# Power MOSFET, N Channel, 100 V, 57 A, 0.012 ohm, TO-220, Through Hole

![Product image](https://novapart.co/image/farnell:2083333/)

**URL**: https://novapart.co/products/FDP150N10/power-mosfet-n-channel-100-v-57-a-0012-ohm-to-220
**SKU**: FDP150N10
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.8960
**Stock**: 10+

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:57A; Drain Source Voltage Vds:100V; On Resistance Rds(on):0.012ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:2.5V; Po

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 110W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220 |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 57A |
| Drain Source On State Resistance | 0.012ohm |
| Gate Source Threshold Voltage Max | 2.5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2083333/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

**==> picture [74 x 8] intentionally omitted <==**

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November 2013<br>**----- End of picture text -----**<br>


## **FDP150N10 N-Channel PowerTrench[®] MOSFET** 

**100 V, 57 A, 15 m** Ω 

## **Features** 

- RDS(on) = 12 m Ω (Typ.) @ VGS = 10 V, ID = 49 A 

- Fast Switching Speed 

- Low Gate Charge 

- High Performance Trench Technology for Extremely Low R DS(on) 

- High Power and Current Handling Capability 

- RoHS Compliant 

## **Description** 

This N-Channel MOSFET is produced using Fairchild Semiconductor’s advanced PowerTrench[®] process that has been tailored to minimize the on-state resistance while maintaining superior switching performance. 

## **Applications** 

- Synchronous Rectification for ATX / Server / Telecom PSU 

- Battery Protection Circuit 

- Motor Drives and Uninterruptible Power Supplies 

- Micor Solar Inverter 

**==> picture [469 x 337] intentionally omitted <==**

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D<br>GDS G<br>TO-220<br>S<br>MOSFET Maximum Ratings TC = 25 [o] C unless otherwise noted.<br>DO Symbol Parameter FDP150N10 Unit<br>|W, VDSS Drain to Source Voltage 100 V<br>|We VGSS Gate to Source Voltage ±20 V<br>PP ID Drain Current a - Continuous - Continuous  EF ((TTCC = 25 = 100 [o] C [o] C) ) 4057 AA<br>GO IDM Drain Current - Pulsed                                           (Note 1) 228 A<br>A EAS Single Pulsed Avalanche Energy (Note 2) 132 mJ<br>«i dv/dt Peak Diode Recovery dv/dt                                                                           isk TF (Note 3) 7.5 | V/ns<br>PD Power Dissipation - Derate Above 25(TC = 25 [o] C) [o] C 0.88110 W/W [o] C<br>TTTne<br>TJ, TSTG Operating and Storage Temperature Range a -55 to +150 oC<br>Aneem TL Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds ll C(t eC 300 —si= oC<br>Thermal Characteristics<br>Symbol Parameter FDP150N10 Unit<br>R θ JC Thermal Resistance, Junction to Case, Max.               1.13 oC/W<br>R θ JA Thermal Resistance, Junction to Ambient, Max.                62.5<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2008 Fairchild Semiconductor Corporation FDP150N10 Rev. C3 

**1** 

## **Package Marking and Ordering Information** 

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||||||||
|---|---|---|---|---|---|---|
|Part Number|Top Mark|Package|Packing Method|Reel Size|Tape Width|Quantity|
|FDP150N10|FDP150N10|TO-220|Tube|N/A|N/A|50 units|

