# Power MOSFET, P Channel, 30 V, 14.5 A, 7800 µohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2101409/)

**URL**: https://novapart.co/products/FDS6673BZ/power-mosfet-p-channel-30-v-145-a-7800-ohm-soic
**SKU**: FDS6673BZ
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3210
**Stock**: 10+

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-14.5A; Drain Source Voltage Vds:-30V; On Resistance Rds(on):0.0065ohm; Rds(on) Test Voltage Vgs:-10V; Threshold Voltage Vgs:-1.

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 1W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 14.5A |
| Drain Source On State Resistance | 7800µohm |
| Gate Source Threshold Voltage Max | 1.9V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2101409/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

**==> picture [50 x 7] intentionally omitted <==**

**----- Start of picture text -----**<br>
March 2009<br>**----- End of picture text -----**<br>


## **FDS6673BZ** 

**P-Channel PowerTrench[®] MOSFET -30V, -14.5A, 7.8m** 

## **General Description** 

This P-Channel MOSFET is produced using Fairchild Semiconductor’s advanced Power Trench process that has been especially tailored to minimize the on-state resistance. This device is well suited for Power Management and load switching applications common in Notebook Computers and Portable Battery Packs. 

## **Features** 

Max rDS(on) = 7.8m GS[= -10V, I] D[ = -14.5A                          ] Max rDS(on) = 12m VGS = -4.5V, ID = -12A Extended VGS range (-25V) for battery applications HBM ESD protection level of 6.5kV typical (note 3) High performance trench technology for extremely low rDS(on) High power and current handling capability RoHS compliant 

**==> picture [433 x 321] intentionally omitted <==**

**----- Start of picture text -----**<br>
D<br>D 5 4<br>D<br>D 6 3<br>7 2<br>G<br>S<br>S  8 1<br>SO-8 S<br>MOSFET Maximum Ratings TA = 25°C unless otherwise noted<br>Symbol Parameter Ratings Units<br>VDS Drain to Source Voltage -30 V<br>VGS Gate to Source Voltage ±25 V<br>Drain Current Continuous Note1a)   -14.5 A<br>ID                         -Pulsed -75 A<br>Power Dissipation for Single Operation                                  (Note1a)  2.5<br>PD                                                                                                        Note1b)  1.2 W<br>                                                                                                       Note1c)  1.0<br>TJ, TSTG Operating and Storage Temperature -55 to 150 °C<br>Thermal Characteristics<br>R JA Thermal Resistance , Junction to Ambient (Note 1a) 50 °C/W<br>R JC Thermal Resistance , Junction to Case (Note 1) —— 25 °C/W<br>Package Marking and Ordering Information<br>Device Marking Device Reel Size Tape Width Quantity<br>FDS6673BZ FDS6673BZ 13’’ 12mm 2500 units<br>_ i<br>**----- End of picture text -----**<br>


