# Power MOSFET, N Channel, 30 V, 18 A, 0.0038 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2322615/)

**URL**: https://novapart.co/products/FDS8672S/power-mosfet-n-channel-30-v-18-a-00038-ohm-soic
**SKU**: FDS8672S
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.8140
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 2.5W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.0038ohm |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 18A |
| Drain Source On State Resistance | 0.0038ohm |
| Gate Source Threshold Voltage Max | 2.1V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2322615/)

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## **FDS8672S** 

## **N-Channel PowerTrench[®] SyncFET[™] 30V, 18A, 4.8m** Ω 

## **Features** 

Max rDS(on) = 4.8mΩ at VGS = 10V, ID = 18A 

Max rDS(on) = 7.0mΩ at VGS = 4.5V, ID = 15A Includes SyncFET Schottky Body Diode 

High Performance Trench Technology for Extremely Low rDS(on) and Fast Switching 

High Power and Current Handling Capability 

## **General Description** 

The FDS8672S is designed to replace a single MOSFET and Schottky diode in synchronous DC/DC power supplies. This 30V MOSFET is designed to maximize power conversion efficiency, providing a low rDS(on) and low gate charge. The FDS8672S includes a patented combination of a MOSFET monolithically integrated with a Schottky diode using Fairchild’s monolithic SyncFET technology. 

## **Applications** 

Synchronous Rectifier for DC/DC Converters 

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100% Rg (Gate Resistance) Tested Notebook Vcore Low Side Switch<br>Termination is Lead-free and RoHS Compliant Point of Load Low Side Switch<br>D<br>D D 5 4 G<br>D<br>D D 6 3 S<br>D 7 2 S<br>G<br>SO-8<br>S D 8 1 S<br>¢ S<br>Pin 1 S<br>**----- End of picture text -----**<br>


## **MOSFET Maximum Ratings** TA = 25°C unless otherwise noted. 

|**Symbol**<br>**Parameter**||||**Ratings**||**Units**|
|---|---|---|---|---|---|---|
|VDS<br>Drain to Source Voltage||||30||V|
|VGS<br>Gate to Source Voltage||||±20||V|
|ID<br>Drain Current   -Continuous<br>-Pulsed||(Note 4)||18<br>80||A|
|EAS<br>Single Pulse Avalanche Energy||(Note 3)||216||mJ|
|PD<br>Power Dissipation<br>TA= 25°C<br>Power Dissipation<br>TA= 25°C||(Note 1a)<br> (Note 1b)||2.5<br>1.0||W|
|TJ, TSTG<br>Operatingand Storage Junction Temperature Range||||-55 to +150||°C|
|**Thermal Characteristics**|||||||
|**Package Marking and Ordering Information**<br>RθJC<br>Thermal Resistance, Junction to Case<br> (Note 1)<br>25<br>°C/W<br>RθJA<br>Thermal Resistance, Junction to Ambient<br> (Note 1a)<br>50<br>~~ee~~<br>~~ee ae~~|||||||
|**Device Marking**<br>**Device**<br>**Package**<br>**Reel Size**<br>**Tape Width**<br>**Quantity**<br>FDS8672S<br>FDS8672S<br>SO8<br>13’’<br>12mm<br>2500 units<br>~~ee~~<br>~~ee~~|||||||



