# IGBT, 30 A, 2.3 V, 186 W, 1.2 kV, TO-3P, 3 Pins

![Product image](https://novapart.co/image/farnell:2453877/)

**URL**: https://novapart.co/products/FGA15N120ANTDTU-F109/igbt-30-a-23-v-186-w-12-kv-to-3p-3-pins
**SKU**: FGA15N120ANTDTU-F109
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || IGBTs || Single IGBTs
**Price**: €1.7100
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Power Dissipation | 186W |
| Transistor Mounting | Through Hole |
| Transistor Case Style | TO-3P |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 30A |
| Collector Emitter Voltage Max | 1.2kV |
| Collector Emitter Saturation Voltage | 2.3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2453877/)

**==> picture [67 x 8] intentionally omitted <==**

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November 2013<br>**----- End of picture text -----**<br>


## **FGA15N120ANTDTU 1200 V, 15 A NPT Trench IGBT** 

## **Features** 

- NPT Trench Technology, Positive temperature coefficient 

- Low Saturation Voltage: VCE(sat), typ = 1.9 V @ IC = 15 A and TC = 25C 

- Low Switching Loss: Eoff, typ = 0.6 mJ @ IC = 15 A and TC = 25C 

## **Description** 

Using Fairchild's proprietary trench design and advanced NPT technology, the 1200V NPT IGBT offers superior conduction and switching performances, high avalanche ruggedness and easy parallel operation. 

This device is well suited for the resonant or soft switching application such as induction heating, microwave oven. 

- Extremely Enhanced Avalanche Capability 

**==> picture [469 x 388] intentionally omitted <==**

**----- Start of picture text -----**<br>
C<br>G<br>TO-3P<br>G C E E<br>Absolute Maximum Ratings<br>Symbol Description Ratings Unit<br>VCES Collector-Emitter Voltage 1200 V<br>es ee<br>VGES Gate-Emitter Voltage  20 V<br>es IC Collector Current     a @ TC =   25C 30 A<br>a Collector Current @ TC = 100C 15 A<br>| IICMF  —.)MOesa Pulsed Collector Current  Diode Continuous Forward CurrentDiode Continuous Forward Current(Note 1) @ T@ TCC —  = 25 = 100 ll C OA C ieee 301545 — E SC AAA<br>IFM Diode Maximum Forward Current 45 A<br>A.——- TPJD esee Maximum Power Dissipation Maximum Power Dissipation         Operating Junction Temperature —=— (sles @ T@ TCC =   25 = 100CC |, -55 to +15018674 —=FEe WWC<br>Tstg Storage Temperature Range -55 to +150 C<br>Rs TL Maximum Lead Temp. for soldering |}§ iA 300 C § ||<br>Purposes, 1/8” from case for 5 seconds<br>Thermal Characteristics<br>Symbol Parameter Typ. Max. Unit<br>RJC Thermal Resistance, Junction-to-Case for IGBT -- 0.67 C / W<br>RJC Thermal Resistance, Junction-to-Case for Diode -- 2.88 C / W<br>RJA Thermal Resistance, Junction-to-Ambient -- 40 C / W<br>**----- End of picture text -----**<br>


