|-|250|uA|
|IGES|G-E Leakage Current|VGE= VGES, VCE= 0 V|-|-|±400|nA|
|**On Characteristics**|||||||
|VGE(th)|G-E Threshold Voltage|IC= 40 mA, VCE= VGE|4.8|6.4|8.0|V|
|VCE(sat)|Collector to Emitter Saturation Voltage|IC= 40 A,VGE= 15 V<br>TC= 25oC|-|2.3|2.9|V|
|||IC= 40 A,VGE= 15 V,<br>TC= 175oC|-|2.7|-|V|
|**Dynamic Characteristics**<br>—~~a~~|||||||
|Cies<br>_|Input Capacitance<br>_~~—~~|VCE= 30 V,VGE= 0 V,<br>f = 1MHz<br>~~—~~—<br>—|-<br>—<br>—|2800<br>—<br>~~a~~|-<br>—<br>~~a~~|pF<br>—<br>~~a~~|
|Coes<br>_|Output Capacitance<br>_~~—~~||-<br>—<br>—|105<br>—<br>~~a~~|-<br>—<br>~~a~~|pF<br>—<br>~~a~~|
|Cres<br>_|Reverse Transfer Capacitance<br>_~~—~~||-<br>—<br>—|60<br>—<br>~~a~~|-<br>—<br>~~a~~|pF<br>—<br>~~a~~|
|**Switching Characteristics**<br>_~~—~~—<br>—~~a~~|||||||
|td(on)<br>_|Turn-On Delay Time<br>_~~—~~|VCC= 600 V, IC= 40 A,<br>RG= 23, VGE= 15 V,<br>Inductive Load, TC= 25oC<br>~~—~~—<br>—|-<br>—<br>—|45<br>—<br>~~a~~|-<br>—<br>~~a~~|ns<br>—<br>~~a~~|
|tr<br>_|Rise Time<br>_~~—~~||-<br>—<br>—|70<br>—<br>~~a~~|-<br>—<br>~~a~~|ns<br>—<br>~~a~~|
|td(off)<br>_|Turn-Off Delay Time<br>_~~—~~||-<br>—<br>—|560<br>—<br> ~~a~~|-<br>—<br>~~a~~|ns<br>—<br>~~a~~|
|tf|Fall Time||-|15|-|ns|
|Eon|Turn-On Switching Loss||-|4.1|-|mJ|
|Eoff|Turn-Off Switching Loss||-|1.0|-|mJ|
|Ets|Total Switching Loss||-|5.1|-|mJ|
|td(on)<br>~~p~~|Turn-On Delay Time<br>~~p~~|VCC= 600 V, IC= 40 A,<br>RG= 23, VGE= 15 V,<br>Inductive Load, TC= 175oC<br>~~p~~o|-<br>o|43<br>o|-<br>o|ns<br>o|
|tr<br>~~p~~|Rise Time<br>~~p~~||-<br>o|73<br>o|-<br>o|ns<br>o|
|td(off)<br>~~p~~|Turn-Off Delay Time<br>~~p~~||-<br>o|572<br>o|-<br>o|ns<br>o|
|tf<br>~~p~~|Fall Time<br>~~p~~||-<br>o|58<br>o|-<br>o|ns<br>o|
|Eon<br>~~p~~|Turn-On Switching Loss<br>~~p~~||-<br>o|6.9<br>o|-<br>o|mJ<br>o|
|Eoff<br>~~p~~|Turn-Off Switching Loss<br>~~p~~||-<br>o|1.9<br>o|-<br>o|mJ<br>o|
|Ets<br>~~p~~|Total Switching Loss<br>~~p~~||-<br>o|8.8<br>o|-<br>o|mJ<br>o|



**2** 

©2014 Fairchild Semiconductor Corporation FGH12040WD Rev. C7 

www.fairchildsemi.com 

## **Electrical Characteristics of the IGBT** (continued) 

|**Symbol**|**Parameter**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|Qg|Total Gate Charge|VCE= 600 V, IC= 40 A,<br>VGE= 15 V|-|226|-|nC|
|Qge|Gate to Emitter Charge||-|18|-|nC|
|Qgc|Gate to Collector Charge||-|155|-|nC|



