# Power MOSFET, N Channel, 30 V, 21 A, 0.0036 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:1495213/)

**URL**: https://novapart.co/products/FDS6699S/power-mosfet-n-channel-30-v-21-a-00036-ohm-soic
**SKU**: FDS6699S
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.4880
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Power Dissipation | 2.5mW |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 2.5mW |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.0036ohm |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 21A |
| Drain Source On State Resistance | 0.0036ohm |
| Gate Source Threshold Voltage Max | 1.4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1495213/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

**==> picture [74 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
December 2012<br>**----- End of picture text -----**<br>


## **FDS6699S** 

## **30V N-Channel PowerTrench® SyncFET™** 

## **Features** 

- 21 A, 30 V Max RDS(ON) = 3.6 mΩ @ VGS = 10 V Max RDS(ON) = 4.5 mΩ @ VGS = 4.5 V 

- ■ Includes SyncFET Schottky body diode 

- High performance trench technology for extremely low RDS(ON) and fast switching 

- ■ High power and current handling capability ■ 100% RG (Gate Resistance) tested 

## **General Description** 

The FDS6699S is designed to replace a single SO-8  MOSFET and Schottky diode in synchronous DC:DC power supplies. This 30V MOSFET is designed to maximize power conversion efficiency, providing a low RDS(ON)  and low gate charge.  The FDS6699S includes an integrated Schottky diode using Fairchild’s monolithic SyncFET technology. 

## **Applications** 

- Synchronous Rectifier for DC/DC Converters – 

- Notebook Vcore low side switch 

- Point of Load low side switch 

**==> picture [102 x 76] intentionally omitted <==**

**----- Start of picture text -----**<br>
D<br>D<br>D<br>D<br>IV<br>G<br>S<br>x S<br>SO-8 S<br>**----- End of picture text -----**<br>


**==> picture [90 x 61] intentionally omitted <==**

**----- Start of picture text -----**<br>
5 4<br>6 3<br>7 2<br>8 1<br>**----- End of picture text -----**<br>


## **Absolute Maximum Ratings** TA=25°C unless otherwise noted 

**==> picture [449 x 178] intentionally omitted <==**

**----- Start of picture text -----**<br>
Symbol Parameter Ratings Units<br>VDSS Drain-Source Voltage  30  V<br>VGSS Gate-Source Voltage ±20 V<br>ID Drain Current – Continuous (Note 1a) 21 A<br>– Pulsed 105<br>EAS Single Pulse Avalanche Energy                                                                   (Note 4) 541 mJ<br>PD Power Dissipation for Single Operation (Note 1a) 2.5 W<br>(Note 1b) 1.2<br>(Note 1c) 1<br>TJ, TSTG Operating and Storage Junction Temperature Range –55 to +150 °C<br>Thermal Characteristics<br>RθJA Thermal Resistance, Junction-to-Ambient (Note 1a) 50 °C/W<br>RθJC Thermal Resistance, Junction-to-Case (Note 1) 25<br>**----- End of picture text -----**<br>


