# Power MOSFET, N Channel, 30 V, 8.5 A, 0.023 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2575360/)

**URL**: https://novapart.co/products/FDS8884/power-mosfet-n-channel-30-v-85-a-0023-ohm-soic
**SKU**: FDS8884
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2210
**Stock**: 10+
**Lead Time**: 373 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:8.5A; Drain Source Voltage Vds:30V; On Resistance Rds(on):0.019ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:1.7

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | PowerTrench |
| Qualification | - |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 8.5A |
| Drain Source On State Resistance | 0.023ohm |
| Gate Source Threshold Voltage Max | 1.7V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2575360/)

## **ON Semiconductor** 

## **Is Now** 

**==> picture [390 x 69] intentionally omitted <==**

**To learn more about onsemi™, please visit our website at www.onsemi.com** 

**onsemi** and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as-is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. 

**==> picture [435 x 533] intentionally omitted <==**

**----- Start of picture text -----**<br>
FDS8884<br>N-Channel PowerTrench [®]  MOSFET<br>30V, 8.5A, 23m Ω<br>General Descriptions Features<br>This N-Channel MOSFET has been designed specifically  Max rDS(on) = 23mΩ at VGS = 10V, ID = 8.5A<br>to improve the overall efficiency of DC/DC converters using<br>either synchronous or conventional switching PWM  Max rDS(on) = 30mΩ at VGS = 4.5V, ID = 7.5A<br>controllers.  It has been optimized for low gate charge, low  Low gate charge<br>rDS(on) and fast switching speed.<br>100% RG Tested<br>RoHS Compliant<br>*<br>D<br>D 5 4<br>D<br>D 6 3<br>7 2<br>G<br>S<br>S 8 1<br>SO-8 S<br>MOSFET Maximum Ratings TA = 25°C unless otherwise noted<br>Symbol Parameter Ratings Units<br>VDS Drain to Source Voltage 30 V<br>VGS Gate to Source Voltage ±20 V<br>Drain Current Continuous    (Note 1a) 8.5 A<br>ID Pulsed 40 A<br>EAS Single Pulse Avalanche Energy   (Note 2) 32 mJ<br>Power dissipation 2.5 W<br>PD Derate above 25 [o] C 20 mW/ [o] C<br>TJ, TSTG Operating and Storage Temperature -55 to 150 oC<br>Thermal Characteristics<br>RθJA Thermal Resistance, Junction to Ambient         (Note 1a) 50 oC/W<br>RθJA Thermal Resistance, Junction to Case (Note 1) 25 oC/W<br>[_<br>Package Marking and Ordering Information<br>Device Marking Device Package Reel Size Tape Width Quantity<br>FDS8884 FDS8884 SO-8 330mm 12mm 2500 units<br>[_|}<br>LEAD F R EE IMPLE<br>M<br>E<br>N<br>T<br>A<br>NOIT<br>**----- End of picture text -----**<br>