©2007 Fairchild Semiconductor Corporation **1** FDS8672S Rev.1.4 

www.fairchildsemi.com 

**Electrical Characteristics** TJ = 25°C unless otherwise noted. 

|**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Units**<br>**Off Characteristics**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= 1mA, VGS= 0V<br>30<br>V<br>ΔBVDSS<br>ΔTJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 10mA, referenced to 25°C<br>33<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 24V, VGS = 0V<br>500<br>μA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20V, VDS = 0V<br>±100<br>nA<br>**On Characteristics**<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS,  ID= 1mA<br>1.0<br>2.1<br>3.0<br>V<br>ΔVGS(th)<br>ΔTJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= 10mA, referenced to 25°C<br>-5<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= 10V,  ID= 18A<br>3.8<br>4.8<br>mΩ<br>VGS= 4.5V, ID= 15A<br>5.3<br>7.0<br>VGS= 10V,  ID= 18A, TJ= 125°C<br>5.3<br>7.8<br>gFS<br>Forward Transconductance<br>VDS= 5V,  ID= 18A<br>78<br>S<br>**Dynamic Characteristics**<br>Ciss<br>Input Capacitance<br>VDS= 15V, VGS= 0V,<br>f = 1MHz<br>2005<br>2670<br>pF<br>Coss<br>Output Capacitance<br>985<br>1310<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>135<br>205<br>pF<br>Rg<br>Gate Resistance<br>f = 1MHz<br>0.6<br>2.0<br>Ω<br>~~re~~<br>~~Se~~|**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Units**<br>**Off Characteristics**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= 1mA, VGS= 0V<br>30<br>V<br>ΔBVDSS<br>ΔTJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 10mA, referenced to 25°C<br>33<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 24V, VGS = 0V<br>500<br>μA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20V, VDS = 0V<br>±100<br>nA<br>**On Characteristics**<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS,  ID= 1mA<br>1.0<br>2.1<br>3.0<br>V<br>ΔVGS(th)<br>ΔTJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= 10mA, referenced to 25°C<br>-5<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= 10V,  ID= 18A<br>3.8<br>4.8<br>mΩ<br>VGS= 4.5V, ID= 15A<br>5.3<br>7.0<br>VGS= 10V,  ID= 18A, TJ= 125°C<br>5.3<br>7.8<br>gFS<br>Forward Transconductance<br>VDS= 5V,  ID= 18A<br>78<br>S<br>**Dynamic Characteristics**<br>Ciss<br>Input Capacitance<br>VDS= 15V, VGS= 0V,<br>f = 1MHz<br>2005<br>2670<br>pF<br>Coss<br>Output Capacitance<br>985<br>1310<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>135<br>205<br>pF<br>Rg<br>Gate Resistance<br>f = 1MHz<br>0.6<br>2.0<br>Ω<br>~~re~~<br>~~Se~~|**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Units**<br>**Off Characteristics**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= 1mA, VGS= 0V<br>30<br>V<br>ΔBVDSS<br>ΔTJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 10mA, referenced to 25°C<br>33<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 24V, VGS = 0V<br>500<br>μA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20V, VDS = 0V<br>±100<br>nA<br>**On Characteristics**<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS,  ID= 1mA<br>1.0<br>2.1<br>3.0<br>V<br>ΔVGS(th)<br>ΔTJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= 10mA, referenced to 25°C<br>-5<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= 10V,  ID= 18A<br>3.8<br>4.8<br>mΩ<br>VGS= 4.5V, ID= 15A<br>5.3<br>7.0<br>VGS= 10V,  ID= 18A, TJ= 125°C<br>5.3<br>7.8<br>gFS<br>Forward Transconductance<br>VDS= 5V,  ID= 18A<br>78<br>S<br>**Dynamic Characteristics**<br>Ciss<br>Input Capacitance<br>VDS= 15V, VGS= 0V,<br>f = 1MHz<br>2005<br>2670<br>pF<br>Coss<br>Output Capacitance<br>985<br>1310<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>135<br>205<br>pF<br>Rg<br>Gate