## **Package Marking and Ordering Information** 

**Device Marking Device Reel Size Tape width Quantity** FDS6699S FDS6699S 13’’ 12mm 2500 units 

**1** 

©2012 Fairchild Semiconductor Corporation FDS6699S Rev. D3 

www.fairchildsemi.com 

## **Electrical Characteristics** TA = 25°C unless otherwise noted 

|**Symbo**|**l**<br>**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Off Characteristics**|||||||
|BV<br>DSS|Drain–Source Breakdown Voltage<br>V<br>|GS<br>= 0 V, I<br>D<br>= 1 mA|30|||V|
|∆<br>BV<br>DSS<br>∆<br>T<br>J|Breakdown Voltage Temperature<br>Coeffcient<br>I<br>D|= 1 mA, Referenced to 25<br>°<br>C||28||mV/<br>°<br>C|
|I<br>DSS|Zero Gate Voltage Drain Current<br>V<br>|DS<br>= 24 V, V<br>GS<br>= 0 V|||500|µ<br>A|
|I<br>GSS|Gate–Body Leakage<br>V<br>|GS<br>= ±20 V, V<br>DS<br>= 0 V|||±100|nA|
|**On Characteristics**<br>(Note 2)|||||||
|V<br>GS(th)|Gate Threshold Voltage<br>V<br>|DS<br>= V<br>GS<br>, I<br>D<br>= 1 mA|1|1.4|3|V|
|∆<br>V<br>GS(th)<br>∆<br>T<br>J|Gate Threshold Voltage Temperature<br>Coeffcient<br>I<br>D|= 1 mA, Referenced to 25<br>°<br>C||–3.2||mV/<br>°<br>C|
|R<br>DS(on)|Static Drain–Source<br>On–Resistance<br>V<br><br>V<br><br>V<br>|GS<br>= 10 V, I<br>D<br>= 21 A<br>GS<br>= 4.5 V, I<br>D<br>= 19 A<br>GS<br>=10 V, I<br>D<br>=21 A, T<br>J<br>=150<br>°<br>C||3.0<br>3.6<br>4.6|3.6<br>4.5<br>5.6|m<br>Ω|
|g<br>FS|Forward Transconductance<br>V<br>|DS<br>= 10 V, I<br>D<br>= 21 A||100||S|
|**Dynamic Characteristics**|||||||
|C<br>iss|Input Capacitance<br>V<br><br>f<br>Output Capacitance<br>Reverse Transfer Capacitance|DS<br>= 15 V, V<br>GS<br>= 0 V,<br>= 1.0 MHz||3610|4800|pF|
|C<br>oss||||1080|1435|pF|
|C<br>rss||||340|680|pF|
|R<br>G|Gate Resistance<br>V<br>|GS<br>= 15 mV,  f = 1.0 MHz|0.4|1.8|3.1|Ω|
|**Switching Characteristics**<br>(Note 2)|||||||
|t<br>d(on)|Turn–On Delay Time<br>V<br><br>V<br><br>Turn–On Rise Time<br>Turn–Off Delay Time<br>Turn–Off Fall Time|DD<br>= 15 V, I<br>D<br>= 1 A,<br>GS<br>= 10 V, R<br>GEN<br>= 6<br>Ω||11|20|ns|
|t<br>r||||12|22|ns|
|t<br>d(off)||||73|117|ns|
|t<br>f||||38|61|ns|
|Q<br>g(TOT)|Total Gate Charge at Vgs = 10V<br>V<br><br>Total Gate Charge at Vgs = 5V<br>Gate–Source Charge<br>Gate–Drain Charge|DD<br>= 15 V, I<br>D<br>= 21 A,||65|91|nC|
|Q<br>g||||35|49|nC|
|Q<br>gs||||9||nC|
|Q<br>gd||||11||nC|
|**Drain–Source Diode Characteristics and Maximum Ratings**|||||||
|V<br>SD|Drain–Source Diode Forward Voltage<br>V<br>|GS<br>= 0 V, I<br>S<br>= 3.5 A         (Note 2)||0.36|0.7|V|
|t<br>rr|Diode Reverse Recovery Time<br>I<br>F<br>d<br>i<br>Diode Reverse Recovery Current<br>Diode Reverse Recovery Charge|= 21 A,<br>F<br>/d<br>t<br>= 300 A/µs               (Note 3)||32||ns|
|I<br>RM||||2.2||A|
|Q<br>rr||||35||nC|



**Notes:** 

1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. 

a) 50°/W when mounted b) 105°/W when mounted c) 125°/W when mounted on a 1 in2 pad of 2 oz on a .04 in2 pad of 2 oz on a minimum pad. copper copper 

Scale 1 : 1 on letter size paper 

2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0% 

3. See “SyncFET Schottky body diode characteristics” below. 

4. EAS[ of 541 mJ is based on starting T] J[ = 25 ][°][C, L = 3 mH, I] AS[ = 19 A, V] DD[ = 30 V, V] GS[ = 10 V. 100% test at L = 1 mH, I] AS[ = 25 A.] 

