# Power MOSFET, N Channel, 40 V, 12.8 A, 0.0105 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:1495221/)

**URL**: https://novapart.co/products/FDS8447/power-mosfet-n-channel-40-v-128-a-00105-ohm-soic
**SKU**: FDS8447
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.4530
**Stock**: 1000+
**Lead Time**: 373 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:12.8A; Drain Source Voltage Vds:40V; On Resistance Rds(on):0.009ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:1.8V; Power Dissip

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 2.5mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 40V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 12.8A |
| Drain Source On State Resistance | 0.0105ohm |
| Gate Source Threshold Voltage Max | 1.8V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1495221/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **FDS8447 Single N-Channel PowerTrench[®] MOSFET 40V, 12.8A, 10.5m** Ω 

## **General Description** 

## **Features** 

**==> picture [75 x 35] intentionally omitted <==**

**----- Start of picture text -----**<br>
November 2006<br>tm<br>**----- End of picture text -----**<br>


Max rDS(on) = 10.5mΩ at VGS = 10V, ID = 12.8A This single N-Channel MOSFET is produced using Fairchild Semiconductor’s advanced PowerTrench **[®]** Max rDS(on) = 12.3mΩ at VGS = 4.5V, ID = 11.4A process that has been especially tailored to minimize  the Low gate charge on-state resistance and yet maintain superior switching performance. High performance trench technology for extremely low rDS(on) **Applications** High power and current handling capability DC - DC conversion RoHS compliant 

**==> picture [144 x 90] intentionally omitted <==**

**----- Start of picture text -----**<br>
D<br>D<br>D<br>D<br>G<br>SO-8<br>S<br>S<br>Pin 1 S<br>**----- End of picture text -----**<br>


**==> picture [158 x 77] intentionally omitted <==**

**----- Start of picture text -----**<br>
D 5 4 G<br>D 6 3 S<br>D 7 2 S<br>D 8 1 S<br>**----- End of picture text -----**<br>


## **MOSFET Maximum Ratings** TA = 25°C unless otherwise noted 

|**Symbol**|**Parameter**|**Parameter**||||**Ratings**|**Ratings**|||**Units**|
|---|---|---|---|---|---|---|---|---|---|---|
|VDS|Drain to Source Voltage||||||40|||V|
|VGS|Gate to Source Voltage||||||±20|||V|
|ID|Drain Current   -Continuous<br>-Pulsed|Drain Current   -Continuous<br>-Pulsed|Drain Current   -Continuous<br>-Pulsed|Drain Current   -Continuous(Note 1a)<br>-Pulsed|||12.8<br>50|||A|
|EAS|Drain-Source Avalanche Energy                                                (Note 3)|Drain-Source Avalanche Energy                                                (Note 3)|Drain-Source Avalanche Energy                                                (Note 3)|Drain-Source Avalanche Energy                                                (Note 3)|||150|||mJ|
|PD|Power Dissipation for Single Operation                                        (Note 1a)<br>(Note 1b)||Power Dissipation for Single Operation                                        (Note 1a)<br>(Note 1b)|Power Dissipation for Single Operation                                        (Note 1a)<br>(Note 1b)|||2.5<br>1|||W|
|TJ, TSTG|Operating and Storage Junction Temperature Range|||||-55 to 150||||°C|
|**Thermal Characteristics**|**Thermal Characteristics**||||||||||
|RθJA<br>RθJC<br>~~[_~~|Thermal Resistance-Single operation, Junction to Ambient      (Note 1a)<br>Thermal Resistance, Junction to Case|||Thermal Resistance-Single operation, Junction to Ambient      (Note 1a)<br>Thermal Resistance, Junction to Case(Note 1)|||50<br>25|||°C/W|
|**Package Marking and Ordering Information**|**Package Marking and Ordering Information**||||||||||
|**Device Marking**<br>**Device**<br>FDS8447<br>FDS8447<br>~~{_]~~||**Reel Size**<br>13’’||**Tape Width**<br>12mm||||**Quantity**<br>2500 units|||