©2009 Fairchild Semiconductor Corporation **1** FDS6673BZ Rev. B2 

www.fairchildsemi.com 

**Electrical Characteristics** TJ = 25°C unless otherwise noted 

|**Electrica**|**l Characteristics**TJ= 25°C unle|ss otherwise noted|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Units**|
|**Off Characteristics**|||||||
|BVDSS|Drain to Source Breakdown Voltage<br>I|D= -250�A, VGS= 0V|-30|||V|
|�BVDSS<br>�TJ|Breakdown Voltage Temperature<br>Coefficient<br>I<br>|D= -250�A, referenced to<br>25°C||-20||mV/°C|
|IDSS|Zero Gate Voltage Drain Current<br>|VDS= -24V, VGS= 0V|||-1|�A|
|IGSS|Gate to Source Leakage Current<br>|VGS= ±25V, VDS= 0V|||±10|�A|
|**On Characteristics**<br>**(Note 2)**|||||||
|VGS(th)|Gate to Source Threshold Voltage<br>|VGS= VDS,  ID= -250�A|-1|-1.9|-3|V|
|�VGS(th)<br>�TJ|Gate to Source Threshold Voltage<br>Temperature Coefficient<br>I<br>|D= -250�A, referenced to<br>25°C||8.1||mV/°C|
|rDS(on)|Drain to Source On Resistance<br><br><br><br>|VGS= -10V , ID= -14.5A||6.5|7.8|m�|
|||VGS= -4.5V, ID= -12A||9.6|12||
|||VGS= -10V, ID= -14.5A<br>TJ= 125oC||9.7|12||
|gFS|Forward Transconductance<br>|VDS= -5V, ID= -14.5A||60||S|
|**Dynamic Characteristics**|||||||
|Ciss|Input Capacitance<br><br>f<br>Output Capacitance<br>Reverse Transfer Capacitance|VDS= -15V, VGS= 0V,<br>= 1.0MHz||3500|4700|pF|
|Coss||||600|800|pF|
|Crss||||600|900|pF|
|**Switching Characteristics**<br>**(Note 2)**|||||||
|td(on)|Turn-On Delay Time<br><br><br>Rise Time<br>Turn-Off Delay Time<br>Fall Time|VDD= -15V, ID= -1A<br>VGS= -10V, RGS= 6�||14|26|ns|
|tr||||16|29|ns|
|td(off)||||225|36|ns|
|tf||||105|167|ns|
|Qg|Total Gate Charge<br><br>I|VDS= -15V, VGS= -10V,<br>D= -14.5A||88|124|nC|
|Qg|Total Gate Charge<br><br> <br>Gate to Source Gate Charge<br>Gate to Drain Charge|VDS= -15V, VGS= -5V,<br>ID= -14.5A||46|65|nC|
|Qgs||||8||nC|
|Qgd||||23.5||nC|
|**Drain-Source Diode Characteristics**|||||||
|VSD|Source to Drain Diode  Forward Voltage|VGS= 0V, IS= -2.1A||-0.7|-1.2|V|
|trr|Reverse Recovery Time<br>I|F= 14.5A, di/dt = 100A/�s|||45|ns|
|Qrr|Reverse RecoveryCharge<br>I|F= 14.5A, di/dt = 100A/�s|||34|nC|



**Notes:** 

- **1:** R�JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R�JC is guaranteed by design while R�CA is determined by the user’s board design. 

**==> picture [64 x 79] intentionally omitted <==**

|a) 50oC/W (10 sec)<br>when mounted on a 1 in2<br>pad of 2 oz copper|b) 105oC/W when mounted<br>on a .04 in2pad of 2 oz<br>copper<br>c) 125oC/W when mounted<br>on a minimun pad|
|---|---|



Scale 1 : 1 on letter size paper 

- **2:** Pulse Test: Pulse Width < 300�s, Duty Cycle < 2.0%. 

- **3:** The diode connected between the gate and source serves only as protection against ESD. No gate overvoltage rating is implied. 

