# Resettable Fuse, PPTC, 0603 (1608 Metric), PolySwitch femtoSMDC Series, 15 VDC, 50 mA, 150 mA

![Product image](https://novapart.co/image/farnell:2786609RL/)

**URL**: https://novapart.co/products/FEMTOSMDC005F-2/resettable-fuse-pptc-0603-1608-metric-polyswitch
**SKU**: FEMTOSMDC005F-2
**Manufacturer**: LITTELFUSE
**Category**: Circuit Protection || Thermistors || Resettable Fuses || Surface Mount PPTCs
**Price**: €0.2850
**Stock**: 1000+
**Lead Time**: 85 days (indicative)

## Description

Thermistor Mounting:SMD; Product Range:PolySwitch femtoSMDC Series; Holding Current:50mA; Tripping Current:150mA; Voltage Rating:15VDC; Operating Temperature Min:-40°C; Operating

## Specifications

| Parameter | Value |
|---|---|
| Svhc | To Be Advised |
| Time To Trip | 0.1s |
| Trip Current | 150mA |
| Product Range | PolySwitch femtoSMDC Series |
| Voltage Rating | 15VDC |
| Holding Current | 50mA |
| Pptc Case Style | 0603 (1608 Metric) |
| Current Rating Max | 40A |
| Operating Temperature Max | 85°C |
| Operating Temperature Min | -40°C |
| Automotive Qualification Standard | - |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2786609RL/)

PTC **Datasheet** 

**femtoSMDC Series** Surface Mount 

## HFL_J@WAG. **RoHS** A 

## **Description** 

The femtoSMDC series provides surface mount overcurrent protection for applications where space is at a premium and resettable protection is desired. 

## **Features & Benefits** 

- Broadest range of resettable devices available in industry 

- Low resistance 

   - Fast time-to-trip 

   - RoHS complaint, lead-free and halogen-free 

- Small 0603 footprint 

## **Applications** 

## **Additional Information** 

- Mobile Electronics 

- Batteries 

- Computer 

- Portable electronics 

- Multimedia 

- Game machines 

- Telephone and broadband 

- Automotive 

- Industrial controls 

- Battery 

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Resources Accessories Samples<br>**----- End of picture text -----**<br>


## **Agency Approvals** 

|**Agency**|**Agency File Number**|
|---|---|
||E74889|
||78165|
|A|72161792<br>50253253|



## **Electrical Charachteristics** 

|femtoSMDC005F|RF2926-000|0.05|0.15|15|40|0.50|0.50|0.10|3.80|30.00|
|---|---|---|---|---|---|---|---|---|---|---|
|femtoSMDC008F|RF3692-000|0.08|0.20|12|40|0.50|0.60|0.10|2.80|14.00|
|femtoSMDC010F|RF3693-000|0.10|0.25|12|40|0.50|0.70|0.10|1.70|8.00|
|femtoSMDC012F|RF3695-000|0.12|0.30|9|40|0.50|0.80|0.10|1.10|5.80|
|femtoSMDC016F|RF3696-000|0.16|0.40|9|40|0.50|1.00|0.10|1.00|4.20|
|femtoSMDC020F|RF2587-000|0.20|0.45|9|40|0.50|2.00|0.10|0.70|3.00|
|femtoSMDC035F|RF2477-000|0.35|0.70|6|40|0.50|3.50|0.10|0.28|1.00|



## **Notes:** 

- **IH** : Hold current: maximum current device will pass without interruption in 20°C still air. **IT** : Trip current: minimum current that will switch the device from low resistance to high resistance in 20°C still air. 

- **VMAX** : Maximum continuous voltage device can withstand without damage at rated current. 

- **IMAX** : Maximum fault current device can withstand without damage at rated voltage. 

**PD** : Power dissipated from device when in the tripped state in 20°C still air. 

**RMIN** : Minimum resistance of device as supplied at 20°C unless otherwise specified. 

- **R1MAX** : Maximum resistance measured one hour post-trip or post-reflow at 20°C. 

