# Power MOSFET, N Channel, 30 V, 13 A, 0.0074 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2453419/)

**URL**: https://novapart.co/products/FDS6298/power-mosfet-n-channel-30-v-13-a-00074-ohm-soic
**SKU**: FDS6298
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.8010
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Power Dissipation | 3W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 3W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.0074ohm |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 13A |
| Drain Source On State Resistance | 0.0074ohm |
| Gate Source Threshold Voltage Max | 1.7V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2453419/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **FDS6298** 

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April 2007<br>tm<br>**----- End of picture text -----**<br>


## **30V N-Channel Fast Switching PowerTrench[] MOSFET** 

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**----- Start of picture text -----**<br>
General Description  Features<br>This specifically to improve the overall efficiency of DC/DC N-Channel  MOSFET  has  been  designed   13 A, 30 V.  RDS(ON) = 9 mΩ @ VGS = 10 V<br>converters using either synchronous or conventional  RDS(ON) = 12 mΩ @ VGS = 4.5 V<br>switching PWM controllers.  It has been optimized for<br>low gate charge, low RDS(ON) and fast switching speed.   Low gate charge (10nC @ VGS=5V)<br>Applications   Very low Miller Charge (3nC)<br> Control Switch for DC-DC Buck converters   Low Rg (1 Ohm)<br> Notebook Vcore   ROHS Compliant<br> Telecom / Networking Point of Load<br>D 5 4<br>DD [D]<br>DD 6 3<br>DD<br>7 2<br>SO-8 G<br>G 8 1<br>S<br>[S]<br>S<br>Pin 1 & SO-8 SS [S]<br>**----- End of picture text -----**<br>


|**Absolute Maximum Ratings**TA=25oC unless otherwise noted|**Absolute Maximum Ratings**TA=25oC unless otherwise noted|**Absolute Maximum Ratings**TA=25oC unless otherwise noted||||
|---|---|---|---|---|---|
|**Symbol**<br>**Parameter**|||**Ratings **||**Units**|
|VDSS<br>Drain-Source Voltage|||30||V|
|VGSS<br>Gate-Source Voltage|||±20||V|
|Drain Current – Continuous<br>ID|(Note 1a)||13||A|
|– Pulsed|||50|||
|Power Dissipation for Single Operation<br>PD<br>Power Dissipation for Single Operation|(Note 1a)<br>(Note 1b)||3.0<br>1.2||W|
|EAS<br>Single Pulse Avalanche Energy|(Note 3)||181||mJ|
|TJ, TSTG<br>Operatingand Storage Junction Temperature Range|||–55 to +150||°C|
|**Thermal Characteristics**||||||
|RθJA<br>Thermal Resistance, Junction-to-Ambient<br>(Note 1a)<br>RθJA<br>Thermal Resistance, Junction-to-Ambient<br>(Note 1b)<br>RθJC<br>Thermal Resistance, Junction-to-Case<br>(Note 1)<br>**Package Marking and Ordering Information **<br>**Device Marking**<br>**Device**<br>**Reel Size**<br>FDS6298<br>FDS6298<br>13’’<br>~~i~~<br>~~a~~||**n**|50<br>125<br>25<br>**Tape width**<br>12mm|°C/W<br>°C/W<br>°C/W<br>**Quantity**<br>2500 units||



FDS6298  Rev. C1 ( W) 

