# Power MOSFET, N Channel, 500 V, 4 A, 1.38 ohm, TO-251 (IPAK), Through Hole

![Product image](https://novapart.co/image/farnell:3616189/)

**URL**: https://novapart.co/products/FDU5N50NZTU/power-mosfet-n-channel-500-v-4-a-138-ohm-to-251
**SKU**: FDU5N50NZTU
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.4120
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Power Dissipation | 62W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-251 (IPAK) |
| Drain Source Voltage Vds | 500V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 4A |
| Drain Source On State Resistance | 1.38ohm |
| Gate Source Threshold Voltage Max | 5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3616189/)

## FDU5N50NZTU 

## Power MOSFET, N-Channel, UniFET II 

## **500 V, 4 A, 1.5** 

UniFET II MOSFET is ON Semiconductor’s high voltage MOSFET family based on advanced planar stripe and DMOS technology. This advanced MOSFET family has the smallest on−state resistance among the planar MOSFET, and also provides superior switching performance and higher avalanche energy strength. In addition, internal gate−source ESD diode allows UniFET II MOSFET to withstand over 2 kV HBM surge stress. This device family is suitable for switching power converter applications such as power factor correction (PFC), flat panel display (FPD) TV power, ATX and electronic lamp ballasts. 

## **Features** 

- RDS(on) = 1.38  (Typ.) @ VGS = 10 V, ID = 2 A 

- Low Gate Charge (Typ. 9 nC) 

- Low Crss (Typ. 4 pF) 

- 100% Avalanche Tested 

- Improved dv/dt Capability 

- ESD Improved Capability 

- These Devices are Pb−Free and are RoHS Compliant 

## **Applications** 

- LCD / LED TV 

## **www.onsemi.com** 

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- Lighting 

- Charger / Adapter 

## **ORDERING INFORMATION** 

See detailed ordering, marking and shipping information on page 2 of this data sheet. 

Publication Order Number: **FDU5N50NZTU/D** 

**1** 

© Semiconductor Components Industries, LLC, 2018 **May, 2019 − Rev. 1** 

## **FDU5N50NZTU** 

**MAXIMUM RATINGS** (TC = 25 ° C unless otherwise noted) 

|**MAXIMUM R**|**ATINGS**(TC= 25°C unless otherwise noted)||||
|---|---|---|---|---|
|**Symbol**|**Parameter**||**Value**|**Unit**|
|VDSS|Drain−to−Source Voltage||500|V|
|VGSS|Gate−to−Source Voltage||±25|V|
|ID|Drain Current|Continuous (TC= 25°C)|4|A|
|||Continuous (TC= 100°C)|2.4||
|IDM|Drain Current|Pulsed (Note 1)|16|A|
|EAS|Single Pulse Avalanche Energy (Note 2)||304|mJ|
|IAR|Avalanche Current (Note 1)||4|A|
|EAR|Repetitive Avalanche Energy (Note 1)||6.2|mJ|
|dv/dt|Peak Diode Recovery (Note 3)||10|V/ns|
|PD|Power Dissipation|TC= 25°C|62|W|
|||Derate Above 25°C|0.5|W/°C|
|TJ, TSTG|Operating and Storage Temperature Range||−55 to +150|°C|
|TL|Maximum Lead Temperature for Soldering Purposes (1/8″from case for 5 seconds)||300|°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

1. Repetitive Rating: Pulse width limited by maximum junction temperature. 

2. IAS = 4 A, VDD = 50 V, L = 38 mH, RG = 25 � , starting TJ = 25 ° C. 

3. ISD ≤ 4 A, di/dt ≤ 200 A/ � s, VDD ≤ BVDSS, Starting TJ = 25 ° C. 

## **THERMAL CHARACTERISTICS** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|R�JC|Thermal Resistance, Junction−to−Case|2.0|°C/W|
|R�JA|Thermal Resistance, Junction−to−Ambient|90||



## **PACKAGE MARKING AND ORDERING INFORMATION** 

|**Part Number**|**Top Mark**|**Package**|**Packing Method**|**Reel Size**|**Tape Width**|**Quantity**|
|---|---|---|---|---|---|---|
|FDU5N50NZTU|FDU5N50NZ|IPAK|Tube|N/A|N/A|75 units|