FDS6699S Rev. D3 

**2** 

www.fairchildsemi.com 

## **Typical Characteristics** 

**==> picture [444 x 523] intentionally omitted <==**

**----- Start of picture text -----**<br>
105 2.6<br>V GS = 10V 3.0V 2.4<br>87.5 VGS = 2.5V<br>2.2<br>4.5V 3.5V<br>70 2<br>1.8<br>52.5<br>1.6 3.0V<br>35 2.5V 1.4 3.5V<br>4.0V<br>1.2 4.5V<br>17.5 6.0V<br>1 10V<br>0 0.8<br>0 0.5 1 1.5 2 0 17.5 35 52.5 70 87.5 105<br>VDS, DRAIN-SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 1. On-Region Characteristics. Figure 2. On-Resistance Variation with<br>Drain Current and Gate Voltage.<br>1.6 0.012<br>VIDGS = 21A =10V ID = 10.5A<br>1.4 0.01<br>1.2 0.008<br>1 0.006 TA = 125°C<br>0.8 0.004<br>TA = 25°C<br>0.6 0.002<br>-50 -25 0 25 50 75 100 125 2 4 6 8 10<br>T J, JUNCTION TEMPERATURE ( ° C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3. On-Resistance Variation with Figure 4. On-Resistance Variation with<br>Temperature. Gate-to-Source Voltage.<br>105 1000<br>VDS = 5V VGS = 0V<br>87.5 100<br>70 10 TA = 125°C<br>52.5 1 25°C<br>TA = 125°C<br>35 -55°C 0.1<br>-55°C<br>17.5 25°C 0.01<br>0 0.001<br>1 1.5 2 2.5 3 0 0.2 0.4 0.6 0.8<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>, NORMALIZED<br>, DRAIN CURRENT (A)  ID RDS(ON)<br>DRAIN-SOURCE ON-RESISTANCE<br>, NORMALIZED<br>DS(ON) , ON-RESISTANCE (OHM)<br>R DS(ON)<br>R<br> DRAIN-SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)ID<br>, REVERSE DRAIN CURRENT (A)IS<br>**----- End of picture text -----**<br>


**Figure 5. Transfer Characteristics.** 

**Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature.** 

**3** 

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FDS6699S Rev. D3 

## **Typical Characteristics** (continued) 

**==> picture [448 x 150] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 5000<br>f = 1MHz<br>ID = 21A VGS = 0 V<br>8 4000<br>V DS = 10V<br>20V<br>Ciss<br>6 3000<br>15V<br>4 2000<br>Coss<br>2 1000 Crss<br>0 0<br>0 10 20 30 40 50 60 70 0 5 10 15 20 25 30<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>CAPACITANCE (pF)<br>, GATE-SOURCE VOLTAGE (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


**Figure 7. Gate Charge Characteristics.** 

**Figure 8. Capacitance Characteristics.** 

**==> picture [459 x 149] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000 50<br>RDS(ON) LIMIT SINGLE PULSERθJA = 125°C/W<br>100 40 TA = 25°C<br>100us<br>1ms<br>10 10ms 30<br>100ms<br>1s<br>10s<br>DC<br>1 20<br>VGS = 10V<br>SINGLE PULSE<br>0.1 RθJA = 125° C/W 10<br>TA = 25°C<br>0.01 0<br>0.01 0.1 1 10 100 0.001 0.01 0.1 1 10 100 1000<br>VDS, DRAIN-SOURCE VOLTAGE (V) t1, TIME (sec)<br>, DRAIN CURRENT (A)<br>ID<br>P(pk), PEAK TRANSIENT POWER (W)<br>**----- End of picture text -----**<br>


**Figure 9. Maximum Safe Operating Area.** 

**Figure 10. Single Pulse Maximum Power Dissipation.** 

**==> picture [386 x 124] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>D = 0.5<br>RθJA [(t) = r(t) * R] θJA<br>0.2 RθJA  = 125 °C/W<br>0.1 0.1<br>0.05<br>P(pk)<br>0.02 t1<br>0.01 0.01 t2<br>TJ - TA = P * R θJA (t)<br>SINGLE PULSE Duty Cycle, D = t1 /t2<br>0.001<br>0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>THERMAL RESISTANCE<br>r(t), NORMALIZED EFFECTIVE TRANSIENT<br>**----- End of picture text -----**<br>


**Figure 11. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1c. Transient thermal response will change depending on the circuit board design.** 

**4** 

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FDS6699S Rev. D3 

## **Typical Characteristics** (continued) 

## **SyncFET Schottky Body Diode Characteristics** 

Fairchild’s SyncFET process embeds a Schottky diode in parallel with PowerTrench MOSFET.  This diode exhibits similar characteristics to a discrete external Schottky diode in parallel with a MOSFET.  Figure 12 shows the reverse recovery characteristic of the FDS6699S. 

