# Power MOSFET, N Channel, 150 V, 15 A, 0.04 ohm, TO-220F, Through Hole

![Product image](https://novapart.co/image/farnell:3368776/)

**URL**: https://novapart.co/products/FDPF390N15A/power-mosfet-n-channel-150-v-15-a-004-ohm-to-220f
**SKU**: FDPF390N15A
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.6390
**Stock**: 500+
**Lead Time**: 120 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | PowerTrench |
| Qualification | - |
| Power Dissipation | 22W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220F |
| Drain Source Voltage Vds | 150V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 15A |
| Drain Source On State Resistance | 0.04ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3368776/)

## **Is Now Part of** 

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Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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December 2013<br>**----- End of picture text -----**<br>


## **FDPF390N15A** 

## **N-Channel PowerTrench[®] MOSFET** 

## **150 V, 15 A, 40 mΩ** 

## **Features** 

- RDS(on) = 31 mΩ (Typ.) @ VGS = 10 V, ID = 15 A 

- Fast Switching Speed 

- Low Gate Charge, QG = 14.3 nC (Typ.) 

- High Performance Trench Technology for Extremely Low R DS(on) 

- High Power and Current Handling Capability 

## **Description** 

This N-Channel MOSFET is produced using Fairchild Semiconductor’s advanced PowerTrench **[®]** process that has been tailored to minimize the on-state resistance while maintain-ing superior switching performance. 

## **Applications** 

   - Consumer Appliances 

   - LED TV 

- RoHS Compliant 

- Synchronous Rectification 

- Uninterruptible Power Supply 

- Motor Solar Inverter 

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GDS<br>TO-220F<br>**----- End of picture text -----**<br>


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D<br>G<br>S<br>**----- End of picture text -----**<br>


**Absolute Maximum Ratings** TC = 25°C unless otherwise noted. 

|**Symbol**|**Parameter**|**Parameter**|**FDPF390N15A              Unit**|**FDPF390N15A              Unit**|
|---|---|---|---|---|
|VDSS|Drain to Source Voltage||150|V|
|VGSS|Gate to Source Voltage||±20|V|
|ID|Drain Current|- Continuous(TC= 25oC,Silicon Limited)|15|A|
|||- Continuous(TC= 100oC,Silicon Limited)|10||
|IDM|Drain Current|- Pulsed<br>(Note 1)|(Note 1)<br>60|A|
|EAS<br>~~——~~|Single Pulsed Avalanche Energy<br>(Note 2)<br>~~——~~||(Note 2)<br>78<br>~~——~~|mJ<br>~~——~~|
|dv/dt<br>~~——~~|Peak Diode Recoverydv/dt<br>(Note 3)<br>~~——~~||(Note 3)<br>6.0<br>V<br>~~——~~|V<br>/ns<br>~~——~~|
|PD<br>~~——~~|Power Dissipation<br>~~——~~|(TC= 25oC)<br>~~——~~|22<br>~~——~~|W<br>~~——~~|
|||- Derate above 25oC<br>~~——~~|0.18<br>~~——~~|oC<br>W/<br>~~——~~|
|TJ, TSTG<br>~~——~~<br>~~es~~|Operatingand Storage Temperature Range<br>~~——~~||-55 to +175<br>~~——~~|oC<br>~~——~~|
|TL<br>~~es~~|Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds.||300|oC|



## **Thermal Characteristics** 

**Symbol Parameter FDPF390N15A Unit** R θ JC Thermal Resistance, Junction to Case, Max. 5.7 oC/W ~~—_——~~ R θ JA Thermal Resistance, Junction to Ambient, Max. 62.5 ~~a~~ 

www.fairchildsemi.com 

©2011 Fairchild Semiconductor Corporation **1** FDPF390N15A Rev C1 

## **Package Marking and Ordering Information** 

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||||||||
|---|---|---|---|---|---|---|
|Part Number|Top Mark|Package|Packing Method|Reel Size|Tape Width|Quantity|
|FDPF390N15A|FDPF390N15A|TO-220F|Tube|N/A|N/A|50 units|

