# Power MOSFET, N Channel, 20 V, 16 A, 0.004 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2453420/)

**URL**: https://novapart.co/products/FDS6574A/power-mosfet-n-channel-20-v-16-a-0004-ohm-soic
**SKU**: FDS6574A
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3240
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 2.5W |
| Rds(On) Test Voltage | 4.5V |
| On Resistance Rds(On) | 0.004ohm |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 20V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 16A |
| Drain Source On State Resistance | 0.004ohm |
| Gate Source Threshold Voltage Max | 600mV |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2453420/)

## **FDS6574A** 

**==> picture [63 x 39] intentionally omitted <==**

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May  2008<br>tmM<br>**----- End of picture text -----**<br>


## **20V N-Channel PowerTrench[] MOSFET** 

## **General Description** 

## **Features** 

This N-Channel MOSFET has been designed • 16 A, 20 V. RDS(ON)  = 6 mΩ @ VGS = 4.5 V specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional RDS(ON)  = 7 mΩ @ VGS = 2.5 V switching PWM controllers.  It has been optimized for RDS(ON)  = 9 mΩ @ VGS = 1.8 V low gate charge, low RDS(ON) and fast switching speed. • Low gate charge **Applications** • High performance trench technology for extremely High performance trench technology for extremely • DC/DC converter low RDS(ON)DS(ON) • High power and current handling capability • RoHS Compliant **D D 5 4 D D 6 3 7 2 G** * **S S 8 1 SO-8 S** 

   - High performance trench technology for extremely High performance trench technology for extremely low RDS(ON)DS(ON) 

- **Absolute Maximum Ratings** TA=25[o] C unless otherwise noted 

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Symbol Parameter Ratings Units<br>VDSS Drain-Source Voltage 20 V<br>VGSS Gate-Source Voltage ± 8 V<br>ID Drain Current – Continuous (Note 1a) 16 A<br>– Pulsed 80<br>PD Power Dissipation for Single Operation (Note 1a) 2.5 W<br>(Note 1b) 1.2<br>(Note 1c) 1.0<br>TJ, TSTG Operating and Storage Junction Temperature Range –55 to +175 °C<br>Thermal Characteristics<br>RθJA Thermal Resistance, Junction-to-Ambient  (Note 1a) 50 °C/W<br>RθJC Thermal Resistance, Junction-to-Case (Note 1) 25 °C/W<br>SF—<br>Package Marking and Ordering Information<br>Device Marking Device Reel Size Tape width Quantity<br>FDS6574A FDS6574A 13’’ 12mm 2500 units<br>—<br>**----- End of picture text -----**<br>


FDS6574A  Rev B2(W) 

2008 Fairchild Semiconductor Corporation 

|**Electrical Characteristics**|**Electrical Characteristics**|TA= 25°C unless otherwise noted|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Units**|
|**Off Characteristics**|||||||
|BVDSS|Drain–Source Breakdown Voltage|VGS= 0 V,<br>ID= 250µA|20|||V|
|∆BVDSS<br>∆TJ|Breakdown Voltage Temperature<br>Coefficient|ID= 250µA, Referenced to 25°C||10||mV/°C|
|IDSS|Zero Gate Voltage Drain Current|VDS= 16 V,<br>VGS= 0 V|||1|µA|
|IGSSF|Gate–Body Leakage, Forward|VGS= 8 V,<br>VDS= 0 V|||100|nA|
|IGSSR|Gate–Body Leakage, Reverse|VGS= –8 V<br>VDS= 0 V|||–100|nA|
|**On Characteristics**<br>**(Note 2)**|||||||
|VGS(th)|Gate Threshold Voltage|VDS= VGS,<br>ID= 250µA|0.4|0.6|1.5|V|
|∆VGS(th)<br>∆TJ|Gate Threshold Voltage<br>Temperature Coefficient|ID= 250µA, Referenced to 25°C||–2.7||mV/°C|
|RDS(on)|Static Drain–Source<br>On–Resistance|VGS= 4.5 V,<br>ID= 16 A<br>VGS= 2.5 V,<br>ID= 15 A<br>VGS= 1.8 V,<br>ID= 13 A<br>VGS= 4.5 V,ID= 16 A,TJ=125°C||4<br>4.4<br>5<br>5.3|6<br>7<br>9<br>9|mΩ|
|ID(on)|On–State Drain Current|VGS= 4.5 V,<br>VDS= 5 V|40|||A|
|gFS|Forward Transconductance|VDS= 5 V,<br>ID= 16 A||115||S|
|**Dynamic Characteristics**|||||||
|Ciss|Input Capacitance|VDS= 10V,<br>VGS= 0 V,<br>f = 1.0 MHz||7657||pF|
|Coss|Output Capacitance|||1432||pF|
|Crss|Reverse Transfer Capacitance|||775||pF|
|**Switching Characteristics**<br>**(Note 2)**|||||||
|td(on)|Turn–On Delay Time|VDD= 10 V,<br>ID= 1 A,<br>VGS= 4.5 V, RGEN= 6Ω||19.5|35|ns|
|tr|Turn–On Rise Time|||22|36|ns|
|td(off)|Turn–Off DelayTime|||173|277|ns|
|tf|Turn–Off Fall Time|||82|131|ns|
|Qg|Total Gate Charge|VDS= 10 V,<br>ID= 16 A,<br>VGS= 4.5 V||75|105|nC|
|Qgs|Gate–Source Charge|||9||nC|
|Qgd|Gate–Drain Charge|||17||nC|
|**Drain–Source Diode Characteristic**||**s and Maximum Ratings**|||||
|IS|Maximum Continuous Drain–Sour|ce Diode Forward Current|||2.1|A|
|VSD|Drain–Source Diode Forward<br>Voltage|VGS= 0 V,<br>IS= 2.1 A<br>(Note 2)||0.56|1.2|V|