**----- End of picture text -----**<br>


**Electrical Characteristics** TC = 25[o] C unless otherwise noted. 

**==> picture [481 x 424] intentionally omitted <==**

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|||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|Symbol|Parameter|Test Conditions|Min.|Typ.|Max.|Unit|
|Off Characteristics|
|BVDSS|Drain to Source Breakdown Voltage|ID = 250|μ|A, VGS = 0 V, TC= 25|[o]|C|100|-|-|V|
|Δ|/ BV|Δ|TDSSJ|Breakdown Voltage Temperature Coefficient|ID = 250|μ|A, Referenced to 25|[o]|C|-|0.1|-|V/|[o]|C|
|IDSS|Zero Gate Voltage Drain Current|VVDSDS = 100 V, V = 100 V, VGS GS = 0 V= 0 V, TC = 150|[o]|C|--|--|5001|μ|A|
|IGSS|Gate to Body Leakage Current|VGS = ±20 V, VDS = 0 V|-|-|±100|nA|
|On Characteristics|
|————|oe|
|VGS(th)|Gate Threshold Voltage|VGS = VDS, ID = 250|μ|A|2.5|-|4.5|V|
|RDS(on)|Static Drain to Source On Resistance|VGS = 10 V, ID = 49 A|-|12|15|m|Ω|
|ae|gFS|Forward Transconductance|VDS = 20 V, ID = 49 A|-|156|-|S|
|Dynamic Characteristics|
|Ciss|Input Capacitance|-|3580|4760|pF|
|Coss|Output Capacitance|Vf = 1 MHzDS = 25 V, VGS = 0 V,|-|340|450|pF|
|Crss|Reverse Transfer Capacitance|-|140|210|pF|
|==|Switching Characteristics|EEE|
|td(on)|Turn-On Delay Time|-|47|104|ns|
|tr|Turn-On Rise Time|VDD = 50 V, ID = 49 A,|-|164|338|ns|
|td(off)|Turn-Off Delay Time|VGS = 10 V, RG = 25|Ω|-|86|182|ns|
|tf|Turn-Off Fall Time|(Note 4)|-|83|176|ns|
|Qg(tot)|Total Gate Charge at 10V|VDS = 80 V, ID = 49 A,|-|53|69|nC|
|Qgs|Gate to Source Gate Charge|VGS = 10 V|-|19|-|nC|
|Qgd|Gate to Drain “Miller” Charge|(Note 4)|-|15|-|nC|
|Drain-Source Diode Characteristics|
|==|IS|Maximum Continuous Drain to Source Diode Forward Current|eae|-|-|57|A|
|ISM|Maximum Pulsed Drain to Source Diode Forward Current|-|-|228|A|
|VSD|Drain to Source Diode Forward Voltage|VGS = 0 V, ISD = 49 A|-|-|1.3|V|
|trr|Reverse Recovery Time|VGS = 0 V, ISD = 49 A,|-|41|-|ns|
|SE|Qrr|Reverse Recovery Charge|dIF/dt = 100 A/|μ|s|-|70|-|nC|
|Notes:|
|1:|Repetitive rating: pulse width limited by maximum junction temperature.|

**----- End of picture text -----**<br>


- 2: L = 0.11 mH, IAS = 49 A, VDD = 50 V, RG = 25 Ω , starting TJ = 25°C. 

- 3: ISD ≤ 49 A, di/dt ≤ 200 A/ μ s, VDD ≤ BVDSS, starting TJ = 25°C. 

- 4: Essentially independent of operating temperature typical characteristics. 

