# Power MOSFET, N Channel, 40 V, 11 A, 0.01 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2453418/)

**URL**: https://novapart.co/products/FDS4672A/power-mosfet-n-channel-40-v-11-a-001-ohm-soic
**SKU**: FDS4672A
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2560
**Stock**: 10+
**Lead Time**: 236 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:11A; Drain Source Voltage Vds:40V; On Resistance Rds(on):0.01ohm; Rds(on) Test Voltage Vgs:4.5V; Threshold Voltage Vgs:1.2V; Powe

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 40V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 11A |
| Drain Source On State Resistance | 0.01ohm |
| Gate Source Threshold Voltage Max | 1.2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2453418/)

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Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **FDS4672A** 

**==> picture [75 x 36] intentionally omitted <==**

**----- Start of picture text -----**<br>
  February 2007<br>tm<br>**----- End of picture text -----**<br>


## **40V N-Channel PowerTrench**[®] **MOSFET** 

## **General Description** 

This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers.  It has been optimized for low gate charge, low RDS(ON) and fast switching speed. **Applications** • DC/DC converter **D D D D G** + **S S SO-8 S** 

## **Features** 

- 11 A, 40 V. RDS(ON)  = 13 mΩ @ VGS = 4.5 V 

- High performance trench technology for extremely low RDS(ON) 

- Low gate charge  (35 nC typical) 

- High power and current handling capability 

- RoHS Compliant 

**==> picture [88 x 60] intentionally omitted <==**

**----- Start of picture text -----**<br>
5 4<br>6 3<br>7 2<br>8 1<br>**----- End of picture text -----**<br>


## **Absolute Maximum Ratings** TA=25[o] C unless otherwise noted 

**Symbol Parameter Ratings Units** VDSS Drain-Source Voltage 40 V VGSS Gate-Source Voltage ±12 V ID Drain Current – Continuous (Note 1a) 11 A – Pulsed 50 EAS Single Pulse Avalanche Energy (Note 3) 181 mJ PD Power Dissipation for Single Operation (Note 1a) 2.5 W (Note 1b) 1.4 (Note 1c) 1.2 TJ, TSTG Operating and Storage Junction Temperature Range -55 to +175 °C **Thermal Characteristics** RθJA Thermal Resistance, Junction-to-Ambient (Note 1a) 50 °C/W RθJC Thermal Resistance, Junction-to-Case (Note 1) 25 °C/W ~~ee~~ **Package Marking and Ordering Information Device Marking Device Reel Size Tape width Quantity** FDS4672A FDS4672A 13’’ 12mm 2500 units ~~>~~ 

©2007 Fairchild Semiconductor Corporation FDS4672A  Rev C1 (W) 