2007 Fairchild Semiconductor Corporation 

|**Electrical Characteristics**<br>TA= 25°C unless otherwise noted<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>**Off Characteristics**<br>BVDSS<br>Drain–Source Breakdown Voltage<br>VGS= 0 V, ID= 250µA<br>30<br>-<br>-<br>V<br>∆BVDSS<br>∆TJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 250µA, Referenced to 25°C<br>-<br>30<br>-<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 24 V, VGS= 0 V<br>-<br>-<br>1<br>µA<br>IGSS<br>Gate–BodyLeakage<br>VGS=±20 V, VDS= 0 V<br>-<br>-<br>±100<br>nA<br>**On Characteristics**<br>**(Note 2)**<br>VGS(th)<br>Gate Threshold Voltage<br>VDS= VGS, ID= 250µA<br>1<br>1.7<br>3<br>V<br>∆VGS(th)<br> <br>∆TJ<br>Gate Threshold Voltage<br>Temperature Coefficient<br>ID= 250µA, Referenced to 25°C<br>-<br>–5<br>-<br>mV/°C<br>RDS(ON)<br>Static Drain–Source<br>On–Resistance<br>VGS= 10 V, ID= 13 A<br>VGS= 4.5 V, ID= 12 A<br>VGS= 10 V, ID= 13 A, TJ=125°C<br>-<br>7.4<br>9.4<br>11<br>9<br>12<br>15<br>mΩ<br>gFS<br>Forward Transconductance<br>VDS= 10 V, ID= 13 A<br>-<br>58<br>-<br>S<br>**Dynamic Characteristics**<br>Ciss<br>Input Capacitance<br>-<br>1108<br>-<br>pF<br>Coss<br>Output Capacitance<br>-<br>310<br>-<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>VDS= 15 V,  VGS= 0 V,<br>f = 1.0 MHz<br>-<br>109<br>-<br>pF<br>RG<br>Gate Resistance<br>VGS= 15 mV,  f = 1.0 MHz<br>0.3<br>1<br>1.7<br>Ω<br>**Switching Characteristics(Note 2)**<br>td(on)<br>Turn–On DelayTime<br>-<br>11<br>20<br>ns<br>tr<br>Turn–On Rise Time<br>-<br>5<br>10<br>ns<br>td(off)<br>Turn–Off DelayTime<br>-<br>27<br>43<br>ns<br>tf<br>Turn–Off Fall Time<br>VDD= 15 V, ID= 1 A,<br>VGS= 10 V, RGEN= 6Ω<br>-<br>7<br>14<br>ns<br>Qg<br>Total Gate Charge<br>-<br>10<br>14<br>nC<br>Qgs<br>Gate–Source Charge<br>-<br>3<br>-<br>nC<br>Qgd<br>Gate–Drain Charge<br>VDS= 15 V, ID= 13 A,<br>VGS= 5 V<br>-<br>3<br>-<br>nC<br>**Drain–Source Diode Characteristics**<br>~~res~~<br>~~=~~<br>~~SEE~~<br>~~——~~|
|---|
|VSD<br>Drain–Source Diode Forward<br>Voltage<br>VGS= 0 V, IS= 2.1 A<br>(Note 2)<br>-<br>0.74<br>1.2<br>V<br>trr<br>Diode Reverse Recovery Time<br>IF= 13 A, dIF/dt = 100 A/µs<br>-<br>27<br>-<br>ns<br>Qrr<br>Diode Reverse Recovery Charge<br>-<br>13<br>-<br>nC<br>~~—_————————~~|



**Notes: 1.** RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.  RθJC is guaranteed by design while RθCA is determined by the user's board design. 

a) 50°C/W when mounted on a 1in[2] pad of 2 oz copper 

b) 125°C/W when mounted on a minimum pad. Scale 1 : 1 on letter size paper 

**2.** Test: Pulse Width < 300µs, Duty Cycle < 2.0% 

**3.** Starting TJ = 25°C, L = 3mH, IAS = 11A, VDD = 30V, VGS = 10V 

FDS6298 Rev. C1 (W) 

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**----- Start of picture text -----**<br>
Typical Characteristics<br>80 2.6<br>70 VGS = 10V6.0V 4.5V 4.0V 2.4 VGS = 3.0V<br>2.2<br>60 3.5.V<br>2<br>50<br>1.8 3.5V<br>40<br>1.6 4.0V<br>30 3.0V 1.4 4.5V<br>5.0V<br>20 1.2 6.0V<br>10V<br>10 1<br>0 0.8<br>0 0.5 1 1.5 2 2.5 0 10 20 30 40 50 60 70 80<br>VDS, DRAIN-SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 1. On-Region Characteristics.  Figure 2. On-Resistance Variation with<br>Drain Current and Gate Voltage.<br>1.8 0.028<br>ID = 13A ID = 6.5A<br>1.6 VGS = 10V 0.024<br>1.4 0.02<br>1.2 0.016<br>TA = 125 [o] C<br>1 0.012<br>0.8 0.008<br>TA = 25 [o] C<br>0.6<br>0.004<br>-50 -25 0 25 50 75 100 125 150<br>2 4 6 8 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3. On-Resistance Variation with  Figure 4. On-Resistance Variation with<br>Temperature.  Gate-to-Source Voltage.<br>100<br>80<br>VDS = 5V VGS = 0V<br>70 10<br>60 TA = -55 [o] C 25 [o] C TA = 125 [o] C<br>125 [o] 1<br>50 C 25 [o] C<br>0.1<br>40<br>-55 [o] C<br>30 0.01<br>20<br>0.001<br>10<br>0.0001<br>0<br>0 0.2 0.4 0.6 0.8 1 1.2<br>1.5 2 2.5 3 3.5 4<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5. Transfer Characteristics.  Figure 6. Body Diode Forward Voltage Variation<br>with Source Current and Temperature.<br>, NORMALIZED<br>DS(ON)<br>, DRAIN CURRENT (A)ID R<br>DRAIN-SOURCE ON-RESISTANCE<br>FDS6298 30V N-Channel Fast Switching PowerTrench<br><br>, NORMALIZED<br>DS(ON) , ON-RESISTANCE (OHM)<br>R DS(ON)<br>R<br> DRAIN-SOURCE ON-RESISTANCE<br> MOSFET<br>, DRAIN CURRENT (A)ID<br>, REVERSE DRAIN CURRENT (A)IS<br>**----- End of picture text -----**<br>


FDS6298 Rev. C1 (W) 