**----- End of picture text -----**<br>


**Electrical Characteristics** TC = 25°C unless otherwise noted. 

**==> picture [480 x 465] intentionally omitted <==**

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|||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|Symbol|Parameter|Test Conditions|Min.|Typ.|Max.|Unit|
|Off Characteristics|
|BVDSS|Drain to Source Breakdown Voltage|ID = 250|µA, VGS = 0|V|150|-|-|V|
|∆BV|/|∆DSSTJ|Breakdown Voltage Temperature Coefficient|ID = 250|µA, Referenced to 25|[o]|C|-|0.1|-|V/|[o]|C|
|IDSS|Zero Gate Voltage Drain Current|VVDSDS = 120 = 120|V, TV, VC GS= 125= 0|V|[o]|C|--|--|5001|µA|
|[So|IGSS|Gate to Body Leakage Current|VGS = ±20|V, VDS|= 0|V|-|-|±100|nA|
|On Characteristics|
|VGS(th)|Gate Threshold Voltage|VGS = VDS, ID = 250|µA|2.0|-|4.0|V|
|RDS(on)|Static Drain to Source On Resistance|VGS = 10|V, ID = 15A|-|31|40|mΩ|
|gFS|Forward Transconductance|VDS = 10|V, ID = 15|A|-|32|-|S|
|Dynamic Characteristics|
|CCiossss|InOutput Caput Capacitancepacitance|f = 1VDS = 75MHzV, VGS = 0|V|--|96596|1285130|ppFF|
|Crss|Reverse Transfer Capacitance|-|5.8|-|pF|
|Coss(er)|Energy Related Output Capacitance|VDS = 75|V,VGS = 0|V|169|-|pF|
|Qg(tot)|Total Gate Charge at 10V|-|14.3|18.6|nC|
|Qgs|Gate to Source Gate Charge|VDS = 75|V,ID = 27|A|5.0|-|nC|
|Qgs2|Gate Charge Threshold to Plateau|VGS = 10|V|-|2.0|-|nC|
|Qgd|Gate to Drain “Miller” Charge|(Note 4)|-|3.5|-|nC|
|==:|ESR|Equivalent Series Resistance (G-S)|f = 1|MHz|-|1.4|-|Ω|
|Switching Characteristics|
|td(on)|Turn-On Delay Time|-|14|38|ns|
|tr|Turn-On Rise Time|VDD = 75|V, ID = 27|A|-|10|30|ns|
|td(off)|Turn-Off Delay Time|VGS = 10|V, RG = 4.7|Ω|-|20|50|ns|
|SOE|tf|Turn-Off Fall Time|(Note 4)|-|5|20|ns|
|Drain-Source Diode Characteristics|
|IS|Maximum Continuous Drain to Source Diode Forward Current|-|-|15|A|
|ISM|Maximum Pulsed Drain to Source Diode Forward Current|-|-|64|A|
|VSD|Drain to Source Diode Forward Voltage|VGS|= 0|V, ISD = 15|A|-|-|1.25|V|
|trr|Reverse Recovery Time|VGS = 0|V, ISD = 27|A|-|63|-|ns|
|Se|Qrr|Reverse Recovery Charge|dIF/dt = 100|A/µs|-|131|-|nC|
|Notes:|
|1. Repetitive rating: pulse-width limited by maximum junction temperature.|

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2. Starting TJ = 25°C,  L = 3 mH, ISD = 7.2 A 

3. ISD ≤ 15 A, di/dt ≤ 200 A/μs, VDD ≤ BVDSS, starting TJ = 25°C 

4. Essentially independent of operating temperature typical characteristics. 

www.fairchildsemi.com 

**2** 

©2011 Fairchild Semiconductor Corporation FDPF390N15A Rev C1 

## **Typical Performance Characteristics** 

Figure 1. On-Region Characteristics 

Figure 2. Transfer Characteristics 

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200<br>*Notes:<br>100  1. V DS  = 10V<br> 2. 250 µ s Pulse Test<br>10<br>150 [[o]] C 25 [[o]] C<br>-55 [[o]] C<br>1<br>h dL 2 3 4 5 6 7 8<br>VGS, Gate-Source Voltage[V]GS, Gate-Source Voltage[V], Gate-Source Voltage[V]<br>Figure 4. Body Diode Forward Voltage<br> Variation vs. Source Current<br> and Temperature<br>200<br>100<br>Fee<br> 150 [[o]] C 25 [[o]] C<br>10<br>LAA<br>*Notes:<br>1. V GS  = 0V<br>2. 250 µ s Pulse Test<br>Leh<br>10.4 tt<br>0.4 0.6 0.8 1.0 1.2 1.3<br>VSD, Body Diode Forward Voltage [V]SD, Body Diode Forward Voltage [V], Body Diode Forward Voltage [V]<br>, Drain Current[A]<br>IDD<br>, Reverse Drain Current [A]ISS<br>ISS<br>**----- End of picture text -----**<br>


