# Power MOSFET, N Channel, 40 V, 18 A, 3300 µohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2322613/)

**URL**: https://novapart.co/products/FDS8638/power-mosfet-n-channel-40-v-18-a-3300-ohm-soic
**SKU**: FDS8638
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.8960
**Stock**: 1000+
**Lead Time**: 148 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:18A; Drain Source Voltage Vds:40V; On Resistance Rds(on):0.0033ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:1.9V; Pow

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 40V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 18A |
| Drain Source On State Resistance | 3300µohm |
| Gate Source Threshold Voltage Max | 1.9V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2322613/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

**March 2009** 

## **FDS8638** 

## **N-Channel PowerTrench[®] MOSFET 40 V, 18 A, 4.3 m** Ω **Features** 

## **General Description** 

**==> picture [460 x 282] intentionally omitted <==**

**----- Start of picture text -----**<br>
Max rDS(on) = 4.3 mΩ at VGS = 10 V, ID = 18 A This N-Channel MOSFET is produced using Fairchild<br>Semiconductor’s advance Power Trench [®]  process that has<br>Max rDS(on) = 5.4 mΩ at VGS = 4.5 V, ID = 16 A  been especially tailored to minimize the on-state resistance and<br>yet maintain superior switching performance.<br>High performance trench technology for extremely low rDS(on)<br>100% UIL Tested<br>Applications<br>RoHS Compliant<br>Synchronous Rectifier<br>Load Switch<br>D<br>D<br>D 5 4 G<br>D<br>D D 6 3 S<br>D 7 2 S<br>G<br>SO-8<br>S D 8 1 S<br>¢ S<br>Pin 1 S<br>**----- End of picture text -----**<br>


|**MOSFET Maximum Ratings  **TA= 25 °C unless otherwise noted|**MOSFET Maximum Ratings  **TA= 25 °C unless otherwise noted||||||
|---|---|---|---|---|---|---|
|**Symbol**<br>**Parameter**||||**Ratings**||**Units**|
|VDS<br>Drain to Source Voltage||||40||V|
|VGS<br>Gate to Source Voltage||||±20||V|
|ID<br>Drain Current   -Continuous<br>-Pulsed||||18<br>100||A|
|EAS<br>Single Pulse Avalanche Energy||(Note 3)||541||mJ|
|PD<br>Power Dissipation                                                   TA= 25 °C<br>Power Dissipation                                                   TA= 25 °C||°C(Note 1a)<br>°C(Note 1b)||2.5<br>1||W|
|TJ, TSTG<br>Operatingand Storage Junction Temperature Range||||-55 to +150||°C|
|**Thermal Characteristics**|||||||
|**Package Marking and Ordering Information**<br>RθJC<br>Thermal Resistance, Junction to Case(Note 1)<br>25<br>°C/W<br>RθJA<br>Thermal Resistance, Junction to Ambient(Note 1a)<br>50<br>~~—ee~~<br>~~ee ae~~|||||||
|**Device Marking**<br>**Device**<br>**Package**<br>**Reel Size**<br>**Tape Width**<br>**Quantity**<br>FDS8638<br>FDS8638<br>SO-8<br>13 “<br>12 mm<br>2500 units<br>~~ee~~|||||||