## **Notes:** 

**1.** RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.  RθJC is guaranteed by design while RθCA is determined by the user's board design. 

a) 50°C/W when b) 105°C/W when mounted on a 1in[2] mounted on a .04 in[2] pad of 2 oz copper pad of 2 oz copper 

c) 125°C/W when mounted on a minimum pad. 

Scale 1 : 1 on letter size paper 

**2.** Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0% 

FDS6574A Rev B2(W) 

## **Typical Characteristics** 

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**----- Start of picture text -----**<br>
100 2<br>VGS = 4.5V 2.5V<br>3.5V<br>80 1.8<br>1.8V VGS = 1.5V<br>1.5V 1.6<br>60<br>1.4<br>40  1.8V<br>1.2  2.5V<br>20  3.0V  3.5V  4.5V<br>1<br>0 0.8<br>0 0.5 1 1.5 2 0 20 40 60 80 100<br>VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DIRAIN CURRENT (A)<br>, NORMALIZED<br>, DRAIN CURRENT (A)ID RDS(ON)<br>DRAIN-SOURCE ON-RESISTANCE<br>**----- End of picture text -----**<br>


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Figure 1. On-Region Characteristics.<br>**----- End of picture text -----**<br>


**Figure 2. On-Resistance Variation with Drain Current and Gate Voltage.** 

**==> picture [423 x 353] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.6 0.012<br>VIGSD = 16A = 4.5V ID = 8A<br>1.4 0.01<br>1.2 0.008<br>TA = 125 [o] C<br>1 0.006<br>0.8 0.004<br>TA = 25 [o] C<br>0.6 0.002<br>-50 -25 0 25 50 75 100 125 150 175 1 2 3 4 5<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3. On-Resistance Variation with Figure 4. On-Resistance Variation with<br>Temperature. Gate-to-Source Voltage.<br>90 100<br>VDS = 5V TA = -55 [o] C 25 [o] C VGS = 0V<br>75 10<br>125 [o] C<br>TA = 125 [o] C<br>60 1<br>25 [o] C<br>45 0.1<br>-55 [o] C<br>30 0.01<br>15 0.001<br>0 0.0001<br>0.5 0.8 1.1 1.4 1.7 2 0 0.2 0.4 0.6 0.8 1<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD,  BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5. Transfer Characteristics. Figure 6. Body Diode Forward Voltage Variation<br>with Source Current and Temperature.<br>, NORMALIZED<br>DS(ON) , ON-RESISTANCE (OHM)<br>R DS(ON)<br>R<br> DRAIN-SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)ID<br>, REVERSE DRAIN CURRENT (A)IS<br>**----- End of picture text -----**<br>


FDS6574A Rev B2(W) 

