# Power MOSFET, N Channel, 25 V, 220 mA, 4 ohm, SOT-23, Surface Mount

![Product image](https://novapart.co/image/farnell:9845011/)

**URL**: https://novapart.co/products/FDV301N/power-mosfet-n-channel-25-v-220-ma-4-ohm-sot-23
**SKU**: FDV301N
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.0420
**Stock**: 1000+
**Lead Time**: 153 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:220mA; Drain Source Voltage Vds:25V; On Resistance Rds(on):3.1ohm; Rds(on) Test Voltage Vgs:4.5V; Threshold Voltage Vgs:850mV;

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 350mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | SOT-23 |
| Drain Source Voltage Vds | 25V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 220mA |
| Drain Source On State Resistance | 4ohm |
| Gate Source Threshold Voltage Max | 1.06V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:9845011/)

**DATA SHEET www.onsemi.com** 

## Digital FET, N-Channel FDV301N, FDV301N-F169 

## **General Description** 

This N−Channel logic level enhancement mode field effect transistor is produced using **onsemi’s** proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on−state resistance. This device has been designed especially for low voltage applications as a replacement for digital transistors. Since bias resistors are not required, this one N−channel FET can replace several different digital transistors, with different bias resistor values. 

## **Features** 

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**----- Start of picture text -----**<br>
D<br>G S<br>SOT−23<br>CASE 318−08<br>**----- End of picture text -----**<br>


- 25 V, 0.22 A Continuous, 0.5 A Peak 

   - ♦ RDS(on) = 5 � @ VGS = 2.7 V 

   - ♦ RDS(on) = 4 � @ VGS = 4.5 V 

- Very Low Level Gate Drive Requirements Allowing Direct Operation in 3 V Circuits. VGS(th) < 1.06 V 

- Replace Multiple NPN Digital Transistors with One DMOS FET 

- This Device is Pb−Free and Halide Free 

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Vcc<br>D<br>OUT<br>IN G S<br>GND<br>**----- End of picture text -----**<br>


**Figure 1. Inverter Application** 

## **MARKING DIAGRAM** 

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**----- Start of picture text -----**<br>
&E&Y<br>301&E&G<br>&E = Designates Space<br>&Y = Binary Calendar Year<br>Coding Scheme<br>301 = Specific Device Code<br>&G = Date Code<br>**----- End of picture text -----**<br>


## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|FDV301N,<br>FDV301N−F169|SOT−23−3<br>(Pb−Free,<br>Halide−Free)|3000 /<br>Tape & Reel|



- †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

Publication Order Number: **FDV301N/D** 

**1** 

© Semiconductor Components Industries, LLC, 2009 **May, 2025 − Rev. 10** 

**FDV301N, FDV301N−F169** 

**ABSOLUTE MAXIMUM RATINGS** TA = 25 ° C unless otherwise noted. 

|**ABSOLUTE M**|**AXIMUM RATINGS**TA= 25°C unless otherwise noted.|||
|---|---|---|---|
|**Symbol**|**Parameter**|**FDV301N**|**Unit**|
|VDSS, VCC|Drain−Source Voltage, Power Supply Voltage|25|V|
|VGSS, VI|Gate−Source Voltage, VIN|−0.3 to 8|V|
|ID, IO|Drain/Output Current−Continuous|0.22|A|
|||0.5||
|PD|Maximum Power Dissipation|0.35|W|
|TJ, TSTG|Operating and Storage Temperature Range|−55 to 150|°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

**THERMAL CHARACTERISTICS** TA = 25 ° C unless otherwise noted. 

|**THERMAL C**|**HARACTERISTICS**TA= 25°C unless otherwise noted.|||
|---|---|---|---|
|**Symbol**|**Parameter**|**Value**|**Unit**|
|RθJA|Thermal Resistance, Junction−to−Ambient|357|°C/W|



## **INVERTER ELECTRICAL CHARACTERISTICS** TA = 25 ° C unless otherwise noted. 

|**Symbol**|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|IO(off)|Zero Input Voltage Output Current|VCC= 20 V, VI= 0 V|−|−|1|�A|
|VI(off)|Input Voltage|VCC= 5 V, IO= 10�A|−|−|0.5|V|
|VI(on)||VO= 0.3 V, IO= 0.005 A|1|−|−||
|RO(on)|Output to Ground Resistance|VI= 2.7 V, IO= 0.2 A|−|4|5|�|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

