# Power MOSFET, P Channel, 40 V, 30 A, 0.0205 ohm, DFNW, Surface Mount

![Product image](https://novapart.co/image/farnell:3616196/)

**URL**: https://novapart.co/products/FDWS9511L-F085/power-mosfet-p-channel-40-v-30-a-00205-ohm-dfnw
**SKU**: FDWS9511L-F085
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3830
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (15-Jan-2018) |
| No. Of Pins | 8Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 68.2W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | DFNW |
| Drain Source Voltage Vds | 40V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 30A |
| Drain Source On State Resistance | 0.0205ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3616196/)

**DATA SHEET www.onsemi.com** ~~ee~~ 

## MOSFET ~~a~~ – Power, Single P-Chanel 

## -40 V, -30 A, 20.5 m 

## FDWS9511L-F085 

## **Features** 

- Small Footprint (5x6 mm) for Compact Design 

- Low R to Minimize Conduction Losses DS(on) 

- Low QG and Capacitance to Minimize Driver Losses 

- Wettable Flank Option for Enhanced Optical Inspection 

- AEC−Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **MAXIMUM RATINGS** (TJ = 25 ° C unless otherwise noted) 

**Parameter Symbol Value Unit** Drain−to−Source Voltage VDSS −40 V Gate−to−Source Voltage VGS ± 20 V Continuous Drain Steady TC = 25 ° C ID −30 A Current R(Notes 1, 3)JC State TC = 100 ° C −30 Power Dissipation TC = 25 ° C PD 68.2 W R JC (Note 1) TC = 100 ° C 34.1 ~~Tee~~ Continuous Drain Steady TC = 25 ° C ID −9.1 A ~~Pe)~~ Current R(Notes 1, 2, 3)JA State TC = 100 ° C −6.5 Power Dissipation TC = 25 ° C PD 3.0 W R JA (Notes 1, 2) TC = 100 ° C 1.5 ~~=_—=e=e Ce~~ Pulsed Drain Current T ~~ee~~ C = 25 ° C, tp ~~ee~~ = 10 s ~~ee~~ IDM −298 A Operating Junction and Storage Temperature TJ, TSTG −55 to ° C Range +175 ~~i~~ Source Current (Body Diode) IS −100 A ~~a~~ Single Pulse Drain−to−Source Avalanche EAS 25 mJ Energy (IL(pk) = −25) ~~i~~ Lead Temperature for Soldering Purposes TL 260 ° C (1/8 ″ from case for 10 s) ~~Pt~~ Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

**THERMAL RESISTANCE MAXIMUM RATINGS** 

**Parameter Symbol Value Unit** Junction−to−Case − Steady State R JC 2.2 ° C/W Junction−to−Ambient − Steady State (Note 2) R JA 50 ~~a~~ 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. Current is limited by wirebond configuration 

2. Surface−mounted on FR4 board using a 650 mm[2] , 2 oz. Cu pad. 

3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. 

**==> picture [163 x 158] intentionally omitted <==**

**----- Start of picture text -----**<br>
V(BR)DSS RDS(ON) MAX ID MAX<br>20.5 m  @ −10 V<br>−40 V −30 A<br>32.0 m  @ −4.5 V<br>D (5,6,7,8)<br>G (4)<br>S (1,2,3)<br>**----- End of picture text -----**<br>


**P−Channel MOSFET** 

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Top Bottom<br>D<br>D<br>D<br>D<br>G<br>S<br>S<br>S<br>Pin 1<br>DFNW8<br>CASE 507AU<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAM** 

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ON AYWWWL<br>FDWS<br>9511L<br>|<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>WL = Assembly Lot<br>FDWS = Device Code<br>9511L = Device Code<br>(Note: Microdot may be in either location)<br>**----- End of picture text -----**<br>


**ORDERING INFORMATION** 

**Device Package Shipping**[†] FDWS9511L−F085 DFNW8 3000 / (Power56) Tape & Reel (Pb−Free) ~~T_T~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

