# Power MOSFET, N Channel, 250 V, 3 A, 0.117 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2453412RL/)

**URL**: https://novapart.co/products/FDS2734/power-mosfet-n-channel-250-v-3-a-0117-ohm-soic
**SKU**: FDS2734
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.8180
**Stock**: 1000+
**Lead Time**: 141 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:3A; Drain Source Voltage Vds:250V; On Resistance Rds(on):0.097ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:3V; Power

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 250V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 3A |
| Drain Source On State Resistance | 0.117ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2453412RL/)

## **Is Now Part of** 

## **To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **FDS2734 N-Channel UItraFET Trench[®] MOSFET** 

**==> picture [68 x 58] intentionally omitted <==**

**----- Start of picture text -----**<br>
August 2006<br>tm<br>**----- End of picture text -----**<br>


## **250V, 3.0A, 117m** Ω 

## **Features** 

Max rDS(on) =117mΩ at  VGS =10V, ID = 3.0A 

Max rDS(on) =126mΩ at  VGS = 6V, ID = 2.8A Fast switching speed 

High  performance  trench   technology for   extremely low r DS(on) 

## **General Descriptions** 

This single N-Channel MOSFET is produced using Fairchild Semiconductor’s advanced UItraFET Trench **[®]** process that  has  been   especially tailored to   minimize the on-state resistance and yet maintain superior switching performance. 

## **Application** 

DC-DC conversion 

High power and current handling capability 

**==> picture [156 x 153] intentionally omitted <==**

**----- Start of picture text -----**<br>
RoHS compliant<br>D<br>D<br>D<br>D<br>SO- 8<br>G<br>S<br>S<br>Sd S<br>Pin  1<br>**----- End of picture text -----**<br>


**==> picture [91 x 60] intentionally omitted <==**

**----- Start of picture text -----**<br>
5 4<br>6 3<br>7 2<br>8 1<br>**----- End of picture text -----**<br>


**MOSFET Maximum Ratings** TA = 25°C unless otherwise noted 

|**MOSFET Maximum Ratings**|**MOSFET Maximum Ratings**TA = 25°C unless otherwise notedA = 25°C unless otherwise noted= 25°C unless otherwise noted|TA = 25°C unless otherwise notedA = 25°C unless otherwise noted= 25°C unless otherwise noted|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|||**Ratings**||**Units**|
|VDS|Drain to Source Voltage|||250||V|
|VGS|Gate to Source Voltage|||±20||V|
|ID|Drain Current -Continuous                                                             (Note 1a)<br>-Pulsed|Drain Current -Continuous                                                             (Note 1a)||3.0<br>50||A|
|EAS|Single Pulse Avalanche Energy(Note 3)|(Note 3)||12.5||mJ|
|PD|Power dissipation                                                                           (Note 1a)<br>Power dissipation                                                                           (Note 1b)|Power dissipation                                                                           (Note 1a)<br>Power dissipation                                                                           (Note 1b)||2.5<br>1.0||W|
|TJ, TSTG|Operatingand Storage  Junction Temperature Range|||-55 to 150||oC|
|**Thermal Characteristics**|**Thermal Characteristics**||||||
|RθJA<br>Thermal Resistance, Junction- to -Ambient                                (Note 1a)<br>50<br>oC/W<br>RθJA<br>Thermal Resistance, Junction- to- Ambient                                (Note 1b)<br>125<br>RθJC<br>Thermal Resistance, Junction -to- Case                                     (Note 1)<br>25<br>~~os~~|||||||
|**Package Marking and Ordering Information**|**Package Marking and Ordering Information**||||||
|**Device Marking**<br>**Device**<br>**Package**<br>FDS2734<br>FDS2734<br>SO-8<br>~~{[{_~~||**Reel Size**<br>13’’<br>~~]~~||**Tape Width**<br>12mm|**Quantity**<br>2500 units||