## **Typical Characteristics** 

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**----- Start of picture text -----**<br>
5 10000<br>ID = 16 A VDS = 5V 10V CISS f = 1 MHzVGS = 0 V<br>4 8000<br>15V<br>3 6000<br>2 4000<br>COSS<br>1 2000<br>CRSS<br>0 0<br>0 15 30 45 60 75 90 0 5 10 15 20<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7. Gate Charge Characteristics. Figure 8. Capacitance Characteristics.<br>1000 50<br>SINGLE PULSE<br>RθJA = 125°C/W<br>100 100µs 40 T A  = 25°C<br>RDS(ON) LIMIT 1ms<br>10 10ms 30<br>100ms<br>1s<br>10s<br>1 DC 20<br>VGS = 4.5V<br>SINGLE PULSE<br>0.1 RθJA = 125 [o] C/W 10<br>TA = 25 [o] C<br>0.01 0<br>0.01 0.1 1 10 100 0.001 0.01 0.1 1 10 100<br>VDS, DRAIN-SOURCE VOLTAGE (V) t1, TIME (sec)<br>Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum<br>Power Dissipation.<br>1<br>D = 0.5<br>0.1 0.20.1 R RθθJAJA (  = 125 t) = r(t) o * C/W R θJA<br>0.05<br>P(pk)<br>0.02<br>0.01 t1<br>0.01 t2<br>TJ - TA = P * RθJA(t)<br>Duty Cycle, D = t1 / t2<br>SINGLE PULSE<br>0.001<br>0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>Figure 11. Transient Thermal Response Curve.<br>                             Thermal characterization performed using the conditions described in Note 1c.<br>                            Transient thermal response will change depending on the circuit board design.<br>CAPACITANCE (pF)<br>, GATE-SOURCE VOLTAGE (V)<br>GS<br>V<br>, DRAIN CURRENT (A)ID<br>P(pk), PEAK TRANSIENT POWER (W)<br>r(t), NORMALIZED EFFECTIVE<br>TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


FDS6574A Rev B2(W) 

## **TRADEMARKS** 

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidianries, and is not intended to be an exhaustive list of all such trademarks. 

ACEx[®] FPS™ PDP-SPM™ The Power Franchise[®] Build it Now™ F-PFS™ Power-SPM™ the wer CorePLUS™ FRFET[®] PowerTrench[®] Paw tm CorePOWER™ Global Power Resource[SM] Programmable Active Droop™ TinyBoost™ _CROSSVOLT_ ™ Green FPS™ QFET[®] TinyBuck™ CTL™ Green FPS™ e-Series™ QS™ TinyLogic[®] Current Transfer Logic™ GTO™ Quiet Series™ TINYOPTO™ EcoSPARK[®] IntelliMAX™ RapidConfigure™ TinyPower™ EfficentMax™ ISOPLANAR™ Saving our world 1mW at a time™ TinyPWM™ EZSWITCH™ * MegaBuck™ SmartMax™ TinyWire™ ™ MICROCOUPLER™ SMART START™ µSerDes™ MicroFET™ SPM[®] ® MicroPak™ STEALTH™ ~~-~~ "ZZ... Fairchild[®] MillerDrive™ SuperFET™ UHC[®] Fairchild Semiconductor[®] MotionMax™ SuperSOT™-3 Ultra FRFET™ FACT Quiet Series™ Motion-SPM™ SuperSOT™-6 UniFET™ FACT[®] OPTOLOGIC[®] SuperSOT™-8 VCX™ FAST[®] OPTOPLANAR[®] SuperMOS™ VisualMax™ FastvCore™ ® ® FlashWriter[® ] * tm Te ceNeRAL 

* EZSWITCH™ and FlashWriter[®] are trademarks of System General Corporation, used under license by Fairchild Semiconductor. 

## **DISCLAIMER** 

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. 

**LIFE SUPPORT POLICY** FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. 

- As used herein: 

1. Life support devices or systems are devices or systems which, 2. A critical component in any component of a life support, (a) are intended for surgical implant into the body or (b) device, or system whose failure to perform can be reasonably support or sustain life, and (c) whose failure to perform when expected to cause the failure of the life support device or properly used in accordance with instructions for use provided system, or to affect its safety or effectiveness. in the labeling, can be reasonably expected to result in a significant injury of the user. 

## **PRODUCT STATUS DEFINITIONS Definition of Terms** 

|**Definition of Terms**|||
|---|---|---|
|**Datasheet Identification**|**Product Status**|**Definition**|
|Advance Information|Formative or In Design|This datasheet contains the design specifications for product development.<br>Specifications may change in any manner without notice.|
|Preliminary|First Production|This datasheet contains preliminary data; supplementary data will be pub-<br>lished at a later date. Fairchild Semiconductor reserves the right to make<br>changes at any time without notice to improve design.|
|No Identification Needed|Full Production|This datasheet contains final specifications. Fairchild Semiconductor reserves<br>the right to make changes at any time without notice to improve the design.|
|Obsolete|Not In Production|This datasheet contains specifications on a product that is discontinued by<br>Fairchild Semiconductor. The datasheet is for reference information only.|



Rev. I34 

FDS6574A Rev B2(W) 



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