Resistance<br>f = 1MHz<br>0.6<br>2.0<br>Ω<br>~~re~~<br>~~Se~~|**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Units**<br>**Off Characteristics**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= 1mA, VGS= 0V<br>30<br>V<br>ΔBVDSS<br>ΔTJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 10mA, referenced to 25°C<br>33<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 24V, VGS = 0V<br>500<br>μA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20V, VDS = 0V<br>±100<br>nA<br>**On Characteristics**<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS,  ID= 1mA<br>1.0<br>2.1<br>3.0<br>V<br>ΔVGS(th)<br>ΔTJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= 10mA, referenced to 25°C<br>-5<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= 10V,  ID= 18A<br>3.8<br>4.8<br>mΩ<br>VGS= 4.5V, ID= 15A<br>5.3<br>7.0<br>VGS= 10V,  ID= 18A, TJ= 125°C<br>5.3<br>7.8<br>gFS<br>Forward Transconductance<br>VDS= 5V,  ID= 18A<br>78<br>S<br>**Dynamic Characteristics**<br>Ciss<br>Input Capacitance<br>VDS= 15V, VGS= 0V,<br>f = 1MHz<br>2005<br>2670<br>pF<br>Coss<br>Output Capacitance<br>985<br>1310<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>135<br>205<br>pF<br>Rg<br>Gate Resistance<br>f = 1MHz<br>0.6<br>2.0<br>Ω<br>~~re~~<br>~~Se~~|**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Units**<br>**Off Characteristics**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= 1mA, VGS= 0V<br>30<br>V<br>ΔBVDSS<br>ΔTJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 10mA, referenced to 25°C<br>33<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 24V, VGS = 0V<br>500<br>μA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20V, VDS = 0V<br>±100<br>nA<br>**On Characteristics**<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS,  ID= 1mA<br>1.0<br>2.1<br>3.0<br>V<br>ΔVGS(th)<br>ΔTJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= 10mA, referenced to 25°C<br>-5<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= 10V,  ID= 18A<br>3.8<br>4.8<br>mΩ<br>VGS= 4.5V, ID= 15A<br>5.3<br>7.0<br>VGS= 10V,  ID= 18A, TJ= 125°C<br>5.3<br>7.8<br>gFS<br>Forward Transconductance<br>VDS= 5V,  ID= 18A<br>78<br>S<br>**Dynamic Characteristics**<br>Ciss<br>Input Capacitance<br>VDS= 15V, VGS= 0V,<br>f = 1MHz<br>2005<br>2670<br>pF<br>Coss<br>Output Capacitance<br>985<br>1310<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>135<br>205<br>pF<br>Rg<br>Gate Resistance<br>f = 1MHz<br>0.6<br>2.0<br>Ω<br>~~re~~<br>~~Se~~|
|---|---|---|---|---|
|**Switching Characteristics**|||||
|td(on)<br>Turn-On DelayTime<br>VDD= 15V, ID= 18A,<br>VGS= 10V, RGEN= 6Ω<br>tr<br>Rise Time<br>td(off)<br>Turn-Off DelayTime||12<br>22<br>4<br>10<br>26<br>42|ns<br>ns<br>ns||
|tf<br>Fall Time||3<br>10|ns||
|Qg<br>Total Gate Charge<br>VGS = 0V to 10V<br>VDD= 15V,<br>ID= 18A<br>Qg<br>Total Gate Charge<br>VGS = 0V to 5V<br>Qgs<br>Gate to Source Charge<br>Qgd<br>Gate to Drain “Miller” Charge<br>~~——————~~||29<br>41<br>15<br>21<br>5.5<br>3.7|nC<br>nC<br>nC<br>nC||
|**Drain-Source Diode Characteristics**|||||
|VSD<br>Source to Drain Diode  Forward Voltage<br>VGS = 0V, IS = 18A<br>0.8<br>1.2<br>V<br>VGS = 0V, IS = 1.8A<br>0.4<br>0.7<br>trr<br>Reverse RecoveryTime<br>IF= 18A, di/dt = 300A/μs<br>27<br>43<br>ns<br>Qrr<br>Reverse RecoveryCharge<br>31<br>50<br>nC<br>~~——~~|||||
|NOTES:|||||
|1. RθJAis determined with the device mounted on a 1in2pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJCis guaranteed by design while RθCAis determined by|||||
|the user's board design.|||||
|a) 50°C/W when mounted on a<br>1in2pad of 2 oz copper.||b) 125°C/W when mounted on a<br>minimum pad.|||