© 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/31/21 

**1** 

PTC **Datasheet** 

**femtoSMDC Series** Surface Mount 

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## **Temperature Rerating** 

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Maximum Ambient Temperature<br>Part Number -40°C  -20°C  0°C  20°C  25°C 40°C 50°C 60°C 70°C 80°C 85°C<br>Hold Current (A)<br>femtoSMDC Series — Size 1608mm/0603mils<br>femtoSMDC005F 0.08  0.07  0.06  0.05  0.05  0.04  0.04  0.03  0.03  0.02  0.02<br>femtoSMDC008F 0.13  0.11  0.10  0.08  0.08  0.07  0.06  0.06  0.05  0.04  0.04<br>femtoSMDC010F 0.16  0.14  0.12  0.11  0.10  0.09  0.08  0.07  0.06  0.05  0.04<br>femtoSMDC012F 0.18  0.16  0.14  0.12  0.12  0.11  0.10  0.08  0.08  0.07  0.06<br>femtoSMDC016F 0.25  0.22  0.18  0.17  0.16  0.14  0.12  0.11  0.10  0.08  0.07<br>femtoSMDC020F 0.30  0.27  0.24  0.20  0.20  0.17  0.16  0.14  0.12  0.11  0.10<br>femtoSMDC035F 0.53  0.47  0.41  0.36  0.35  0.30  0.27  0.25  0.22  0.19  0.17<br>**----- End of picture text -----**<br>


**Note:** The average time current curves and Temperature Rerating curve performance is affected by a number or variables, and these curves provided as guidance only. Customer must verify the performance in their application. 

## **Temperature Rerating Curve** 

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200<br>180<br>160<br>140<br>120<br>100<br>80<br>60<br>40<br>20<br>0<br>-40  -20  0  20  40  60  80  100  120<br>Ambient Temperature (°C)<br>% of Rated Hold and Trip Current<br>**----- End of picture text -----**<br>


© 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/31/21 

**2** 

PTC **Datasheet** 

**femtoSMDC Series** Surface Mount 

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## **Typical Time-to-Trip Curves at 20°C** 

## **femtoSMDCxxxF** 

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**----- Start of picture text -----**<br>
A B C DE G<br>A  =  femtoSMDC005F  100 F<br>B  =  femtoSMDC008F<br>C  =  femtoSMDC010F  10<br>D  = femtoSMDC012F<br>E  = femtoSMDC016F<br>1<br>F  = femtoSMDC020F<br>G  = femtoSMDC035F<br>0.1<br>0.01<br>E<br>A C D G<br>F<br>0.001<br>0.01 0.1 1 B 10<br>Fault Current (A)<br>Time-to-Trip (s)<br>**----- End of picture text -----**<br>


## **Physical Specifications** 

||**Physical Specifcations**|
|---|---|
|**Terminal Pad Material**|100%MatteTin with NickelUnderplate|
|**Soldering Characteristics**|ANSI/J-STD-002Category 3|
|**Solder Heat Withstand**|per IEC-STD68-2-20,TestTb, Section5,Method1a|
|**Flammability Resistance**|per IEC 695-2-2 NeedleFlameTestfor 20 seconds|



## **Environmental Specifications** 

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Test Test Method Conditions Resistance Change<br>60°C, 1000 hrs ±3% typ<br>Storage Life PS300, Section 5.3.2 85°C, 1000 hrs ±3% typ<br>Humidity Aging PS300, Section 5.3.1 85°C, 85% R.H., 100 hrs ±1.2% typ<br>Thermal Shock MIL-STD-202, Method 107G 85°C, -40°C (20 Times)125°C, -55°C (10 Times) -33% typ-33% typ<br>Vibration MIL-STD-883C per MIL-STD-883C No Change<br>Freon No Change<br>Solvent Resistance PS300, Section 5.2.2 Trichloroethane No Change<br>Hydrocarbons No Change<br>Moisture Resistance Level Level 1, J-STD-020<br>40°C max, 70% RH max; devices should remain in original sealed bags prior to use.<br>Storage Conditions<br>Devices may not meet specifed values if these storage conditions are exceeded.<br>**----- End of picture text -----**<br>


© 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/31/21 

**3** 

PTC **Datasheet** 

**femtoSMDC Series** Surface Mount 

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## **Dimension Figures** 

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A B<br>C<br>D E<br>**----- End of picture text -----**<br>