www.fairchildsemi.com 

©2008 Fairchild Semiconductor Corporation FDP150N10 Rev. C3 

**2** 

## **Typical Performance Characteristics** 

**==> picture [436 x 600] intentionally omitted <==**

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Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics<br>1000<br>500<br>V GS  = 15.0 V       *Notes:<br>           10.0 V              8.0 V    1. V DS = 20V<br>             7.0 V    2. 250 μ s Pulse Test<br>100              6.5 V<br>             6.0 V 100<br>             5.5 V 150oC<br>25oC<br>10 10<br>Was *Notes: LA<br>   1. 250 μ s Pulse Test -55oC<br>   2. TC = 25 [o] C<br>2<br>0.02 V en 0.1 1 10 e e 1<br>3 4 5 6 7 8<br>VDS,Drain-Source Voltage[V]<br>VGS,Gate-Source Voltage[V]<br>Figure 3. On-Resistance Variation vs.  Figure 4. Body Diode Forward Voltage<br>                     Drain Current and Gate Voltage                  Variation vs. Source Current<br>                                                                                                               and Temperature<br>30 500<br>25  150 [o] C<br>100<br>fe Hlepeaa<br>20<br>VGS = 10V 25 [o] C<br>15 10 aie<br>VGS = 20V<br>10 *Notes:<br>*Note: TC = 25 [o] C 1. V2. 250GS μ  = 0Vs Pulse Test<br>5 1<br>0 100 200 300 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6<br>ID, Drain Current [A] VSD, Body Diode Forward Voltage [V]<br>Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics<br>5000 10<br>*Note:<br>4000 Ciss    1. V    2. f = 1MHz GS = 0V 8 V VDSDS  = 25V  = 50V<br>VDS = 80V<br>3000 6<br>Coss C iss = C gs + C gd ( C ds = shorted )<br>Coss = Cds + Cgd<br>2000 Crss = Cgd 4<br>1000 a Crss 2 AE<br>*Note: ID = 49A<br>0 meee 0 feet<br>0.1 1 10 30 0 10 20 30 40 50 60<br>VDS, Drain-Source Voltage [V] Qg, Total Gate Charge [nC]<br>,Drain Current[A]<br>ID ,Drain Current[A]<br>ID<br>] ,<br>Ω<br>m<br>[<br>DS(ON)<br>R<br>, Reverse Drain Current [A]<br>Drain-Source On-Resistance IS<br>, Gate-Source Voltage [V]<br>Capacitances [pF] GS<br>V<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2008 Fairchild Semiconductor Corporation FDP150N10 Rev. C3 

**3** 

## **Typical Performance Characteristics** (Continued) 

**==> picture [444 x 596] intentionally omitted <==**

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       Figure 7. Breakdown Voltage Variation                      Figure 8. On-Resistance Variation<br>                        vs. Temperature                                                            vs. Temperature<br>1.15 2.4<br>1.10 PPR 2.0<br>RR ES<br>1.05 1.6<br>nae<br>1.00 1.2<br>Gill aanaae *Notes:<br>0.95    1. V    2. ID GS  = 250uA  = 0V 0.8 *Notes:<br>   1. VGS = 10V<br>   2. ID = 49A<br>0.90 ane4n a n a 0.4<br>-100 -50 0 50 100 o 150 200 -100 -50 0 50 100 150 200<br>TJ, Junction Temperature [ C]<br>TJ, Junction Temperature  [ [o] C ]<br>        Figure 9. Maximum Safe Operating Area                   Figure 10. Maximum Drain Current<br>         vs. Case Temperature<br>500 70<br>100 60<br>100 μ s<br>50<br>10<br>1ms<br>40<br>PSS Operation in This Area  100ms BREE<br>1 is Limited by R DS(on) 10ms 30<br>| PN<br>SINGLE PULSE DC<br>20<br>0.1 TC = 25 [o] C<br>TJ = 150 [o] C 10<br>R θ JC  = 1.13 [o] C/W<br>0.01 aS}o eee 0 SES<br>1 10 100 25 50 75 100 125 150<br>VDS, Drain-Source Voltage [V] TC, Case Temperature [oC]<br>Figure 11. Transient Thermal Response Curve<br>2<br>1<br>0.5<br>0.2<br>P DM<br>0.1<br>0.1 t1<br>0.05 t2<br>*Notes:<br>0.02<br>0.01    1. Z θ JC (t) = 1.13 [o] C/W Max.<br>   2. Duty Factor, D= t1/t2<br>Single pulse<br>   3. TJM - TC = PDM * Z θ JC(t)<br>0.01<br>10-5 10-4 10-3 10-2 10-1 1 10<br>  tRectangular Pulse Duration [sec]1, Rectangular Pulse Duration [sec]<br>, [Normalized] , [Normalized]<br>BVDSS DS(on)<br>R<br>Drain-Source On-Resistance<br>Drain-Source Breakdown Voltage<br>, Drain Current [A]<br>ID , Drain Current [A]<br>ID<br>oC/W]  ] ZJC θ<br>[<br>(t), Thermal Response [<br>ZThermal Response JC θ<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2008 Fairchild Semiconductor Corporation FDP150N10 Rev. C3 