©2006 Fairchild Semiconductor Corporation FDS2734 Rev. B 

www.fairchildsemi.com 

**1** 

**Electrical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [447 x 583] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||||||||
|---|---|---|---|---|---|---|---|---|
|Symbol|Parameter|Test Conditions|Min|Typ|Max|Units|
|Off Characteristics|
|BVDSS|Drain to Source Breakdown Voltage|ID = 250µA, VGS = 0V|250|V|
|∆BV∆ TDSSJ|Breakdown Voltage Temperature     Coefficient|ID = 250µA, referenced to 25|[o]|C|157|mV/|[o]|C|
|IDSS|Zero Gate Voltage Drain Current|VVDSDS = 200V,V = 200V, VGSGS=0 V = 0V|TJ = 55|[o]|C|101|µA|
|——=|IGSS|Gate to Source Leakage Current|VGS = ±20V, VDS =0 V|±100|nA|
|On Characteristics (Note 2)|
|VGS(th)|Gate to Source Threshold Voltage|VGS = VDS, ID = 250µA|2|3|4|V|
|∆  ∆V TGS(th)J|Gate to Source Threshold Voltage   Temperature Coefficient|ID = 250µA, referenced to 25|[o]|C|-10.7|mV/|[c]|
|VGS = 10V, ID = 3.0A,|97|117|
|rDS(on)|Drain to Source On Resistance|VGS = 6V , ID = 2.8A,|101|126|mΩ|
|VGS = 10V, ID = 3.0A, TJ = 125|[o]|C|205|225|
|gFS|Forward Transconductance|VDS=10V, ID  =3.0A,|15.1|S|
|Dynamic Characteristics|
|Ciss|Input Capacitance|1960|2610|pF|
|Coss|Output Capacitance|f = 1MHzVDS = 100V, VGS = 0V,|85|130|pF|
|Crss|Reverse Transfer Capacitance|26|40|pF|
|RG|Gate Resistance|f = 1MHz|0.7|Ω|
|————|nn|
|Switching Characteristics|
|td(on)|Turn-On Delay Time|23|37|ns|
|tr|Rise Time|VVDDGS = 125V, I = 10V, RGSD = 3A = 6Ω|11|19|ns|
|td(off)|Turn-Off Delay Time|40|64|ns|
|tf|Fall Time|11|19|ns|
|Qg|Total Gate Charge|VDS = 125V, VGS = 10V|32|45|nC|
|Qgs|Gate to Source Gate Charge|ID = 3.0A|9|nC|
|Qgd|Gate to Drain Charge|8|nC|
|=|Drain-Source Diode Characteristics|nee|
|VSD|Source to Drain Diode Voltage|ISD = 3.0A|0.74|1.2|V|
|trr|Reverse Recovery Time|IF = 3.0 A, diF/dt = 100A/µs|72|108|ns|
|ee|Qrr|Reverse Recovery Charge|185|278|nC|
|Notes:|
|1:|RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the|
|drain pins. RθJC is guaranteed by design while|RθCA is determined by the user’s board design.|
|b) 125°C/W when|
|a) 50°C/W when|mounted on a minimum|
|mounted on a 1in|[2]|
|pad of 2 oz copper|
|pad of 2 oz copper|
|nC|Scale 1 : 1 on letter size paper|

**----- End of picture text -----**<br>


**==> picture [20 x 365] intentionally omitted <==**

- **2:3:** Pulse Test  Width <300Starting TJ = 25°C, L = 1mH, Iµs, Duty Cycle <2%AS = 5A, VDD = 100V, V. GS = 10V 