2. Pulse Test: Pulse Width < 300μs, Duty cycle < 2.0%. 

3. Starting TJ = 25°C,  L = 3mH, IAS = 12A, VDD = 30V, VGS = 10V. 

4. Pulse current was measured at 250uS pulse, refer to Fig 11 Forward Safe Operation Area for detail. 

www.fairchildsemi.com 

©2007 Fairchild Semiconductor Corporation FDS8672S Rev.1.4 

**2** 

## **Typical Characteristics** TJ = 25°C unless otherwise noted. 

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80 4.0<br>PULSE DURATION = 80 μ s<br>VGS = 3.5V 3.5 DUTY CYCLE = 0.5%MAX<br>60 VGS = 3V<br>VGS =  10V 3.0<br>VGS =  4.5V 2.5<br>40 VGS =  3.5V<br>VGS = 4V 2.0 VGS = 4V<br>VGS = 3V<br>1.5<br>20<br>VGS =  4.5V<br>PULSE DURATION = 80DUTY CYCLE = 0.5%MAX μ s 1.0 VGS =  10V<br>0 0.5<br>0 1 2 3 0 20 40 60 80<br>VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT(A)<br>Figure 1.  On-Region Characteristics Figure 2.  Normalized On-Resistance<br>vs. Drain Current and Gate Voltage<br>1.6 15<br> ID = 18A ID = 18A PULSE DURATION = 80 μ s<br>VGS = 10V DUTY CYCLE = 0.5%MAX<br>1.4<br>12<br>1.2<br>9<br>1.0 TJ = 125 [o] C<br>6<br>0.8<br>TJ = 25 [o] C<br>0.6 3<br>-75 -50 -25 0 25 50 75 100 125 150 2 4 6 8 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized  On- Resistance                                         Figure 4.   On-Resistance vs.  Gate to<br>vs. Junction Temperature Source Voltage<br>80 100<br>PULSE DURATION = 80 μ s VGS = 0V<br>DUTY CYCLE = 0.5%MAX<br>10<br>60 TJ = 125 [o] C<br>VDD = 5V<br>1<br>40<br>TJ = 125 [o] C 0.1 TJ = 25 [o] C<br>20<br>TJ = 25 [o] C 0.01 TJ = -55 [o] C<br>TJ = -55 [o] C<br>0 0.001<br>0 1 2 3 4 0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5.  Transfer Characteristics Figure 6.    Source to Drain  Diode<br>Forward Voltage vs. Source Current<br>NORMALIZED<br>DRAIN CURRENT (A)<br>,<br>ID<br>DRAIN TO SOURCE ON-RESISTANCE<br>)<br>Ω<br>m<br>(<br>, DRAIN TO<br>NORMALIZED<br>rDS(on)<br>SOURCE ON-RESISTANCE<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>ID<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2007 Fairchild Semiconductor Corporation FDS8672S Rev.1.4 

**3** 

## **Typical Characteristics** TJ = 25°C unless otherwise noted. 

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10 5000<br>ID = 18A C iss<br>8<br>VDD = 10V<br>VDD = 15V 1000 Coss<br>6<br>VDD = 20V<br>4<br>Crss<br>2 f = 1MHz<br>100 VGS = 0V<br>0 60<br>0 5 10 15 20 25 30 0.1 1 10 30<br>Qg, GATE CHARGE(nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance vs.   Drain<br>to Source Voltage<br>30 20<br>15<br>10 VGS = 10V<br>TJ = 25 [o] C 10<br>VGS = 4.5V<br>TJ = 125 [o] C 5<br>R θ JA = 50oC/W<br>1 0<br>0.01 0.1 1 10 100 500 25 50 75 100 125 150<br>tAV, TIME IN AVALANCHE(ms) TA, AMBIENT TEMPERATURE (oC)<br>Figure 9. Unclamped Inductive                                  Figure 10.  Maximum Continuous Drain<br>Switching Capability Current vs. Ambient Temperature<br>1000 10000<br>10us<br>100 SINGLE PULSE<br>100us 1000 R θ JA = 125 [o] C/W<br>10 TA = 25 [o] C<br>1ms<br>1 THIS AREA IS  10ms 100<br>LIMITED BY r 100ms<br>DS(on)<br>1s<br>0.1 SINGLE PULSE 10s 10<br>TJ = MAX RATED DC<br>0.01 R θ JA = 125 [o] C/W CURVE BENT TO<br>T A = 25 [o] C MEASURED DATA 1<br>0.001 0.5<br>0.01 0.1 1 10 100200 10-5 10-4 10-3 10-2 10-1 1 10 100 1000<br>VDS, DRAIN to SOURCE VOLTAGE (V) t, PULSE WIDTH (sec)<br>Figure 11.  Forward  Bias  Safe                                      Figure 12.   Single  Pulse  Maximum<br>Operating Area  Power Dissipation<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE(V)<br>GS<br>V<br>DRAIN CURRENT (A)<br>,<br>ID<br>, AVALANCHE CURRENT(A)<br>IAS<br>, DRAIN CURRENT (A)<br>D<br> I PEAK TRANSIENT POWER (W)<br>P)(PK,<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2007 Fairchild Semiconductor Corporation FDS8672S Rev.1.4 