## **Absolute Maximum Ratings** 

## **Thermal Characteristics** 

**Notes:** 

(1) Repetitive rating: Pulse width limited by max. junction temperature 

**1** 

©2006 Fairchild Semiconductor Corporation FGA15N120ANTDTU Rev. C1 

www.fairchildsemi.com 

|**Symbol**<br>~~re~~|**Parameter**<br>~~re~~|**Test Conditions**<br>~~re~~|**Min.**<br>~~re~~|**Typ.**<br>~~re~~|**Max.**<br>~~re~~|**Unit**<br>~~re~~|
|---|---|---|---|---|---|---|
|**Off Characteristics**<br>~~re~~|||||||
|ICES<br>~~re~~|Collector Cut-Off Current<br>~~re~~|VCE= VCES, VGE= 0 V<br>~~re~~|--<br>~~re~~|--<br>~~re~~|3<br>~~re~~|mA<br>~~re~~|
|IGES<br>~~re~~|G-E Leakage Current<br>~~re~~|VGE= VGES, VCE= 0 V<br>~~re~~|--<br>~~re~~|--<br>~~re~~|± 250<br>~~re~~|nA<br>~~re~~|
|**On Characteristics**<br>~~[= ==Eee~~|||||||
|VGE(th)<br>~~[=~~|G-E Threshold Voltage<br>~~[=~~|IC= 15 mA, VCE= VGE<br>~~[= ==Eee~~|4.5<br>~~==Eee~~|6.5<br>~~==Eee~~|8.5<br>~~==Eee~~|V<br>~~==Eee~~|
|VCE(sat)<br>~~[=~~|Collector to Emitter<br>Saturation Voltage<br>~~[=~~|IC= 15 A,VGE= 15 V<br>~~[= ==Eee~~|--<br>~~==Eee~~|1.9<br>~~==Eee~~|2.4<br>~~==Eee~~|V<br>~~==Eee~~|
|||IC= 15 A,VGE= 15 V,<br>TC= 125C<br>~~[= ==Eee~~|--<br>~~==Eee~~|2.2<br>~~==Eee~~|--<br>~~==Eee~~|V<br>~~==Eee~~|
|||IC= 30 A,VGE= 15 V<br>~~[= ==Eee~~|--<br>~~==Eee~~|2.3<br>~~==Eee~~|--<br>~~==Eee~~|V<br>~~==Eee~~|
|**Dynamic Characteristics**<br>~~[= ==Eee~~|||||||
|Cies|Input Capacitance|VCE= 30 V,VGE= 0 V,<br>f = 1 MHz|--|2650|--|pF|
|Coes|Output Capacitance||--|143|--|pF|
|Cres|Reverse Transfer Capacitance||--|96|--|pF|
|**Switching Characteristics**|||||||
|td(on)|Turn-On Delay Time|VCC= 600 V, IC= 15 A,<br>RG= 10, VGE= 15 V,<br>Inductive Load, TC= 25C|--|15|--|ns|
|tr|Rise Time||--|20|--|ns|
|td(off)|Turn-Off Delay Time||--|160|--|ns|
|tf|Fall Time||--|100|180|ns|
|Eon|Turn-On Switching Loss||--|3|4.5|mJ|
|Eoff|Turn-Off Switching Loss||--|0.6|0.9|mJ|
|Ets|Total Switching Loss||--|3.6|5.4|mJ|
|td(on)|Turn-On Delay Time|VCC= 600 V, IC= 15 A,<br>RG= 10, VGE= 15 V,<br>Inductive Load, TC= 125C|--|15|--|ns|
|tr|Rise Time||--|20|--|ns|
|td(off)|Turn-Off Delay Time||--|170|--|ns|
|tf|Fall Time||--|150|--|ns|
|Eon|Turn-On Switching Loss||--|3.2|4.8|mJ|
|Eoff|Turn-Off Switching Loss||--|0.8|1.2|mJ|
|Ets|Total Switching Loss||--|4.0|6.0|mJ|
|Qg<br>~~ee~~|Total Gate Charge<br>~~ee~~|VCE= 600 V, IC= 15 A,<br>VGE= 15 V<br>~~ee~~|--<br>~~ee~~|120<br>~~ee~~|180<br>~~ee~~|nC<br>~~ee~~|
|Qge<br>~~ee~~|Gate-Emitter Charge<br>~~ee~~||--<br>~~ee~~|16<br>~~ee~~|22<br>~~ee~~|nC<br>~~ee~~|
|Qgc<br>~~ee~~|Gate-Collector Charge<br>~~ee~~||--<br>~~ee~~|50<br>~~ee~~|65<br>~~ee~~|nC<br>~~ee~~|



**2** 

©2006 Fairchild Semiconductor Corporation FGA15N120ANTDTU Rev. C1 

www.fairchildsemi.com 

|**Symbol**|**Parameter**|**Test Conditions**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|VFM|Diode Forward Voltage|IF= 15 A|TC=   25C|--|1.7|2.7|V|
||||TC= 125C|--|1.8|--||
|trr|Diode Reverse Recovery Time|IF= 15 A<br>diF/dt = 200 A/s|TC=   25C|--|210|330|ns|
||||TC= 125C|--|280|--||
|Irr|Diode Peak Reverse Recovery Cur-<br>rent||TC=   25C|--|27|40|A|
||||TC= 125C|--|31|--||
|Qrr|Diode Reverse Recovery Charge||TC=   25C|--|2835|6600|nC|
||||TC= 125C|--|4340|--||