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**----- Start of picture text -----**<br>
Typical Characteristics<br>10 1500<br>f = 1MHz<br>ID = 13A VDS = 10V 15V CISS VGS = 0 V<br>8 1200<br>20V<br>6 900<br>4 600<br>COSS<br>2 300<br>CRSS<br>0 0<br>0 4 8 12 16 20 0 5 10 15 20 25 30<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7. Gate Charge Characteristics.  Figure 8. Capacitance Characteristics.<br>100<br>100<br>100µs<br>R DS(ON)  LIMIT 1ms<br>10<br>10ms<br>100ms<br>1s<br>1 10s<br>DC 10<br>25<br>V GS  = 10V<br>0.1 SINGLE PULSE 125<br>RθJA = 125 [o] C/W<br>TA = 25 [o] C<br>0.01 1<br>0.01 0.1 1 10 100 0.01 0.1 1 10 100 1000<br>VDS, DRAIN-SOURCE VOLTAGE (V) tAV, TIME IN AVALANCHE (mS)<br>Figure 9. Maximum Safe Operating Area.  Figure 10. Unclamped Inductive Switching<br>Capability<br>50<br>SINGLE PULSE<br>40 RθJA T  = 125°C/WA  = 25°C<br>30<br>20<br>10<br>0<br>0.001 0.01 0.1 1 10 100<br>t1, TIME (sec)<br>Figure 11. Single Pulse Maximum Power Dissipation.<br>CAPACITANCE (pF)<br>, GATE-SOURCE VOLTAGE (V)<br>GS<br>V<br>, DRAIN CURRENT (A)ID<br>, AVALANCHE CURRENT (A)<br>IAS<br>P(pk), PEAK TRANSIENT POWER (W)<br>**----- End of picture text -----**<br>


FDS6298 Rev. C1 (W) 

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**----- Start of picture text -----**<br>
Typical Characteristics<br>1<br>D = 0.5<br>RθJA(t) = r(t) * RθJA<br>0.2 R θJA  = 125 °C/W<br>0.1 0.1<br>0.05 P(pk)<br>0.02 t1<br>0.01 0.01 t2<br>TJ - TA = P * RθJA(t)<br>SINGLE PULSE Duty Cycle, D = t1 / t2<br>0.001<br>0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>Figure 12. Transient Thermal Response Curve.<br>Thermal characterization performed using the conditions described in Note 1c.<br>Transient thermal response will change depending on the circuit board design.<br>r(t), NORMALIZED EFFECTIVE<br>TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


FDS6298 Rev. C1 (W) 

## **TRADEMARKS** 

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. 

**==> picture [424 x 211] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||||
|---|---|---|---|---|
|ACEx®|i-Lo|™|Power-SPM™|TinyBoost™|
|Across the board. Around the world.™|ImpliedDisconnect™|PowerTrench®|TinyBuck™|
|ActiveArray™|IntelliMAX™|Programmable Active Droop™|TinyLogic®|
|Bottomless™|ISOPLANAR™|QFET®|TINYOPTO™|
|Build it Now™|MICROCOUPLER™|QS™|TinyPower™|
|CoolFET™|MicroPak™|QT Optoelectronics™|TinyWire™|
|CROSSVOLT|™|MICROWIRE™|Quiet Series™|TruTranslation™|
|CTL™|Motion-SPM™|RapidConfigure™|μSerDes™|
|Current Transfer Logic™|MSX™|RapidConnect™|UHC®|
|DOME™|MSXPro™|ScalarPump™|UniFET™|
|E2CMOS™|OCX™|SMART START™|VCX™|
|EcoSPARK®|OCXPro™|SPM®|Wire™|
|EnSigna™|OPTOLOGIC®|STEALTH™|
|FACT Quiet Series™ FACT®®|OPTOPLANARPACMAN™|®|SuperFETSuperSOT™™-3|
|FAST|PDP-SPM™|SuperSOT™-6|
|FASTr™|POP™|SuperSOT™-8|
|FRFETFPS™|®|Power247Power220®®|SyncFET™ TCM™|
|GlobalOptoisolator™|PowerEdge™|The Power Franchise®|
|GTO™|PowerSaver™|™|
|HiSeC™|

**----- End of picture text -----**<br>


## **DISCLAIMER** 

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. 

## **LIFE SUPPORT POLICY** 

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. 

As used herein: 

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 

2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 

## **PRODUCT STATUS DEFINITIONS** 

## **Definition of Terms** 

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||||
|---|---|---|
|Datasheet Identification|Product Status|Definition|
|Advance Information|Formative or In Design|This datasheet contains the design specifications for product|
|development. Specifications may change in any manner without notice.|
|Preliminary|First Production|This datasheet contains preliminary data; supplementary data will be|
|published at a later date. Fairchild Semiconductor reserves the right to|
|make changes at any time without notice to improve design.|
|No Identification Needed|Full Production|This datasheet contains final specifications. Fairchild Semiconductor|
|reserves the right to make changes at any time without notice to improve|
|design.|
|Obsolete|Not In Production|This datasheet contains specifications on a product that has been|
|discontinued by Fairchild Semiconductor. The datasheet is printed for|
|reference information only.|

**----- End of picture text -----**<br>


Rev. I26 

© 2007 Fairchild Semiconductor Corporation 

www.fairchildsemi.com 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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