www.fairchildsemi.com 

©2006 Fairchild Semiconductor Corporation FDS8447 Rev. B 

**1** 

||||**FDS8447 Single N-Channel PowerTrench**|
|---|---|---|---|
|**Electrical Characteristics**TJ= 25°C unless otherwise noted<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>**Off Characteristics**<br>BVDSS<br>Drain to Source Breakdown Voltage ID= 250µA, VGS= 0V<br>40<br>V<br>∆BVDSS<br>∆TJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 250µA, referenced to 25°C<br>34<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 32V,  VGS= 0V<br>1<br>µA<br>TJ= 55°C<br>10<br>µA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20V, VDS= 0V<br>±100<br>nA<br>**On Characteristics**<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS,  ID= 250µA<br>1<br>1.8<br>3<br>V<br>∆VGS(th)<br>∆TJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= 250µA, referenced to 25°C<br>-5<br>mV/°C<br>rDS(on)<br>Drain to Source On Resistance<br>VGS= 10V, ID= 12.8A<br>9<br>10.5<br>mΩ<br>VGS= 4.5V, ID= 11.4A<br>10<br>12.3<br>VGS= 10V, ID= 12.8A,TJ= 125°C<br>13<br>15<br>gFS<br>Forward Transconductance<br>VDS= 10V, ID= 12.8A<br>75.3<br>S<br> **(Note 2)**<br>**Dynamic Characteristics**<br>Ciss<br>Input Capacitance<br>VDS= 20V, VGS= 0V,<br>f = 1MHz<br>2000<br>2600<br>pF<br>Coss<br>Output Capacitance<br>250<br>350<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>150<br>250<br>pF<br>Rg<br>Gate Resistance<br>f = 1MHz<br>1.3<br>Ω<br>**Switching Characteristics**<br>td(on)<br>Turn-On DelayTime<br>VDD= 20V, ID= 12.8A<br>VGS= 10V, RGEN= 4.5Ω<br>11<br>20<br>ns<br>tr<br>Rise Time<br>14<br>25<br>ns<br>td(off)<br>Turn-Off DelayTime<br>27<br>42<br>ns<br>tf<br>Fall Time<br>7<br>14<br>ns<br>Qg<br>Total Gate Charge at VGS= 10V<br>VDS= 20V, ID= 12.8A,<br>35<br>49<br>nC<br>Qg<br>Total Gate Charge at VGS= 5V<br>19<br>27<br>nC<br>Qgs<br>Gate to Source Gate Charge<br>6<br>nC<br>Qgd<br>Gate to Drain “Miller”Charge<br>7<br>nC<br>~~=~~<br>~~EEE~~<br>~~—————~~<br>~~ee~~<br>~~SS~~<br>~~OE~~|||**FDS8447 Single N-Channel PowerTrench® MOSFET**|
|**Drain-Source Diode Characteristics**<br>and Maximum Ratings||||
|VSD<br>Source to Drain Diode  Forward Voltage VGS= 0V, IS= 12.8A(note 2)<br>0.84<br>1.2<br>V<br>trr<br>Reverse RecoveryTime<br>IF= 12.8A, diF/dt= 100A/µs<br>19<br>29<br>ns<br>Qrr<br>Reverse RecoveryCharge<br>9.5<br>19<br>nC<br>~~—~~||||
|**Notes:**||||
|**1:** RθJAis the sum of the junction-to-case and case-to- ambient  thermal resistance where the case thermal reference is defined  as the solder mounting surface of the||is the sum of the junction-to-case and case-to- ambient  thermal resistance where the case thermal reference is defined  as the solder mounting surface of the|is the sum of the junction-to-case and case-to- ambient  thermal resistance where the case thermal reference is defined  as the solder mounting surface of the|
|drain pins. RθJCis guaranteed by design  while RθJAis determined by the user’s board design.||||
|**a)**50°C/W when<br>mounted on a 1in2<br>**b)**125°C/W when mounted on a<br>minimum pad .||||
|pad of 2 oz copper||||
|Scale 1:1 on letter size paper||||



- **2:** Pulse Test: Pulse Width < 300 us, Duty Cycle < 2.0%. 

- **3:** Starting TJ = 25°C, L = 3mH, IAS = 10A, VDD = 40V, VGS = 10V. 

FDS8447 Rev.B 

www.fairchildsemi.com 

**2** 

**Typical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [437 x 589] intentionally omitted <==**

**----- Start of picture text -----**<br>
50 3.0<br>PULSE DURATION = 80 µ s PULSE DURATION = 80 µ s<br>40 DUTY CYCLE = 0.5%MAX 2.5 VGS = 3V DUTY CYCLE = 0.5%MAX<br>VGS =10V<br>VGS = 4.5V<br>30 2.0<br>VGS =  3.5V<br>20 1.5 VGS = 4.5V VGS = 3.5V<br>VGS = 3V<br>10 1.0<br>VGS =  10V<br>0 0.5<br>0.0 0.4 0.8 1.2 1.6 2.0 0 10 20 30 40 50<br>VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT(A)<br>Figure 1.  On Region Characteristics Figure 2.  Normalized On-Resistance vs Drain<br>Current and Gate Voltage<br>1.8 25<br>1.6  IVDGS = 12.8A = 10V ID = 12.8A PULSE DURATION = 80DUTY CYCLE = 0.5%MAX µ s<br>20<br>1.4<br>TJ = 125 [o] C<br>1.2 15<br>1.0 TJ = 25 [o] C<br>10<br>0.8<br>0.6 5<br>-50 -25 0 25 50 75 100 125 150 2 4 6 8 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V) [10]<br>Figure 3.  Normalized On Resistance vs Junction  Figure 4.   On-Resistance vs Gate to Source<br>Temperature Voltage<br>50 100<br>PULSE DURATION = 80 µ s VGS = 0V<br>DUTY CYCLE = 0.5%MAX<br>40 10<br>VDS = 5V<br>TJ = 150 [o] C<br>30 1<br>TJ = 150 [o] C<br>TJ = 25 [o] C<br>20 0.1<br>TJ = 25 [o] C<br>10 0.01 TJ = -55 [o] C<br>TJ = -55 [o] C<br>0 1E-3<br>1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5.  Transfer Characteristics Figure 6.  Source to Drain  Diode Forward<br>Voltage vs Source Current<br>NORMALIZED<br>, DRAIN CURRENT (A)<br>ID<br>DRAIN TO SOURCE ON-RESISTANCE<br>)<br>Ω<br>m<br>(<br>, DRAIN TO<br>NORMALIZED<br>rDS(on)<br>SOURCE ON-RESISTANCE<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>ID<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