|**Electrical Characteristics**|**Electrical Characteristics**|TA= 25°C unless otherwise noted|TA= 25°C unless otherwise noted|||||
|---|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**||**Test Conditions**|**Min**|**Typ**|**Max**|**Units**|
|**Off Characteristics**||||||||
|BVDSS|Drain–Source Breakdown Voltage||VGS= 0 V,ID= 250μA|40|||V|
|ΔBVDSS<br>ΔTJ|Breakdown Voltage Temperature<br>Coefficient||ID= 250μA, Referenced to 25°C||37||mV/°C|
|IDSS|Zero Gate Voltage Drain Current||VDS= 32 V, VGS= 0 V|||1|μA|
|IGSSF|Gate–BodyLeakage, Forward||VGS= 12 V,  VDS= 0 V|||100|nA|
|IGSSR|Gate–BodyLeakage, Reverse||VGS= –12 V VDS= 0 V|||–100|nA|
|**On Characteristics**<br>**(Note 2)**||||||||
|VGS(th)|Gate Threshold Voltage||VDS= VGS,ID= 250μA|0.8|1.2|2.0|V|
|ΔVGS(th)<br> <br>ΔTJ|Gate Threshold Voltage<br>Temperature Coefficient||ID= 250μA, Referenced to 25°C||–4||mV/°C|
|RDS(on)|Static Drain–Source<br>On–Resistance||VGS= 4.5 V,  ID= 11 A<br>VGS=4.5V,ID=11A,TJ=125°C||10<br>15|13<br>21|mΩ|
|ID(on)|On–State Drain Current||VGS= 4.5 V, VDS= 5 V|50|||A|
|gFS|Forward Transconductance||VDS= 5 V,  ID= 11 A||65||S|
|**Dynamic Characteristics**||||||||
|Ciss|Input Capacitance||VDS= 20 V,  VGS= 0 V,<br>f = 1.0 MHz||4766||pF|
|Coss|Output Capacitance||||346||pF|
|Crss|Reverse Transfer Capacitance||||155||pF|
|**Switching Characteristics(Note 2)**||||||||
|td(on)|Turn–On DelayTime||VDD= 20 V,  ID= 1 A,<br>VGS= 4.5  V,  RGEN= 6Ω||17|31|ns|
|tr|Turn–On Rise Time||||9|18|ns|
|td(off)|Turn–Off DelayTime||||43|68|ns|
|tf|Turn–Off Fall Time||||14|25|ns|
|Qg|Total Gate Charge||VDS= 20 V,  ID= 11 A,<br>VGS= 4.5 V||35|49|nC|
|Qgs|Gate–Source Charge||||7.8||nC|
|Qgd|Gate–Drain Charge||||8.8||nC|
|**Drain–Source Diode Characteristic**||**s and Maximum Ratings**||||||
|IS|Maximum Continuous Drain–Sour|ce Diode Forward Current||||2.1|A|
|VSD|Drain–Source Diode Forward<br>Voltage|VGS= 0 V,<br>IS= 2.1 A<br>(Note 2)|||0.7|1.2|V|



**Notes:** 

**1.** RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.  RθJC is guaranteed by design while RθCA is determined by the user's board design. 

a) 50°C/W when b) 105°C/W when c) 125°C/W when mounted on a mounted on a 1in[2] mounted on a .04 in[2] minimum pad. pad of 2 oz copper pad of 2 oz copper 

Scale 1 : 1 on letter size paper 

**2.** Pulse Test: Pulse Width < 300μs, Duty Cycle < 2.0% 

- **3** .Starting TJ = 25[o] C, L = 3mH,ID = 11A, VDD = 40V, VGS = 10V 

FDS4672A Rev C1 (W) 

## **Typical Characteristics** 

**==> picture [414 x 522] intentionally omitted <==**

**----- Start of picture text -----**<br>
50 1.6<br>VGS = 4.5V 2.5V<br>3.5V<br>40<br>3.0V 1.4<br>VGS = 2.5V<br>30<br>1.2<br>20  3.0V<br> 3.5V<br>2.0V  4.0V  4.5V<br>10 1<br>0 0.8<br>0 0.5 1 1.5 2<br>0 10 20 30 40 50<br>VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 1. On-Region Characteristics.  Figure 2. On-Resistance Variation with<br>Drain Current and Gate Voltage.<br>2 0.03<br>1.8 V IGSD = 11A  = 4.5V 0.026 ID = 5.5A<br>1.6<br>0.022<br>1.4 TA = 125 [o] C<br>1.2 0.018<br>1<br>0.014<br>0.8 TA = 25 [o] C<br>0.01<br>0.6<br>0.4 0.006<br>-50 -25 0 25 50 75 100 125 150 175 1.5 2 2.5 3 3.5 4 4.5 5<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3. On-Resistance Variation with  Figure 4. On-Resistance Variation with<br>Temperature.  Gate-to-Source Voltage.<br>70 100<br>VDS = 5V TA = -55 [o] C 25 [o] C VGS = 0V<br>60 10<br>125 [o] C<br>50 TA = 125 [o] C<br>1<br>40 25 [o] C<br>0.1<br>30 -55 [o] C<br>0.01<br>20<br>10 0.001<br>0 0.0001<br>1 1.5 2 2.5 3 0 0.2 0.4 0.6 0.8 1 1.2<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD,  BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5. Transfer Characteristics.  Figure 6. Body Diode Forward Voltage Variation<br>with Source Current and Temperature.<br>, NORMALIZED<br>, DRAIN CURRENT (A)ID RDS(ON)<br>DRAIN-SOURCE ON-RESISTANCE<br>, NORMALIZED<br>RDS(ON) , ON-RESISTANCE (OHM)DS(ON)<br>R<br> DRAIN-SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)ID<br>, REVERSE DRAIN CURRENT (A)IS<br>**----- End of picture text -----**<br>


