# Standard Recovery Diode, 100 V, 30 A, Single, 970 mV, 180 A

![Product image](https://novapart.co/image/farnell:2851911/)

**URL**: https://novapart.co/products/FERD30SM100DJFTR/standard-recovery-diode-100-v-30-a-single-970-mv
**SKU**: FERD30SM100DJFTR
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Standard Recovery Rectifier Diodes
**Price**: €0.4450
**Stock**: 10+
**Lead Time**: 126 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:100V; Forward Current If(AV):30A; Diode Configuration:Single; Forward Voltage VF Max:970mV; Reverse Recovery Time trr Max:-; Forward Surge Cur

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Product Range | - |
| Qualification | - |
| Diode Case Style | PowerFLAT |
| Diode Configuration | Single |
| Forward Voltage Max | 970mV |
| Forward Surge Current | 180A |
| Reverse Recovery Time | - |
| Average Forward Current | 30A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 100V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2851911/)

**FERD30SM100DJF** 

Datasheet 

100 V, 30 A field effect rectifier 

## **Features** 

- ST patented rectifier process 

- Stable leakage current over reverse voltage 

- Low forward voltage drop 

- High frequency operation 

- ECOPACK[®] 2 compliant 

## **Applications** 

- Switching diode 

- Notebook adapter 

- LED lighting 

- DC / DC converter 

## **Description** 

The FERD30SM100DJF is based on a proprietary technology that achieves the best in class VF / IR trade-off for a given silicon surface. 

Packaged in PowerFLAT™ 5x6, the FERD30SM100DJF is optimized for use in confined applications where both efficiency and thermal performance are key. 

## **Product status** 

FERD30SM100DJF 

|**Product summary**|**Product summary**|
|---|---|
|**Symbol**|**Value**|
|**IF(AV)**|30 A|
|**VRRM**|100 V|
|**T j(max.)**|175 °C|
|**VF(typ.)**|0.665 V|



**DS10782** - **Rev 3** - **February 2019** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**FERD30SM100DJF Characteristics** 

**1** 

## **Characteristics** 

**Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified, anode terminals short circuited)** 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage||100|V|
|IF(RMS)|Forward rms current||45|A|
|IF(AV)|Average forward current, δ = 0.5, square wave|TC= 100 °C|30|A|
|IFSM|Surge non repetitive forward current|tp= 10 ms sinusoidal|180|A|
|Tstg|Storage temperature range||-65 to +175|°C|
|Tj|Maximum operating junction temperature(1)||+175|°C|



_1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink._ 

**Table 2. Thermal resistance parameter** 

|**Symbol**|**Parameter**|**Max. value**|**Unit**|
|---|---|---|---|
|Rth(j-c)|Junction to case|2.6|°C/W|



For more information, please refer to the following application note : 

- AN5046 : Printed circuit board assembly recommendations for STMicroelectronics PowerFLAT™ packages 

**Table 3. Static electrical characteristics (anode terminals short-circuited)** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR(1)|Reverse leakage current|Tj= 25 °C|VR= VRRM|-|-|150|µA|
|||Tj= 125 °C||-|8|16|mA|
|||Tj= 125 °C|VR= 70 V|-|-|9||
|VF(2)|Forward voltage drop|Tj= 25 °C|IF= 5 A|-||0.480|V|
|||Tj= 125 °C||-|0.395|0.435||
|||Tj= 25 °C|IF= 10 A|-||0.595||
|||Tj= 125 °C||-|0.510|0.555||
|||Tj= 25 °C|IF= 30 A|-||0.970||
|||Tj= 125 °C||-|0.665|0.735||



_1. Pulse test: tp = 5 ms, δ < 2%_ 

_2. Pulse test: tp = 380 µs, δ < 2%_ 

To evaluate the conduction losses, use the following equation: 

P = 0.562 x IF(AV) + 0.0057 x IF[2] (RMS) 

For more information, please refer to the following application notes related to the power losses : 

- AN604: Calculation of conduction losses in a power rectifier 

- AN4021: Calculation of reverse losses on a power diode 

**DS10782** - **Rev 3** 

**page 2/9** 

**FERD30SM100DJF Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**Figure 1. Average forward power dissipation versus Figure 2. Average forward current versus ambient average forward current (anode terminals short circuited) temperature (δ = 0.5, anode terminals short circuited)** 

**==> picture [465 x 139] intentionally omitted <==**

**----- Start of picture text -----**<br>
30 PF(AV)(W)  40 IF(AV)(A)<br>δ = 0.5 δ = 1 Rth(j-a) = Rth(j-c)<br>25 δ = 0.2<br>30<br>δ = 0.1<br>20<br>δ = 0.05<br>15 20<br>10 T<br>T<br>10<br>5<br>δ= tp/T tp I F(AV) (A)<br>0 δ= tp/T tp Tamb(°C)<br>0<br>0 5 10 15 20 25 30 35 40<br>0 25 50 75 100 125 150 175<br>**----- End of picture text -----**<br>