FDS8447 Rev.B 

www.fairchildsemi.com 

**3** 

**Typical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [438 x 590] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 104<br>VDD = 10V Ciss<br>8<br>103<br>6 VDD = 20V Coss<br>VDD = 30V<br>4<br>102 Crss<br>2 f = 1MHz<br>VGS = 0V<br>0 101<br>0 10 20 30 40 0.1 1 10 40<br>Qg, GATE CHARGE(nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance vs Drain to Source Voltage<br>16 15<br>13 12 VGS = 10V<br>10 TJ = 25 [o] C 9<br>7 6 VGS = 4.5V<br>TJ = 125 [o] C<br>4 3<br>R θ JA = 50oC/W<br>1 0<br>0.01 0.1 1 10 100 25 50 75 100 125 150<br>tAV, TIME IN AVALANCHE(ms) TA, AMBIENT TEMPERATURE (oC)<br>Figure 9.  Unclamped Inductive Switching  Figure 10.  Maximum Continuous Drain Current vs<br>Capability Ambient Temperature<br>100 2000<br>1000<br>100us VGS = 10V<br>10<br>1ms 100<br>SINGLE PULSE<br>1 OPERATION IN THIS  10ms RTA θ  = 25°CJA = 125°C/W<br>AREA MAY BE  100ms<br>LIMITED BY r<br>DS(on) 10<br>0.1 SINGLE PULSE 1s<br>TJ = MAX RATED 10s<br>SINGLE PULSE<br>TA = 25 [O] C<br>DC<br>0.01 1<br>0.01 0.1 1 10 100 200 10-4 10-3 10-2 10-1 100 101 102 103<br>t, PULSE WIDTH (s)<br>VDS, DRAIN to SOURCE VOLTAGE (V)<br>Figure 11.  Forward Bias Safe Operating Area Figure 12.  Single Pulse Maximum Power<br>Dissipation<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE(V)<br>GS<br>V<br>, DRAIN CURRENT (A)<br>ID<br>, AVALANCHE CURRENT(A)<br>IAS<br>, DRAIN CURRENT (A)<br>D<br> I<br>, PEAK TRANSIENT POWER (W)P)(PK<br>**----- End of picture text -----**<br>


FDS8447 Rev.B 

www.fairchildsemi.com 

**4** 

**==> picture [434 x 213] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Characteristics  TJ = 25°C unless otherwise noted<br>2<br>1 DUTY CYCLE-DESCENDING ORDER<br>D = 0.5<br>      0.2<br>      0.1<br>0.1<br>      0.05<br>      0.02 P(PK)<br>      0.01<br>0.01<br>t1<br>t2<br>1E-3 SINGLE PULSE RR θθ JAJA (t) = r(t)*R= 125 [o] C/W                    T θ JA J-TA =P*R θ JA<br>DUTY FACTOR: D = t1/t2<br>0.0002<br>10-4 10-3 10-2 10-1 100 101 102 103<br>t, RECTANGULAR PULSE DURATION (s)<br>Figure 13.  Transient Thermal Response Curve<br>IMPEDANCE, ZJA θ<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


FDS8447 Rev.B 

www.fairchildsemi.com 

**5** 

## **FAIRCHILD SEMICONDUCTOR TRADEMARKS** 

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. 

|ACEx™|FACT Quiet Series™|OCX™|SILENT SWITCHER®|UniFET™|
|---|---|---|---|---|
|ActiveArray™|GlobalOptoisolator™|OCXPro™|SMART START™|VCX™|
|Bottomless™|GTO™|OPTOLOGIC®|SPM™|Wire™|
|Build it Now™|HiSeC™|OPTOPLANAR™|Stealth™||
|CoolFET™|I2C™|PACMAN™|SuperFET™||
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|EcoSPARK™|IntelliMAX™|PowerEdge™|SuperSOT™-8||
|E2CMOS™|ISOPLANAR™|PowerSaver™|SyncFET™||
|EnSigna™|LittleFET™|PowerTrench®|TCM™||
|FACT®|MICROCOUPLER™|QFET®|TinyBoost™||
|FAST®|MicroFET™|QS™|TinyBuck™||
|FASTr™|MicroPak™|QT Optoelectronics™|TinyPWM™||
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|Across the board. Around the world.™||µSerDes™|TruTranslation™||
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|Programmable Active Droop™|||||



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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. 

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## As used herein: 

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## **PRODUCT STATUS DEFINITIONS** 

**Definition of Terms** 

|**Definition of Terms**|||
|---|---|---|
|**Datasheet Identification**|**Product Status**|**Definition**|
|Advance Information|Formative or In Design|This datasheet contains the design specifications for<br>product development. Specifications may change in<br>any manner without notice.|
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Rev. I22 

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