Publication Order Number: **FDWS9511L−F085/D** 

**1** 

© Semiconductor Components Industries, LLC, 2018 **October, 2021 − Rev. 2** 

**FDWS9511L−F085** 

## **ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTIC**|**S**(TJ= 25°C|unless otherwise noted)|unless otherwise noted)|||||
|---|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Test Condition**||**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||||
|Drain−to−Source Breakdown Voltage|V(BR)DSS|VGS= 0 V, ID= −250�A||−40|||V|
|Drain−to−Source Breakdown Voltage<br>Temperature Coefficient|V(BR)DSS/<br>TJ||||20||mV/°C|
|Zero Gate Voltage Drain Current|IDSS|VGS= 0 V,<br>VDS= −40 V|TJ= 25°C|||−1|�A|
||||TJ= 175°C|||−1|mA|
|Zero Gate Voltage Drain Current|IGSS|VDS= 0 V, VGS=±16 V||||±100|nA|
|**ON CHARACTERISTICS**(Note 4)||||||||
|Gate Threshold Voltage|VGS(TH)|VGS= VDS, ID= −250�A||−1|−1.8|−3|V|
|Threshold Temperature Coefficient|VGS(TH)/TJ||||−5.1||mV/°C|
|Drain−to−Source On Resistance|RDS(on)|VGS= −10 V|ID= −30 A||17|20.5|m�|
|||VGS= −4.5 V|ID= −15 A||26|34||
|**CHARGES, CAPACITANCES & GATE RESISTANCE**||||||||
|Input Capacitance|CISS|VGS= 0 V, f = 100 KHz, VDS= −20 V|||1200||pF|
|Output Capacitance|COSS||||470|||
|Reverse Transfer Capacitance|CRSS||||26|||
|Gate Resistance|RG|VGS= 0.5 V, f = 1 MHz|||37||�|
|Total Gate Charge|QG(TOT)|VGS= −4.5 V, VDS= −20 V; ID= −30 A|||8||nC|
|||VGS= −10 V, VDS= −20 V; ID= −30 A|||18|||
|Threshold Gate Charge|QG(TH)|VGS= 0 to −1 V|||1|||
|Gate−to−Source Gate Charge|QGS|VDD= −20 V, ID= −30 A|||4|||
|Gate−to−Drain “Miller” Charge|QGD||||3|||
|Plateau Voltage|VGP||||−3.8||V|
|**SWITCHING CHARACTERISTICS**||||||||
|Turn−On Delay Time|td(ON)|VDD= −20 V, ID= −30 A,<br>VGS= −10 V, RGEN= 6�|||8||ns|
|Turn−On Rise Time|tr||||28|||
|Turn−Off Delay Time|td(OFF)||||112|||
|Turn−Off Fall Time|tf||||40|||
|**DRAIN−SOURCE DIODE CHARACTERISTICS**||||||||
|Source−to−Drain Diode Voltage|VSD|ISD= −30 A, VGS= 0 V|||−0.9|−1.3|V|
|||ISD= −15 A, VGS= 0 V|||−0.85|−1.2||
|Reverse Recovery Time|tRR|VGS= 0 V, dISD/dt = 100 A/�s,<br>IS= −30 A|||36||ns|
|Charge Time|ta||||18|||
|Discharge Time|tb||||18|||
|Reverse Recovery Charge|QRR||||24||nC|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

4. Pulse Test: pulse width ≤ 300 � s, duty cycle ≤ 2%. 

5. Switching characteristics are independent of operating junction temperatures. 

**www.onsemi.com** 

**2** 

**FDWS9511L−F085** 

## **TYPICAL CHARACTERISTICS** 

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1.2 50<br>45 Current Limited<br>1.0 by Package<br>40<br>35<br>0.8<br>30<br>0.6 25 VGS = 10 V<br>20<br>0.4<br>15<br>10<br>0.2<br>5<br>0 0<br>0 25 50 75 100 125 150 175 25 50 75 100 125 150 175<br>TC, CASE TEMPERATURE ( ° C) TC, CASE TEMPERATURE ( ° C)<br>Figure 1. Normalized Power Dissipation vs. Figure 2. Maximum Continuous Drain Current<br>Case Temperature vs. Case Temperature<br>2<br>1<br>50% Duty Cycle<br>20%<br>P DM<br>10%<br>0.1 5%<br>2% t1<br>1% t2<br>DUTY CYCLE, D = t1/t2<br>Single Pulse Peak T J  = P DM  X Z �JC  X R �JC  + T C<br>0.01<br>0.00001 0.0001 0.001 0.01 0.1 1 10<br>t, RECTANGULAR PULSE DURATION (s)<br>Figure 3. Normalized Maximum Transient Thermal Impedance<br>1000<br>VGS = −10 V TC = 25 ° C<br>For temperatures above 25 ° C<br>derate peak current as follows:<br>175  � T<br>I  � I C<br>25 � 150<br>100 � �<br>Single Pulse<br>10<br>0.00001 0.0001 0.001 0.01 0.1 1 10<br>t, RECTANGULAR PULSE DURATION (s)<br>, DRAIN CURRENT (A)<br>ID<br>POWER DISSIPATION MULTIPLIER<br>, NORMALIZED THERMAL IMPEDANCE<br>JC<br>�<br>Z<br>, PEAK CURRENT (A)<br>IDM<br>**----- End of picture text -----**<br>