## **ELECTRICAL CHARACTERISTICS** TA = 25 ° C unless otherwise noted. 

|**ELECTRICAL**|**CHARACTERISTICS**TA= 25°C unle|ss otherwise noted.|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**|||||||
|BVDSS|Drain−Source Breakdown Voltage|VGS= 0 V, ID= 250�A|25|−|−|V|
|�BVDSS/�TJ|Breakdown Voltage Temp. Coefficient|ID= 250�A, Referenced to 25°C|−|25|−|mV/°C|
|IDSS|Zero Gate Voltage Drain Current|VDS= 20 V, VGS= 0 V|−|−|1|�A|
|||VDS= 20 V, VGS= 0 V, TJ= 55°C|−|−|10||
|IGSS|Gate − Body Leakage Current|VGS= 8 V, VDS= 0 V|−|−|100|nA|
|**ON CHARACTERISTICS**|||||||
|�VGS(th)/�TJ|Gate Threshold Voltage Temp.<br>Coefficient|ID= 250�A, Referenced to 25°C|−|−2.1|−|mV/°C|
|VGS(th)|Gate Threshold Voltage|VDS= VGS, ID= 250�A|0.70|0.85|1.06|V|
|RDS(on)|Static Drain−Source On−Resistance|VGS= 2.7 V, ID= 0.2 A|−|3.8|5|�|
|||VGS= 2.7 V, ID= 0.2 A, TJ= 125°C|−|6.3|9||
|||VGS= 4.5 V, ID= 0.4 A|−|3.1|4||
|ID(on)|On−State Drain Current|VGS= 2.7 V, VDS= 5 V|0.2|−|−|A|
|gFS|Forward Transconductance|VDS= 5 V, ID= 0.4 A|−|0.2|−|S|



**www.onsemi.com** 

**2** 

**FDV301N, FDV301N−F169** 

**ELECTRICAL CHARACTERISTICS** TA = 25 ° C unless otherwise noted. (continued) 

|**ELECTRICAL**|**CHARACTERISTICS**TA= 25°C unle|ss otherwise noted. (continued)|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|**DYNAMIC CHARACTERISTICS**|||||||
|Ciss|Input Capacitance|VDS= 10 V, VGS= 0 V, f = 1.0 MHz|−|9.5|−|pF|
|Coss|Output Capacitance||−|6|−||
|Crss|Reverse Transfer Capacitance||−|1.3|−||
|**SWITCHING CHARACTERISTICS**(Note 1)|||||||
|tD(on)|Turn − On Delay Time|VDD= 6 V, ID= 0.5 A, VGS= 4.5 V,<br>RGEN= 50�|−|3.2|8|ns|
|tr|Turn − On Rise Time||−|6|15||
|tD(off)|Turn − Off Delay Time||−|3.5|8||
|tf|Turn − Off Fall Time||−|3.5|8||
|Qg|Total Gate Charge|VDS= 5 V, ID= 0.2 A, VGS= 4.5 V|−|0.49|0.7|nC|
|Qgs|Gate−Source Charge||−|0.22|−||
|Qgd|Gate−Drain Charge||−|0.07|−||
|**DRAIN−SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS**|||||||
|IS|Maximum Continuous Drain−Source Diode Forward Current||−|−|0.29|A|
|VSD|Drain−Source Diode Forward Voltage|VGS= 0 V, IS= 0.29 A (Note 1)|−|0.8|1.2|V|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Pulse Test: Pulse Width ≤ 300 � s, Duty Cycle ≤ 2.0%. 