**3** 

©2006 Fairchild Semiconductor Corporation FGA15N120ANTDTU Rev. C1 

www.fairchildsemi.com 

## **Typical Performance Characteristics** 

**Figure 1. Typical Output Characteristics** 

**Figure 2. Typical Saturation Voltage** 

**Characteristics** 

**==> picture [423 x 558] intentionally omitted <==**

**----- Start of picture text -----**<br>
200 TC = 25oC 20V 150 Common Emitter<br>17V 15V 12V 120 V T C GE=  = 15V    25oC<br>150 TC = 125oC<br>TT fe 90 TZ<br>VGE = 10V<br>100<br>50 y 60<br>30<br>0 ET 0 Ea<br>0 2 4 6 8 10 0 2 4 6<br>Collector-Emitter Voltage, VCE [V] Collector-Emitter Voltage, VCE [V]<br>Figure 3. Saturation Voltage vs. Case Figure 4. Saturation Voltage vs. VGE<br>              Temperature at Variant Current Level<br>3.0<br>Common Emitter Common Emitter<br>VGE = 15V 16 T C  = 25oC<br>IC = 24A<br>2.5 12<br>I C  = 15A 8<br>2.0<br>4<br>ae Gaal 24A GeGeae 15A<br>1.5 25 Py 50 75 LEE 100 125 150 0 0 ee 4 IC = 7.5A8 12 16 20<br>Case Temperature, TC [oC] Gate-Emitter Voltage, V GE [V]<br>Figure 5. Saturation Voltage vs. VGE   GE    Figure 6. Capacitance Characteristics<br>3500<br>Common Emitter<br>16 T C  = 125oC 3000 Ciss<br>2500<br>12<br>Saal SSeSeS 2000 Se<br>8 1500 Common EmitterVGE = 0V, f = 1MHz<br>SSG) Seenes 1000 Geren TC = 25 o C<br>4 CW 24A 15A EE 500 SHES Crss Coss<br>0 = IC = 7.5A 0 See<br>0.1 1 10<br>0 4 8 12 16 20<br>Gate-Emitter Voltage, VGE [V] Collector-Emitter Voltage, VCE[V]<br> [A]C  [A]C<br>Collector Current, I<br> Collector Current , I<br> [V]  [V]<br>CE CE<br>Collector-Emitter Voltage, V Collector-Emitter Voltage, V<br> [V]<br>CE<br>Capacitance [pF]<br>Collector-Emitter Voltage, V<br>**----- End of picture text -----**<br>


**Figure 3. Saturation Voltage vs. Case Temperature at Variant Current Level** 

**Figure 4. Saturation Voltage vs. VGE** 

**Figure 5. Saturation Voltage vs. VGE   GE** 

**Figure 6. Capacitance Characteristics** 

**4** 

©2006 Fairchild Semiconductor Corporation FGA15N120ANTDTU Rev. C1 

www.fairchildsemi.com 

## **Typical Performance Characteristics  (Continued)** 

**Figure 7. Turn-On Characteristics vs. Gate** 

**==> picture [456 x 591] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7. Turn-On Characteristics vs. Gate Figure 8. Turn-Off Characteristics vs. Gate<br>                Resistance                                                                        Resistance<br>100<br>Common Emitter<br>1000 V CC  = 600V, V GE  = 15V<br>tr ae ITTCC C  = 15A = 125= 25oC    o C  —_ td(off)<br>10 td(on) 100<br>tf<br>Common Emitter<br>VCC = 600V, VGE = 15V<br>IC = 15A<br>T C  = 25oC<br>TC = 125oC  10<br>1 bane[Pe] 0 aE 10 20 30 e 40 50 60 70<br>0 10 20 30 40 50 60 70<br>Gate Resistance, RG[] Gate Resistance, RG []<br>Figure 9. Switching Loss vs. Gate Resistance            Figure 10. Turn-On Characteristics vs.<br>                                                                                                                 Collector Current<br>Common Emitter Common Emitter<br>10 V ITC C CC = 15A = 25  = 600V, V oC    GE  = 15V 100 VT T CC GE = 2  = 125  = 15V, R5oC oC   G = 10<br>|ETT TC = 125 o C tr<br>Eon<br>td(on)<br>Eoff<br>10<br>1<br>Fe KEE<br>10 15 20 25 30<br>0 10 20 30 40 50 60 70<br>Gate Resistance, RG [] Collector Current, IC [A]<br>Figure 11. Turn-Off Characteristics vs. Figure 12. Switching Loss vs. Collector Current<br>                  Collector Current<br>Common Emitter Common Emitter<br>= VT T CC GE  = 25  = 125  = 15VoC   o C  , R G  = 10 td(off) 10 | VT TC CGE = 25  = 125  = 15V, RoC    oC   G = 10 Eon<br>100<br>Eoff<br>1<br>tf<br>10 ErrLL] 0.1 eand E RErrT<br>10 15 20 25 30 5 10 15 20 25 30<br>Collector Current, IC [A] Collector Current, IC [A]<br>Switching Time [ns] Switching Time [ns]<br>Switching Loss [mJ] Switching Time [ns]<br>Switching Time [ns] Switching Loss [mJ]<br>**----- End of picture text -----**<br>


