# Power MOSFET, N Channel, 250 V, 50 A, 0.047 ohm, TO-220AB, Through Hole

![Product image](https://novapart.co/image/farnell:3616138/)

**URL**: https://novapart.co/products/FDP2710-F085/power-mosfet-n-channel-250-v-50-a-0047-ohm-to
**SKU**: FDP2710-F085
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.4400
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (15-Jan-2018) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 403W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220AB |
| Drain Source Voltage Vds | 250V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 50A |
| Drain Source On State Resistance | 0.047ohm |
| Gate Source Threshold Voltage Max | 5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3616138/)

## **ON Semiconductor** 

## **Is Now** 

**==> picture [390 x 69] intentionally omitted <==**

**To learn more about onsemi™, please visit our website at www.onsemi.com** 

**onsemi** and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as-is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. 

## **FDP2710-F085** 

## **N-Channel PowerTrench[®] MOSFET** 

## **250V, 50A, 47m** Ω 

## **Features** 

Typ rDS(on) = 38mΩ at VGS = 10V, ID = 50A 

Typ Qg(TOT) = 78nC at VGS = 10V 

## **General Description** 

This N-Channel MOSFET is produced using ON Semiconductor’s advanced PowerTrench process that has been especially tailored to minimize the on-state resistance and yet maintain superior switching performance. 

## **Applications** 

Fast switching speed 

Low gate charge 

High performance trench technology for extremely low RDS(on) 

PDP application 

Hybrid Electric Vehicle DC/DC converters 

High power and current handling capability 

Qualified to AEC Q101 

| RoHS Compliant > 

Publication Order Number: FDP2710-F085/D 

© 2010 Semiconductor Components Industries, LLC. September-2017, Rev. 1 

**1** 

**MOSFET Maximum Ratings** TC = 25°C unless otherwise noted 

|**Symbol**|**Parameter**|**Parameter**|**Parameter**|**Parameter**|**Parameter**|**Parameter**|**Parameter**|**Ratings**|**Ratings**|**Ratings**|**Ratings**|**Units**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|VDSS|Drain to Source Voltage|||||||250||||V|
|VGS|Gate to Source Voltage|||||||±30||||V|
|ID|Drain Current Continuous(TC< 50oC, VGS= 10V)|||||||50||||A|
||Continuous(Tamb= 25oC, VGS= 10V, with RθJA= 62oC/W)|||||||4|||||
||Pulsed|||||||See Figure 4|||||
|EAS|Single Pulse Avalanche Energy<br> (Note 1)|||||||483||||mJ|
|PD|Power Dissipation|||||||403||||W|
||Derate above 25oC|||||||3.2||||W/oC|
|TJ, TSTG|Operatingand Storage Temperature|||||||-55 to +150||||oC|
|**Thermal Characteristics**|||||||||||||
|RθJC|Maximum Thermal Resistance Junction to Case|||||||0.31||||oC/W|
|RθJA|Maximum Thermal Resistance Junction to Ambient<br> (Note 2)|||||||62||||oC/W|
|**Package Marking and Ordering Information**|||||||||||||
|**Device Marking**||**Device**|**Package**||**Reel Size**||**Tape Width**|||**Quantity**|||
|FDP2710||FDP2710-F085|TO220||Tube|||NA||50 units|||
|**Electrical Characteristics**TC= 25°C unless otherwise noted|||||||||||||
|**Symbol**|**Parameter**|||**Test Conditions**||||**Min**|**Typ**||**Max**|**Units**|
|**Off Characteristics**|||||||||||||
|BVDSS|Drain to Source Breakdown Voltage|||ID= 250µA, VGS= 0V||||250|-||-|V|
|∆BVDSS<br>/ ∆TJ|Breakdown Voltage Temperature<br>Coefficient|||ID= 250µA, Referenced to 25°C||||-|0.25||-|V/°C|
|IDSS|Zero Gate Voltage Drain Current|||VDS= 250V,<br>VGS= 0V||||-|-||1|µA|
|||||||TC = 125oC||-|-||500||
|IGSS|Gate to Source Leakage Current|||VGS= ±30V||||-|-||±100|nA|
|**On Characteristics**|||||||||||||
|VGS(th)|Gate to Source Threshold Voltage|||VGS= VDS, ID= 250µA||||3|3.9||5|V|
|rDS(on)|Drain to Source On Resistance|||ID= 50A, VGS= 10V,||||-|38||47|mΩ|
|||||ID= 50A, VGS= 10V,<br>TJ= 150oC||||-|104||129||
|gFS|Forward Transconductance|||ID= 25A, VDS= 10V||||-|63||-|S|
|**Dynamic Characteristics**|||||||||||||
|Ciss|Input Capacitance|||VDS= 25V, VGS= 0V,<br>f = 1MHz||||-|5690||-|pF|
|Coss|Output Capacitance|||||||-|425||-|pF|
|Crss|Reverse Transfer Capacitance|||||||-|115||-|pF|
|Qg(TOT)|Total Gate Charge at 20V|||VGS= 0 to 10V||||-|78||101|nC|
|Qgs|Gate to Source Gate Charge|||||||-|31||-|nC|
|Qgd|Gate to Drain “Miller“ Charge|||||||-|20||-|nC|