## **TYPICAL CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
0.5 1.4<br>VGS = 4.5 V 3.5 V VGS = 2.0 V<br>4.0 V 3.0 V<br>0.4<br>1.2<br>2.5 V<br>2.7 V<br>2.7 V<br>0.3 2.5 V 3.0 V<br>1<br>3.5 V<br>0.2<br>2.0 V<br>0.8<br>0.1 4.0 V<br>1.5 V 4.5 V<br>0 0.6<br>0 0.5 1 1.5 2 2.5 3 0 0.1 0.2 0.3 0.4 0.5<br>VDS, Drain−Source Voltage (V) ID, Drain Current (A)<br>On−Resistance<br>, Normalized Drain−Source<br>, Drain−Source Current (A)<br>ID<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


**Figure 2. On−Region Characteristics** 

**Figure 3. On−Resistance Variation with Drain Current and Gate Voltage** 

**www.onsemi.com** 

**3** 

**FDV301N, FDV301N−F169** 

## **TYPICAL PERFORMANCE CHARACTERISTICS** (continued) 

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1.8 15<br>ID = 0.2 A ID = 0.2 A<br>1.6 V GS  = 2.7 V 12<br>1.4 25 ° C 125 ° C<br>9<br>1.2<br>6<br>1.0<br>3<br>0.8<br>0.6<br>0<br>−50 −25 0 25 50 75 100 125 150 2 2.5 3 3.5 4<br>TJ, Junction Temperature ( � C) VGS, Gate to Source Voltage (V)<br>Figure 4. On−Resistance Variation with Temperature Figure 5. On Resistance Variation with<br>Gate−To−Source Voltage<br>0.20 0.5<br>VDS = 5.0 V TJ = −55 ° C 0.2 V GS  = 0 V<br>25 ° C 0.1<br>0.15 TJ = 125 ° C<br>125 ° C<br>25 ° C<br>0.01<br>0.10<br>−55 ° C<br>0.05 0.001<br>0 0.0001<br>0.5 1 1.5 2 2.5 0.2 0.4 0.6 0.8 1 1.2<br>VGS, Gate to Source Voltage (V) VSD, Body Diode Forward Voltage (V)<br>Figure 6. Transfer Characteristics Figure 7. Body Diode Forward Voltage Variation<br>with Source Current and Temperature<br>5 30<br>ID = 0.2 A VDS = 5 V 20<br>4<br>10 V<br>Ciss<br>15 V 10<br>3 Coss<br>5<br>2<br>3<br>1 2 f = 1 MHz<br>VGS = 0 V Crss<br>0 1<br>0 0.1 0.2 0.3 0.4 0.5 0.6 0.1 0.5 1 2 5 10 25<br>Qg, Gate Charge (nC) VDS, Drain to Source Voltage (V)<br>) �<br>, On−Resistance (<br>On−Resistance<br>, Normalized Drain−Source<br>DS(on)<br>R<br>DS(on)<br>R<br>, Drain Current (A)<br>ID<br>, Reverse Drain Current (A)<br>IS<br>Capacitance (pF)<br>, Gate−Source Voltage (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


**Figure 8. Gate Charge Characteristics** 

**Figure 9. Capacitance Characteristics** 

**www.onsemi.com** 

**4** 

**FDV301N, FDV301N−F169** 

## **TYPICAL PERFORMANCE CHARACTERISTICS** (continued) 

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1 5<br>1 ms Single Pulse<br>0.5 R DS(on)  Limit 1 s 100 ms 4 RTA �  = 25JA = 357 ° C ° C/W<br>10 s<br>0.2<br>DC 3<br>0.1<br>2<br>0.05<br>VGS = 2.7 V<br>Single Pulse 1<br>0.02 R � JA = 357 ° C/W<br>TA = 25 ° C<br>0.01 0<br>0.5 1 2 5 10 15 25 35 0.001 0.01 0.1 1 10 100 300<br>VDS, Drain−Source Voltage (V) Single Pulse Time (s)<br>Figure 10. Maximum Safe Operating Area Figure 11. Single Pulse Maximum Power Dissipation<br>1<br>D = 0.5<br>0.5<br>0.2<br>0.2<br>0.1 R � JA (t) = r(t) * R � JA<br>0.1 0.05 R � JA = 357 ° C/W<br>0.05<br>0.02<br>0.02 P(pk)<br>0.01 0.01 t1 t2<br>0.005<br>T J  − T A  = P * R � JA (t)<br>Single Pulse<br>0.002 Duty Cycle, D = t1/t2<br>0.001<br>0.0001 0.001 0.01 0.1 1 10 100 300<br>t1, Time (s)<br>Power (W)<br>, Drain Current (A)<br>ID<br>Thermal Resistance<br>r(t), Normalized Effective Transient<br>**----- End of picture text -----**<br>