**4** 

**==> picture [392 x 401] intentionally omitted <==**

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IG = const.<br>F<br>Charge<br> Figure 12. Gate Charge Test Circuit & Waveform<br>VDS RL VDS 90%<br>VGS VDD<br>RG<br>10%<br>V 10V GS DUT VGS<br>td(on) tr td(off) tf<br>=n wa t on 4S t off<br> Figure 13. Resistive Switching Test Circuit & Waveforms<br>Vos oy5 EASa“a Las?LIAS<br>lo oy} BVpss<br>of las<br>>in (ad) =F Von Ip (t)<br>VGS TL DUT Vop<br>**----- End of picture text -----**<br>


**Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms** 

www.fairchildsemi.com 

©2008 Fairchild Semiconductor Corporation FDP150N10 Rev. C3 

**5** 

**==> picture [335 x 545] intentionally omitted <==**

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DUT +<br>VDS<br>_<br>I SD<br>L<br>Driver<br>RG<br>Same Type<br>as DUT VDD<br>VGS • dv/dt controlled by  RG<br>• ISD controlled by pulse period<br>Gate Pulse Width<br>VGS D = --------------------------<br>Gate Pulse Period 10V<br>( Driver )<br>ff}<br>IFM , Body Diode Forward Current<br>I SD<br>( DUT ) di/dt<br>IRM<br>4 Ne<br>Body Diode Reverse Current<br>VDS<br>( DUT ) Body Diode Recovery dv/dt<br>VSD VDD<br>eerie<br>Body Diode<br>Forward Voltage Drop<br> Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2008 Fairchild Semiconductor Corporation FDP150N10 Rev. C3 

**6** 

## **Mechanical Dimensions** 

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3<br>**----- End of picture text -----**<br>


## **Figure 16. TO-220, Molded, 3-Lead, Jedec Variation AB** 

_Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products._ 

_Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:_ 

_http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT220-003_ 

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**7** 

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|AccuPower™<br>AX-CAP®*<br>BitSiC™<br>Build it Now™<br>CorePLUS™<br>CorePOWER™<br>_CROSSVOLT_™<br>CTL™<br>Current Transfer Logic™<br>DEUXPEED®<br>Dual Cool™<br>EcoSPARK®<br>EfficentMax™<br>ESBC™<br>Fairchild®<br>Fairchild Semiconductor®<br>FACT Quiet Series™<br>FACT®<br>FAST®<br>FastvCore™<br>FETBench™<br>FPS™<br>®|F-PFS™<br>FRFET®<br>Global Power ResourceSM<br>GreenBridge™<br>Green FPS™<br>Green FPS™ e-Series™<br>G_max_™<br>GTO™<br>IntelliMAX™<br>ISOPLANAR™<br>Marking Small Speakers Sound Louder<br>and Better™<br>MegaBuck™<br>MICROCOUPLER™<br>MicroFET™<br>MicroPak™<br>MicroPak2™<br>MillerDrive™<br>MotionMax™<br>mWSaver®<br>OptoHiT™<br>OPTOLOGIC®<br>OPTOPLANAR®|PowerTrench®<br>PowerXS™<br>Programmable Active Droop™<br>QFET®<br>QS™<br>Quiet Series™<br>RapidConfigure™<br>Saving our world, 1mW/W/kW at a time™<br>SignalWise™<br>SmartMax™<br>SMART START™<br>Solutions for Your Success™<br>SPM®<br>STEALTH™<br>SuperFET®<br>SuperSOT™-3<br>SuperSOT™-6<br>SuperSOT™-8<br>SupreMOS®<br>SyncFET™<br>™<br>tm®|Sync-Lock™<br>®*<br>TinyBoost®<br>TinyBuck®<br>TinyCalc™<br>TinyLogic®<br>TINYOPTO™<br>TinyPower™<br>TinyPWM™<br>TinyWire™<br>TranSiC™<br>TriFault Detect™<br>TRUECURRENT®*<br>μSerDes™<br>UHC®<br>Ultra FRFET™<br>UniFET™<br>VCX™<br>VisualMax™<br>VoltagePlus™<br>XS™<br>E SYSTEM<br>GENERAL<br>WZ...|
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## **Definition of Terms** 

|**Datasheet Identification**|**Product Status**|**Definition**|
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|Advance Information|Formative / In Design|Datasheet contains the design specifications for product development. Specifications<br>may change in any manner without notice.|
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Rev. I66 

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