www.fairchildsemi.com 

**2** 

FDS6673BZ Rev. B2 

**Typical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [434 x 601] intentionally omitted <==**

**----- Start of picture text -----**<br>
80 4.0<br>70 PULSE DURATION = 80DUTY CYCLE = 0.5%MAX � s 3.83.63.4 VGS = -3.5V PULSE DURATION = 80DUTY CYCLE = 0.5%MAX � s<br>3.2<br>60 VGS = -4V 3.0<br>2.8<br>50 VGS = -10V 2.6<br>40 VGS = -5V 2.42.2 VGS = -4V<br>30 VGS = -4.5V 2.01.8 VGS = -4.5V<br>1.6<br>20 VGS = -3.5V 1.41.2 VGS = -5V<br>10 VGS = -3V 1.00.80.6 VGS = -10V<br>0<br>0 1 2 3 4 10 20 30 40 50 60 70 80<br>-VDS, DRAIN TO SOURCE VOLTAGE (V) -ID, DRAIN CURRENT(A)<br>Figure 1.  On Region Characteristics Figure 2.  Normalized On-Resistance vs Drain<br>Current and Gate Voltage<br>1.5 25<br>1.4 ID = -14.5A ID = -7A PULSE DURATION = 80 � s<br> VGS = -10V 20 DUTY CYCLE = 0.5%MAX<br>1.3<br>1.2<br>15 TJ = 150 [o] C<br>1.1<br>1.0<br>10<br>0.9<br>0.8 5 TJ = 25 [o] C<br>0.7<br>0.6 0<br>-80 -40 0 40 80 120 160 2 4 6 8 10<br>TJ, JUNCTION TEMPERATURE (oC) -VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized On Resistance vs Junction  Figure 4.   On-Resistance vs Gate to Source<br>Temperature Voltage<br>80<br>PULSE DURATION = 80 � s 100<br>DUTY CYCLE = 0.5% MAX VGS = 0V<br>60 VDS = -6V 10<br>TJ = 150 [o] C TJ = 150 [o] C<br>1<br>40<br>TJ = 25 [o] C TJ = 25 [o] C<br>0.1<br>20<br>0.01 TJ = -55 [o] C<br>TJ = -55 [o] C<br>0 1E-3<br>2.0 2.5 3.0 3.5 4.0 4.5 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4<br>-VGS, GATE TO SOURCE VOLTAGE (V) -VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5.  Transfer Characteristics Figure 6.  Source to Drain  Diode Forward<br>                           Voltage vs Source Current<br>NORMALIZED<br>, DRAIN CURRENT (A)<br>D<br>-I<br>DRAIN TO SOURCE ON-RESISTANCE<br>)<br>�<br>m<br> NORMALIZED , DRAIN TO SOURCE  (<br>ON-RESISTANCE<br>rDS(on)<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>D<br>-I<br>, REVERSE DRAIN CURRENT (A)<br>S<br>-I<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**3** 

FDS6673BZ Rev. B2 

**Typical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [434 x 591] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 6000<br>8 Ciss<br>6 VDD = -10V VDD = -15V Coss<br>1000<br>VDD = -20V Crss<br>4<br>2 f = 1MHz<br>VGS = 0V<br>0 100<br>0 20 40 60 80 100 0.1 1 10 30<br>Qg, GATE CHARGE(nC) - VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance vs Drain to Source Voltage<br>1000<br>40<br>100<br>10 TJ = 150 [o] C<br>10<br>1<br>TJ = 25 [o] C<br>0.1<br>0.01 TJ = 25 [o] C TJ = 125 [o] C<br>1E-3<br>1E-4 1<br>0 5 10 15 20 25 30 35 10-2 10-1 100 101 102 103<br>-VGS(V) tAV, TIME IN AVALANCHE(ms)<br>Figure 9.  Ig vs VGS Figure 10.  Unclamped Inductive Switching<br>Capability<br>16 100<br>100 � s<br>12 10 1ms<br>VGS = -10V<br>10 ms<br>8 1 THIS AREA IS<br>VGS = -4.5V LIMITED BY r 100 ms<br>DS(on)<br>SINGLE PULSE 1s<br>4 0.1 TJ = MAX RATED<br>R � JA = 125 [o] C/W 10s<br>DC<br>TC = 25 [o] C<br>0 0.01<br>25 50 75 100 125 150 0.01 0.1 1 10 100 500<br>TA, AMBIENT TEMPERATURE( [o] C) -VDS, DRAIN to SOURCE VOLTAGE (V)<br>Figure 11.  Maximum Continuous Drain Current vs  Figure 12.  Forward Bias Safe Operating Area<br>Ambient Temperature<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE(V)<br>GS<br>V -<br>(uA)<br>g<br>-I<br>, AVALANCHE CURRENT(A)<br>AS<br>-I<br>, DRAIN CURRENT (A)<br>D<br>, DRAIN CURRENT (A) -I<br>D<br>-I<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**4** 