www.fairchildsemi.com 

**2** 

FDS2734 Rev. B 

**Typical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [434 x 587] intentionally omitted <==**

**----- Start of picture text -----**<br>
50 2.5<br>VGS- Descending Order<br>VGS = 10V VGS = 5V<br>40             8V VGS = 4.5V<br>            6V 2.0 VGS = 6V<br>            5V<br>30<br>1.5<br>VGS = 10V<br>20<br>VGS = 8V<br>1.0<br>10<br>PULSE DURATION = 80 µ s PULSE DURATION = 80 µ s<br>DUTY CYCLE = 0.5%MAX DUTY CYCLE = 0.5%MAX<br>0 0.5<br>0 2 4 6 8 10 0 10 20 30 40 50<br>VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT(A)<br>Figure 1.  On Region Characteristics Figure 2.   Normalized On-Resistance vs Drain<br>Current and Gate Voltage<br>2.8 0.4<br> ID = 3.0A ID =3A PULSE DURATION = 80 µ s<br>2.4 VGS = 10V DUTY CYCLE = 0.5%MAX<br>0.3<br>2.0<br>TJ = 150 [o] C<br>1.6 0.2<br>1.2<br>0.1<br>0.8<br>TJ = 25 [o] C<br>0.4 0.0<br>-50 -25 0 25 50 75 100 125 150 3 4 5 6 7 8 9 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized On Resistance vs Junction   Figure 4.   On-Resistance vs  Gate to Source<br>Temperature Voltage<br>20 100<br>PULSE DURATION = 80 µ s VGS = 0V<br>DUTY CYCLE = 0.5%MAX<br>15<br>10 TJ = 150 [o] C<br>10<br>TJ = 150 [o] C TJ = 25 [o] C 1 TJ = 25 [o] C<br>5 TJ = -55 [o] C<br>TJ = -55 [o] C<br>0 0.1<br>2 3 4 5 6 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5.  Transfer Characteristics Figure 6.  Source to Drain  Diode Forward Voltage<br>vs Source Current<br>NORMALIZED<br>, DRAIN CURRENT (A)<br>ID<br>DRAIN TO SOURCE ON-RESISTANCE<br>)<br>Ω<br>m<br>(<br>NORMALIZED<br>,  ON-RESISTANCE<br>rDS(on)<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>ID<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**3** 

FDS2734 Rev. B 

**Typical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [435 x 577] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 5000<br>Ciss<br>8 f = 1MHz<br>VDD = 50V VDD = 125V 1000 Coss VGS = 0V<br>6<br>VDD = 200V<br>4 100 Crss<br>2<br>0 10<br>0 10 20 30 40 0.1 1 10 100<br>Qg, GATE CHARGE(nC) VDS,DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance vs Drain to Source Voltage<br>10 3.5<br>3.0<br>VGS = 10V<br>2.5<br>TJ = 25 [o] C 2.0<br>1 VGS = 6V<br>1.5<br>TJ = 125 [o] C 1.0<br>0.5<br>R θ JA = 50 [o] C/W<br>0.1 0.0<br>1E-3 0.01 0.1 1 10 100 25 50 75 100 125 150<br>tAV, TIME IN AVALANCHE (mS) TA, AMBIENT TEMPERATURE( [o] C)<br>Figure 9.  Unclamped Inductive Switching  Figure 10.  Maximum Continuous Drain Current vs<br>Capability Ambient Temperature<br>102 104<br>10us TA = 25 [o] C<br>FOR TEMPERATURES<br>101 103 ABOVE 25CURRENT AS FOLLOWS: [o] C DERATE PEAK<br>100 I = I25  150-----------------------125 – TA<br>1ms<br>102<br>10-1 10ms VGS = 10V<br>100ms<br>10-2 OPERATION IN THIS  SINGLE PULSE DC1s 101<br>AREA MAY BE  TJ = MAX RATED SINGLE PULSE<br>10-3 LIMITED BY rDS(on) TA = 25 [o] C 100<br>10-1 100 101 102 103 10-3 10-2 10-1 100 101 102 103<br>VDS, DRAIN TO SOURCE VOLTAGE (V) t, PULSE WIDTH (s)<br>Figure 11.  Forward Bias Safe Operating Area Figure 12.  Single Pulse Maximum Power<br>Dissipation<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE(V)<br>GS<br>V<br>, DRAIN CURRENT (A)<br>, AVALANCHE CURRENT (A) ID<br>IAS<br>, DRAIN CURRENT (A)<br>ID<br>, PEAK TRANSIENT POWER (W)P)(PK<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**4** 