©2009 Fairchild Semiconductor Corporation **1** FDS8638 Rev.C 

www.fairchildsemi.com 

## **Electrical Characteristics** TJ = 25 °C unless otherwise noted 

|**Off Characteristics**<br>**On Characteristics**<br>**Dynamic Characteristics**<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= 250µA, VGS= 0 V<br>40<br>V<br>∆BVDSS<br>∆TJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 250µA, referenced to 25 °C<br>32<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 32 V, VGS = 0 V<br>1<br>µA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20 V, VDS = 0 V<br>±100<br>nA<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS,  ID= 250µA<br>1.0<br>1.9<br>3.0<br>V<br>∆VGS(th)<br>∆TJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= 250µA, referenced to 25 °C<br>-7<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= 10 V,  ID= 18 A<br>3.3<br>4.3<br>mΩ<br>VGS= 4.5 V, ID= 16 A<br>4.0<br>5.4<br>VGS= 10 V,  ID= 18 A, TJ= 125 °C<br>4.8<br>6.3<br>gFS<br>Forward Transconductance<br>VDS= 5 V,  ID= 18 A<br>88<br>S<br>Ciss<br>Input Capacitance<br>VDS= 15 V, VGS= 0 V,<br>f = 1 MHz<br>4270<br>5680<br>pF<br>Coss<br>Output Capacitance<br>1175<br>1560<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>120<br>180<br>pF<br>Rg<br>Gate Resistance<br>0.9<br>Ω<br>~~To~~<br>~~ee~~|**Off Characteristics**<br>**On Characteristics**<br>**Dynamic Characteristics**<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= 250µA, VGS= 0 V<br>40<br>V<br>∆BVDSS<br>∆TJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 250µA, referenced to 25 °C<br>32<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 32 V, VGS = 0 V<br>1<br>µA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20 V, VDS = 0 V<br>±100<br>nA<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS,  ID= 250µA<br>1.0<br>1.9<br>3.0<br>V<br>∆VGS(th)<br>∆TJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= 250µA, referenced to 25 °C<br>-7<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= 10 V,  ID= 18 A<br>3.3<br>4.3<br>mΩ<br>VGS= 4.5 V, ID= 16 A<br>4.0<br>5.4<br>VGS= 10 V,  ID= 18 A, TJ= 125 °C<br>4.8<br>6.3<br>gFS<br>Forward Transconductance<br>VDS= 5 V,  ID= 18 A<br>88<br>S<br>Ciss<br>Input Capacitance<br>VDS= 15 V, VGS= 0 V,<br>f = 1 MHz<br>4270<br>5680<br>pF<br>Coss<br>Output Capacitance<br>1175<br>1560<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>120<br>180<br>pF<br>Rg<br>Gate Resistance<br>0.9<br>Ω<br>~~To~~<br>~~ee~~|
|---|---|
|**Switching Characteristics**||
|td(on)<br>Turn-On DelayTime<br>VDD= 20 V, ID= 18 A,<br>VGS= 10 V, RGEN= 6Ω<br>16<br>30<br>ns<br>tr<br>Rise Time<br>6<br>13<br>ns<br>td(off)<br>Turn-Off DelayTime<br>39<br>63<br>ns||
|tf<br>Fall Time<br>5<br>10<br>ns||
|Qg<br>Total Gate Charge<br>VGS = 0 V to 10 V<br>VDD= 20 V,<br>ID= 18 A<br>61<br>86<br>nC<br>Qg<br>Total Gate Charge<br>VGS = 0 V to 4.5 V<br>27<br>39<br>nC<br>Qgs<br>Gate to Source Charge<br>12<br>nC<br>Qgd<br>Gate to Drain “Miller” Charge<br>7.2<br>nC<br>~~——————~~||
|**Drain-Source Diode Characteristics**||
|VSD<br>Source to Drain Diode  Forward Voltage<br>VGS = 0 V, IS = 18 A(Note 2)<br>0.81<br>1.3<br>V<br>VGS = 0 V, IS = 2.1 A(Note 2)<br>0.71<br>1.2<br>trr<br>Reverse RecoveryTime<br>IF= 18 A, di/dt = 100 A/µs<br>51<br>82<br>ns<br>Qrr<br>Reverse RecoveryCharge<br>30<br>49<br>nC<br>~~———~~||



NOTES: 1. RθJA is determined with the device mounted on a 1 in[2] pad 2 oz copper pad on a 1.5 x 1.5  in. board of FR-4 material. RθJC is guaranteed by design while RθCA is determined by the user's board design. 

a) 50 °C/W when mounted on a b) 125 °C/W when mounted on a 1 in[2 ] pad of 2 oz copper. minimum pad. 

2. Pulse Test: Pulse Width < 300 µs, Duty cycle < 2.0%. 

3. Starting TJ = 25 °C,  L = 3 mH, IAS = 19 A, VDD = 40 V, VGS = 10 V. 

©2009 Fairchild Semiconductor Corporation FDS8638 Rev.C 

www.fairchildsemi.com 

**2** 

## **Typical Characteristics** TJ = 25 °C unless otherwise noted 

**==> picture [469 x 590] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 4.0<br>80 VGS =  10 V VGS = 3.5 V 3.5 VGS = 3 V PULSE DURATION = 80 DUTY CYCLE = 0.5% MAX µ s<br>3.0<br>60 VGS =  4.5 V VGS = 3.5 V<br>2.5<br>VGS = 4 V PULSE DURATION = 80 DUTY CYCLE = 0.5% MAX µ s<br>2.0<br>40<br>VGS =  4 V<br>1.5<br>20<br>VGS = 3 V 1.0<br>VGS = 4.5 V VGS =  10 V<br>0 0.5<br>0.0 0.5 1.0 1.5 2.0 0 20 40 60 80 100<br>VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 1.  On Region Characteristics Figure 2.  Normalized On-Resistance<br>vs Drain Current and Gate Voltage<br>1.6 20<br>VIDGS = 18 A = 10 V ID = 18 A PULSE DURATION = 80 DUTY CYCLE = 0.5% MAX µ s<br>1.4<br>15<br>1.2<br>10<br>1.0<br>TJ = 125  [o] C<br>5<br>0.8<br>TJ = 25  [o] C<br>0.6 0<br>-75 -50 -25 0 25 50 75 100 125 150 2 4 6 8 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized  On  Resistance                                         Figure 4.   On-Resistance vs  Gate to<br>vs Junction Temperature Source Voltage<br>100 100<br>PULSE DURATION = 80  µ s VGS = 0 V<br>DUTY CYCLE = 0.5% MAX<br>80<br>VDS = 5 V 10 TJ = 150  [o] C<br>60<br>TJ = 150  [o] C 1 TJ = 25 [ o] C<br>40<br>TJ = 25  [o] C 0.1<br>20<br>TJ = -55  [o] C<br>TJ = -55  [o] C<br>0 0.01<br>1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>NORMALIZED<br>DRAIN CURRENT (A)<br>,<br>ID<br>DRAIN TO SOURCE ON-RESISTANCE<br>)<br>Ω<br>m<br>(<br>DRAIN TO<br>NORMALIZED rDS(on),<br>SOURCE ON-RESISTANCE<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>ID<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