## **Electrical Characteristics of the DIODE** TC = 25°C unless otherwise noted 

|**Symbol**|**Parameter**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|VFM|Diode Forward Voltage|IF= 40 A,TC= 25oC|-|3.6|4.7|V|
|||IF= 40 A,TC= 175oC|-|2.9|-|V|
|trr<br>——|Diode Reverse Recovery Time<br>——~~—~~|VR= 600 V, IF= 40 A,<br>diF/dt = 200 A/us,  TC= 25oC<br>~~—~~——|-<br>——|71<br>——|-<br>——|ns<br>——|
|Irr<br>——|Diode Peak Reverse Recovery Current<br>——~~—~~||-<br>——|6.8<br>——|-<br>——|A<br>——|
|Qrr<br>——|Diode Reverse Recovery Charge<br>——~~—~~||-<br>——|242<br>——|-<br>——|nC<br>——|
|Erec<br>——<br>Se|Reverse Recovery Energy<br>——~~—~~<br>Se|VR= 600 V, IF= 40A,<br>diF/dt = 200 A/us,  TC= 175oC<br>~~—~~——<br>OEE|-<br>——<br>OEE|690<br>——<br>OEE|-<br>——<br>OEE|uJ<br>——<br>OEE|
|trr<br>——<br>Se|Diode Reverse Recovery Time<br>——~~—~~<br>Se||-<br>——<br>OEE|500<br>——<br>OEE|-<br>——<br>OEE|ns<br>——<br>OEE|
|Irr<br>Se|Diode Peak Reverse Recovery Current<br>Se||-<br>OEE|17<br>OEE|-<br>OEE|A<br>OEE|
|Qrr<br>Se|Diode Reverse Recovery Charge<br>Se||-<br>OEE|4250<br>OEE|-<br>OEE|nC<br>OEE|



**3** 

©2014 Fairchild Semiconductor Corporation FGH12040WD Rev. C7 

www.fairchildsemi.com 

**Typical Performance Characteristics Figure 1. Typical Output Characteristics                   Figure 2. Typical Output Characteristics** 100 100 80 Cf wl — 80 60 A a —= 60 = 12V 33 -6 40 -9 40 °° “ps| &ay pe /fone Voge = 8V Le | 0.0 2.0 4.0 6.0 8.0 10.0 0.0 2.0 4.0 6.0 8.0 10.0 Collector-Emitter Voltage, Vce [V] Collector-Emitter Voltage, Vce [V] **Figure 3. Typical Saturation Voltage                          Figure 4. Saturation Voltage vs. Case Characteristics                                                                    Temperature at Variant Current Level   Temperature at Variant Current Level** 100 4.5 we > Voge = 15V VorCommon = 15V Emitter / .Y jo =Ww 4,0 Common|S Emitter 

## **Typical Performance Characteristics** 

- **Figure 3. Typical Saturation Voltage                          Figure 4. Saturation Voltage vs. Case Characteristics                                                                    Temperature at Variant Current Level   Temperature at Variant Current Level** 

- **Figure 5. Saturation Voltage vs. VGE                          Figure 6. Saturation Voltage vs. VGE** 

**4** 

©2014 Fairchild Semiconductor Corporation FGH12040WD Rev. C7 

www.fairchildsemi.com 

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Typical Performance Characteristics<br>Figure 7. Capacitance Characteristics                        Figure 8. Gate Charge Characteristics<br>10000 15 Common Emitter Vl<br>_ To = 25°C<br>Cig = 42 400V.<br>><br>51000 $o{f/ |<br>:3<br>**----- End of picture text -----**<br>


**Figure 9. Turn-on Characteristics vs.                         Figure 10. Turn-off Characteristics vs. Gate Resistance                                                             Gate Resistance** 

**Figure 11. Swithcing Loss vs.                                     Figure 12. Turn-on Characteristics vs. Gate Resistance                                                          Collector Current** 