**www.onsemi.com** 

**2** 

## **FDU5N50NZTU** 

**ELECTRICAL CHARACTERISTICS** (TC = 25 ° C unless otherwise specified) 

|**ELECTRIC**|**AL CHARACTERISTICS**(TC= 25°C unles|s otherwise specified)|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**|||||||
|BVDSS|Drain−to−Source Breakdown Voltage|ID= 250�A, VGS= 0 V, TJ= 25°C|500|||V|
|�BVDSS/�TJ|Breakdown Voltage Temperature<br>Coefficient|ID= 250�A, Referenced to 25°C||0.5||V/°C|
|IDSS|Zero Gate Voltage Drain Current|VDS= 500 V, VGS= 0 V|||1|�A|
|||VDS= 400 V, TC= 125°C|||10||
|IGSS|Gate−to−Body Leakage Current|VGS=±25 V, VDS= 0 V|||±10|�A|
|**ON CHARACTERISTICS**|||||||
|VGS(th)|Gate Threshold Voltage|VGS= VDS, ID= 250�A|3.0||5.0|V|
|RDS(on)|Static Drain−to−Source On Resistance|VGS= 10 V, ID= 2 A||1.38|1.5|�|
|gFS|Forward Transconductance|VDS= 20 V, ID= 2 A||3.54||S|
|**DYNAMIC CHARACTERISTICS**|||||||
|Ciss|Input Capacitance|VDS= 25 V, VGS= 0 V, f = 1 MHz||330|440|pF|
|Coss|Output Capacitance|||50|70||
|Crss|Reverse Transfer Capacitance|||4|6||
|Qg(tot)|Total Gate Charge at 10 V|VDS= 400 V, ID= 4 A,<br>VGS= 10 V (Note 4)||9|12|nC|
|Qgs|Gate−to−Source Gate Charge|||2|||
|Qgd|Gate−to−Drain “Miller” Charge|||4|||
|**SWITCHING CHARACTERISTICS**|||||||
|td(on)|Turn−On Delay Time|VDD= 250 V, ID= 4 A,<br>VGS= 10 V, RG= 25�(Note 4)||12|35|ns|
|tr|Turn−On Rise Time|||22|55||
|td(off)|Turn−Off Delay Time|||28|65||
|tf|Turn−Off Fall Time|||21|50||
|**DRAIN−SOURCE DIODE CHARACTERISTICS**|||||||
|IS|Maximum Continuous Drain to Source Diode Forward Current||||4|A|
|ISM|Maximum Pulsed Drain to Source Diode Forward Current||||16||
|VSD|Drain to Source Diode Forward Voltage|VGS= 0 V, ISD= 4 A|||1.4|V|
|trr|Reverse Recovery Time|VGS= 0 V, ISD= 4 A,<br>dIF/dt = 100 A/�s||210||ns|
|Qrr|Reverse Recovery Charge|||1.1||�C|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Essentially independent of Operating Temperature Typical Characteristics. 

**www.onsemi.com** 

**3** 

**FDU5N50NZTU** 

## **TYPICAL CHARACTERISTICS** 

**Figure 1. On−Region Characteristics** 

**Figure 2. Transfer Characteristics** 

**Figure 3. On−Resistance Variation vs. Drain Current and Gate Voltage** 

**Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperature** 

**Figure 5. Capacitance Characteristics** 

**Figure 6. Gate Charge Characteristics** 

**www.onsemi.com** 

**4** 

**FDU5N50NZTU** 

## **TYPICAL CHARACTERISTICS** 

**Figure 7. Breakdown Voltage Variation vs. Temperature** 

**Figure 8. On−Resistance Variation vs. Temperature** 

**Figure 9. Maximum Safe Operating Area vs. Case Temperature** 

**Figure 10. Maximum Drain Current** 

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**Figure 11. Transient Thermal Response Curve** 

**www.onsemi.com** 

**5** 

**FDU5N50NZTU** 

**Figure 12. Gate Charge Test Circuit & Waveform** 

**Figure 13. Resistive Switching Test Circuit & Waveforms** 

**Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms** 

**www.onsemi.com** 

**6** 

**FDU5N50NZTU** 

**Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms** 

UniFET is a trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. 

**www.onsemi.com** 

**7** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**DPAK3 (IPAK)** CASE 369AR ISSUE O 

DATE 30 SEP 2016 

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Electronic versions are uncontrolled except when accessed directly from the Document Repository.<br>DOCUMENT NUMBER: 98AON13815G Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red.<br>DESCRIPTION: DPAK3 (IPAK) PAGE 1 OF 1<br>**----- End of picture text -----**<br>


**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2016 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **ADDITIONAL INFORMATION** 

**TECHNICAL PUBLICATIONS** : **ONLINE SUPPORT** : www.onsemi.com/support **Technical Library:** www.onsemi.com/design/resources/technical−documentation **For additional information, please contact your local Sales Representative at onsemi Website:** www.onsemi.com www.onsemi.com/support/sales 

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