**Figure 5.  Transfer Characteristics** 

**Figure 6.    Source to Drain  Diode Forward Voltage vs Source Current** 

©2009 Fairchild Semiconductor Corporation FDS8638 Rev.C 

www.fairchildsemi.com 

**3** 

## **Typical Characteristics** TJ = 25 °C unless otherwise noted 

**==> picture [468 x 590] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 10000<br>ID = 18 A Ciss<br>8<br>VDD = 20 V<br>6<br>1000<br>VDD = 15 V VDD = 25 V Coss<br>4<br>Crss<br>2 f = 1 MHz<br>100 VGS = 0 V<br>0 50<br>0 10 20 30 40 50 60 70 0.1 1 10 40<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance vs Drain<br>to Source Voltage<br>30 20<br>15<br>10 TJ = 25 [ o] C VGS = 10 V<br>TJ = 100  [o] C 10<br>VGS = 4.5 V<br>TJ = 125  [o] C<br>5<br>R θ JA = 50 oC/W<br>1 0<br>0.01 0.1 1 10 100 1000 25 50 75 100 125 150<br>tAV, TIME IN AVALANCHE (ms) TA, AMBIENT TEMPERATURE (oC)<br>Figure 9. Unclamped Inductive                                  Figure 10.  Maximum Continuous Drain                             Maximum Continuous Drain<br>Switching Capability Current  vs Ambient  Temperature<br>200 1000<br>100<br>VGS = 10 V<br>1 ms<br>10 100<br>SINGLE PULSE<br>10 ms<br>R θ JA = 125  [o] C/W<br>1 THIS AREA IS LIMITED BY rDS(on) 100 ms 10 TC = 25  [o] C<br>SINGLE PULSE 1 s<br>0.1 TJ = MAX RATED<br>R θ JA = 125  [o] C/W 10 s<br>TC = 25  [o] C DC 1<br>0.01 0.5<br>0.01 0.1 1 10 100 200 10-3 10-2 10-1 1 10 100 1000<br>VDS, DRAIN to SOURCE VOLTAGE (V) t, PULSE WIDTH (sec)<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE (V)<br>GS<br>V<br>DRAIN CURRENT (A)<br>,<br>ID<br>, AVALANCHE CURRENT (A)<br>IAS<br>, DRAIN CURRENT (A)<br>ID<br>PEAK TRANSIENT POWER (W)<br>P)(PK,<br>**----- End of picture text -----**<br>


**Figure 10.  Maximum Continuous Drain                             Maximum Continuous Drain Current  vs Ambient  Temperature** 

**Figure 11.  Forward Bias Safe Operating Area** 

**Figure 12.   Single  Pulse Maximum Power  Dissipation** 

©2009 Fairchild Semiconductor Corporation FDS8638 Rev.C 

www.fairchildsemi.com 

**4** 

**==> picture [470 x 208] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Characteristics  TJ = 25 °C unless otherwise noted<br>2<br>1 DUTY CYCLE-DESCENDING ORDER<br>D = 0.5<br>      0.2<br>      0.1<br>0.1<br>      0.05<br>      0.02 PDM<br>      0.01<br>t1<br>0.01 SINGLE PULSE t2<br>NTES:<br>R θ JA = 125  [o] C/W DUTY FACTOR: D = t1/t2<br>(Note 1b) PEAK TJ = PDM x Z θJA  x R θJA  + TA<br>0.001<br>10-3 10-2 10-1 1 10 100 1000<br>t, RECTANGULAR PULSE DURATION (sec)<br>Figure 13.  Junction-to-Ambient Transient Thermal Response Curve<br>Z JA θ<br>IMPEDANCE,<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


©2009 Fairchild Semiconductor Corporation FDS8638 Rev.C 

www.fairchildsemi.com 

**5** 

## **TRADEMARKS** 

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Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. 

## **PRODUCT STATUS DEFINITIONS Definition of Terms** 

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|---|---|---|
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©2009 Fairchild Semiconductor Corporation FDS8638 Rev.C 

www.fairchildsemi.com 

Rev. I39 

**6** 

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