**Figure 4. Peak Current Capability** 

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**3** 

**FDWS9511L−F085** 

## **TYPICAL CHARACTERISTICS** 

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1K<br>Operation in this area may<br>be limited by package<br>100<br>100  � s<br>10<br>TC = 25 ° C<br>TJ = Max Rated<br>Single Pulse<br>1 1 ms<br>Operation in this area may 10 ms<br>100 ms<br>be limited by RDS(on)<br>0.1<br>0.1 1 10 100<br>−VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>Figure 5. Forward Bias Safe Operating Area<br>100<br>Pulse Duration = 250  � s<br>Duty Cycle = 0.5% Max<br>80<br>VDS = −5 V<br>60<br>40 T J  = 25 ° C<br>20<br>TJ = 175 ° C TJ = −55 ° C<br>0<br>1 2 3 4 5 6 7 8<br>VGS, GATE−TO−SOURCE VOLTAGE (V)<br>Figure 7. Transfer Characteristics<br>120<br>250  � s Pulse Width VGS = 10 V<br>TJ = 25 ° C 7.0 V<br>80<br>5.0 V<br>4.5 V<br>40 4.0 V<br>3.5 V<br>0<br>0 1 2 3 4 5<br>−VDS, DRAIN−SOURCE VOLTAGE (V)<br>, DRAIN CURRENT (A)<br>ID<br>, DRAIN CURRENT (A)<br>ID<br>, DRAIN CURRENT (A)<br>D<br>−I<br>**----- End of picture text -----**<br>


**Figure 9. Saturation Characteristics** 

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100<br>If R = 0, tAV=(L)(IAS)/(1.3*Rated BVDSS− VDD)<br>If R  ≠  0, t AV =(L/R)In[(I AS *R)/(1.3*Rated BV DSS − V DD )+1]<br>10 Starting TJ = 25 ° C<br>Starting TJ = 150 ° C<br>NOTE: Refer to  onsemi<br>Application Notes AN7514 and AN7515<br>1<br>0.001 0.01 0.1 1 10 100<br>, AVALANCHE CURRENT (A)<br>IAS<br>**----- End of picture text -----**<br>


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tAV, TIME IN AVALANCHE (mS)<br>**----- End of picture text -----**<br>


**Figure 6. Unclamped Inductive Switching Capability** 

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100<br>VGS = 0 V<br>10<br>1<br>0.1<br>TJ = 175 ° C<br>0.01<br>TJ = 25 ° C TJ = −55 ° C<br>0.001<br>0 0.2 0.4 0.6 0.8 1.0 1.2<br>−VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 8. Forward Diode Characteristics<br>120<br>250  � s Pulse Width<br>TJ = 175 ° C<br>VGS = 10 V<br>7.0 V<br>80<br>5.0 V<br>4.5 V<br>40 4.0 V<br>3.5 V<br>0<br>0 1 2 3 4 5<br>VDS, DRAIN−SOURCE VOLTAGE (V)<br>, REVERSE DRAIN CURRENT (A)<br>S<br>−I<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


**Figure 10. Saturation Characteristics** 

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**4** 

**FDWS9511L−F085** 

## **TYPICAL CHARACTERISTICS** 

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140 1.8<br>Pulse Duration = 250 Duty Cycle = 0.5% Max � s 1.6 ID = 30 A<br>VGS = 10 V<br>105<br>1.4<br>ID = −30 A<br>70 1.2<br>TJ = 175 ° C 1.0<br>35<br>0.8<br>TJ = 25 ° C<br>0 0.6<br>3 4 5 6 7 8 9 10 −80 −40 0 40 80 120 160 200<br>VGS, GATE−TO−SOURCE VOLTAGE (V) TJ, JUNCTION TEMPERATURE ( ° C)<br>Figure 11. RDS(on) vs. Gate Voltage Figure 12. Normalized RDS(on) vs. Junction<br>Temperature<br>1.2 1.10<br>VIDGS = −250  = VDS � A ID = −1 mA<br>1.0 1.05<br>0.8 1.00<br>0.6 0.95<br>0.4 0.90<br>−80 −40 0 40 80 120 160 200 −80 −40 0 40 80 120 160 200<br>TJ, JUNCTION TEMPERATURE ( ° C) TJ, JUNCTION TEMPERATURE ( ° C)<br>Figure 13. Normalized Gate Threshold Voltage Figure 14. Normalized Drain−to−Source<br>vs. Temperature Breakdown Voltage vs. Junction Temperature<br>10K 10<br>VDD = 16 V<br>C ISS 8 V DD = 24 V<br>1K<br>C OSS 6<br>100 VDD = 20 V<br>CRSS 4<br>10<br>f = 1 MHz 2<br>VGS = 0 V<br>1 0<br>0.1 1 10 40 0 4 8 12 16 20<br>−VDS, DRAIN−TO−SOURCE VOLTAGE (V) Qg, GATE CHARGE (nC)<br>) �<br>, ON−RESISTANCE (m ON−RESISTANCE<br>, NORMALIZED DRAIN−SOURCE<br>DS(on)<br>R<br>DS(on)<br>R<br>BREAKDOWN VOLTAGE<br>NORMALIZED DRAIN−TO−SOURCE<br>NORMALIZED GATE THRESHOLD VOLTAGE<br>CAPACITANCE (pF)<br>, GATE−TO−SOURCE VOLTAGE (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


**Figure 15. Capacitance vs. Drain−to−Source Voltage** 

**Figure 16. Gate Charge vs. Gate−to−Source Voltage** 

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**5** 

**FDWS9511L−F085** 

## **PACKAGE DIMENSIONS** 

**DFNW8 5.2x6.3, 1.27P** CASE 507AU ISSUE A 

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**6** 

**FDWS9511L−F085** 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

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