FDS2734 Rev. B 

**==> picture [429 x 225] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Characteristics  TJ = 25°C unless otherwise noted<br>4<br>DUTY CYCLE-DESCENDING ORDER<br>1<br>D = 0.5<br>      0.2<br>0.1       0.1<br>      0.05<br>0.01       0.02 PDM<br>      0.01<br>1E-3 t1<br>t2<br>1E-4 NOTES:<br>DUTY FACTOR: D = t1/t2<br>SINGLE PULSE PEAK TJ = PDM x Z θJA  x R θJA  + TA<br>1E-5<br>10-4 10-3 10-2 10-1 100 101 102 103<br>t, RECTANGULAR PULSE DURATION(s)<br>Figure 13.  Transient Thermal Response Curve<br>                                            Thermal characterization performed using the conditions described in Note 1b<br>                                            Transient thermal response will change depending on the circuit board design<br>IMPEDANCE, ZJA θ<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**5** 

FDS2734 Rev. B 

## **TRADEMARKS** 

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. 

|ACEx™|FACT Quiet Series™|OCX™|SILENT SWITCHER®|UniFET™|
|---|---|---|---|---|
|ActiveArray™|GlobalOptoisolator™|OCXPro™|SMART START™|UltraFET®|
|Bottomless™|GTO™|OPTOLOGIC®|SPM™|VCX™|
|Build it Now™|HiSeC™|OPTOPLANAR™|Stealth™|Wire™|
|CoolFET™|I2C™|PACMAN™|SuperFET™||
|_CROSSVOLT_™|_i-Lo_™|POP™|SuperSOT™-3||
|DOME™|ImpliedDisconnect™|Power247™|SuperSOT™-6||
|EcoSPARK™|IntelliMAX™|PowerEdge™|SuperSOT™-8||
|E2CMOS™|ISOPLANAR™|PowerSaver™|SyncFET™||
|EnSigna™|LittleFET™|PowerTrench®|TCM™||
|FACT™|MICROCOUPLER™|QFET®|TinyBoost™||
|FAST®|MicroFET™|QS™|TinyBuck™||
|FASTr™|MicroPak™|QT Optoelectronics™|TinyPWM™||
|FPS™|MICROWIRE™|Quiet Series™|TinyPower™||
|FRFET™|MSX™|RapidConfigure™|TinyLogic®||
||MSXPro™|RapidConnect™|TINYOPTO™||
|Across the board.|Around the world.™|μSerDes™|TruTranslation™||
|The Power Franchise®||ScalarPump™|UHC™||
|Programmable Active Droop™|||||



## **DISCLAIMER** 

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. 

## **LIFE SUPPORT POLICY** 

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. 

As used herein: 

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2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 

## **PRODUCT STATUS DEFINITIONS Definition of Terms** 

|**PRODUCT STATUS DEFINITIONS**<br>**Definition of Terms**|||
|---|---|---|
|**Datasheet Identification**|**Product Status**|**Definition**|
|Advance Information|Formative or In Design|This datasheet contains the design specifications for<br>product development. Specifications may change in<br>any manner without notice.|
|Preliminary|First Production|This datasheet contains preliminary data, and<br>supplementary data will be published at a later date.<br>Fairchild Semiconductor reserves the right to make<br>changes at any time without notice to improve<br>design.|
|No Identification Needed|Full Production|This datasheet contains final specifications. Fairchild<br>Semiconductor reserves the right to make changes at<br>any time without notice to improve design.|
|Obsolete|Not In Production|This datasheet contains specifications on a product<br>that has been discontinued by Fairchild semiconductor.<br>The datasheet is printed for reference information only.|



Rev. I20 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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