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**2** 

|**Electrical Characteristics**TC= 25oC unless otherwise noted|**Electrical Characteristics**TC= 25oC unless otherwise noted|**Electrical Characteristics**TC= 25oC unless otherwise noted|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Units**|
|**Switching Characteristics**|||||||
|td(on)|Turn-On DelayTime|VDD= 125V, ID= 50A<br>VGS= 10V, RGEN= 25Ω|-|85|-|ns|
|tr|Rise Time||-|183|-|ns|
|td(off)|Turn-Off DelayTime||-|140|-|ns|
|tf|Fall Time||-|121|-|ns|
|**Drain-Source Diode Characteristics**|||||||
|IS|Maximum Continuous Drain-Source Diode Forward Current||-|-|50|A|
|ISM|Maximum Pulsed Drain-Source Diode Forward Current||-|-|150|A|
|VSD|Source to Drain Diode Voltage|ISD= 50A|-|0.9|1.2|V|
|trr|Reverse RecoveryTime|ISD= 50A, dISD/dt = 100A/µs|-|166|216|ns|
|Qrr|Reverse RecoveryCharge||-|1|1.3|uC|



**Notes:** 

- **1:** Starting TJ = 25[o] C, L = 1.68mH, IAS = 24A. **2:** Pulse width 100s 

**This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry.  For a copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/ All ON Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems** 

**certification.** 

**www.onsemi.com** 

**3** 

## **Typical Characteristics** 

**==> picture [433 x 559] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.2 60<br>CURRENT LIMITED VGS = 10V<br>BY PACKAGE<br>1.0 50<br>0.8 40<br>0.6 30<br>0.4 20<br>0.2 10<br>0.0 0<br>0 25 50 75 100 125 150 25 50 75 100 125 150<br>TC, CASE TEMPERATURE( [o] C) TC, CASE TEMPERATURE (oC)<br>Figure 1.  Normalized Power Dissipation vs Case  Figure 2.  Maximum Continuous Drain Current vs<br>Temperature       Case Temperature<br>2<br>DUTY CYCLE - DESCENDING ORDER<br>1<br>D = 0.50<br>  0.20<br>  0.10<br>  0.05<br>  0.02 PDM<br>  0.01<br>0.1<br>t1<br>t2<br>NOTES:<br>DUTY FACTOR: D = t1/t2<br>SINGLE PULSE PEAK TJ = PDM x Z θ JC x R θ JC + TC<br>0.01<br>10-5 10-4 10-3 10-2 10-1 100 101<br>t, RECTANGULAR  PULSE DURATION(s)<br>Figure 3.  Normalized Maximum Transient Thermal Impedance<br>3000<br>VGS = 10V TC = 25 [o] C<br>FOR TEMPERATURES<br>1000 ABOVE 25 [o] C DERATE PEAK<br>CURRENT AS FOLLOWS:<br>I = I2 150 - TC<br>125<br>100<br>SINGLE PULSE<br>10<br>10-5 10-4 10-3 10-2 10-1 100 101<br>t, RECTANGULAR PULSE DURATION(s)<br>Figure 4.  Peak Current Capability<br>, DRAIN CURRENT (A)<br>ID<br>POWER DISSIPATION MULTIPLIER<br>IMPEDANCE, ZJC θ<br>NORMALIZED THERMAL<br>PEAK CURRENT (A)<br>,<br>IDM<br>**----- End of picture text -----**<br>