**5** 

©2014 Fairchild Semiconductor Corporation FGH12040WD Rev. C7 

www.fairchildsemi.com 

## **Typical Performance Characteristics** 

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Figure 13. Turn-off Characteristics vs. Figure 14. Swithcing Loss vs.<br>Collector Current Collector Current<br>**----- End of picture text -----**<br>


**Figure 15. Load Current vs. Frequency** 

**Figure 16. SOA Characteristics** 

**Figure 17. Forward Characteristics** 

**Figure 18. Reverse Recovery Current** 

**6** 

©2014 Fairchild Semiconductor Corporation FGH12040WD Rev. C7 

www.fairchildsemi.com 

## **Typical Performance Characteristics** 

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**----- Start of picture text -----**<br>
Figure 19. Reverse Recovery Time Figure 20. Stored Charge<br>700 5000<br>0,<br>7=a” 600 freare-|T, = 175°C...° | | ee a)== 4000 H TonTc_= 25°C175°C 70--- —<br>=g 500 *V_R = 600V CooS “Vp = 600 V<br>ke x<br>>° o<br>: .ae eee : ae<br>E 300 — 3 2000 _<br>~ ans dildt = 200A/ a<br>200 di/dt = 100A/us 1 os<br>pe i es 2 cee<br>> o<br>1000 SS rF.OCOMt~<—s—sSS a 0 ee J<br>0 20 40 60 80 0 20 40<br>Forward Current, Ir [A] Forwad<br>Figure 21. Transient Thermal Impedance of IGBT<br>= 0.1 | go —<br>rs5 0.20.1 —Z-Ca<br>¢ 0.05 ui i<br>w 0.02 PDM<br>sO °T Foo i t1 )<br>t2<br>3s ingle pulse 1. +<br>= Single pulse: DutyPeak Factor,T, = PdmD x=t1/t2Zthjc +<br>1E-3<br>10° 10° 10° 10° 10"<br>Rectangular Pulse Duration [sec]<br>Figure 22. Transient Thermal Impedance of Diode<br>(Loo<br>1 a<br>FSg 0.1 0.20.1 a=a<br>5 0.05 : 2 care : :<br>2 0.02 rr: eee oon<br>2 0.01<br>PDM<br>g= 0.01. singlepnt pulseNh tS t  L 1 |<I1 L<br>2 PIUIEMIEIE £ Le t2 > |<br>**----- End of picture text -----**<br>


**7** 

©2014 Fairchild Semiconductor Corporation FGH12040WD Rev. C7 

www.fairchildsemi.com 

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[15.87] [E] [4.82] 4.58 [E] B<br>15.37<br>A<br>  12.81  E<br>4.13<br>3.53 6.85 3.65 [E]<br>6.61 3.51<br>0.254 [M] B A [M]<br>[5.58] [E]<br>5.34 [1.35]<br>5.20 0.51<br>4.96<br>  13.08 MIN<br>[20.82] [E]<br>20.32<br>1 3<br>3 1<br>[1.87]<br>[3.93] [E] 1.53 [(2X)  ]<br>3.69<br>  1.60   [20.25] [E]<br>19.75<br>[2.77]<br>2.43<br>[0.71]<br>0.51<br>5.56 [2.66]<br>2.29<br>11.12<br>[1.35]<br>1.17<br>0.254 [M] B A [M]<br>**----- End of picture text -----**<br>


NOTES: UNLESS OTHERWISE SPECIFIED. 

A.  PACKAGE REFERENCE: JEDEC TO-247, ISSUE E, VARIATION AB, DATED JUNE, 2004. B.  DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH, AND TIE BAR EXTRUSIONS. 

**==> picture [99 x 44] intentionally omitted <==**

- C.  ALL DIMENSIONS ARE IN MILLIMETERS. 

- D.  DRAWING CONFORMS TO ASME Y14.5 - 1994 

> E DOES NOT COMPLY JEDEC STANDARD VALUE 

- F.   DRAWING FILENAME: MKT-TO247G03_REV02 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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**1** 



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