©2006 Semiconductor Components Industries, LLC. October-2017, Rev. 1 

**1** Publication Order Number: FDS8884/D 

|**Electrical Characteristics**TJ= 25°C unless otherwise noted|**Electrical Characteristics**TJ= 25°C unless otherwise noted|**Electrical Characteristics**TJ= 25°C unless otherwise noted|**Electrical Characteristics**TJ= 25°C unless otherwise noted|||||
|---|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**||**Min**|**Typ**|**Max**|**Units**|
|**Off Characteristics**||||||||
|BVDSS<br>|Drain to Source Breakdown Voltage<br>ID|= 250µA, VGS= 0V||30|||V|
|∆BVDSS<br> ∆TJ<br> <br>|Breakdown Voltage Temperature<br>Coefficient<br>ID<br>25|= 250µA, referenced to<br>oC|||23||mV/oC|
|IDSS<br>|Zero Gate Voltage Drain Current<br>V<br>V|DS= 24V<br>GS= 0V||||1|µA|
||||TJ= 125oC|||250||
|IGSS<br>|Gate to Source Leakage Current<br>V|GS=±20V||||±100|nA|
|**On Characteristics(Note 3)**||||||||
|VGS(th)<br>|Gate to Source Threshold Voltage<br>V|GS= VDS, ID= 250µA||1.2|1.7|2.5|V|
|∆VGS(th)<br>∆TJ<br> <br>|Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID<br>25|= 250µA, referenced to<br>oC|||-4.9||mV/oC|
|rDS(on)<br>|Drain to Source On Resistance<br>V<br>V<br>V<br>TJ|GS= 10V, ID= 8.5A,|||19|23|mΩ|
|||GS= 4.5V , ID= 7.5A,|||23|30||
|||GS= 10V, ID= 8.5A,<br>= 125oC|||26|32||
|**Dynamic Characteristics**||||||||
|Ciss<br>I|nput Capacitance<br>V<br>f =<br>Output Capacitance<br>Reverse Transfer Capacitance|DS= 15V, VGS= 0V,<br>1MHz|||475|635|pF|
|Coss<br>|||||100|135|pF|
|Crss<br>|||||65|100|pF|
|RG<br>|Gate Resistance<br>f|= 1MHz|||0.9|1.6|Ω|
|**Switching Characteristics** **(Note 3)**||||||||
|td(on)<br>|Turn-On DelayTime<br>V<br>V<br>Rise Time<br>Turn-Off DelayTime<br>Fall Time|DD= 15V, ID= 8.5A<br>GS= 10V, RGS= 33Ω|||5|10|ns|
|tr<br>|||||9|18|ns|
|td(off)<br>|||||42|68|ns|
|tf<br>|||||21|34|ns|
|Qg<br>|Total Gate Charge<br>V <br>ID|DS= 15V, VGS= 10V<br>= 8.5A|||9.2|13|nC|
|Qg<br>|Total Gate Charge<br>V <br>ID<br>Gate to Source Gate Charge<br>Gate to Drain Charge|DS= 15V, VGS= 5V<br>= 8.5A|||5.0|7|nC|
|Qgs<br>|||||1.5||nC|
|Qgd<br>|||||2.0||nC|
|**Drain-Source Diode Characteristics**||||||||
|VSD<br>|Source to Drain Diode Voltage<br>IS <br>IS|D= 8.5A|||0.9|1.25|V|
|||D= 2.1A|||0.8|1.0|V|
|trr<br>|Reverse RecoveryTime<br>IF <br>Reverse RecoveryCharge|= 8.5A, di/dt = 100A/µs||||33|ns|
|Qrr<br>||||||20|nC|



**Notes:** 

- **1:** RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user’s board design. 

**==> picture [69 x 79] intentionally omitted <==**

a) 50°C/W when b) 105°C/W when c) 125°C/W when mounted on a 1 in2 mounted on a .04 in[2] mounted on a pad of 2 oz copper pad of 2 oz copper minimun pad 

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**----- Start of picture text -----**<br>
Scale 1 : 1 on letter size paper<br>**----- End of picture text -----**<br>


- **2:** Starting TJ = 25°C, L = 1mH, IAS = 8A, VDD = 27V, VGS = 10V. 

- **3:** Pulse Test:Pulse Width <300µs, Duty Cycle <2%. 

**www.onsemi.com** 

**2** 

**Typical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [434 x 598] intentionally omitted <==**

**----- Start of picture text -----**<br>
40 3.0<br>PULSE DURATION = 80 µ s PULSE DURATION = 80 µ s<br>DUTY CYCLE = 0.5%MAX DUTY CYCLE = 0.5%MAX<br>30 VGS = 10V 2.5 VGS = 3V<br>VGS = 5.0V VGS = 3.5V<br>VGS = 3.5V 2.0<br>20 VGS = 4.5V VGS = 4V<br>VGS = 4.5V<br>VGS = 4.0V 1.5<br>10 VGS = 3V<br>1.0<br>VGS = 5V VGS = 10V<br>0 0.5<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 5 10 15 20 25 30 35 40<br>VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT(A)<br>Figure 1.  On Region Characteristics Figure 2.   Normalized On-Resistance vs Drain<br>current and Gate Voltage<br>1.6 60<br> V IDGS = 8.5A = 10V 55 ID = 8.5A PULSE DURATION = 80DUTY CYCLE = 0.5%MAX µ s<br>1.4<br>50<br>45<br>1.2<br>40<br>1.0 35 TJ = 150 [o] C<br>30<br>0.8 25<br>20 TJ = 25 [o] C<br>0.6 15<br>-80 -40 0 40 80 120 160 2 4 6 8 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized On Resistance vs Junction   Figure 4.   On-Resistance vs  Gate to Source<br>Temperature Voltage<br>40 40<br>PULSE DURATION = 80 µ s VGS = 0V<br>35 DUTY CYCLE = 0.5%MAX 10<br>30<br>VDD = 5V TJ = 25 [o] C 1 TA = 150 [o] C TJ = 25 [o] C<br>25<br>20<br>0.1<br>15 TJ = 150 [o] C TJ = -55 [o] C<br>10<br>0.01<br>5 TJ = -55 [o] C<br>0 1E-3<br>1 2 3 4 5 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5.  Transfer Characteristics Figure 6.  Source to Drain  Diode Forward Voltage<br>vs Source Current<br>NORMALIZED<br>, DRAIN CURRENT (A)<br>ID<br>DRAIN TO SOURCE ON-RESISTANCE<br>)<br>Ω<br>m<br>(<br> NORMALIZED , DRAIN TO SOURCE  ON-RESISTANCE<br>rDS(ON)<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>ID<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