**Figure 3. Relative variation of thermal impedance junction Figure 4. Reverse leakage current versus reverse voltage to case versus pulse duration applied (typical values)** 

**==> picture [458 x 138] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zth(j-c)/Rth(j-c) IR(mA)<br>1.0 1.E+01 T  = 125 °C<br>0.9 POWERFlat™ 5x6 j<br>0.8 Tj = 100  ° C<br>0.7<br>1.E+00<br>0.6 Tj = 75 °C<br>0.5<br>0.4 Tj = 50 °C<br>0.3 Single pulse 1.E-01<br>0.2<br>T  = 25 °C<br>0.10.0 tP(s) 1.E-02 j VR(V)<br>1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 0 10 20 30 40 50 60 70 80 90 100<br>**----- End of picture text -----**<br>


**Figure 5. Junction capacitance versus reverse voltage applied (typical values)** 

**==> picture [210 x 135] intentionally omitted <==**

**----- Start of picture text -----**<br>
C(pF)<br>10000<br>F = 1 MHz<br>VOSC = 30 mVRMS<br>Tj = 25  ° C<br>1000<br>VR(V)<br>100<br>1 10 100<br>**----- End of picture text -----**<br>


**Figure 6. Forward voltage drop versus forward current (typical values, anode terminals short circuited)** 

**==> picture [209 x 136] intentionally omitted <==**

**----- Start of picture text -----**<br>
IF(A)<br>100.0<br>10.0<br>Tj = 75 °C<br>T  = 125 °C<br>1.0 j<br>T  = 25 °C<br>j<br>0.1 VF(V)<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9<br>**----- End of picture text -----**<br>


**DS10782** - **Rev 3** 

**page 3/9** 

**FERD30SM100DJF Characteristics (curves)** 

**Figure 7. Thermal resistance junction to ambient versus copper surface under tab (typical values)** 

**==> picture [225 x 152] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(j-a) (°C/W)<br>150<br>PowerFlat™_5X6<br>125 epoxy printed board FR4, eCu = 35 µm<br>100<br>75<br>50<br>25<br>SCu(cm²)<br>0<br>0 1 2 3 4 5 6 7 8 9 10<br>**----- End of picture text -----**<br>


**DS10782** - **Rev 3** 

**page 4/9** 

**FERD30SM100DJF Package information** 

**2** 

## **Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. 

## **2.1 PowerFLAT™ 5x6 package information** 

- Epoxy meets UL 94,V0 

- Cooling method: by conduction (C) 

**Figure 8. PowerFLAT™ 5x6 package outline (non-contractual)** 

**==> picture [118 x 139] intentionally omitted <==**

**==> picture [66 x 292] intentionally omitted <==**

**----- Start of picture text -----**<br>
Bottom view<br>Side view<br>Top view<br>**----- End of picture text -----**<br>


**DS10782** - **Rev 3** 

**page 5/9** 

**FERD30SM100DJF PowerFLAT™ 5x6 package information** 

**Table 4. PowerFLAT™ 5x6 mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Rf**|**Millimeters**|||**Inches (for reference only)**|||
|**e**|**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.80||1.00|0.031||0.039|
|A1|0.00||0.05|0.000||0.002|
|b|0.30||0.50|0.01||0.02|
|c||0.25|||0.010||
|D|4.80||5.40|0.189||0.212|
|D2|3.91||4.45|0.154||0.175|
|e||1.27|||0.050||
|E|5.90||6.35|0.232||0.250|
|E2|3.34||3.70|0.138||0.146|
|L|0.50||0.80|0.020||0.031|
|K|1.10||1.575|0.015||0.023|
|L1|0.05|0.15|0.25|0.002|0.006|0.009|



**Figure 9. PowerFLAT™ 5x6 recommended footprint (dimensions are in mm)** 

**DS10782** - **Rev 3** 

**page 6/9** 

**FERD30SM100DJF Ordering Information** 

**3 Ordering information** 

## **Table 5. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|FERD30SM100DJFTR|F30SM 100|PowerFLAT™ 5x6|95 mg|3000|Tape and reel|



**DS10782** - **Rev 3** 

**page 7/9** 

**FERD30SM100DJF** 

## **Revision history** 

**Table 6. Document revision history** 

|**Date**|**Version**|**Changes**|
|---|---|---|
|09-Jan-2015|1|Initial release.|
|29-Nov-2018|2|UpdatedSection Cover imageandSection 2.1 PowerFLAT™ 5x6 package information. Added<br>Section Applications.|
|08-Feb-2019|3|UpdatedFigure 8. PowerFLAT™ 5x6 package outline (non-contractual)andTable 4. PowerFLAT™<br>5x6 mechanical data.|



**DS10782** - **Rev 3** 

**page 8/9** 

**FERD30SM100DJF** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2019 STMicroelectronics – All rights reserved 

**DS10782** - **Rev 3** 

**page 9/9** 



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