**==> picture [119 x 108] intentionally omitted <==**

**----- Start of picture text -----**<br>
TIME : 12.5ns/div<br>CURRENT : 0.8A/div<br>**----- End of picture text -----**<br>


Schottky barrier diodes exhibit significant leakage at high temperature and high reverse voltage.  This will increase the power in the device. 

**==> picture [195 x 133] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.1<br>[———  ————<br>rs | T A  = 125 [o] C a<br>0.01 oe<br>SSS SSS SSS<br>T A  = 100 [o] C<br>0.001 ee<br>pf df<br>——————<br>a<br>0.0001<br>Lf ||<br>T A  = 25 [o] C<br>a—————_{—S——| ee<br>0.00001 a<br>0 5 10 15 20 25 30<br>VDS, REVERSE VOLTAGE (V)<br>, REVERSE LEAKAGE CURRENT (A)<br>IDSS<br>**----- End of picture text -----**<br>


**Figure 13. SyncFET body diode reverse leakage versus drain-source voltage and temperature.** 

**Figure 12. FDS6699S SyncFET body diode reverse recovery characteristic.** 

**5** 

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FDS6699S Rev. D3 

## **TRADEMARKS** 

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 

2Cool™ F-PFS™ PowerTrench[®] The Power Franchise[®] AccuPower™ FRFET[®] PowerXS™ D ® AX-CAP™*BitSiC[®] Global Power ResourceGreen Bridge™[SM] QFETProgrammable Active Droop™[®] P.Wwewer Build it Now™ Green FPS™ QS™ TinyBoost™ CorePLUS™ Green FPS™ e-Series™ Quiet Series™ TinyBuck™ CorePOWER™ G _max_ ™ RapidConfigure™ TinyCalc™ _CROSSVOLT_ ™ GTO™ ™ TinyLogic[®] TINYOPTO™ CTL™ IntelliMAX™ Current Transfer Logic™ ISOPLANAR™ Saving our world, 1mW/W/kW at a time™ TinyPower™ DEUXPEED[®] Marking Small Speakers Sound Louder SignalWise™ TinyPWM™ Dual Cool™ and Better™ SmartMax™ TinyWire™ TranSiC[®] EcoSPARK[®] MegaBuck™ SMART START™ TriFault Detect™ EfficentMax™ MICROCOUPLER™ Solutions for Your Success™ TRUECURRENT[®] * ESBC™ MicroFET™ SPM[®] ® MicroPak™ STEALTH™ μSerDes™ MicroPak2™ SuperFET[®] Fairchild ~~-~~[®] MillerDrive™ SuperSOT™-3 VZ4.... Fairchild Semiconductor[®] MotionMax™ SuperSOT™-6 UHC[®] FACT Quiet Series™ Motion-SPM™ SuperSOT™-8 Ultra FRFET™ FACT[®] mWSaver™ SupreMOS[®] UniFET™ FAST[®] OptoHiT™ SyncFET™ VCX™ FastvCore™ OPTOLOGIC[®] Sync-Lock™ VisualMax™ FETBench™ OPTOPLANAR[®] ®* VoltagePlus™ FlashWriter[® ] * ® [5 SYSTEMGENERAL XS™ FPS™ 

*Trademarks of System General Corporation, used under license by Fairchild Semiconductor. 

## **DISCLAIMER** 

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. 

## **LIFE SUPPORT POLICY** 

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. 

As used here in: 

1. Life support devices or systems are devices or systems which, (a) are 2. intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 

- A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 

## **ANTI-COUNTERFEITING POLICY** 

Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support. 

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. 

## **PRODUCT STATUS DEFINITIONS** 

## **Definition of Terms** 

|**Datasheet Identification**|**Product Status**|**Definition**|
|---|---|---|
|Advance Information|Formative / In Design|Datasheet contains the design specifications for product development. Specifications<br>may change in any manner without notice.|
|Preliminary|First Production|Datasheet contains preliminary data; supplementary data will be published at a later<br>date. Fairchild Semiconductor reserves the right to make changes at any time without<br>notice to improve design.|
|No Identification Needed|Full Production|Datasheet contains final specifications. Fairchild Semiconductor reserves the right to<br>make changes at any time without notice to improve the design.|
|Obsolete|Not In Production|Datasheet contains specifications on a product that is discontinued by Fairchild<br>Semiconductor. The datasheet is for reference information only.|



Rev. I61 

www.fairchildsemi.com 

**6** 

FDS6699S Rev. D3 

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