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200 200<br>VGS = 15.0V   *Notes:<br>100   10.0V 100  1. V DS  = 10V<br>  8.0V  2. 250 µ s Pulse Test<br>  7.0V<br>  6.5V<br>  6.0V<br>  5.5V<br>  5.0V<br>10 10<br>150 [[o]] C 25 [[o]] C<br>-55 [[o]] C<br>*Notes:<br> 1. 250 µ s Pulse Test<br> 2. TC = 25 [o] C<br>1 1<br>0.1 f 1 | 5 h dL 2 3 4 5 6 7 8<br>VDS, Drain-Source Voltage[V] VGS, Gate-Source Voltage[V]GS, Gate-Source Voltage[V], Gate-Source Voltage[V]<br>Figure 3. On-Resistance Variation vs.  Figure 4. Body Diode Forward Voltage<br> Drain Current and Gate Voltage  Variation vs. Source Current<br> and Temperature<br>80 200<br>100<br>60 | Fee<br>VGS = 10V<br> 150 [[o]] C 25 [[o]] C<br>10<br>40<br>VGS = 20V<br>AL LAA<br>*Notes:<br>1. V GS  = 0V<br>*Note: TC = 25 [o] C 2. 250 µ s Pulse Test<br>20 0 ew} 20 40 60 80 100 10.4 Leh 0.6 0.8 tt 1.0 1.2 1.3<br>ID, Drain Current [A] VSD, Body Diode Forward Voltage [V]SD, Body Diode Forward Voltage [V], Body Diode Forward Voltage [V]<br>Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics<br>2000 10<br>1000<br>Ciss 8 VVDSDS = 30V = 75V<br>—— See fe<br>VDS = 120V<br>100 6<br>Coss<br>*Note: 4<br>10  1. VGS = 0V<br> 2. f = 1MHz<br>C iss  = C gs  + C gd (C ds  = shorted) Crss 2<br>Coss = Cds + Cgd<br>Crss = Cgd *Note: ID = 27A<br>1 SH 0 Ae<br>0.1 1 10 100 200 0 4 8 12 16<br>VDS, Drain-Source Voltage [V] Qg, Total Gate Charge [nC]<br>, Drain Current[A] , Drain Current[A]<br>ID IDD<br>],<br>Ω<br>m<br>[<br>DS(ON)<br>R<br>Drain-Source On-Resistance , Reverse Drain Current [A]ISS<br>, Gate-Source Voltage [V]<br>Capacitances [pF]<br>GS<br>V<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**3** 

©2011 Fairchild Semiconductor Corporation FDPF390N15A Rev C1 

Typical Performance Characteristics (Continued) 

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 Figure 7. Breakdown Voltage Variation   Figure 8. On-Resistance Variation<br> vs. Temperature   vs. Temperature<br>1.10 2.6<br>1.08 2.4<br>TTT [fff TT<br>2.0<br>1.04 a Poeeeennnn/A<br>1.6<br>1.00<br>COT 1.2 Eee<br>0.96 *Notes: 0.8 *Notes:<br> 1. VGS = 0V  1. VGS = 10V<br> 2. ID = 250 µ A  2. ID = 15A<br>0.92 aaaae ceoee 0.4 aaaaeeeene<br>-80 -40 0 40 80 120 160 -80 -40 0 40 80 120 160<br>TJ, Junction Temperature [ [o] C] TJ, Junction Temperature [ [o] C]<br> Figure 9. Maximum Safe Operating Area   Figure 10. Maximum Drain Current<br> vs. Case Temperature<br>300<br>16<br>100 VGS= 10V<br>10 100 µ s 12<br>1ms<br>1 10ms<br>100ms 8<br>Operation in This Area  DC<br>0.1 is Limited by R DS(on)<br>*Notes:<br>4<br>0.01  1. TC = 25 [o] C<br> 2. TJ = 150 [o] C<br> 3. Single Pulse R θ JC =5.7 [o] C/W<br>0.001 0<br>1 10 100 200 25 50 75 100 125 150<br>VDS, Drain-Source Voltage [V] TC, Case Temperature [oC]<br> Figure 11. Eoss vs. Drain to Source Volatage   Figure 12. Unclamped Inductive<br>     Switching Capability<br>1.2 12<br>If R = 0<br>10 tAV = (L)(IAS)/(1.3*RATED BVDSS-VDD)<br>If R = 0<br>1.0 t AV  = (L/R)In[(I AS *R)/(1.3*RATED BV DSS -V DD )+1]<br>o<br>0.8 STARTING TJ = 25 C<br>0.6<br>Goueee-aoee Frit STARTING TJ = 150 PRCT o C<br>0.4<br>0.2 A ay NE<br>0.0 ae] 1 LMI<br>0 30 60 90 120 150 0.01 0.1 1 10 20<br>VDS, Drain to Source Voltage [V] tAV, TIME IN AVALANCHE (ms)<br>, [Normalized] , [Normalized]<br>BVDSS RDS(on)<br>Drain-Source On-Resistance<br>Drain-Source Breakdown Voltage<br>rain Current [A]<br>, D<br>ID<br>, Drain Current [A]<br>ID<br>]<br>J<br>µ<br>[<br>,<br>OSS<br>, AVALANCHE CURRENT (A)<br>IAS<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**4** 