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**4** 

## **Typical Characteristics** 

**==> picture [432 x 596] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>1000 If R = 0<br>tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD)<br>10us If R  ≠ 0<br>100 tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1]<br>100us<br>10<br>10 STARTING TJ = 25 [o] C<br>1 1ms<br>0.1 OPERATION IN THIS  SINGLE PULSE 10ms STARTING TJ = 125 [o] C<br>AREA MAY BE LIMITED BY rDS(on) TTCJ = MAX RATED= 25 [o] C DC 1<br>0.01 0.01 0.1 1 10 100<br>1 10 100 500<br>tAV, TIME IN AVALANCHE (ms)<br>VDS, DRAIN TO SOURCE VOLTAGE (V)<br>NOTE: Refer to ON Semiconductor Application Notes AN7514<br>Figure 5.  Forward Bias Safe Operating Area and AN7515<br>Figure 6.  Unclamped Inductive Switching<br>Capability<br>140 140<br>PULSE DURATION = 80 µ s<br>120 DUTY CYCLE = 0.5% MAXVDD = 20V 120 DUTY CYCLE = 0.5% MAXPULSE DURATION = 80 µ s<br>100 100<br>80 80 VGS = 10V<br>60 TJ = 150 [o] C 60 VGS = 6.5V<br>40 40<br>TJ = 25 [o] C TJ = -55 [o] C VGS = 6V<br>20 20<br>VGS = 5.5V<br>0 0<br>2 3 4 5 6 7 8 9 10 0 3 6 9 12 15<br>VGS, GATE TO SOURCE VOLTAGE (V) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Transfer Characteristics Figure 8.  Saturation Characteristics<br>200 3.0<br>ID = 50A DUTY CYCLE = 0.5% MAXPULSE DURATION = 80 µ s PULSE DURATION = 80 µ s<br>DUTY CYCLE = 0.5% MAX<br>2.5<br>150<br>2.0<br>TJ = 150 [o] C<br>100 1.5<br>1.0<br>50 TJ = 25 [o] C<br>0.5<br> ID = 50A<br>0 0.6 VGS = 10V<br>6 7 8 9 10 -80 -40 0 40 80 120 160<br>VGS, GATE TO SOURCE VOLTAGE (V) TJ, JUNCTION TEMPERATURE( [o] C)<br>Figure 9.  Drain to Source On-Resistance Drain to Source On-Resistance  Figure 10.  Normalized Drain to Source On<br>Variation vs Gate to Source Voltage  Resistance vs Junction Temperature<br>, DRAIN CURRENT (A)<br> ID , AVALANCHE CURRENT (A)IAS<br>, DRAIN CURRENT (A)<br>, DRAIN CURRENT (A)ID ID<br>)<br>Ω<br>m<br>(<br>, DRAIN TO SOURCE  ON-RESISTANCE  NORMALIZED<br>rDS(on)<br> DRAIN TO SOURCE ON-RESISTANCE<br>**----- End of picture text -----**<br>


**Figure 9.  Drain to Source On-Resistance Drain to Source On-Resistance Variation vs Gate to Source Voltage** 

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**5** 

## **Typical Characteristics** 

**==> picture [433 x 374] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.3 1.15<br>VGS = VDS ID = 1mA<br>1.2 ID = 250 µ A<br>1.10<br>1.1<br>1.0<br>1.05<br>0.9<br>0.8 1.00<br>0.7<br>0.95<br>0.6<br>0.5 0.90<br>-80 -40 0 40 80 120 160 -80 -40 0 40 80 120 160<br>TJ, JUNCTION TEMPERATURE( [o] C) TJ, JUNCTION TEMPERATURE ( [o] C)<br>Figure 11.  Normalized Gate Threshold Voltage vs  Figure 12.  Normalized Drain to Source<br>Junction Temperature Breakdown Voltage vs Junction Temperature<br>20000 10<br>10000 ID = 50A VDD = 120V<br>Ciss 8 VDD = 125V<br>VDD = 130V<br>1000 6<br>Coss<br>4<br>Crss<br>100<br>2<br>f = 1MHz<br>VGS = 0V<br>10 0<br>0.1 1 10 100 0 20 40 60 80<br>VDS, DRAIN TO SOURCE VOLTAGE (V) Qg ,  GATE CHARGE(nC)<br>NORMALIZED GATE<br>THRESHOLD VOLTAGE  BREAKDOWN VOLTAGE<br>NORMALIZED DRAIN TO SOURCE<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE(V)<br>GS<br>V<br>**----- End of picture text -----**<br>


**Figure 13.  Capacitance vs Drain to Source Voltage** 

**Figure 14.  Gate Charge vs Gate to Source Voltage** 

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**6** 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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