FDS4672A Rev C1 (W) 

## **Typical Characteristics** 

**==> picture [411 x 296] intentionally omitted <==**

**----- Start of picture text -----**<br>
5 7000<br>ID = 11A VDS = 10V 20V f = 1 MHzVGS = 0 V<br>4 5600<br>30V CISS<br>3 4200<br>2 2800<br>1 1400<br>COSS<br>0 0 CRSS<br>0 10 20 30 40 0 10 20 30 40<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7. Gate Charge Characteristics.  Figure 8. Capacitance Characteristics.<br>100 100<br>100μs<br>1ms<br>R DS(ON)  LIMIT 10ms<br>10<br>100ms<br>1s<br>10s<br>1 10<br>DC<br>25 ℃<br>V GS  = 4.5V<br>SINGLE PULSE<br>0.1<br>RθJA = 125 [o] C/W 125 ℃<br>TA = 25 [o] C<br>0.01 1<br>0.01 0.1 1 10 100 0.01 0.1 1 10 100 1000<br>VDS, DRAIN-SOURCE VOLTAGE (V) tAV, TIME IN AVALANCHE (mS)<br>CAPACITANCE (pF)<br>, GATE-SOURCE VOLTAGE (V)<br>GS<br>V<br>, DRAIN CURRENT (A)ID , AVALANCHE CURRENT (A)<br>IAS<br>**----- End of picture text -----**<br>


**Figure 9. Maximum Safe Operating Area.** 

**Figure 10. Unclamped Inductive Switching Capability.** 

**==> picture [406 x 133] intentionally omitted <==**

**----- Start of picture text -----**<br>
50<br>40<br>30 SINGLE PULSE<br>RθJA = 125°C/W<br>20<br>TA = 25°C<br>10<br>0<br>0.001 0.01 0.1 1 10 100<br>t1, TIME (sec)<br> P(pk),PEAK TRANSIENT POWER (W)<br>**----- End of picture text -----**<br>


**Figure 11   Single Pulse Maximum Power Dissipation.** 

FDS4672A Rev C1 (W) 

## **Typical Characteristics** 

**==> picture [412 x 166] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>D = 0.5<br>0.2 R θJA (t) = r(t) + R θJA<br>0.1 0.1 RθJA = 125 [o] C/W<br>0.05<br>P(pk)<br>0.02<br>0.01 t 1<br>0.01 t2<br>TJ - TA = P * RθJA(t)<br>SINGLE PULSE Duty Cycle, D = t 1  / t 2<br>0.001<br>0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>Figure 12. Transient Thermal Response Curve.<br>Thermal characterization performed using the conditions described in Note 1c.<br>Transient thermal response will change depending on the circuit board design.<br>r(t), NORMALIZED EFFECTIVE<br>TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


. 

FDS4672A Rev C1 (W) 

## **TRADEMARKS** 

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|ACEx™|FACT Quiet Series™|OCX™|SILENT SWITCHER®|UniFET™|
|ActiveArray™|GlobalOptoisolator™|OCXPro™|SMART START™|VCX™|
|Bottomless™|GTO™|OPTOLOGIC®|SPM™|Wire™|
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|FAST®|MicroFET™|QS™|TinyBuck™||
|FASTr™|MicroPak™|QT Optoelectronics™|TinyPWM™||
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|Across the board. Around the world.™||µSerDes™|TruTranslation™||
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. 

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**PRODUCT STATUS DEFINITIONS Definition of Terms** 

|**PRODUCT STATUS DEFINITIONS**<br>**Definition of Terms**|||
|---|---|---|
|**Datasheet Identification**|**Product Status**|**Definition**|
|Advance Information|Formative or In<br>Design|This datasheet contains the design specifications for<br>product development. Specifications may change in<br>any manner without notice.|
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Rev. I22 

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