FDS6673BZ Rev. B2 

## **Typical Characteristics** TJ = 25 °C unless otherwise noted 

**==> picture [470 x 369] intentionally omitted <==**

**----- Start of picture text -----**<br>
104<br>VGS = -10V<br>103<br>102<br>10 SINGLE PULSE<br>R � JA = 125 [o] C/W<br>TA = 25 [o] C<br>1<br>0.5<br>10-4 10-3 10-2 10-1 1 10 102 103<br>t, PULSE WIDTH (sec)<br>Figure 13.  Single Pulse Maximum Power Dissipation<br>2<br>1 DUTY CYCLE-DESCENDING ORDER<br>D = 0.5<br>      0.2<br>0.1       0.1<br>      0.05<br>      0.02 PDM<br>      0.01<br>0.01<br>t1<br>SINGLE PULSE t2<br>1E-3 NOTES:<br>R � JA = 125 [o] C/W DUTY FACTOR: D = t1/t2<br>PEAK TJ = PDM x Z �JA  x R �JA  + TA<br>1E-4<br>10-4 10-3 10-2 10-1 1 10 102 103<br>t, RECTANGULAR PULSE DURATION (sec)<br>PEAK TRANSIENT POWER (W)<br>P)(PK,<br>Z JA �<br>IMPEDANCE,<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


**Figure 14.  Junction-to-Ambient Transient Thermal Response Curve** 

www.fairchildsemi.com 

**5** 

FDS6673BZ Rev. B2 

## **TRADEMARKS** 

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 

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|||||||||
|---|---|---|---|---|---|---|---|
|Build it Now™|FRFET|[®]|Programmable Active Droop™|
|CorePLUS™CorePOWER™|Global Power ResourceGreen FPS™|[SM]|QFETQS™|[®]|Pawthe|wer|tm|
|CROSSVOLT|™|Green FPS™ e-Series™|Quiet Series™|TinyBoost™|
|CTL™|GTO™|RapidConfigure™|TinyBuck™|
|Current Transfer Logic™|IntelliMAX™|TinyLogicTINYOPTO™|[®]|
|EcoSPARK|[®]|ISOPLANAR™|™|
|EfficentMax™|MegaBuck™|Saving our world, 1mW /W /kW at a time™|TinyPower™|
|EZSWITCH™ *|MICROCOUPLER™|SmartMax™|TinyPWM™|
|™|MicroFET™|SMART START™|TinyWire™|
|TriFault Detect™|
|MicroPak™|SPM|[®]|
|TRUECURRENT™*|
|®|MillerDrive™|STEALTH™|SerDes™|
|F|tm|MotionMax™|SuperFET™|
|Fairchild|[®]|Motion-SPM™|SuperSOT™-3|
|Fairchild Semiconductor|[®]|OPTOLOGIC|[®]|SuperSOT™-6|
|FACT Quiet Series™|OPTOPLANAR|[®]|SuperSOT™-8|124...|
|FACT|[®]|®|SupreMOS™|UHC|[®]|
|FASTFastvCore™|[®]|tm|SyncFET™|®|Ultra FRFET™UniFET™|
|FlashWriter|[®]|*|PDP SPM™|VCX™|
|FPS™F-PFS™|Power-SPM™PowerTrench|[®]|[5|The Power Franchise|GENERALSYSTEM|[®]|VisualMax™XS™|
|PowerXS™|

**----- End of picture text -----**<br>


*Trademarks of System General Corporation, used under license by Fairchild Semiconductor. 

## **DISCLAIMER** 

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. 

## **LIFE SUPPORT POLICY** 

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. 

As used herein: 

1. Life support devices or systems are devices or systems which, (a) are 2. intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 

A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 

## **ANTI-COUNTERFEITING POLICY** 

Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support. 

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. 

## **PRODUCT STATUS DEFINITIONS Definition of Terms** 

**==> picture [464 x 98] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||
|---|---|---|
|Datasheet Identification|Product Status|Definition|
|Advance Information|Formative / In Design|Datasheet contains the design specifications for product development. Specifications|
|may change in any manner without notice.|
|Datasheet contains preliminary data; supplementary data will be published at a later|
|Preliminary|First Production|date. Fairchild Semiconductor reserves the right to make changes at any time without|
|notice to improve design.|
|No Identification Needed|Full Production|Datasheet contains final specifications. Fairchild Semiconductor reserves the right to|
|make changes at any time without notice to improve the design.|
|Obsolete|Not In Production|Datasheet contains specifications on a product that is discontinued by Fairchild|
|Semiconductor. The datasheet is for reference information only.|

**----- End of picture text -----**<br>


Rev. I39 

www.fairchildsemi.com 

**6** 

FDS6673BZ Rev. B2 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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