**Resistance                                                                        Resistance** 

**Figure 12. Switching Loss vs. Collector Current** 

**5** 

©2006 Fairchild Semiconductor Corporation FGA15N120ANTDTU Rev. C1 

www.fairchildsemi.com 

## **Typical Performance Characteristics  (Continued)** 

**Figure 13. Gate Charge Characteristics                        Figure 14. SOA Characteristics** 

**==> picture [417 x 357] intentionally omitted <==**

**----- Start of picture text -----**<br>
15<br>Common Emitter<br>12 R TCL  = 40  = 25  oC 100 Ic MAX (Pulsed) 50  s<br>Paine Ic MAX (Continuous)<br>600V 4 10 100 s<br>9<br>TF 400V = DC Operat i on 1m s<br>1<br>6 Vcc = 200V<br>B-===- aineee a<br>Single Nonrepetitive<br>3 0.1 Pu l se Tc = 25 oC<br>Curves m ust be derated<br>l i near l y with increase<br>0 POvAnTSEEE E REE 0.01 | in tem perature eae<br>0 20 40 60 80 100 120 0.1 1 10 100 1000<br>Gate Charge, Qg [nC] Collector - Em itter Voltage, V CE [V]<br>Figure 15. Turn-Off SOA<br>100<br>10<br>Safe Operating Area<br>1 Be VGE = 15V, TC = 125oC<br>10 100 1000<br>Collector-Emitter Voltage, VCE [V]<br> [V]<br>GE Collector Current, Ic [A]<br>Gate-Emitter Voltage, V<br>Collector Current, I [A]C<br>**----- End of picture text -----**<br>


## **Figure 15. Turn-Off SOA** 

**Figure 16. Transient Thermal Impedance of IGBT** 

**==> picture [308 x 149] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br>1<br>0.5<br>0.1 0.2<br>0.1<br>0.05 Pdm<br>0.01 0.02 t1<br>0.01 t2<br>single pulse Duty factor D = t1 / t2<br>Peak Tj = Pdm  Zthjc + TC<br>1E-3<br>1E-5 1E-4 1E-3 0.01 0.1 1 10<br>Rectangular Pulse Duration [sec]<br>Thermal Response [Zthjc]<br>**----- End of picture text -----**<br>


**6** 

©2006 Fairchild Semiconductor Corporation FGA15N120ANTDTU Rev. C1 

www.fairchildsemi.com 

## **Typical Performance Characteristics  (Continued)** 

**==> picture [454 x 388] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 17. Forward Characteristics Figure 18. Reverse Recovery Current<br>50 30<br>di F /dt = 200A/s<br>25<br>10<br>20<br>ert 6  see<br>T J  = 125 o C 15<br>1 ALL T J  = 25oC Eee diF/dt = 100A/s<br>10<br>TC = 125 o C   5<br>TC =  25oC<br>0.1 FtZAtios7 0 mT e eeT<br>0.0 0.4 0.8 1.2 1.6 2.0 2.4 5 10 15 20 25<br>Forward Voltage , VF [V] Forward Current , IF [A]<br>Figure 19. Stored Charge Figure 20. Reverse Recovery Time<br>7000<br>400<br>6000 di F /dt = 200A/s diF/dt = 100A/s<br>5000 300<br>4000 A [ee] di F /dt = 100A/s<br>200<br>3000 diF/dt = 200A/s<br>2000 IA | [| | |<br>1000 Ce 100<br>0 eaeeePfffee ee 0 aed<br>5 10 15 20 25 5 10 15 20 25<br>Forward Current , IF [A] Forward Current , IF [A]<br>Forward Current , I [A]F  [A]rr<br>Reverse Recovery Currnet , I<br> [nC]rr<br> [ns]<br>rr<br>Stored Recovery Charge , Q<br>Reverse Recovery Time , t<br>**----- End of picture text -----**<br>


**7** 

©2006 Fairchild Semiconductor Corporation FGA15N120ANTDTU Rev. C1 

www.fairchildsemi.com 

## **Mechanical Dimensions** 

## **Figure 21.   TO-3P 3L - 3LD, T03, PLASTIC, EIAJ SC-65** 

_Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products._ 

_Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT3P0-003_ 

**8** 

©2006 Fairchild Semiconductor Corporation FGA15N120ANTDTU Rev. C1 

www.fairchildsemi.com 

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## **PRODUCT STATUS DEFINITIONS Definition of Terms** 

|**Datasheet Identification**|**Product Status**|**Definition**|
|---|---|---|
|Advance Information|Formative / In Design|Datasheet contains the design specifications for product development. Specifications<br>may change in any manner without notice.|
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Rev. I66 

**9** 

©2006 Fairchild Semiconductor Corporation FGA15N120ANTDTU Rev. C1 

www.fairchildsemi.com 



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