**Figure 1** 

## **Dimension** 

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Dimensions in Millimeters (Inches)<br>Part Number A B C D E Figure<br>Min Max Min Max Min Max Min Max Min Max<br>femtoSMDC Series — Size 1608mm/0603mils<br>1.40 1.80 0.45 0.85 0.60 1.00 0.10 0.50 0.075<br>femtoSMDC005F — 1<br>(0.055) (0.071) (0.017) (0.033) (0.023) (0.039) (0.004) (0.020) (0.003)<br>1.40 1.80 0.45 0.85 0.60 1.00 0.10 0.50 0.075<br>femtoSMDC008F — 1<br>(0.055) (0.071) (0.017) (0.033) (0.023) (0.039) (0.004) (0.020) (0.003)<br>1.40 1.80 0.45 0.85 0.60 1.00 0.10 0.50 0.075<br>femtoSMDC010F — 1<br>(0.055) (0.071) (0.017) (0.033) (0.023) (0.039) (0.004) (0.020) (0.003)<br>1.40 1.80 0.35 0.75 0.60 1.00 0.10 0.50 0.075<br>femtoSMDC012F — 1<br>(0.055) (0.071) (0.013) (0.030) (0.023) (0.039) (0.004) (0.020) (0.003)<br>1.40 1.80 0.35 0.75 0.60 1.00 0.10 0.50 0.075<br>femtoSMDC016F — 1<br>(0.055) (0.071) (0.013) (0.030) (0.023) (0.039) (0.004) (0.020) (0.003)<br>1.40 1.80 0.35 0.75 0.60 1.00 0.10 0.50 0.075<br>femtoSMDC020F — 1<br>(0.055) (0.071) (0.013) (0.030) (0.023) (0.039) (0.004) (0.020) (0.003)<br>1.40 1.80 0.55 0.95 0.60 1.00 0.10 0.50 0.075<br>femtoSMDC035F — 1<br>(0.055) (0.071) (0.021) (0.037) (0.023) (0.039) (0.004) (0.020) (0.003)<br>**----- End of picture text -----**<br>


## **Recommended Pad Layout** 

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A<br>B C B<br>**----- End of picture text -----**<br>


## **Packaging and Marking Information** 

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Part Tape and Reel   Standard  Part Dimension A  Dimension B  Dimension C  Agency<br>Number Quantity Package Marking (Nom) (Nom) (Nom) Recognition<br>femtoSMDC Series — Size 1608mm/0603mils<br>femtoSMDC005F 4,000 20,000 A 0.80 (0.032) 0.60 (0.024) 0.80 (0.032) UL, CSA<br>femtoSMDC008F 4,000 20,000 T 0.80 (0.032) 0.60 (0.024) 0.80 (0.032) UL, CSA, TÜV<br>femtoSMDC010F 4,000 20,000 B 0.80 (0.032) 0.60 (0.024) 0.80 (0.032) UL, CSA, TÜV<br>femtoSMDC012F 5,000 25,000 C 0.80 (0.032) 0.60 (0.024) 0.80 (0.032) UL, CSA<br>femtoSMDC016F 5,000 25,000 E 0.80 (0.032) 0.60 (0.024) 0.80 (0.032) UL, CSA<br>femtoSMDC020F 5,000 25,000 F 0.80 (0.032) 0.60 (0.024) 0.80 (0.032) UL, CSA, TÜV<br>femtoSMDC035F 4,000 20,000 K 0.80 (0.032) 0.60 (0.024) 0.80 (0.032) UL, CSA<br>**----- End of picture text -----**<br>


© 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/31/21 

**4** 

PTC **Datasheet** 

**femtoSMDC Series** Surface Mount 

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## **Solder Reflow Recommendations** 

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Profile Feature Pb-Free Assembly<br>Average ramp up rate (TsMAX to Tp) 3°C/s max Tp tp Critical Zone<br>Preheat - Ramp Up TL to Tp<br>•  Temperature min (Ts•  Temperature max (TsMINMAX) ) 150°C200°C TL TsMAX tL<br>•  Time (tsMIN to tsMAX) 60-120 s TsMIN<br>Time maintained above: -<br>•  Temperature (TL) 217°C Preheatts Ramp Down<br>•  Time (tL) 60-150 s<br>Peak/Classification temperature (Tp) 260°C 25<br>t 25˚C to Peak<br>Time within 5°C of actual peak temperature -<br>Reflow Profile Time<br>Time (tp) 30 s max<br>Ramp down rate 3°C/s max<br>Time 25°C to peak temperature 8 min max<br>Temperature<br>**----- End of picture text -----**<br>


**Note:** All temperatures refer to topside of the package, measured on the package body surface. 

## **Solder Reflow** 

- Recommended reflow method: IR, hot air, nitrogen. 