**www.onsemi.com 3** 

## **Typical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [435 x 581] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 700<br>600<br>8 Ciss<br>VDD = 10V VDD = 15V 500 f = 1MHz<br>6 400 VGS = 0V<br>4 VDD = 20V 300 Coss<br>200<br>2<br>100 Crss<br>0<br>0 2 4 6 8 10 0.1 1 10 30<br>Qg, GATE CHARGE(nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance vs Drain to Source Voltage<br>20 9<br>8<br>VGS = 10V<br>10 7<br>6<br>STARTING TJ = 25 [o] C<br>5 VGS = 4.5V<br>4<br>3<br>STARTING TJ = 125 [o] C 2<br>1 R θ JA = 50 [o] C/W<br>1 0<br>0.01 0.1 1 10 20 25 50 75 100 125 150<br>tAV, TIME IN AVALANCHE(ms) TA, AMBIENT TEMPERATURE( [o] C)<br>Figure 9.  Unclamped Inductive Switching  Figure 10.  Maximum Continuous Drain Current vs<br>Capability Ambient Temperature<br>100 2000<br>1000 TA = 25 [o] C<br>10us FOR TEMPERATURES<br>ABOVE 25 [o] C DERATE PEAK<br>10 CURRENT AS FOLLOWS:<br>100us 100 I = I25  150-----------------------125 – TA<br>VGS=10V<br>1 1ms<br>OPERATION IN THIS  10ms<br>AREA MAY BE<br>0.1 LIMITED BY rDS(on) 100ms 10<br>SINGLE PULSE 1s<br>TJ = MAX RATED<br>TA = 25 [o] C DC SINGLE PULSE<br>0.01 1<br>0.1 1 10 100 10-5 10-4 10-3 10-2 10-1 100 101 102<br>VDS, DRAIN TO SOURCE VOLTAGE (V)<br>t, PULSE WIDTH (s)<br>Figure 11.  Forward Bias Safe Operating Area Figure 12.  Single Pulse Maximum Power<br>Dissipation<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE(V)<br>GS<br>V<br>, DRAIN CURRENT (A)<br>, AVALANCHE CURRENT(A)IAS ID<br>)<br>W<br>(<br>, DRAIN CURRENT (A)<br>D<br> I<br>, PEAK TRANSIENT POWER<br>(PK)<br>P<br>**----- End of picture text -----**<br>


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**4** 

**==> picture [429 x 196] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Characteristics  TJ = 25°C unless otherwise noted<br>2<br>1 DUTY CYCLE-DESCENDING ORDER<br>D =0.5<br>    0.2<br>    0.1<br>0.1     0.05<br>    0.02 PDM<br>    0.01<br>0.01 t1<br>SINGLE PULSE t2<br>NOTES:<br>DUTY FACTOR: D = t1/t2<br>PEAK TJ = PDM x Z θJA  x R θJA  + TA<br>1E-3<br>10-5 10-4 10-3 10-2 10-1 100 101 102 103<br>t, RECTANGULAR PULSE DURATION(s)<br>Figure 13.  Transient Thermal Response Curve<br>IMPEDANCE, ZJA θ<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


**www.onsemi.com** 

**5** 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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