**Figure 12. Transient Thermal Response Curve** 

**www.onsemi.com** 

**5** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

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SOT−23 (TO−236) 2.90x1.30x1.00 1.90P<br>CASE 318<br>ISSUE AU<br>DATE 14 AUG 2024<br>**----- End of picture text -----**<br>


**SCALE 4:1** 

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GENERIC<br>MARKING DIAGRAM*<br>XXXM �<br>�<br>1<br>XXX = Specific Device Code<br>M = Date Code<br>� = Pb−Free Package<br>**----- End of picture text -----**<br>


*This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ � ”, may or may not be present. Some products may not follow the Generic Marking. 

## **STYLES ON PAGE 2** 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98ASB42226B** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: SOT−23 (TO−236) 2.90x1.30x1.00 1.90P PAGE 1 OF 2** 

**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

DATE 14 AUG 2024 

## **SOT−23 (TO−236) 2.90x1.30x1.00 1.90P** CASE 318 ISSUE AU 

**==> picture [489 x 178] intentionally omitted <==**

**----- Start of picture text -----**<br>
STYLE 1 THRU 5: STYLE 6: STYLE 7: STYLE 8:<br>CANCELLED PIN 1. BASE PIN 1. EMITTER PIN 1. ANODE<br>2. EMITTER 2. BASE 2. NO CONNECTION<br>3. COLLECTOR 3. COLLECTOR 3. CATHODE<br>STYLE 9: STYLE 10: STYLE 11: STYLE 12: STYLE 13: STYLE 14:<br>PIN 1. ANODE PIN 1. DRAIN PIN 1. ANODE PIN 1. CATHODE PIN 1. SOURCE PIN 1. CATHODE<br>2. ANODE 2. SOURCE 2. CATHODE 2. CATHODE 2. DRAIN 2. GATE<br>3. CATHODE 3. GATE 3. CATHODE−ANODE 3. ANODE 3. GATE 3. ANODE<br>STYLE 15: STYLE 16: STYLE 17: STYLE 18: STYLE 19: STYLE 20:<br>PIN 1. GATE PIN 1. ANODE PIN 1. NO CONNECTION PIN 1. NO CONNECTION PIN 1. CATHODE PIN 1. CATHODE<br>2. CATHODE 2. CATHODE 2. ANODE 2. CATHODE 2. ANODE 2. ANODE<br>3. ANODE 3. CATHODE 3. CATHODE 3. ANODE 3. CATHODE−ANODE 3. GATE<br>STYLE 21: STYLE 22: STYLE 23: STYLE 24: STYLE 25: STYLE 26:<br>PIN 1. GATE PIN 1. RETURN PIN 1. ANODE PIN 1. GATE PIN 1. ANODE PIN 1. CATHODE<br>2. SOURCE 2. OUTPUT 2. ANODE  2. DRAIN  2. CATHODE  2. ANODE<br>3. DRAIN 3. INPUT 3. CATHODE  3. SOURCE  3. GATE  3. NO CONNECTION<br>STYLE 27: STYLE 28:<br>PIN 1. CATHODE PIN 1. ANODE<br> 2. CATHODE  2. ANODE<br> 3. CATHODE  3. ANODE<br>**----- End of picture text -----**<br>


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Electronic versions are uncontrolled except when accessed directly from the Document Repository.<br>DOCUMENT NUMBER: 98ASB42226B Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red.<br>DESCRIPTION: SOT−23 (TO−236) 2.90x1.30x1.00 1.90P PAGE 2 OF 2<br>**----- End of picture text -----**<br>


**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **ADDITIONAL INFORMATION** 

**TECHNICAL PUBLICATIONS** : **ONLINE SUPPORT** : www.onsemi.com/support **Technical Library:** www.onsemi.com/design/resources/technical−documentation **For additional information, please contact your local Sales Representative at onsemi Website:** www.onsemi.com www.onsemi.com/support/sales 

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 



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