- Recommended maximum paste thickness: 0.25mm (0.010in) 

- Devices can be cleaned using standard methods and aqueous solvents. 

- Experience has shown the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed underneath each device’s termination.  As such, we request that customers comply with our recommended solder pad layouts. 

- Customer should validate that the solder paste amount and reflow recommendations meet its application. 

- We request that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch devices. It is possible that raised features could negatively impact solderability performance of our devices. 

## **Rework** 

- Standard industry practices. (Please also avoid direct contact to the device.) 

## **Part Ordering Number System** 

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femtoSMDC       005    F    -2<br>Packaging<br>2 = Tape and Reel<br>Lead Free<br>Hold Current Indicator<br>Product Series<br>**----- End of picture text -----**<br>


© 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/31/21 

**5** 

PTC **Datasheet** 

**femtoSMDC Series** Surface Mount 

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## **Tape and Reel Specifications** 

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**----- Start of picture text -----**<br>
femtoSMDC  femtoSMDC<br>EIA 481-1 EIA 481-1<br>femtoSMDC005F femtoSMDC005F<br>Description femtoSMDC012F  Description femtoSMDC012F<br>femtoSMDC008F femtoSMDC008F<br>femtoSMDC016F  femtoSMDC016F<br>femtoSMDC010F femtoSMDC010F<br>femtoSMDC020F femtoSMDC020F<br>femtoSMDC035F femtoSMDC035F<br>W 8.0 ± 0.30 8.0 ± 0.30 E1  1.75 ± 0.10  1.75 ± 0.10<br>P0  4.0 ± 0.10  4.0 ± 0.10 E2 min  6.25  6.25<br>P1  4.0 ± 0.10  4.0 ± 0.10 T max  0.3  0.3<br>P2  2.0 ± 0.05  2.0 ± 0.05 T1 max  0.1  0.1<br>A0  0.95 ± 0.05  0.95 ± 0.05 K0 0.90 ± 0.1 0.55 ± 0.05<br>B0  1.85 ± 0.05  1.85 ± 0.05 A max  185 185<br>B1 max  4.35  4.35 N min 50 50<br>D0  1.55 ± 0.05  1.55 ± 0.05 W1 8.4 + 1.5/-.00 8.4 + 1.5/-.00<br>F  3.50 ± 0.05  3.50 ± 0.05 W2 max 14.4 14.4<br>**----- End of picture text -----**<br>


## **Tape and Reel Diagrams** 

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T<br>Cover Tape P 0<br>P2 D0<br>E1<br>Figure 1 F<br>W<br>B1 K0 B0 E2<br>T1<br>Embossment A 0 P 1<br>Center lines<br>of cavity<br>W2 (Measured at Hub)<br>Figure 2<br>Cover Tape A N (Hub Dia.)<br>Carrier Tape W1 (Measured at Hub)<br>Embossed Cavity<br>**----- End of picture text -----**<br>


## **Warning** 

- Users should independently evaluate the suitability of and test each product selected for their own application. 

- Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. 

- These devices are intended for protection against damage caused by occasional overcurrent or overtemperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated. 

- Contamination of the PPTC material with certain silicone-based oils or some aggressive solvents can adversely impact the performance of the devices. 

- Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components. 

- PPTC devices are not recommended for installation in applications where the device is constrained such that its PTC properties are inhibited, for example in rigid potting materials or in rigid housings, which lack adequate clearance to accommodate device expansion. 

- Operation in circuits with a large inductance can generate a circuit voltage (Ldi/dt) above the rated voltage of the device. 

**Disclaimer Notice -** Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. 

© 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/31/21 

**6** 



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