**4** 

## **Typical Characteristics** TJ = 25°C unless otherwise noted. 

**==> picture [444 x 171] intentionally omitted <==**

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2<br>1 DUTY CYCLE-DESCENDING ORDER<br>D = 0.5<br>      0.2<br>0.1       0.1 PDM<br>      0.05<br>      0.02<br>0.01       0.01 t1<br>t2<br>NOTES:<br>Z θ JA (t) = r(t) x R θ JA<br>0.001 SINGLE PULSE R θ JA = 125  [o] C/W<br>Peak TJ = PDM x Z θ JA(t) + TA<br>Duty Cycle, D = t1 / t2<br>0.0001<br>10-5 10-4 10-3 10-2 10-1 1 10 100 1000<br>t, RECTANGULAR PULSE DURATION (sec)<br>ZJA θ<br>IMPEDANCE,<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


**Figure 13.  Junction-to-Ambient Transient Thermal Response Curve** 

www.fairchildsemi.com 

©2007 Fairchild Semiconductor Corporation FDS8672S Rev.1.4 

**5** 

**==> picture [502 x 694] intentionally omitted <==**

## ~~—~~ 

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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. TO OBTAIN THE LATEST, MOST UP-TO-DATE DATASHEET AND PRODUCT INFORMATION, VISIT OUR WEBSITE AT HTTP://WWW.FAIRCHILDSEMI.COM. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. 

## **AUTHORIZED USE** 

Unless otherwise specified in this data sheet, this product is a standard commercial product and is not intended for use in applications that require extraordinary levels of quality and reliability. This product may not be used in the following applications, unless specifically approved in writing by a Fairchild officer: (1) automotive or other transportation, (2) military/aerospace, (3) any safety critical application – including life critical medical equipment – where the failure of the Fairchild product reasonably would be expected to result in personal injury, death or property damage. Customer’s use of this product is subject to agreement of this Authorized Use policy. In the event of an unauthorized use of Fairchild’s product, Fairchild accepts no liability in the event of product failure. In other respects, this product shall be subject to Fairchild’s Worldwide Terms and Conditions of Sale, unless a separate agreement has been signed by both Parties. 

## **ANTI-COUNTERFEITING POLICY** 

Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Terms of Use 

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. 

## **PRODUCT STATUS DEFINITIONS** 

**Definition of Terms** 

|**Datasheet Identification**|**Product Status**|**Definition**|
|---|---|---|
|Advance Information|Formative / In Design|Datasheet contains the design specifications for product development. Specifications may change<br>in anymanner without notice.|
|Preliminary|First Production|Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild<br>Semiconductor reserves the right to make changes at anytime without notice to improve design.|
|No Identification Needed|Full Production|Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make<br>changes at anytime without notice to improve the design.|
|Obsolete|Not In Production|Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.<br>The datasheet is for reference information only.|



Rev. I77 

© Fairchild Semiconductor Corporation 

www.fairchildsemi.com 



## Links

- [View this product on Novapart](https://novapart.co/products/FDS8672S/power-mosfet-n-channel-30-v-18-a-00038-ohm-soic)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/en-ES/onsemi/fds8672s/mosfet-n-ch-30v-18a-soic-8/dp/2322615)
---

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