©2011 Fairchild Semiconductor Corporation FDPF390N15A Rev C1 

## Typical Performance Characteristics (Continued) 

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 Figure 13. Transient Thermal Response Curve<br>8<br>0.5<br>1 0.2<br>0.1<br>PDM<br>0.05<br>t 1<br>0.02 t2<br>0.1 0.01 *Notes:<br>Single pulse 1. Z θ JC(t) = 5.7 [o] C/W Max.<br>2. Duty Factor, D= t1/t2<br>3. T JM  - T C  = P DM  * Z θ JC (t)<br>0.0110-5 10-4 10-3 10-2 10-1 1 10 100<br>Rectangular Pulse Duration [sec]<br>C/W]<br>o<br>(t), Thermal Response [<br>ZJC θ<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**5** 

©2011 Fairchild Semiconductor Corporation FDPF390N15A Rev C1 

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VGS<br>Same Type<br>50KΩ as DUT Qg<br>12V 200nF 300nF 10V<br>VGS VDS Qgs Qgd<br>DUT<br>IG = const.<br>Charge<br> Figure 14. Gate Charge Test Circuit & Waveform<br>VDS RL VDS 90%<br>VGS VDD<br>RG<br>10%<br>VGS DUT VGS<br>td(on) tr td(off) tf<br>t on t off<br> Figure 15. Resistive Switching Test Circuit & Waveforms<br>L BVDSS<br>VDS EAS [=] --21-- L IAS2 --------------------BVDSS - VDD<br>I D BVDSSIAS<br>RG VDD ID (t)<br>V GS DUT VDD VDS (t)<br>t p t p Time<br>**----- End of picture text -----**<br>


**Figure 16. Unclamped Inductive Switching Test Circuit & Waveforms** 

www.fairchildsemi.com 

**6** 

©2011 Fairchild Semiconductor Corporation FDPF390N15A Rev C1 

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**----- Start of picture text -----**<br>
DUT +<br>VDS<br>_<br>I SD<br>L<br>Driver<br>RG<br>Same Type<br>as DUT VDD<br>VGS • dv/dt controlled by  RG<br>• ISD controlled by pulse period<br>Gate Pulse Width<br>VGS D = --------------------------<br>Gate Pulse Period 10V<br>( Driver )<br>4282<br>IFM , Body Diode Forward Current<br>I SD<br>( DUT ) di/dt<br>IRM<br>4 Ne<br>Body Diode Reverse Current<br>VDS<br>( DUT ) Body Diode Recovery dv/dt<br>VSD VDD<br>TT<br>Body Diode<br>Forward Voltage Drop<br>**----- End of picture text -----**<br>


**Figure 17. Peak Diode Recovery dv/dt Test Circuit & Waveforms** 

www.fairchildsemi.com 

**7** 

©2011 Fairchild Semiconductor Corporation FDPF390N15A Rev C1 

**==> picture [566 x 759] intentionally omitted <==**

**----- Start of picture text -----**<br>
10.36 2.66<br>A B B<br>9.96 2.42<br>3.28<br>3.40 7.00 3.08<br>0.70<br>3.20<br>SEE NOTE "F" SEE NOTE "F"<br>6.88<br>6.48<br>1 X 45°<br>16.07<br>B<br>15.67<br>16.00<br>15.60<br> (3.23)  B<br>3<br>1<br>1.47<br>2.96<br>2.14 1.24<br>2.56<br>0.90<br>10.05 0.70<br>9.45 0.50 [M] A<br>30°<br>0.45<br>0.60<br>0.25 B<br>0.45<br> 2.54   2.54<br>4.90<br>B<br>4.50<br>NOTES:<br>  A. EXCEPT WHERE NOTED CONFORMS TO<br>EIAJ SC91A.<br>B DOES NOT COMPLY EIAJ STD. VALUE.<br>  C. ALL DIMENSIONS ARE IN MILLIMETERS.<br>  D. DIMENSIONS ARE EXCLUSIVE OF BURRS,<br> MOLD FLASH AND TIE BAR PROTRUSIONS.<br>  E. DIMENSION AND TOLERANCE AS PER ASME<br>Y14.5-1994.<br>  F. OPTION 1 - WITH SUPPORT PIN HOLE.<br>      OPTION 2 - NO SUPPORT PIN HOLE.<br>  G. DRAWING FILE NAME: TO220M03REV5<br>**----- End of picture text -----**<br>


ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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